CN202616187U - Faraday shielding device with cooling function and plasma processing equipment - Google Patents
Faraday shielding device with cooling function and plasma processing equipment Download PDFInfo
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- CN202616187U CN202616187U CN 201220224035 CN201220224035U CN202616187U CN 202616187 U CN202616187 U CN 202616187U CN 201220224035 CN201220224035 CN 201220224035 CN 201220224035 U CN201220224035 U CN 201220224035U CN 202616187 U CN202616187 U CN 202616187U
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Abstract
The utility model provides a Faraday shielding device with cooling function, comprising a Faraday shielding plate and a heat conduction component placed on the Faraday shielding plate or inserted inside the Faraday shielding plate, wherein the heat conduction component is filled with cooling liquid and at least includes an input interface and an output interface used for inputting and outputting the cooling liquid respectively. According to the utility model, the temperature on the Faraday shielding plate can be reduced by adding the heat conduction component, and the problem that the Faraday shielding plate can easily heats up at work can be solved.
Description
Technical field
The utility model relates to semi-conductor processing equipment, especially implements the apparatus for processing plasma of Cement Composite Treated by Plasma for substrate, particularly, and the apparatus for processing plasma that relates to a kind of faraday screen shielding apparatus and have this faraday screen shielding apparatus.
Background technology
In the manufacture process of semiconductor equipment, in the processing procedures such as for example etching, deposition, oxidation, sputter, can utilize plasma that substrate (semiconductor wafer, glass substrate etc.) is handled usually.Usually, for apparatus for processing plasma,, can be divided into substantially and utilize corona (glow) discharge or high-frequency discharge and utilize mode such as microwave as the mode that generates plasma.
In the apparatus for processing plasma of high-frequency discharge mode, be divided into two kinds of capacitive couplings and inductance type couplings again according to energy coupled modes difference.The reaction chamber of capacitive couplings apparatus for processing plasma disposes upper electrode and lower electrode usually, and preferably these two electrodes laterally arrange.And, on lower electrode, carry to put usually and be processed substrate, via integrator the high frequency electric source that plasma generates usefulness is put on upper electrode or lower electrode.Through electronics is quickened,, thereby carry out etched operation because of radio frequency plasma takes place for electronics and the impact ionization of handling gas.Outside the reaction chamber of inductance type coupled plasma treatment facility, dispose electromagnetic induction coil.The high-frequency electromagnetic field energy is coupled into out reaction chamber by coil through a medium window and produces plasma.Being processed substrate also is to be placed on the lower electrode usually, and with another high frequency electric source put on lower electrode with control energy of ions substrate is processed.
With inductance type coupled plasma treatment facility substrate is added man-hour, the energy coupling of carrying out through radio-frequency coil one is removed and is comprised AC and DC two parts.AC portion is used to produce plasma.And direct current component only is used to increase the bombarding energy on ion pair reaction chamber surface.Because the bombardment on ion pair reaction chamber surface can cause the corrosion on surface, must reduce.The main application of faraday screen shielding apparatus reduces or eliminates the energy coupling of direct current component exactly.
In existing technology, the faraday screen shielding apparatus often heats up at work easily, and then has influence on the effect that the faraday screen shielding apparatus is produced.The utility model is desirable to provide a kind of cooling function that has, and through the device that increases a heat conduction temperature on the faraday screen shielding apparatus is reduced, and solves this problem with this.
The utility model content
To defective of the prior art, the purpose of the utility model provides a kind of faraday screen shielding apparatus and apparatus for processing plasma with cooling function.
According to an aspect of the utility model, a kind of faraday screen shielding apparatus with cooling function is provided, it comprises: a Faraday shield plate; And one be positioned on the said Faraday shield plate or insert the conducting-heat elements of said Faraday shield intralamellar part; It is characterized in that; In the said conducting-heat elements cooling fluid is housed, said conducting-heat elements comprises an input interface and an output interface at least, is used for input and output cooling fluid.
Preferably, said conducting-heat elements comprises one or more heat pipe at least, and said one or more heat pipe is formed any in the shapes such as flaabellum shape, spirality, circle, rhombus and star.
