CN202523702U - 一种半导体元件封装结构 - Google Patents
一种半导体元件封装结构 Download PDFInfo
- Publication number
- CN202523702U CN202523702U CN2011205524274U CN201120552427U CN202523702U CN 202523702 U CN202523702 U CN 202523702U CN 2011205524274 U CN2011205524274 U CN 2011205524274U CN 201120552427 U CN201120552427 U CN 201120552427U CN 202523702 U CN202523702 U CN 202523702U
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- China
- Prior art keywords
- pin
- chip
- semiconductor component
- packaging structure
- component packaging
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L24/42—Wire connectors; Manufacturing methods related thereto
- H01L24/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L24/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/4918—Disposition being disposed on at least two different sides of the body, e.g. dual array
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- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Abstract
Description
Claims (3)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011205524274U CN202523702U (zh) | 2011-12-27 | 2011-12-27 | 一种半导体元件封装结构 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011205524274U CN202523702U (zh) | 2011-12-27 | 2011-12-27 | 一种半导体元件封装结构 |
Publications (1)
Publication Number | Publication Date |
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CN202523702U true CN202523702U (zh) | 2012-11-07 |
Family
ID=47106636
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2011205524274U Expired - Lifetime CN202523702U (zh) | 2011-12-27 | 2011-12-27 | 一种半导体元件封装结构 |
Country Status (1)
Country | Link |
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CN (1) | CN202523702U (zh) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103414041A (zh) * | 2013-08-14 | 2013-11-27 | 番禺得意精密电子工业有限公司 | 电连接器及电连接器的组装方法 |
CN105489560A (zh) * | 2015-11-30 | 2016-04-13 | 广东百圳君耀电子有限公司 | 一种无外壳填充保护型电路元件及其制成工艺 |
-
2011
- 2011-12-27 CN CN2011205524274U patent/CN202523702U/zh not_active Expired - Lifetime
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103414041A (zh) * | 2013-08-14 | 2013-11-27 | 番禺得意精密电子工业有限公司 | 电连接器及电连接器的组装方法 |
CN105489560A (zh) * | 2015-11-30 | 2016-04-13 | 广东百圳君耀电子有限公司 | 一种无外壳填充保护型电路元件及其制成工艺 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C56 | Change in the name or address of the patentee |
Owner name: BRIGHTKING INC. Free format text: FORMER NAME: BRIGHTKING CO., LTD. |
|
CP03 | Change of name, title or address |
Address after: 523808 modern enterprise accelerator No. 3, Songshan high tech Industrial Development Zone, Songshan Lake, Dongguan, Guangdong, Dongguan Patentee after: BRIGHTKING CO., LTD. Address before: 518173 Guangdong, Longgang District, Shenzhen, Henggang six, about 7 Tang Tong Road, south of the Five Ridges Industrial Park on the first floor of 3 Patentee before: BestBright Electronics (Shenzhen) Co., Ltd. |
|
CX01 | Expiry of patent term |
Granted publication date: 20121107 |
|
CX01 | Expiry of patent term |