CN209119064U - Manipulator and silicon wafer separator - Google Patents

Abstract

The utility model provides a kind of manipulator and silicon wafer separator, the manipulator includes setting in flat and can visit the base portion put between adjacent two silicon wafer, positioned at the base portion side and the sucker to draw silicon wafer and out pneumatic module, it is described go out pneumatic module to blow to being located at silicon wafer of the base portion away from sucker side.The silicon wafer separator is separated to the silicon wafer being successively arranged in the gaily decorated basket in pairs and along first direction comprising bracket and several aforementioned mechanical hands along bracket arrangement.The manipulator can effectively avoid the silicon wafer away from sucker side from being adhered to corresponding manipulator, reduce the silicon wafer breakage probability in Slicing procedure, guarantee production efficiency；And can be reduced silicon chip surface residual moisture, it is conducive to the subsequent transmission of silicon wafer.

Description

Robot and wafer separation device

technical field

The utility model relates to the field of photovoltaic production equipment, in particular to a manipulator and a silicon wafer separating device.

Background technique

Texturing is to form a predetermined textured structure on the surface of the silicon wafer to reduce the reflectivity of the silicon wafer and increase the photo-generated current. As the thickness of the silicon wafer decreases, the single-sided texturing technology has a huge advantage over the traditional double-sided texturing technology in reducing the thickness loss of the silicon wafer.

Wet texturing of silicon wafers using acid and alkali solutions is still the mainstream process method in the industry. Among them, the trough wet texturing equipment needs to separate the silicon wafers that are close to each other after the single-sided texturing of the silicon wafers is completed. When performing slicing, the manipulator needs to protrude between two adjacent groups of silicon wafers, and then suck the corresponding silicon wafers through the suction cups. However, since there is still moisture remaining on the surface of the silicon wafer to be separated, the side of the manipulator away from the suction cup may adhere to the silicon wafer on the side, thereby causing the silicon wafer to break during the moving and slicing process of the manipulator.

In view of this, it is necessary to provide a new manipulator and silicon wafer separation device.

Utility model content

The purpose of the present utility model is to provide a manipulator and a silicon wafer separating device, which can prevent the silicon wafer on the side away from the suction cup from adhering to the corresponding manipulator, reduce the fragmentation rate, and ensure the production efficiency; and can reduce the residual moisture on the surface of the silicon wafer, which is beneficial to Subsequent transfer of silicon wafers.

In order to achieve the purpose of the above utility model, the utility model provides a manipulator, comprising a flat base that can be protruded between two adjacent silicon wafers, a suction cup located on one side of the base and used to suck the silicon wafers, and The air outlet assembly is used for blowing air to the silicon wafer on the side of the base that is away from the suction cup.

As a further improvement of the present invention, the air outlet assembly includes an air outlet hole disposed on the surface of the base portion on one side away from the suction cup.

As a further improvement of the present invention, the air outlet holes are evenly distributed along the surface of the base.

As a further improvement of the present invention, the air outlet assembly includes an air outlet pipe located on the side of the base, and an air outlet hole is opened on the air outlet pipe.

The present invention also provides a silicon wafer separating device, which is used for separating silicon wafers arranged in groups of two in a flower basket along a first direction. The silicon wafer separating device includes a movable bracket and a plurality of In the manipulator, a plurality of the manipulators are arranged at intervals along the bracket.

As a further improvement of the present invention, the spacing between adjacent manipulators corresponds to the tooth spacing of the flower basket.

As a further improvement of the present invention, the silicon wafer separating device further includes an air blowing pipe, and the air blowing pipe is provided with blowing holes for blowing air to the aforementioned silicon wafers in two groups.

As a further improvement of the present invention, the blowing pipe is arranged below the silicon wafer to be separated and extends along the first direction; the blowing holes are evenly arranged along the extending direction of the blowing pipe, adjacent to the The spacing of the blowing holes corresponds to the tooth spacing of the flower basket.

As a further improvement of the present invention, the blowing pipe is arranged on the bracket and moves together with the bracket.

As a further improvement of the present invention, the blowing pipes extend linearly and are arranged in two.

The beneficial effects of the present invention are as follows: the manipulator and the silicon wafer separating device of the present invention are suitable for single-sided texturing equipment, and blowing air to the silicon wafer on the side away from the suction cup through the air outlet assembly can prevent the silicon wafer from adhering to the side of the suction cup. The corresponding manipulator can reduce the fragmentation rate and ensure the production efficiency; and can reduce the residual moisture on the surface of the silicon wafer, which is conducive to the subsequent transfer of the silicon wafer and avoids the sliding deviation of the silicon wafer.

