CN202406395U - Auxiliary joint for fixing multilayer PCB inner core board - Google Patents
Auxiliary joint for fixing multilayer PCB inner core board Download PDFInfo
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- CN202406395U CN202406395U CN2011205566370U CN201120556637U CN202406395U CN 202406395 U CN202406395 U CN 202406395U CN 2011205566370 U CN2011205566370 U CN 2011205566370U CN 201120556637 U CN201120556637 U CN 201120556637U CN 202406395 U CN202406395 U CN 202406395U
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Abstract
The utility model relates to an auxiliary structure for fixing a multilayer PCB (Printed Circuit Board) inner core board, which comprises a plurality of explosion-proof hole groups, a plurality of non copper sheet regions and a plurality of inner layer hot melting blocks, wherein the explosion-proof hole groups vertically penetrate the part outside a forming line on each layer of the circuit board; the non copper sheet regions are arranged outside the forming lines on both upper and the lower secondary outer layers of the circuit board; the inner layer hot melting blocks are arranged outside the forming lines on each inner layer outside the upper and the lower secondary outer layers; the explosion-proof hole groups, the non copper sheet regions and the inner layer hot melting blocks are aligned on the same centerline in the vertical direction; each explosion-proof hole group comprises two to six explosion-proof holes which are linearly formed at equal intervals; each inner layer hot melting block comprises inner layer copper bar grids and a plurality of inner layer non copper regions; the inner layer copper bar grids are formed in the mode that a plurality of inner layer short copper bars which are transversely arranged in parallel at equal intervals and a plurality of inner layer long copper bars which are longitudinally arranged in parallel at equal intervals are vertically crossed; and the inner layer non copper regions are arranged between the inner layer copper bar grids. According to the utility model, the fixing degree of the multilayer circuit-board inner core board can be effectively improved; the cost investment is not increased, and the auxiliary structure is beneficial for improving the efficiency of the laminating operation and promoting the product quality.
Description
Technical field
The utility model relates to multi-layer PCB core material skew control technology field, is specifically related to fixedly supplementary structure of a kind of multi-layer PCB core material.
Background technology
Multilayer circuit board is formed through the press pressing by outer copper foil and the some central layer collocation of internal layer insulation PP interlayer.In the actual production process; Core material is prone to produce when high temperature, high pressure pressing slide; Each core material is squinted each other; Cause and to fail to aim at the figure of same vertical plane, poor flow phenomenons such as internal layer open circuit, short circuit occur thereby cause being prone to wiring board, even cause scrapping through boring, plating back.
For avoiding central layer in the pressing process, to produce displacement relatively, traditional way is to the core material predetermined fixed before pressing.Fixed form mainly contains two kinds in the prior art, and a kind of is to fix through rivet, and another kind is fixing through fusing.Adopt that rivet is fixing to need on core material, process in advance rivet hole, this has just increased process flow, has reduced production efficiency, and every wiring board will use 6-14 rivet, increases production cost greatly.In addition, the alignment precision of rivet driver is+/-1.5MIL, therefore, this kind mode can't adapt to the requirement to the higher accurate wiring board of required precision, only is used to wiring board production simple in structure, and progressively is eliminated.As the fixing replacement mode of rivet; Utilize hot melt fixedly to become main flow; This kind fixed form is with the insulation PP interlayer high temperature melting between each core material, utilizes fusing insulation PP interlayer that each core material is clung to reach fixedly purpose, though this kind fixed form can overcome the fixing deficiency of rivet; But in practice, have the core material phenomenon such as insecure that is adhesively fixed, and the high temperature hot melt quality problem such as easy plate bursting layering, the residual plating of liquid medicine have been brought.
Summary of the invention
In view of this, the utility model provides fixedly supplementary structure of the multi-layer PCB core material that a kind ofly can effectively improve multilayer circuit board core material fixation degree, do not increase the cost input, help to improve the pressing operating efficiency and promote product quality in the technical problem that will solve.
For solving the problems of the technologies described above; The technical scheme that the utility model provides is: a kind of multi-layer PCB core material is supplementary structure fixedly, comprises vertically penetrating in each layer of wiring board going up a plurality of explosionproof hole groups beyond the form wire, being arranged on the wiring board a plurality of no copper sheet district beyond two outer form wires and be arranged on except that two on form wire a plurality of internal layer hot melt pieces in addition on each internal layer the next skin up and down.
Said explosionproof hole group, no copper sheet district and internal layer hot melt piece align in vertical direction at same center line.
