CN202614193U - Loading sample positioning device - Google Patents
Loading sample positioning device Download PDFInfo
- Publication number
- CN202614193U CN202614193U CN 201220245324 CN201220245324U CN202614193U CN 202614193 U CN202614193 U CN 202614193U CN 201220245324 CN201220245324 CN 201220245324 CN 201220245324 U CN201220245324 U CN 201220245324U CN 202614193 U CN202614193 U CN 202614193U
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- CN
- China
- Prior art keywords
- guide rail
- sample stage
- disk
- locating device
- center
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- Length Measuring Devices By Optical Means (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The present utility model discloses a loading sample positioning device. The device comprises a working bench, a guide rail, a sample bench and a round disc. The guide rail is horizontally arranged on the working bench, a length scale mark is marked on the guide rail or an edge of the working bench adjacent to the guide rail along the direction of the guide rail; the sample bench is slidingly connected with the guide rail and can be moved in a left and right way along the guide rail; the round disc is arranged on the sample bench and connected with the sample bench through a rotating shaft, and an angle scale mark surrounding the round disc is marked on the sample bench outside the round disc. The device can be used for accurately positioning samples, is convenient to operate, can be used for repeatedly positioning, is high in testing efficiency, and can be used for rapidly measuring depth of a film of each point of the surface of a wafer.
Description
Technical field
The utility model relates to the detection technique field, the particularly a kind of kind locating device that carries that is used for the wafer surface measured film thickness.
Background technology
The processing of Semiconductor substrate wafer need reach out the state that box is promptly used (epi-ready) usually, the surface state of substrate wafer, and especially the external epitaxial growth of surface oxidation layer thickness has material impact.The common instrument that detects substrate wafer (like germanium, silicon, gallium arsenide, indium phosphide etc.) surface film thickness is an ellipsometer.Its principle is the polarisation transformation that occurs when utilizing reflection or the transmission of light beam on interface or film, and is as shown in the figure.The linearly polarized light that the polarizer produces becomes special elliptically polarized light after being orientated certain quarter wave plate, when projecting the testing sample surface to it, as long as the polarizer is got suitable printing opacity direction, what come out by the testing sample surface reflection will be linearly polarized light.Change (comprising the variation of amplitude and phase place) according to the polarization state of polarized light before and after reflection, just can confirm many optical characteristics (like the thickness of film, refractive index etc.) of sample surfaces.During detection, the placement of sample will make the residing plane of detection faces perpendicular to by the incident light axis and the formed plane of incidence of reflection optical axis, and the intersection point through two optical axises.Usually calling reference surface perpendicular to plane by incident light axis and the formed plane of incidence of reflection optical axis and the intersection point through two optical axises.During detection, must satisfy detection faces and overlap with reference surface, the incident angle that also satisfied system this moment equals reflection angle.
When utilizing ellipse inclined to one side system that the surface film thickness of different size wafer is measured; Put down wafer gently on sample stage, move certain some position that wafer (or sample stage) and range estimation need test, mobile wafer with hand; Make it to be positioned at the intersection point place of two optical axises, start test macro and begin test.Repeat this step, realize film thickness test the multiple spot of wafer surface.This is to locate through manual movement wafer or objective table and the Position Approximate of estimating the wafer surface point, so measure consuming timely, accuracy and repeatability are difficult to be guaranteed.
The utility model content
The technical matters that (one) will solve
The technical matters that the utility model will solve provides a kind of easy and simple to handle, year appearance locating device that can repeat, accurately locate.
(2) technical scheme
In order to achieve the above object, the utility model adopts following technical scheme:
The appearance locating device that carries of the utility model comprises worktable, guide rail, sample stage and disk, wherein,
Guide rail is horizontally placed on the worktable, on guide rail or the worktable edge upper edge guide rail bearing mark adjacent with guide rail the length scale mark is arranged;
Sample stage and guide rail are slidingly connected, can be along guide rail direction move left and right;
Disk is positioned on the sample stage, is connected with sample stage through a rotating shaft, and the outer sample stage marked of disk has the angle index line around disk.
