CN202421228U - Kelvin test slide holder - Google Patents
Kelvin test slide holder Download PDFInfo
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- CN202421228U CN202421228U CN2011205512972U CN201120551297U CN202421228U CN 202421228 U CN202421228 U CN 202421228U CN 2011205512972 U CN2011205512972 U CN 2011205512972U CN 201120551297 U CN201120551297 U CN 201120551297U CN 202421228 U CN202421228 U CN 202421228U
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Abstract
The utility model relates to a Kelvin test slide holder, which is characterized in that a testing contact electrode and a testing lead interface are inlaid in a disc-shaped insulation slide body; the testing contact electrode comprises a plurality of circular conductive materials; all the circular conductive materials are insulated from one another; a circular vacuum groove is arranged in the center of a circular plane at the upper part of each circular conductive material, and a vacuum through hole is arranged in each circular vacuum groove; the vacuum through holes are connected with a vacuum interface through internal through holes which can extend out of the disc-shaped insulation slide body; and a contact surface between the detection wire and the excitation wire of a Kelvin circuit and a detected device chip is contacted without leaving any gap as much as possible by improving the structure of the test slide holder without changing an existing chip testing method, so that resistance errors caused by the test slide holder in a chip test are effectively reduced, and the defect rate and the production cost are reduced.
Description
Technical field
The utility model relates to the power device chip performance test apparatus, relates to a kind of Kelvin (Kelvin) test slides platform.
Background technology
For the forward voltage drop of power device chip or the test of on state resistance, for the accuracy of testing, industry has all been taked Kelvin (Kelvin) method of testing at present.Kelvin (Kelvin) test is exactly four usually said line test modes, and the purpose of four line Kelvins test is the pressure drop that the deduction conductor resistance brings.The equivalent resistance of one section 30 centimeter length lead the chances are ten milliohms are to hundred milliohms, if through the electric current of lead enough big (such as being the ampere level), the pressure drop at lead two ends just reaches tens to millivolts up to a hundred so.
But; The test microscope carrier of present vertical operating power semiconductor device chip all is as one with whole microscope carrier; And electronegative potential excitation lines LI and electronegative potential detection line LV are received on the microscope carrier; Like this, the contact resistance between this bulk resistor of microscope carrier and microscope carrier and the chip is all tested as the part of device resistance in series, thereby has caused test error.Though can partly reduce these resistance influences through taking technological means such as surface gold-plating, reasonable vacuum suction; But under high-current test; Still can produce the above resistance in series of at least 5 milliohms; For high-current test, will produce test errors tens of even up to a hundred millivolts; This test error is high-power for some, be unacceptable for the device of low forward voltage drop or on state resistance, especially the big electric current schottky diode of power-type generally has only 20～50 millivolts surplus between its product specification value and the representative value.The resistance error that produces of test then causes chip stage accurately to judge test to the actual specification of product thus, just can carry out test judgement after must arriving Chip Packaging, thereby cause the increase of production cost.
Summary of the invention
To the problems referred to above; The purpose of the utility model provides a kind of design proposal of novel Kelvin (Kelvin) test slides platform; On the basis that does not change existing chip detecting method; Through the structure of test slides platform is transformed; Make the detection line and the excitation lines of Kelvin (Kelvin) circuit accomplish as far as possible that with the surface in contact between the measured device chip zero-clearance contacts, the contact resistance of making every effort between them levels off to 0, thus when effectively reducing chip testing because the resistance error that the test slides platform causes.
For realizing above-mentioned purpose; The utility model is taked following technical scheme: a kind of Kelvin (Kelvin) test slides platform; Comprise discoid insulation slide glass body, it is characterized in that: on discoid insulation slide glass body, also inlayed test contact electrode and test lead interface;
Said discoid insulation slide glass body is discoid, and the test contact electrode on the discoid insulation slide glass body is to be made up of some ring-type conductive materials, and mutually insulated between each ring-type conductive material is embedded in respectively on the discoid insulation slide glass body;
Planar annular center on each said ring-type conductive material top is processed with a ring vaccum groove, on each bar ring vaccum groove, is processed with a vacuum through hole; The bottom of vacuum through hole is communicated with one and is in the intrinsic interior bone of discoid insulation slide glass; Interior bone connects the vacuum through hole on each said ring-type conductive material each other;
One end of interior bone extends to that discoid insulation slide glass body is external to be connected with vacuum interface;
The bottom of said round insulation slide glass body is processed with the groove position corresponding with each ring-type conductive material position, and processing screw hole on the corresponding ring-type conductive material in groove position is installed screw in the screw, and an end of screw leads to below, groove position, fix with great current lead wire,
The bottom of said round insulation slide glass body is fixed with 4 test lead interfaces and threading via hole, and 4 test lead interfaces pass threading via hole and connect with corresponding great current lead wire respectively; Lead-in wire of the every corresponding connection of ring-type conductive material, several lead-in wires are divided into two groups, and as the LI lead-in wire and the LV lead-in wire of Kelvin (Kelvin) test circuit, every group of interior lead-in wire is connected to corresponding test lead interface respectively.
