Background technology
The silicon chip feeding platform is to be used for transferring silicon chip equipment in the solar cell making field.As, in the process of manufacturing solar cells, before making herbs into wool and etching apparatus, all need the silicon chip feeding platform, so that silicon chip is transferred in this making herbs into wool or the etching groove through this silicon chip feeding platform.
Be provided with servomotor in the silicon chip feeding platform; Be connected with driving-belt on this servomotor; Conveyer belt links to each other with plummer, on this plummer, is placed with the film magazine that holds that carries silicon chip, and the rotation through servomotor can drive this driving-belt running; And then regulate the height that this wafer-supporting platform rises or descends, so that the silicon chip that this holds in the film magazine is transferred on the conveyer belt of other technology making apparatus through the mechanical arm of transferring silicon chip.When utilizing mechanical arm to shift this to hold the silicon chip in the film magazine, be to draw this through the vacuum cup on this mechanical arm to hold silicon chip in the film magazine.Because holding the silicon chip of placing in the film magazine adheres to together possibly; Hold the silicon chip in the film magazine in order to make things convenient for this vacuum cup to draw; Position in the both sides of silicon chip feeding platform over against this plummer is provided with air knife; This air knife can outwards be blown, and then the silicon chip that will hold in the film magazine through gas is separated, and is convenient to vacuum cup and draws silicon chip.
But when the silicon chip of the air knife of existing feeding platform in holding film magazine blown; Often owing to inhomogeneous the causing of blowing can not be separated silicon chip; Make when this vacuum cup is drawn silicon chip that often the phenomenon of two or multi-disc silicon chip is drawn in generation simultaneously, and then influence follow-up technology and make.
The utility model content
In view of this, the utility model provides a kind of silicon chip feeding platform, when utilizing this silicon chip feeding platform transferring silicon chip, can reduce the phenomenon that vacuum cup is drawn the multi-disc silicon chip simultaneously.
For realizing above-mentioned purpose; The utility model provides a kind of silicon chip feeding platform; Comprise: place holding film magazine, carrying and saidly hold plummer, the lowering or hoisting gear that links to each other with said plummer of film magazine and be arranged at these plummer both sides and hold the air knife of film magazine of silicon chip over against this; Wherein, said air knife is provided with the rectangle gas outlet.
Preferably, said rectangle gas outlet is made up of two first rectangular edges and two second rectangular edges, and this second rectangular edges is longer than this first rectangular edges, and this second rectangular edges is perpendicular to said plane of holding the place, bottom surface of film magazine.
Preferably, the length of said second rectangular edges is identical with this said gross thickness of holding the silicon chip of specified quantity in the film magazine.
Preferably, said air knife links to each other with gas inlet pipe on being arranged on said plummer.
Preferably, also be provided with gas flow regulating valve on the said air knife.
Visible by technique scheme; A kind of silicon chip feeding platform that the utility model provided comprises: the film magazine that holds of placing silicon chip; Carry the plummer that this holds film magazine; The lowering or hoisting gear that links to each other with this plummer and be arranged at these plummer both sides and hold the air knife of film magazine over against this, this air knife is provided with the rectangle gas outlet.Because the gas outlet of this air knife is a rectangle; When utilizing this rectangle gas outlet outwards to blow; The air blowing area of air knife is bigger, and the gas output of outwards giving vent to anger is even, is easy to the silicon chip that holds in the film magazine is blown open; Be not easy to take place the silicon chip adhesion phenomenon, carry out the absorption biplate of silicon chip transfer appearance or the phenomenon of multi-disc silicon chip thereby reduce the use sucker.
Embodiment
To combine the accompanying drawing among the utility model embodiment below, the technical scheme among the utility model embodiment is carried out clear, intactly description, obviously, described embodiment only is the utility model part embodiment, rather than whole embodiment.Based on the embodiment in the utility model, those of ordinary skills are not making the every other embodiment that is obtained under the creative work prerequisite, all belong to the scope of the utility model protection.
Utilize existing silicon chip feeding platform, when carrying out the silicon chip transfer, the phenomenon of two of vacuum cup absorptions or multi-disc silicon chip takes place through regular meeting.The inventor finds after deliberation; Causing utilizing the reason of two of vacuum cup absorptions or multi-disc silicon chip is because the air knife on the feeding platform is given vent to anger inhomogeneous; Can't will be placed on the silicon chip that holds in the film magazine through blowing separates; Thereby when causing vacuum cup to draw silicon chip, the situation generation that vacuum cup is drawn biplate often takes place.The inventor further discovers; The gas outlet of the air knife of both sides is the circle hole shape gas outlet on the existing silicon chip feeding platform, and referring to shown in Figure 1, the circular hole at this disk air knife center is the venthole of air knife; When this air knife was outwards blown, the strength that air blowing is limited in scope and blows was inhomogeneous.Be not easy silicon chip is separated.Simultaneously, because the gas outlet of this air knife is a circular hole, when then air knife is outwards blown; Gas only can blow to silicon chip current to be drawn and next silicon chip of the silicon chip next-door neighbour that draws with this current band; This holds silicon chip remaining in the film magazine and then can not blown to, therefore, and in the silicon chip transfer process; Silicon chip is shorter by the average time that gas blows to, and the air blowing of short period is difficult for inter-adhesive silicon chip separately.
In order to realize the effect of better blowing; The utility model provides a kind of silicon chip feeding platform; This feeding platform comprises: place holding film magazine, carry this plummer that holds film magazine, the lowering or hoisting gear that links to each other with plummer and be arranged at these plummer both sides and holding the air knife of film magazine over against this of silicon chip; Wherein, this air knife is provided with the rectangle gas outlet.