Preferably, said many heat pipes are arranged in the surperficial or inner of said Faraday shield plate equably.
Preferably, said many heat pipes on said Faraday shield plate surface or inside be center and peripheral and distribute, the density of the heat pipe of said central area is greater than the density of the heat pipe of said fringe region.
Preferably, said heat pipe comprises different loop pipes of two diameters and Duo Gen straight tube, and said many straight tubes are connected with two loop pipes.
Preferably, said loop pipe includes input interface and output interface separately, and said loop pipe input interface and output interface separately connects a cooling device simultaneously.
Preferably, said conducting-heat elements is one to comprise the heat-conducting plate of cooling fluid, and said heat-conducting plate is arranged in the surface of said Faraday shield plate or inner, and the size of said heat-conducting plate and said Faraday shield plate adapts.
Preferably, between said conducting-heat elements and the Faraday shield plate through welding or use heat-conducting glue to be connected.
Preferably, the material of said Faraday shield plate is an aluminium.
Another aspect according to the utility model also provides a kind of apparatus for processing plasma, and it comprises: carry out etched reative cell to being processed substrate; And be configured in above the said reative cell and the coil that is spaced from; Said coil has input, output; It is characterized in that, also comprise the said faraday screen shielding apparatus that is disposed between said reative cell and the said coil and all is spaced apart with said reative cell and said coil.Another aspect according to the utility model also provides.
The utility model is through providing a kind of faraday screen shielding apparatus and plasma processing apparatus with cooling function; It is through increasing a conducting-heat elements; Temperature on the Faraday shield plate is reduced; Often heat up easily at work thereby solve the faraday screen shielding apparatus, and then have influence on this problem of effect that the faraday screen shielding apparatus is produced.
Description of drawings
Through reading the detailed description of non-limiting example being done with reference to following accompanying drawing, it is more obvious that the other features, objects and advantages of the utility model will become:
Fig. 1 illustrates the structural representation according to the apparatus for processing plasma 100 of prior art;
Fig. 2 illustrates the basic principle of operation according to apparatus for processing plasma described in the prior art 100;
Fig. 3 illustrates according to first embodiment of the utility model, the surface texture sketch map of said faraday screen shielding apparatus 2; And
Fig. 4 illustrates according to second embodiment of the utility model, the surface texture sketch map of said faraday screen shielding apparatus 2.
Embodiment
Below in conjunction with accompanying drawing and embodiment the technology contents of the utility model is explained further:
Fig. 1 shows the structural representation according to the apparatus for processing plasma 100 of prior art.Particularly, said apparatus for processing plasma 100 comprises etching reaction chamber 101, and its structure is to be defined by reaction chamber wall 102 and 104 of chamber window.Said reaction chamber wall 102 is made up of stainless steel usually, and said chamber window 104 is processed by quartz usually.104 pairs of said reaction chamber wall 102 of said chamber window provide vacuum seal.Semiconductor wafer 110 is on the chuck 108 on the bottom interior surface that is placed on said etching reaction chamber 101 that is fixed.Coil 116 is positioned on the said chamber window 104 with faraday screen shielding apparatus 2; Said coil 116 is fixed on the said reative cell 101 through the insulation spacer (not shown); Said coil 116 is made and comprise the complete coil of a circle at least by electric conducting material, and the coil 116 shown in Fig. 1 comprises the complete coil of three circles.Coil 116 symbolic representation coils 116 with " * " rotate extension in the page.On the contrary, the coil 116 symbolic representation coils 116 that have " ● " extend toward page inner rotary.Faraday screen shielding apparatus 2 utilize insulation spacer 114 with a fixed interval of separating in coil 116 times.Said faraday screen shielding apparatus 2 is arranged on the said chamber window 104 of next-door neighbour.Said coil 116, faraday screen shielding apparatus 2, be set to parallel to each other basically with chamber window 104.In addition, said coil 116 is electrically connected via a tap 118 with said faraday screen shielding apparatus 2.