Said explosionproof hole group comprises the explosionproof hole that at least two straight line equidistance are arranged, but as preferred, said explosionproof hole group comprises the explosionproof hole that two to six straight line equidistance are arranged.The diameter of said explosionproof hole is 0.5-1.5MM, and the spacing of explosionproof hole is 2.0-5.0MM, but the concrete quantity of explosionproof hole, size, spacing can be selected according to structure, size and the size of wiring board.The insulation PP interlayer of fusion points is by the high temperature melting depression that becomes during because of pressing; Be prone to cause fusion points central layer junction gapped; When carrying out the outer-layer circuit making after the pressing, liquid medicine is prone to remain to gap location through the edges of boards infiltration, is prone to cause oven dry section liquid medicine can not evaporate.This programme is through being provided with the explosionproof hole group at each layer of wiring board, effectively stop pressing after during follow-up wet flow process liquid medicine residual, avoid the liquid medicine evaporation to receive temperatures involved and can't get rid of, reduce layering plate bursting risk.During practical application, said explosionproof hole need not have copper design, phenomenons such as copper facing is coarse to eliminate in the explosionproof hole, residual liquid medicine, thus avoid liquid medicine to be penetrated into the circuit quality that shaping area influences the PCS plate.
Because general wiring board is a rectangle, said no copper sheet district and internal layer hot melt piece all are square, and size is identical, to adapt to the shape of wiring board, promote the substrate utilance.
The inventor finds that through experiment heat absorption rate under hot melt high temperature is fast for the copper layer, and the heat that shop insulation PP interlayer above that absorbs the transmission of copper layer spreads rapidly, is prone to cause thickness of slab uneven.Therefore, the utility model reduces the flowing velocity of insulation PP interlayer when high-temperature fusion through no copper sheet district is set, and avoids causing thickness of slab uneven.
The concrete number of said internal layer hot melt piece on each internal layer is 10-60, according to every long limit 4-10, every minor face is set and 1-5, equidistance, is set in parallel in each internal layer four limit, and the back gauge of said internal layer hot melt piece and form wire is 6-15MM.Number through internal layer hot melt piece rationally is set, distribution mode with and with the distance of form wire; Can guarantee effectively that the PCS wiring board quality in the shaping area is not influenced by hot melt processing; The equidistance of internal layer hot melt piece, parallel corresponding design can make the fuse machine working (machining) efficiency reach best simultaneously.
Said internal layer hot melt piece comprises internal layer copper bar grid and a plurality of internal layer Wu Tong district that the long copper bar of internal layer that the short copper bar of internal layer arranged by a plurality of parallel transverse equidistance and a plurality of parallel longitudinal direction equidistance are arranged intersects vertically and forms, and said internal layer Wu Tong district is arranged between internal layer copper bar grid.The inventor is through discovering, internal layer hot melt piece is designed to latticedly can increase central layer hot melt place adhesion, effectively improves multilayer circuit board core material fixation degree.
The number of the long copper bar of said internal layer is 3-6; The number of the short copper bar of internal layer is 4-10; The width of short copper bar of said internal layer and the long copper bar of internal layer is 0.3-0.8MM, and the spacing between the short copper bar of internal layer is 1.0-2.5MM, and the spacing between the long copper bar of internal layer is 1.5-3.0MM.During practical implementation, number, width, the spacing of short copper bar of said internal layer and the long copper bar of internal layer can comprehensively be decided according to actual track board size and wiring board product structure.
Compared with prior art; The utlity model has following advantage: 1, the utility model is through being provided with the explosionproof hole group at each layer of wiring board; Effectively stop pressing after during follow-up wet flow process liquid medicine residual, avoid the liquid medicine evaporation to receive temperatures involved and can't get rid of, reduce layering plate bursting risk.Phenomenons such as during practical application, in conjunction with explosionproof hole need there not being copper design, copper facing is coarse to eliminate in the explosionproof hole, residual liquid medicine, thus avoid liquid medicine to be penetrated into the circuit quality that shaping area influences the PCS plate.2, the utility model reduces the flowing velocity of insulation PP interlayer when high-temperature fusion through no copper sheet district is set, and avoids causing thickness of slab uneven.3, internal layer hot melt piece is designed to latticedly can increase central layer hot melt place adhesion; Effectively improve multilayer circuit board core material fixation degree; Guarantee insulation PP interlayer in reflow process, to be difficult for running off and thickness of slab to occur thin partially; And the number through internal layer hot melt piece rationally is set, distribution mode with and with the distance of form wire; Can guarantee effectively that the PCS wiring board quality in the shaping area is not influenced by hot melt processing, the equidistance of internal layer hot melt piece, parallel corresponding design can make the fuse machine working (machining) efficiency reach best simultaneously.4, in addition, the utility model is simple in structure, easy to be implemented, and can under the prerequisite that reduces cost, promote production efficiency and substrate utilance.