Every block of ring-type conductive material all need be installed lead-in wire; These lead-in wires can be divided into two groups; LI lead-in wire and LV as Kelvin's test circuit goes between respectively; Lead-in wire in every group both can be connected to corresponding test lead interface after the parallel connection, also can separate independent connect corresponding to the test lead interface.
The material of the ring-type conductive material of inlaying on the discoid insulation slide glass body is copper billet or gold-plated nickel.
The utility model is owing to take above technical scheme, and it has the following advantages: the vacuum through hole is through may extend to the external interior bone of discoid insulation slide glass body
WithVacuum interface connects; On the basis that does not change existing chip detecting method; Through the structure of test slides platform is transformed; Make the detection line and the excitation lines of Kelvin's circuit accomplish as far as possible that with the surface in contact between the measured device chip zero-clearance contacts, the contact resistance of making every effort between them levels off to 0, the resistance error that causes owing to the test slides platform when effectively reducing chip testing; Thereby reduce owing to the defective products rate of measuring the inaccurate chip that causes, reduce production costs.
Description of drawings
Fig. 1 is Kelvin's test slides platform plane structure chart;
Fig. 2 is the equivalent circuit diagram of Kelvin (Kelvin) test;
Fig. 3 is discoid insulation slide glass body vacuum hole part-structure figure;
Fig. 4 is discoid insulation slide glass body lead portion structural drawing;
Fig. 5 is conductive material distribution form 2 synoptic diagram of the utility model;
Fig. 6 is conductive material distribution form 3 synoptic diagram of the utility model;
Fig. 7 is conductive material distribution form 4 synoptic diagram of the utility model.
Embodiment
Below in conjunction with accompanying drawing and embodiment the detailed description of carrying out to the utility model.
Extremely shown in Figure 7 like Fig. 1; Kelvin (Kelvin) test slides platform comprises discoid insulation slide glass body; Also inlayed test contact electrode and test lead interface at discoid insulation slide glass body, and employing has the fixedly vacuum suction fixing structure of measured device chip of zero-clearance;
A kind of Kelvin (Kelvin) test slides platform comprises discoid insulation slide glass body, it is characterized in that: on discoid insulation slide glass body, also inlayed test contact electrode and test lead interface;
Said discoid insulation slide glass body 11 is discoid, and the test contact electrode on the discoid insulation slide glass body 11 is to be made up of some ring-type conductive materials 12, and mutually insulated between each ring-type conductive material 12 is embedded in respectively on the discoid insulation slide glass body 11;
Planar annular center on each said ring-type conductive material 12 top is processed with a ring vaccum groove 13, on each bar ring vaccum groove 13, is processed with a vacuum through hole 16; The bottom of vacuum through hole 16 is communicated with an interior bone 15 that is in the discoid insulation slide glass body 11; Interior bone 15 connects the vacuum through hole 16 on each said ring-type conductive material 12 each other;
One end of interior bone 15 extends to that discoid insulation slide glass body 11 is external to be connected with vacuum interface 17;
The bottom of said round insulation slide glass body 11 is processed with the groove position corresponding with each ring-type conductive material 12 position; Processing screw hole on the corresponding ring-type conductive material 12 in groove position; Screw 19 is installed in the screw, and an end of screw 19 leads to below, groove position, and is fixing with great current lead wire 21;
The bottom of said round insulation slide glass body 11 is fixed with 4 test lead interfaces 18 and passes threading via hole 20 with 20,4 test lead interfaces 18 of threading via hole and connect with corresponding great current lead wire 21 respectively; Lead-in wire 21 of every ring-type conductive material 12 corresponding connections, several lead-in wires 21 are divided into two groups, and as the LI lead-in wire and the LV lead-in wire of Kelvin (Kelvin) test circuit, every group of interior lead-in wire 21 is connected to corresponding test lead interface 18 respectively.
Lead-in wire 21 in every group both can be connected in parallel, and also can separate independent connection.
The equivalent electrical circuit of Kelvin's test is as shown in Figure 2, wherein R
tEquivalence is a measured device, through current source I's and noble potential excitation lines HI and electronegative potential excitation lines LI be that device provides constant current, be connected measure R through noble potential detection line HV, the electronegative potential detection line LV that inserts high input impedance with voltage table
tThe voltage at two ends.r
1, r
2, r
3, r
4Be respectively the conductor resistance and the contact resistance sum of each connecting line.Owing to be connected to high impedance on the detection line, the electric current that therefore flows through on the detection line is minimum, is approximately zero.Because flowing through the electric current of detection line is zero, at r
3And r
4On pressure drop also be zero, and exciting current I is at r
1And r
2Pressure drop do not influence I at measured resistance R
tOn pressure drop, so voltage table V can accurately measure R
tThe pressure drop at two ends.Test result and each conductor resistance and contact resistance r
1, r
2, r
3, r
4Irrelevant, effectively reduced measuring error.
The round insulation slide glass body 11 of the utility model, its diameter dimension should be greater than the chip size of needs test; The ring-type conductive material of on insulation slide glass body, inlaying 12, like copper billet, gold-plated nickel block etc., ring-type conductive material 12 can be two, also can be that polylith carries out the parallel connection use.Mutually insulated between these conductive materials connects the back as the excitation lines of Kelvin (Kelvin) test and the part of detection line through lead-in wire, makes the detection line of Kelvin (Kelvin) circuit and excitation lines try one's best near the chip body.