Description of drawings

1 is a schematic structural diagram of a preferred embodiment of the silicon wafer separation device of the present invention;

FIG. 2 is a schematic plan view of a preferred embodiment of a robot arm of the silicon wafer separation device in FIG. 1;

Fig. 3 is the structural representation of another angle of the manipulator in Fig. 2;

4 is a schematic plan view of another preferred embodiment of the manipulator of the present invention;

5 is a schematic structural diagram of another preferred embodiment of the silicon wafer separation device of the present invention;

FIG. 6 is a schematic diagram of a part of the structure of the silicon wafer separation device in FIG. 5 .

Detailed ways

The present invention will be described in detail below with reference to the embodiments shown in the accompanying drawings. However, this embodiment does not limit the present invention, and the structural, method, or functional transformations made by those of ordinary skill in the art according to this embodiment are all included in the protection scope of the present invention.

Referring to FIG. 1 , the manipulator 100 provided by the present invention and the silicon wafer separation device 200 having the aforementioned manipulator 100 are suitable for single-sided texturing equipment, which are used to complete the single-sided texturing and arrange them in pairs in pairs. The silicon wafers 400 in the flower basket 300 are separated. Here, the arrangement direction of the silicon wafers 400 during the slicing operation is defined as the first direction.

Referring to FIG. 2 and FIG. 3 , the manipulator 100 includes a flat base 11 , a suction cup 12 located on one side of the base 11 and used for sucking silicon wafers 400 , and an air outlet assembly. The base portion 11 is used for protruding into the adjacent two groups of the silicon wafers 400 , and the air outlet component is used for blowing air to the silicon wafer 400 on the side of the base portion 11 away from the suction cup 12 to avoid the side of the silicon wafers 400 . 400 is adhered to the manipulator 100 .

In this embodiment, the air outlet assembly includes an air outlet hole 13 disposed on the surface of the base portion 11 on the side facing away from the suction cup 12 . Preferably, the air outlet holes 13 are evenly distributed along the surface of the base 11 . The air outlet 13 is connected to an external air source, and when the base 11 moves between the adjacent silicon wafers 400, the air outlet 13 blows air toward the silicon wafer 400 on the corresponding side; the aforementioned external air The source can be air or nitrogen.

FIG. 4 shows another embodiment of the present invention, which is different from the foregoing embodiments in that the air outlet assembly includes an air outlet pipe 14 located beside the base 11 and independent of the base 11, so as to facilitate Retrofit and upgrade of existing equipment. The air outlet pipe 14 is preferably extended along the outer edge of the base portion 11 , and the diameter of the air outlet pipe 14 preferably does not exceed the thickness of the base portion 11 to reduce the influence on the action of the manipulator 100 ; the air outlet pipe 14 A vent hole 13' is opened on the top.

The silicon wafer separation device 200 includes a plurality of the aforementioned manipulators 100 , a movable support 21 , a blowing pipe 22 , a positioning side plate 23 and a positioning cylinder 24 . A number of the manipulators 100 are arranged at intervals along the bracket 21. Specifically, the manipulators 100 are arranged below the bracket 21. During the slicing process, the bracket 21 moves to the top of the flower basket 300. And a plurality of the manipulators 100 are arranged in sequence along the first direction. Preferably, the spacing between adjacent manipulators 100 corresponds to the tooth spacing of the flower basket 300 .

The blowing pipe 22 is provided with a blowing hole 221 for blowing the silicon wafer 400 to be separated. The positioning side plates 23 are arranged in two pieces and are oppositely arranged front and rear along the first direction. The distance between the two positioning side plates 23 is slightly larger than the length of the aforementioned flower basket 300 . The positioning cylinder 24 is arranged on the side of one of the positioning side plates 23 . When the flower basket 300 is moved and placed between the two positioning side plates 23 , the Press the flower basket 300 in the direction to fix the position of the flower basket 300 .

In an actual production process, the silicon wafer separation device 200 further includes a plurality of holding robots (not shown), and the holding robots and the aforementioned robots 100 are arranged in correspondence with each other. Wherein, when the manipulator 100 picks up and moves one of the two silicon wafers 400 in a pair, the holding manipulator is used to hold and fix the other one of the two silicon wafers 400 in the flower basket 300 . The initial position, that is, the holding manipulator is used to fix the silicon wafers 400 located on the side of the base 11 away from the suction cup 12 among the aforementioned silicon wafers 400 in pairs. After the flower basket 300 is positioned, the holding manipulator is preferably configured to move into the flower basket 300 in a horizontal direction to hold the corresponding silicon wafer 400 .