Wherein, said guide rail is made up of parallel guide rail A and guide rail B, and said sample stage both sides have the chute that matches with guide rail A and guide rail B respectively.
Wherein, in the centre position of said guide rail or the centre position at the said worktable edge adjacent with guide rail be labeled as 0 point of length scale mark, the distance of mark is 1mm between the two adjacent lengths scale marks.
Wherein, said disk is positioned at the center of sample stage, and rotating shaft is positioned at the center of disk.
Wherein, said sample stage center has a groove, and said rotating shaft is embedded in the groove, and the upper end of rotating shaft is connected with the center of disk.
Wherein, on the circle that with the sample stage center is the center of circle, be marked with the angle index line respectively.
Said disk external diameter is 50 ± 1mm, and said is that the circular diameter in the center of circle is 50,76,100 and 150mm with the sample stage center.
Wherein, the number of degrees of mark are 1 ° between two of said angle index line adjacent scale marks.
Wherein, the both sides of guide rail have stop respectively, and preferred stop is a positive stop strip.
The appearance locating device can be used for measuring the wafer surface film thickness in of the present invention year, and its principle of work is following:
Before test; Go out the correspondence position of the main reference plane of each wafer size in the sample stage marked; Center wafer is overlapped with the table top center, the alignment mark when measuring as wafer with this, each wafer size diameter is respectively 50mm, 76mm, 100mm and 150mm.
In the time will testing, the mobile example platform makes the center of sample stage overlap with the intersection point of two optical axises; Put down wafer gently on disk, make the main reference plane of wafer and the main reference plane label alignment on the sample stage, make the position of test point be positioned at the angle index scope of mark; According to the position of test point, on angle index, read its radially with the angle of horizontal direction, the angle that promptly need rotate; By this angular turn disk, move to left again or the sample stage that moves to right earlier, tested point radially is positioned on 0 extended line in centre position of guide rail; Be the intersection point that tested point is positioned at two optical axises, start test system and test, the film thickness value of reading this point; Repeat this step, accomplish test wafer surface multiple spot film thickness.
(3) beneficial effect
The utility model carries the appearance locating device through on worktable, installing one additional, can accurately locate sample, and is easy and simple to handle, repeatable location, and testing efficiency is high, can be used for measuring fast the film thickness of wafer surface each point.
Description of drawings
Fig. 1 is an ellipsometer principle of work synoptic diagram.
Fig. 2 is the structural representation of the utility model locating device.
Fig. 3 is the sample stage of locating device shown in Figure 2 and the partial enlarged drawing of disk.
Fig. 4 is the cut-open view along A-A line among Fig. 3.
Among the figure: 1, guide rail; 2, sample stage; 3, disk; 4, worktable
Embodiment
Below in conjunction with accompanying drawing and embodiment, the embodiment of the utility model is described in further detail.Following examples are used to explain the utility model, but are not used for limiting the scope of the utility model.
The appearance locating device that carries of the utility model comprises worktable 4, guide rail 1, sample stage 2 and disk 3.Guide rail 1 is horizontally placed on the worktable; Guide rail 1 is made up of parallel guide rail A and guide rail B, and guide rail 1 upper edge guide rail bearing mark has the length scale mark, and the length scale mark is 0 point with the centre position of guide rail 1; The distance of mark is 1mm between the two adjacent lengths scale marks, and there is positive stop strip guide rail 1 both sides.Sample stage 2 both sides have the chute that matches with guide rail A and guide rail B respectively, can be along guide rail 1 direction move left and right, and sample stage 2 centers have a groove, and rotating shaft is embedded in the groove, and the upper end of rotating shaft is connected with the center of disk 3.Disk 3 external diameters are 50mm, with sample stage 2 centers be center of circle diameter be 50,76,100 and the circle of 150mm on be marked with the angle index line respectively, the number of degrees of mark are 1 ° between two adjacent scale marks of angle index line.
