TWI496186B - - Google Patents
Info
- Publication number
- TWI496186B TWI496186B TW103111036A TW103111036A TWI496186B TW I496186 B TWI496186 B TW I496186B TW 103111036 A TW103111036 A TW 103111036A TW 103111036 A TW103111036 A TW 103111036A TW I496186 B TWI496186 B TW I496186B
- Authority
- TW
- Taiwan
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310193642.3A CN104183451A (en) | 2013-05-22 | 2013-05-22 | Faraday shield device capable of realizing rapid heat radiation and plasma processing device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| TW201445612A TW201445612A (en) | 2014-12-01 |
| TWI496186B true TWI496186B (en) | 2015-08-11 |
Family
ID=51964414
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW103111036A TW201445612A (en) | 2013-05-22 | 2014-03-25 | Faraday shield device capable of rapidly dissipating heat and plasma processing device |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104183451A (en) |
| TW (1) | TW201445612A (en) |
Families Citing this family (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106686875B (en) * | 2015-11-06 | 2019-05-17 | 中微半导体设备(上海)股份有限公司 | A kind of device for inductively coupled plasma processing |
| CN108024436A (en) * | 2016-11-01 | 2018-05-11 | 中微半导体设备(上海)有限公司 | A kind of plasma processing apparatus |
| CN108091586B (en) * | 2016-11-21 | 2020-12-29 | 中微半导体设备(上海)股份有限公司 | Plasma processing machine and radio frequency window temperature control system and temperature control method thereof |
| CN106772160B (en) * | 2017-03-13 | 2023-04-18 | 上海纽迈电子科技有限公司 | High-temperature radio frequency coil with cooling structure |
| CN113113280B (en) * | 2020-01-09 | 2022-06-10 | 江苏鲁汶仪器有限公司 | Plasma processing system and opening and closing Faraday component thereof |
| CN115513025A (en) * | 2021-06-23 | 2022-12-23 | 北京鲁汶半导体科技有限公司 | Excitation radio frequency system of plasma etching machine |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030015293A1 (en) * | 2001-07-23 | 2003-01-23 | Tokyo Ohka Kogyo Co., Ltd. | Apparatus for plasma treatment |
| US20080085604A1 (en) * | 2004-07-07 | 2008-04-10 | Showa Denko K.K. | Plasma Treatment Method and Plasma Etching Method |
| CN202616187U (en) * | 2012-05-15 | 2012-12-19 | 中微半导体设备(上海)有限公司 | Faraday shielding device with cooling function and plasma processing equipment |
| TW201309102A (en) * | 2011-08-02 | 2013-02-16 | Advanced Micro Fabrication Equipment Shanghai Co Ltd | Capacitive-coupled plasma processing apparatus and method for processing substrate |
| CN202871737U (en) * | 2012-05-28 | 2013-04-10 | 中微半导体设备(上海)有限公司 | Plasma treatment apparatus and Faraday shielding device included by same |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0590214A (en) * | 1991-09-30 | 1993-04-09 | Tokyo Ohka Kogyo Co Ltd | Coaxial type plasma treatment device |
| EP1269512B1 (en) * | 2000-03-31 | 2007-10-03 | Lam Research Corporation | Inductively coupled plasma etching apparatus with active control of RF peak-to-peak voltage |
| CN101390187A (en) * | 2006-01-24 | 2009-03-18 | 瓦里安半导体设备公司 | Plasma immersion ion source with low effective antenna voltage |
| CN2907173Y (en) * | 2006-02-24 | 2007-05-30 | 苏州大学 | Large-area parallel connected high density inductively coupled plasma source |
| CN102332384A (en) * | 2011-09-26 | 2012-01-25 | 中国科学院微电子研究所 | Device and method for generating neutral particle beams |
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2013
- 2013-05-22 CN CN201310193642.3A patent/CN104183451A/en active Pending
-
2014
- 2014-03-25 TW TW103111036A patent/TW201445612A/en unknown
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20030015293A1 (en) * | 2001-07-23 | 2003-01-23 | Tokyo Ohka Kogyo Co., Ltd. | Apparatus for plasma treatment |
| US20080085604A1 (en) * | 2004-07-07 | 2008-04-10 | Showa Denko K.K. | Plasma Treatment Method and Plasma Etching Method |
| TW201309102A (en) * | 2011-08-02 | 2013-02-16 | Advanced Micro Fabrication Equipment Shanghai Co Ltd | Capacitive-coupled plasma processing apparatus and method for processing substrate |
| CN202616187U (en) * | 2012-05-15 | 2012-12-19 | 中微半导体设备(上海)有限公司 | Faraday shielding device with cooling function and plasma processing equipment |
| CN202871737U (en) * | 2012-05-28 | 2013-04-10 | 中微半导体设备(上海)有限公司 | Plasma treatment apparatus and Faraday shielding device included by same |
Also Published As
| Publication number | Publication date |
|---|---|
| TW201445612A (en) | 2014-12-01 |
| CN104183451A (en) | 2014-12-03 |