The blowing pipe 22 is preferably arranged in a linear extension, the blowing holes 221 are evenly arranged along the extending direction of the blowing pipe 22, and the spacing between the adjacent blowing holes 221 also corresponds to the tooth spacing of the flower basket 300, So that the blowing holes 221 can just blow the silicon wafers 400 that are abutted against each other in pairs. In addition, the opening directions of the blowing holes 221 are the same.

In this embodiment, the blowing pipes 22 extend along the first direction and are located below the positioned flower basket 300 and the silicon wafer 400 to be separated, and the blowing pipes 22 are preferably arranged in two. In actual operation, the air pressure of the air blowing pipe 22 and the distance between the air blowing pipe 22 and the flower basket 300 need to be adjusted in a balanced manner, so as to ensure that the airflow blown from the air blowing holes 221 can effectively act on the corresponding silicon wafer 400, and The blowing pipe 22 may be prevented from being touched during the placement and movement of the flower basket 300 .

As shown in FIG. 5 , another embodiment of the present invention is shown, which is different from the previous embodiment in that the blowing pipe 22 is arranged on the bracket 21 and moves together with the bracket 21 . With reference to FIG. 6 , the blowing pipes 22 are preferably arranged in two and located on both sides of the manipulator 100 respectively.

To sum up, the manipulator 100 and the silicon wafer separating device 200 of the present invention blow air to the silicon wafer 400 on the side away from the suction cup 12 through the air outlet component, so as to prevent the silicon wafer 400 from adhering to the corresponding manipulator 100 . The fragmentation rate is reduced and the production efficiency is guaranteed; and the residual moisture on the surface of the silicon wafer 400 can be reduced, which is beneficial to the subsequent transportation of the silicon wafer 400 and avoids the sliding deviation of the silicon wafer 400 . Further, the silicon wafer separating device 200 blows the silicon wafers 400 to be separated through the blowing holes 221 on the blowing pipe 22 , thereby reducing the adhesion of the silicon wafers 400 during separation and more effectively reducing the silicon wafers during the slicing process. 400 breakage chance.

It should be understood that although this specification is described in terms of embodiments, not every embodiment only includes an independent technical solution, and this description in the specification is only for the sake of clarity, and those skilled in the art should take the specification as a whole, and each The technical solutions in the embodiments can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

The series of detailed descriptions listed above are only specific descriptions for the feasible embodiments of the present invention, and they are not intended to limit the protection scope of the present invention. Any equivalents made without departing from the technical spirit of the present invention Embodiments or changes should all be included within the protection scope of the present invention.

Claims (10)

1. a kind of manipulator is in flat including setting and can visit the base portion put between adjacent two silicon wafer, positioned at the base portion Side and the sucker to draw silicon wafer, it is characterised in that: the manipulator further includes pneumatic module out, it is described go out pneumatic module to It blows to silicon wafer of the base portion away from sucker side is located at.

2. manipulator according to claim 1, it is characterised in that: the pneumatic module out includes that setting deviates from the base portion The venthole of one side surface of sucker.

3. manipulator according to claim 2, it is characterised in that: the venthole uniformly divides along the surface of the base portion Cloth.

4. manipulator according to claim 1, it is characterised in that: the pneumatic module out includes being located at the base portion side Escape pipe offers venthole on the escape pipe.

5. a kind of silicon wafer separator, the silicon wafer will be successively arranged in the gaily decorated basket in pairs and along first direction is separated, It is characterized by: the silicon wafer separator includes the bracket and several according to any one of claims 1-4 of activity setting Manipulator, several manipulators are successively spaced setting along the bracket.

6. silicon wafer separator according to claim 5, it is characterised in that: the spacing of the adjacent manipulator and the flower The tooth pitch of basket is corresponding.

7. silicon wafer separator according to claim 5, it is characterised in that: the silicon wafer separator further includes blowing It manages, the gas hole to blow to aforementioned silicon wafer in pairs is offered on the gas blow pipe.

8. silicon wafer separator according to claim 7, it is characterised in that: the gas blow pipe is arranged in be separated aforementioned The lower section of silicon wafer and extend in a first direction setting；The gas hole is uniformly arranged along the extending direction of the gas blow pipe, adjacent The spacing of the gas hole is corresponding with the tooth pitch of the gaily decorated basket.

9. silicon wafer separator according to claim 7, it is characterised in that: gas blow pipe setting on the bracket and It is moved together with the bracket.

10. silicon wafer separator according to claim 9, it is characterised in that: the gas blow pipe linearly extends and is arranged It is two.