Fig. 2 shows the basic principle of operation according to apparatus for processing plasma described in the prior art 100.In the middle of operation, reacting gas flows through said etching reaction chamber 101 to the gas discharge outlet (not shown) from the gas introduction port (not shown).High frequency power (being radio frequency (RF) power) is applied to said coil 116 by the power supply (not shown) then, flows through the RF electric current of said coil 116 with generation.The RF electric current that flows through said coil 116 generates an electromagnetic field 120 on every side.Said electromagnetic field 120 has produced induced current 122 in said etching reaction chamber 101.Thereby said induced current 122 acts on reacting gas and has produced plasma 123.High frequency power (being radio-frequency power) is applied to said chuck 108 to said plasma 123 directionality to be provided by a power supply (not shown), makes said plasma 123 by on the surface that pulls down to said wafer 110 and carry out etch process.
Said faraday screen shielding apparatus 2 is guaranteed to be distributed to said plasma 123 uniformly by the electromagnetic energy that said coil 116 is produced, thereby the phenomenon that the non-volatile reaction products in the etch process is deposited on the said chamber window 104 can produce uniformly.Same, the sputter of the non-volatile reaction products of being come by said chamber window 104 also can take place uniformly.The generation that has the characteristic that is beneficial to the even said plasma 123 in the whole said etching reaction chamber 101 of the uniform electrical characteristics in whole said chamber window 104.
Fig. 3 shows according to first embodiment of the utility model, the surface texture sketch map of said faraday screen shielding apparatus 2.Particularly; In the present embodiment; Said faraday screen shielding apparatus 2 is made up of a Faraday shield plate 21 and a conducting-heat elements 22; Said Faraday shield plate 21 and said conducting-heat elements 22 are for stacking up and down, and said conducting-heat elements 22 is arranged on the surface of said Faraday shield plate 21, and said conducting-heat elements 22 pastes with said Faraday shield plate 21 mutually.More specifically; Said Faraday shield plate 21 is provided with a plurality of radial slots 211; Said radial slot 211 is used for preventing that radial current from flowing at the Faraday shield plate 21 of conduction, and wherein said radial current is that the said induced current 122 that flows on the coil 116 described in Fig. 1 or Fig. 2 is formed.More particularly, cooling fluid is housed also in the said conducting-heat elements, said cooling fluid shifts from said Faraday shield plate 21 through the heat transferred of said conducting-heat elements 22 and then with heat.
Further; According to embodiment illustrated in fig. 3; Said conducting-heat elements 22 is a heat pipe 221, and said heat pipe 221 is flaabellum shape on the surface of said Faraday shield plate 21 arranges, and said heat pipe 221 is distributed on the surface of said Faraday shield plate 21 equably; It can make the temperature on the said Faraday shield plate 21 pass to said heat pipe 221 equably, avoids causing temperature equalization and the high situation of local temperature of said Faraday shield plate 21.Further, in different variant, the layout shape of said heat pipe 221 also can be different.Particularly, in a variant, the layout shape of said heat pipe 221 can be for spiral, said heat pipe 221 can by the center of said Faraday shield plate 21 in the shape of a spiral shape extend to the edge of said Faraday shield plate 21.And in other variant, the shape of said heat pipe 221 also can be circular, rhombus or star or the like.It will be appreciated by those skilled in the art that these variant all can combine embodiment illustrated in fig. 3 being achieved, and will not give unnecessary details here.
Further, in the present embodiment, said Faraday shield plate 21 pastes with said heat pipe 221 mutually.Form through welding between said Faraday shield plate 21 and the said heat pipe 221 links to each other; Thereby said heat pipe 221 is fixed on the surface of said Faraday shield plate 21; The said heat pipe 221 of heat transferred that produces when adopting the form of welding also to help said Faraday shield plate 21 simultaneously will work is with the purpose of realization the utility model.And it will be apparent to those skilled in the art that; In a variant; Can also fix through using heat-conducting glue be connected between said Faraday shield plate 21 and the said heat pipe 221; The use of heat-conducting glue can be carried out the transmission of heat equally very effectively, and said variant does not influence the flesh and blood of the utility model, will not give unnecessary details here.
