CN202603022U - Fluorescent lamp ballast chip based on system-level packaging - Google Patents
Fluorescent lamp ballast chip based on system-level packaging Download PDFInfo
- Publication number
- CN202603022U CN202603022U CN2012201900598U CN201220190059U CN202603022U CN 202603022 U CN202603022 U CN 202603022U CN 2012201900598 U CN2012201900598 U CN 2012201900598U CN 201220190059 U CN201220190059 U CN 201220190059U CN 202603022 U CN202603022 U CN 202603022U
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- CN
- China
- Prior art keywords
- fluorescent lamp
- chip
- level packaging
- lamp ballast
- full
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B20/00—Energy efficient lighting technologies, e.g. halogen lamps or gas discharge lamps
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
A fluorescent lamp ballast chip based on system-level packaging is composed of a full-wave rectification bridge (1) and a drive chip (2), wherein the full-wave rectification bridge (1) and the drive chip (2) are integrated into the chip through a system-level packaging mode. The fluorescent lamp ballast chip based on the system-level packaging has the advantages of being capable of effectively driving a fluorescent lamp and a compact fluorescent lamp, high in power factor, low in total harmonic distortion, small in radio-frequency interference, suitable for tubes produced by various manufacturers, low in cost, and small in occupied space of a printed circuit board (PCB).
Description
Technical field
The utility model relates to a kind of fluorescent lamp ballast chip based on system in package.
Background technology
At present, existing fluorescent lamp ballast has following two kinds of forms:
1, the full-wave rectification bridge of forming by the diode of four separations and the electric ballast of chip for driving;
2, the electric ballast scheme formed of full-wave rectification bridge chip and town's chip for driving.
Their common characteristic are, adopt more discrete device to realize fluorescent lamp ballast, and the shortcoming that such scheme exists has:
1, the discrete device number is many more, and system failure rate can be high more;
2, the cost of system increases;
3, the area with PCB is big.
The utility model content
The purpose of the utility model is exactly to the above-mentioned deficiency of present existing fluorescent lamp ballast a kind of fluorescent lamp ballast chip based on system in package to be provided.
The utility model is made up of full-wave rectification bridge and chip for driving, and full-wave rectification bridge and chip for driving are integrated into a chip through the form of system in package.
The utility model has the advantages that: this fluorescent lamp ballast chip; Effectively driving fluorescent lamp and compact fluorescent lamp; It not only has power factor (PF) height, total harmonic distortion is low, radio frequency interference is little characteristic; Be fit to the fluorescent tube of all kinds of manufacturer production, and have cost low, take the little advantage of PCB area.
Description of drawings
Fig. 1 is the utility model structural representation.
Embodiment
As shown in Figure 1, the utility model is made up of full-wave rectification bridge 1 and chip for driving 2, and full-wave rectification bridge 1 and chip for driving 2 are integrated into a chip through the form of system in package.
Operation principle: chip is made up of full-wave rectification bridge 1 and chip for driving 2; And the form of employing advanced person's system in package (Sip); Development time significantly shortens, and can reduce the printed circuit board sizes and the number of plies through the height integration of encapsulating products, reduces the integral material cost; Effectively reduce the manufacturing and the operating cost of end product, improved production efficiency.In addition, the Sip design has good electromagnetic interference and suppresses effect, can reduce the work of anti-electromagnetic interference aspect to the system combination client.It uses circuit board space still less, lets the end product design have more imaginations space; Have the more compact appearance design personalized, improved value-added content of product with fashion.
Claims (1)
1. based on the fluorescent lamp ballast chip of system in package, it is characterized in that it is made up of full-wave rectification bridge (1) and chip for driving (2), full-wave rectification bridge (1) and chip for driving (2) are integrated into a chip through the form of system in package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201900598U CN202603022U (en) | 2012-04-30 | 2012-04-30 | Fluorescent lamp ballast chip based on system-level packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012201900598U CN202603022U (en) | 2012-04-30 | 2012-04-30 | Fluorescent lamp ballast chip based on system-level packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202603022U true CN202603022U (en) | 2012-12-12 |
Family
ID=47320525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012201900598U Expired - Fee Related CN202603022U (en) | 2012-04-30 | 2012-04-30 | Fluorescent lamp ballast chip based on system-level packaging |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202603022U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108631611A (en) * | 2018-05-28 | 2018-10-09 | 深圳市天毅科技有限公司 | A kind of full-bridge type chip and circuit |
-
2012
- 2012-04-30 CN CN2012201900598U patent/CN202603022U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108631611A (en) * | 2018-05-28 | 2018-10-09 | 深圳市天毅科技有限公司 | A kind of full-bridge type chip and circuit |
| CN108631611B (en) * | 2018-05-28 | 2019-12-20 | 深圳市天毅科技有限公司 | Full-bridge chip and circuit |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20121212 Termination date: 20160430 |