With diameter 50mm wafer is example, and its implementation method is following:
Go out the correspondence position of the main reference plane of 50mm wafer in sample stage 2 marked, center wafer is overlapped, the alignment mark when measuring as wafer with the table top center with this.Mobile example platform 2 makes the center of sample stage 2 overlap with the intersection point of two optical axises, puts down wafer gently on disk 3; Make the main reference plane of wafer and the main reference plane label alignment on the sample stage 2, make the position (such as the 1/2R=12.5mm place vertical with main reference plane) of test point be positioned at the angle index scope of mark, the angle of on scale, reading the test point horizontal direction is 90 °; Disk 3 rotational angles are 90 °; The sample stage 2 that moves to right again radially is positioned on 0 extended line in centre position of guide rail tested point, and tested point overlaps with the intersection point of two optical axises; Start test system and test, the film thickness value of reading this point.
Claims (9)
1. one kind carries the appearance locating device; Comprise worktable (4), it is characterized in that, also comprise guide rail (1); Said guide rail is horizontally placed on the worktable (4), goes up or worktable (4) edge upper edge guide rail (1) bearing mark adjacent with guide rail (1) has the length scale mark at said guide rail (1);
Sample stage (2), said sample stage (2) is slidingly connected with guide rail (1), can be along guide rail direction move left and right;
Disk (3), said disk (3) are positioned on the sample stage (2), are connected with sample stage (2) through a rotating shaft, and said disk (3) can be gone up in sample stage (2) and rotate, and outer sample stage (2) marked of said disk (3) has around the angle index line of disk (3).
2. according to claim 1 year appearance locating device is characterized in that said guide rail (1) is made up of parallel guide rail A and guide rail B, and said sample stage (2) both sides have the chute that matches with guide rail A and guide rail B respectively.
3. according to claim 1 and 2 year appearance locating device; It is characterized in that; In the centre position of said guide rail (1) or the centre position at said worktable (4) edge adjacent with guide rail (1) be labeled as 0 point of length scale mark, the distance of mark is 1mm between the two adjacent lengths scale marks.
4. according to claim 1 and 2 year appearance locating device is characterized in that said disk (3) is positioned at the center of sample stage (2), and rotating shaft is positioned at the center of disk (3).
5. according to claim 4 year appearance locating device is characterized in that, said sample stage (2) center has a groove, and said rotating shaft is embedded in the groove, and the upper end of rotating shaft is connected with the center of disk.
6. according to claim 5 year appearance locating device is characterized in that, on the circle that with said sample stage (2) center is the center of circle, is marked with the angle index line respectively.
7. according to claim 6 year appearance locating device is characterized in that, the number of degrees of mark are 1 ° between two adjacent scale marks of said angle index line.
8. according to claim 1 and 2 year appearance locating device is characterized in that the both sides of said guide rail (1) have stop respectively.
9. according to claim 8 year appearance locating device is characterized in that said stop is a positive stop strip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220245324 CN202614193U (en) | 2012-05-28 | 2012-05-28 | Loading sample positioning device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 201220245324 CN202614193U (en) | 2012-05-28 | 2012-05-28 | Loading sample positioning device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202614193U true CN202614193U (en) | 2012-12-19 |
Family
ID=47347883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 201220245324 Expired - Lifetime CN202614193U (en) | 2012-05-28 | 2012-05-28 | Loading sample positioning device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202614193U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110208218A (en) * | 2019-07-08 | 2019-09-06 | 莱森光学（深圳）有限公司 | A kind of two-way dispersion distribution function spectral measurement system |
-
2012
- 2012-05-28 CN CN 201220245324 patent/CN202614193U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110208218A (en) * | 2019-07-08 | 2019-09-06 | 莱森光学（深圳）有限公司 | A kind of two-way dispersion distribution function spectral measurement system |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 101113 No. 4, East 2nd Street, Industrial Development Zone, Tongzhou District, Beijing Patentee after: Beijing Tongmei Crystal Technology Co.,Ltd. Address before: 101113 No. 4, East 2nd Street, Industrial Development Zone, Tongzhou District, Beijing Patentee before: BEIJING TONGMEI XTAL TECHNOLOGY Co.,Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20121219 |