Further; According to embodiment illustrated in fig. 3, comprise an input interface 31 and an output interface 32 on the said heat pipe 221 at least, said input interface 31 is used to import cooling fluid; And said output interface 31 is used to export cooling fluid; Said input interface 31 and said output interface 32 connect one one cooling device (not shown among Fig. 3) simultaneously, and said cooling device is used to provide cooling fluid, reduces the temperature of said Faraday shield plate 21.
Further, with reference to embodiment illustrated in fig. 3, in the present embodiment, said Faraday shield plate 21 preferably adopts aluminum, and said heat pipe 221 adopts copper product, when reaching superperformance, also more practices thrift cost with this.And in some variant, said Faraday shield plate 21 and said heat pipe 221 also can adopt some other material.For example said Faraday shield plate 21 adopts some electric conductivities such as copper product or iron material material preferably, and said heat pipe 221 adopts some heat conductivilitys such as aluminum or iron material material preferably, will not give unnecessary details here.
More particularly; In conjunction with embodiment illustrated in fig. 3; It will be apparent to those skilled in the art that; The cooling method of said faraday screen shielding apparatus 2 is: after at first said cooling device begins cooling fluid is provided; Said cooling fluid flows into said heat pipe 221 from said input interface 31, in heat pipe 221, because the contacting of said heat pipe 221 and said Faraday shield plate 21, and all adopt the good material of heat conductivility between the two; Therefore the said Faraday shield plate 21 that temperature is high can be through the heat conducting mode said cooling fluid that the heat transferred temperature is low, so the said cooling fluid of temperature after raising from again from said output interface 31 the said heat pipe 221 of outflow get back in the said cooling device.
Fig. 4 shows according to second embodiment of the utility model, the surface texture sketch map of said faraday screen shielding apparatus 2.Fig. 4 also is appreciated that a variant into above-mentioned Fig. 3.Particularly, in the present embodiment, said conducting-heat elements 22 is made up of two said heat pipes 221; Two said heat pipes 221 are all rounded; Wherein the length of a said heat pipe 221 is greater than the said heat pipe 221 of another root, and said two heat pipes 221 are center and edge distribution, and long said heat pipe 221 is positioned at the edge of said Faraday shield plate 21; Similarly; A said short said heat pipe 221 is positioned at the center of said Faraday shield plate 21, and two said heat pipes 221 are in the same plane, and said Faraday shield plate 21 stacks up and down with said heat pipe 221.More specifically, be provided with an input interface 31 on two said heat pipes 221 separately and an output interface 32 is used for input and output cooling fluid.
Further; In some variant, said heat pipe 221 can be provided with more, for example three, four, five or more; Said many heat pipes 221 can be that length is different, are provided with equally spacedly by the edge of the said Faraday shield plate 21 of middle mind-set of said Faraday shield plate 21.It is unequal that perhaps said many heat pipes 221 can be set to the density of center and marginal position by the center of said Faraday shield plate 21, for example is arranged in the density of said heat pipe 221 density of said Faraday shield plate 21 centers greater than the said heat pipe 221 that is arranged in marginal position.Or said many heat pipes 221 also can equal in length, evenly is provided with dispersedly around the center of said Faraday shield plate 21.Be equipped with an input interface 31 on the every said heat pipe 221 and an output interface 32 it will be appreciated by those skilled in the art that these variant all can combine embodiment illustrated in fig. 4 being achieved, and will not give unnecessary details here.
Further; It will be apparent to those skilled in the art that; Many said heat pipes 221 also can only be provided with a said input interface 31 and an output interface 32, in the case, only need to be provided with between the many said heat pipes 221 tube connector and make between the many said heat pipes 221 and interconnect; Can make cooling fluid through a said input interface 31 and a said output interface 32 every said heat pipe 221 of flowing through, will not give unnecessary details here.
In conjunction with Fig. 3 and embodiment illustrated in fig. 4, further, it will be appreciated by those skilled in the art that said conducting-heat elements 22 also can be a heat-conducting plate 222.Particularly, the shape of said heat-conducting plate 222.Size and said Faraday shield plate 21 adapt; Said heat-conducting plate 222 stacks up and down with said Faraday shield plate 21; And said heat-conducting plate 222 same and said Faraday shield plates 21 utilize the mode of welding or heat-conducting glue to be connected to a fixed, and said heat-conducting plate 222 also is provided with a said input interface 31 and an output interface 32.The form of said heat-conducting plate 222 can realize equally utility model the purpose that will reach, will not give unnecessary details here.