In order clearly to describe the feeding platform of the utility model,, show a kind of structural representation of silicon chip feeding platform referring to Fig. 2; Comprise in this feeding platform and hold film magazine 1; This holds in the film magazine can place the multi-disc silicon chip, and generally speaking, per 200 silicon chips are placed on one and hold in the film magazine.This hold film magazine 1 place plummer (hold film magazine below; Do not draw among the figure) on; This plummer is connected with lowering or hoisting gear; Can also control the up-down of this plummer through regulating this lowering or hoisting gear, thereby regulate the height that holds film magazine, the manipulator of assurance transferring silicon chip can utilize vacuum cup to be drawn to this and hold the silicon chip in the film magazine.Be provided with air knife 2 in the both sides of plummer, air knife 2 can link to each other with plummer through a support 3, and the gas outlet of air knife 2 is rectangle gas outlet 21.The height of this rectangle gas outlet 21 and width can be set according to actual needs.The rectangle gas outlet is compared with existing circle hole shape gas outlet; The dynamics of outwards giving vent to anger is more even, and the area that is blown to by gas on the silicon chip increases, thereby helps silicon chip is separated; Reduce the silicon chip adhesion, and then reduced the phenomenon that vacuum cup is drawn two or multi-disc silicon chip simultaneously.
Wherein, the air knife 2 of this silicon chip feeding platform links to each other with gas inlet pipe 4 on being arranged on said plummer.This gas inlet pipe is used to import dry compressed air CDA, so that the gas supply is provided for air knife.
Also be provided with gas flow regulating valve 22 on this air knife, can control the throughput that air knife is outwards blown through this gas control valve.
For at air knife when silicon chip is blown, holding to have the multi-disc silicon chip to be blown in the film magazine, the rectangle gas outlet of this air knife can be set to the gas outlet of vertical bar shape.That is to say that this rectangle gas outlet can be made up of first rectangular edges and second rectangular edges, this second rectangular edges will be longer than this first rectangular edges, and this second rectangular edges is held the plane at the place, bottom surface of film magazine perpendicular to this.Wherein, this first rectangular edges is represented the width of this rectangle, and this second rectangular edges is represented the height of this gas outlet.The length of this second rectangular edges can be identical with this said gross thickness of holding the silicon chip of specified quantity in the film magazine.As, the length of this second rectangular edges can be identical with the gross thickness of 6 silicon chips, thus when this air knife was outwards blown, having at least up and down, 6 silicon chips were blown to by gas.
Like Fig. 3; Planar structure sketch map for the gas outlet of the air knife of the utility model; It is thus clear that first rectangular edges 211 of the rectangle gas outlet 21 of this air knife 2 is smaller than this second rectangular edges 212; Generally can be identical with the diameter of the circular hole of existing air knife gas outlet with the length of this first rectangular edges, certainly, also can the length of this first rectangular edges be arranged to the diameter greater than existing air knife gas outlet.The length of this second rectangular edges will be much larger than the diameter of circular gas outlet in the existing air knife; When utilizing the air knife of the utility model outwards to blow like this, this silicon chip not only current to be drawn can be blown to by gas, and other silicon chips in this Carrier box also can be blown by gas; The scope of blowing increases; When silicon chip that this is current to be drawn and its next-door neighbour's silicon chip were blown open, all the other silicon chips also can be owing to gas blows, and reduced the adhesion phenomenon between the silicon chip.Like this, when vacuum cup was drawn silicon chip, the phenomenon of drawing two or multi-disc silicon chip simultaneously obviously reduced.
When will be after holding film magazine and having placed silicon chip; This is held film magazine puts on the plummer of silicon chip feeding platform; Along with lowering or hoisting gear and belt running, this is held film magazine be fixed to assigned address, this assigned address is generally subsequent processing and carries out the position that silicon chip is drawn transfer.Placing the front end of printing equipment with the silicon chip feeding platform is example, this hold film magazine be transmitted the band pass to the specified altitude assignment of this print station front end after, the manipulator of this print station will be controlled vacuum cup and move down; In the time can being drawn to this height that holds the silicon chip in the film magazine, stop, in this process, the air knife of these plummer both sides can be blown to the silicon chip that holds in the film magazine always; If this silicon chip that holds top in the film magazine is a silicon chip 1, be downwards successively silicon chip 2, silicon chip 3,,,, silicon wafer N, when then in holding film magazine, blowing through the air knife of the utility model; This silicon chip 1 is blown off separately with silicon chip 2; This silicon chip 2 also can be blown open with silicon chip 3 simultaneously, like this after silicon chip 1 is siphoned away by sucker, when vacuum cup is drawn silicon chip 2 again; Because silicon chip 2 is longer with the time that silicon chip 3 is blown; Silicon chip 2 reduces with silicon chip 3 inter-adhesive possibilities, thereby makes sucker when drawing silicon chip, and the phenomenon of drawing two or multi-disc simultaneously reduces.
To the above-mentioned explanation of the disclosed embodiments, make this area professional and technical personnel can realize or use the utility model.Multiple modification to these embodiment will be conspicuous concerning those skilled in the art, and defined General Principle can realize under the situation of spirit that does not break away from the utility model or scope in other embodiments among this paper.Therefore, the utility model will can not be restricted to these embodiment shown in this paper, but will meet and principle disclosed herein and features of novelty the wideest corresponding to scope.