Test process utilizes the vacuum suction effect can effectively reduce contact resistance.It should be noted that because semi-conductor chip is slim hard brittle material, so the surface smoothness after needing appropriate design to inlay, the normal use of slide holder could be guaranteed.
Fig. 4 is Kelvin (Kelvin) wiring diagram of this slide holder; The groove position is left in bottom at round insulation slide glass body 11; At borehole on the ring-type conductive material 12 and screw 19 is installed is led to below the groove position, screw 19 takes conductive material to make, and directly and 12 conductings of ring-type conductive material; Great current lead wire 21 is installed in the bottom of screw 19, links to each other with lead-in wire interface 18 through through hole 20.It should be noted that every block of ring-type conductive material all need install lead-in wire, these lead-in wires can be divided into two groups, are respectively applied for the LI and the LV lead-in wire of Kelvin (Kelvin) test circuit, and the lead-in wire in every group both can be connected in parallel, and also can separate independent connection.
According to above-mentioned explanation, can realize the scheme of the utility model in conjunction with art technology.
Claims (3)
1. Kelvin's test slides platform comprises discoid insulation slide glass body, it is characterized in that: on discoid insulation slide glass body (11), also inlayed test contact electrode and test lead interface; Said discoid insulation slide glass body (11) is discoid; Test contact electrode on the discoid insulation slide glass body (11) is to be made up of some ring-type conductive materials (12); Mutually insulated between each ring-type conductive material (12) is embedded in respectively on the discoid insulation slide glass body (11); Planar annular center on each said ring-type conductive material (12) top is processed with a ring vaccum groove (13), on each bar ring vaccum groove (13), is processed with a vacuum through hole (16); The bottom of vacuum through hole (16) is communicated with an interior bone (15) that is in the discoid insulation slide glass body (11); Interior bone (15) connects the vacuum through hole (16) on each said ring-type conductive material (12) each other; One end of interior bone (15) extends to that discoid insulation slide glass body (11) is external to be connected with vacuum interface (17); The bottom of said round insulation slide glass body (11) is processed with and corresponding groove position, each ring-type conductive material (12) position; The ring-type conductive material (12) corresponding in the groove position gone up processing screw hole; Screw (19) is installed in the screw; One end of screw (19) leads to below, groove position, and is fixing with great current lead wire (21); The bottom of said round insulation slide glass body (11) is fixed with 4 test lead interfaces (18) and threading via hole (20), and 4 test lead interfaces (18) pass threading via hole (20) and connect with corresponding great current lead wire (21) respectively; The corresponding lead-in wire (21) that connects of every block of ring-type conductive material (12), several lead-in wires (21) are divided into two groups, and as the LI lead-in wire and the LV lead-in wire of Kelvin's test circuit, every group of interior lead-in wire (21) is connected to corresponding test lead interface (18) respectively.
2. Kelvin's test slides platform according to claim 1; It is characterized in that: every block of ring-type conductive material (12) all need be installed lead-in wire (21); These lead-in wires (21) can be divided into two groups; Respectively as the LI of Kelvin's test circuit lead-in wire and LV lead-in wire, the lead-in wire in every group both can be connected to corresponding test lead interface (18) after the parallel connection, also can separate the independent corresponding test lead interface (18) that arrives that connects.
3. Kelvin's test slides platform according to claim 1, it is characterized in that: the material of the ring-type conductive material of inlaying on the discoid insulation slide glass body (11) (12) is copper billet or gold-plated nickel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205512972U CN202421228U (en) | 2011-12-26 | 2011-12-26 | Kelvin test slide holder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205512972U CN202421228U (en) | 2011-12-26 | 2011-12-26 | Kelvin test slide holder |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202421228U true CN202421228U (en) | 2012-09-05 |
Family
ID=46745981
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205512972U Withdrawn - After Issue CN202421228U (en) | 2011-12-26 | 2011-12-26 | Kelvin test slide holder |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202421228U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102565468A (en) * | 2011-12-26 | 2012-07-11 | 天津中环半导体股份有限公司 | Kelvin test slide stage |
| CN104297571A (en) * | 2014-09-28 | 2015-01-21 | 周峰 | Wafer bearing table and Kelvin four-wire test conducting method thereof |
-
2011
- 2011-12-26 CN CN2011205512972U patent/CN202421228U/en not_active Withdrawn - After Issue
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102565468A (en) * | 2011-12-26 | 2012-07-11 | 天津中环半导体股份有限公司 | Kelvin test slide stage |
| CN102565468B (en) * | 2011-12-26 | 2013-10-16 | 天津中环半导体股份有限公司 | Kelvin test slide stage |
| CN104297571A (en) * | 2014-09-28 | 2015-01-21 | 周峰 | Wafer bearing table and Kelvin four-wire test conducting method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20120905 Effective date of abandoning: 20131016 |
|
| RGAV | Abandon patent right to avoid regrant |