More further; It will be appreciated by those skilled in the art that preferably, said conducting-heat elements 22 be arranged on the surface of said Faraday shield plate 21 with said Faraday shield plate 21 for stacking up and down; And in some variant, said conducting-heat elements 22 is arranged at the inside of said Faraday shield plate 21.Particularly; In a variant; Said conducting-heat elements 22 is a heat pipe 221; The passage that said Faraday shield plate 21 set inside have the geomery of some and said heat pipe 221 to adapt, said heat pipe 221 can insert in the said passage from the side of said Faraday shield plate 21, to play the purpose of cooling.And in another variant; Said conducting-heat elements 22 is a said heat-conducting plate 222; Said Faraday shield plate 21 inside are provided with a groove that adapts with said heat-conducting plate 222; Said heat-conducting plate 222 can insert the said groove from the side of said Faraday shield plate 21 equally, thereby plays the effect of cooling.These variant all can combine above-mentioned Fig. 3 and embodiment illustrated in fig. 4 being achieved, and will not give unnecessary details here.
More than the specific embodiment of the utility model is described.It will be appreciated that the utility model is not limited to above-mentioned specific implementations, those skilled in the art can make various distortion or modification within the scope of the claims, and this does not influence the flesh and blood of the utility model.
Claims (10)
1. faraday screen shielding apparatus with cooling function, it comprises:
One Faraday shield plate; And
One is positioned on the said Faraday shield plate or inserts the conducting-heat elements of said Faraday shield intralamellar part; It is characterized in that; In the said conducting-heat elements cooling fluid is housed, said conducting-heat elements comprises that at least one is used to import cooling fluid input interface and and is used to export the cooling fluid output interface.
2. faraday screen shielding apparatus according to claim 1 is characterized in that said conducting-heat elements comprises one or more heat pipe at least, said one or more heat pipe form in the following shape any or appoint several kinds:
Flaabellum shape; Spirality; Circular; Rhombus; And star.
3. faraday screen shielding apparatus according to claim 2 is characterized in that, said many heat pipes are arranged in the surperficial or inner of said Faraday shield plate equably.
4. faraday screen shielding apparatus according to claim 2; It is characterized in that; Said many heat pipes on said Faraday shield plate surface or inside be center and peripheral and distribute, the density of the heat pipe of said central area is greater than the density of the heat pipe of said fringe region.
5. according to claim 3 or 4 described faraday screen shielding apparatus, it is characterized in that said heat pipe comprises different loop pipes of two diameters and Duo Gen straight tube, said many straight tubes are connected with two loop pipes.
6. faraday screen shielding apparatus according to claim 5 is characterized in that, said loop pipe includes input interface and output interface separately, and said loop pipe input interface and output interface separately connects a cooling device simultaneously.
7. faraday screen shielding apparatus according to claim 1; It is characterized in that; Said conducting-heat elements is one to comprise the heat-conducting plate of cooling fluid, and said heat-conducting plate is arranged in the surface of said Faraday shield plate or inner, and the size of said heat-conducting plate and said Faraday shield plate adapts.
8. according to each described faraday screen shielding apparatus in claim 1 to 4 or 6 or 7, it is characterized in that, between said conducting-heat elements and the Faraday shield plate through welding or use heat-conducting glue to be connected.
9. according to each described faraday screen shielding apparatus in claim 1 to 4 or 6 or 7, it is characterized in that the material of said Faraday shield plate is an aluminium.
10. apparatus for processing plasma, it comprises:
Carry out etched reative cell to being processed substrate; And
Be configured in above the said reative cell and the coil that is spaced from, said coil has input, output,
It is characterized in that, also comprise be disposed between said reative cell and the said coil and with said reative cell and said coil all be spaced apart according to each said faraday screen shielding apparatus in the right 1～11.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220224035 CN202616187U (en) | 2012-05-15 | 2012-05-15 | Faraday shielding device with cooling function and plasma processing equipment |
| TW101223047U TWM459518U (en) | 2012-05-15 | 2012-11-28 | Faraday shielding apparatus and plasma processing equipment with temperature reduction function |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220224035 CN202616187U (en) | 2012-05-15 | 2012-05-15 | Faraday shielding device with cooling function and plasma processing equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202616187U true CN202616187U (en) | 2012-12-19 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220224035 Expired - Lifetime CN202616187U (en) | 2012-05-15 | 2012-05-15 | Faraday shielding device with cooling function and plasma processing equipment |
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| Country | Link |
|---|---|
| CN (1) | CN202616187U (en) |
| TW (1) | TWM459518U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103545164A (en) * | 2013-10-30 | 2014-01-29 | 大连理工大学 | Radio frequency plasma reaction chamber |
| CN104183451A (en) * | 2013-05-22 | 2014-12-03 | 中微半导体设备(上海)有限公司 | Faraday shield device capable of realizing rapid heat radiation and plasma processing device |
| CN104302084A (en) * | 2013-07-17 | 2015-01-21 | 朗姆研究公司 | Air cooled faraday shield and methods for using the same |
| CN104299875A (en) * | 2013-07-17 | 2015-01-21 | 中微半导体设备(上海)有限公司 | Inductively coupled plasma processing device |
| CN105470087A (en) * | 2014-09-11 | 2016-04-06 | 中微半导体设备(上海)有限公司 | Inductively coupled plasma processing device |
| US9885493B2 (en) | 2013-07-17 | 2018-02-06 | Lam Research Corporation | Air cooled faraday shield and methods for using the same |
| CN110620029A (en) * | 2018-06-18 | 2019-12-27 | 三星电子株式会社 | Temperature control device, temperature detector and plasma processing equipment comprising temperature control device |
-
2012
- 2012-05-15 CN CN 201220224035 patent/CN202616187U/en not_active Expired - Lifetime
- 2012-11-28 TW TW101223047U patent/TWM459518U/en not_active IP Right Cessation
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104183451A (en) * | 2013-05-22 | 2014-12-03 | 中微半导体设备(上海)有限公司 | Faraday shield device capable of realizing rapid heat radiation and plasma processing device |
| TWI496186B (en) * | 2013-05-22 | 2015-08-11 | ||
| CN104302084A (en) * | 2013-07-17 | 2015-01-21 | 朗姆研究公司 | Air cooled faraday shield and methods for using the same |
| CN104299875A (en) * | 2013-07-17 | 2015-01-21 | 中微半导体设备(上海)有限公司 | Inductively coupled plasma processing device |
| CN104302084B (en) * | 2013-07-17 | 2017-04-12 | 朗姆研究公司 | Air cooled faraday shield and methods for using the same |
| US9885493B2 (en) | 2013-07-17 | 2018-02-06 | Lam Research Corporation | Air cooled faraday shield and methods for using the same |
| CN103545164A (en) * | 2013-10-30 | 2014-01-29 | 大连理工大学 | Radio frequency plasma reaction chamber |
| CN103545164B (en) * | 2013-10-30 | 2016-06-15 | 大连理工大学 | A kind of radio frequency plasma reative cell |
| CN105470087A (en) * | 2014-09-11 | 2016-04-06 | 中微半导体设备(上海)有限公司 | Inductively coupled plasma processing device |
| CN110620029A (en) * | 2018-06-18 | 2019-12-27 | 三星电子株式会社 | Temperature control device, temperature detector and plasma processing equipment comprising temperature control device |
Also Published As
| Publication number | Publication date |
|---|---|
| TWM459518U (en) | 2013-08-11 |
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| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee after: Medium and Micro Semiconductor Equipment (Shanghai) Co., Ltd. Address before: 201201 No. 188 Taihua Road, Jinqiao Export Processing Zone, Pudong New Area, Shanghai Patentee before: Advanced Micro-Fabrication Equipment (Shanghai) Inc. |
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| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121219 |