Description of drawings
Fig. 1 is the utility model embodiment explosionproof hole group structural representation;
Fig. 2 does not have copper sheet plot structure sketch map for the utility model embodiment;
Fig. 3 is the utility model embodiment internal layer hot melt block structure sketch map;
Fig. 4 is that the utility model embodiment explosionproof hole group, no copper sheet district, internal layer hot melt piece are at vertical direction closed state sketch map;
Fig. 5 is view when the utility model embodiment is applied to wiring board.
Embodiment
Understand for the ease of those skilled in the art, will combine accompanying drawing and embodiment that the utility model is explained in further detail below.
Like Fig. 1,2,3,4, shown in 5; A kind of multi-layer PCB core material is supplementary structure fixedly, comprises vertically penetrating in each layer of wiring board going up a plurality of explosionproof hole groups 1 beyond the form wire, being arranged on the wiring board a plurality of no copper sheet district 2 beyond two outer form wires and be arranged on except that two on form wire a plurality of internal layer hot melt pieces 3 in addition on each internal layer the next skin up and down.Explosionproof hole group, no copper sheet district and internal layer hot melt piece align in vertical direction at same center line.
In the present embodiment, a plurality of explosionproof hole groups 1 are meant vertically to penetrate in each layer of wiring board and go up 16 explosionproof hole groups beyond the form wire that wherein two of wiring board long limits respectively are provided with four explosionproof hole groups, two minor faces respectively are provided with two explosionproof hole groups.Explosionproof hole group equidistant line on long limit, the minor face is arranged, and four explosionproof hole groups on the two long limits are corresponding one by one parallel, and two explosionproof hole groups on two minor faces are corresponding one by one parallel.A plurality of no copper sheets district 2 is meant beyond last time outer form wire and 16 no copper sheet districts that are provided with respectively beyond the next outer form wire.A plurality of internal layer hot melt pieces 3 are meant and are arranged on two 16 internal layer hot melt pieces beyond the form wire on each internal layer the next skin; Also be that the concrete number of internal layer hot melt piece on each internal layer is 16; According to every long limit four, every minor face are set and two, equidistance, be set in parallel in each internal layer four limit.16 explosionproof hole groups are corresponding one by one with 16 no copper sheet districts and 16 internal layer hot melt pieces on each internal layer on the last next skin.
Number through internal layer hot melt piece rationally is set, distribution mode with and with the distance of form wire; Can guarantee effectively that the PCS wiring board quality in the shaping area is not influenced by hot melt processing; The equidistance of internal layer hot melt piece, parallel corresponding design can make the fuse machine working (machining) efficiency reach best simultaneously.
Above-mentioned internal layer hot melt piece comprises internal layer copper bar grid 31 and 15 internal layer Wu Tong districts 32 that the long copper bar of internal layer of the short copper bar of the internal layer of being arranged by five parallel transverse equidistance and four parallel longitudinal direction equidistance arrangements intersects vertically and forms, and internal layer Wu Tong district is arranged between internal layer copper bar grid.The inventor is through discovering, internal layer hot melt piece is designed to latticedly can increase central layer hot melt place adhesion.
In the present embodiment, the width of short copper bar of internal layer and the long copper bar of internal layer is 0.3-0.8MM, and the spacing between the short copper bar of internal layer is 1.0-2.5MM, and the spacing between the long copper bar of internal layer is 1.5-3.0MM.In the present embodiment, the back gauge of internal layer hot melt piece and form wire is 6MM.But during practical implementation, number, width, the spacing of short copper bar of said internal layer and the long copper bar of internal layer can comprehensively be decided according to actual track board size and wiring board product structure.
In the present embodiment, explosionproof hole group 1 comprises the explosionproof hole that two straight line equidistance are arranged, and the diameter of explosionproof hole is 0.5MM, and the spacing of explosionproof hole is 2.0MM.The insulation PP interlayer of fusion points is by the high temperature melting depression that becomes during because of pressing; Be prone to cause fusion points central layer junction gapped; When carrying out the outer-layer circuit making after the pressing, liquid medicine is prone to remain to gap location through the edges of boards infiltration, is prone to cause oven dry section liquid medicine can not evaporate.This programme is through being provided with the explosionproof hole group at each layer of wiring board, effectively stop pressing after during follow-up wet flow process liquid medicine residual, avoid the liquid medicine evaporation to receive temperatures involved and can't get rid of, reduce layering plate bursting risk.During practical application, said explosionproof hole need not have copper design, phenomenons such as copper facing is coarse to eliminate in the explosionproof hole, residual liquid medicine, thus avoid liquid medicine to be penetrated into the circuit quality that shaping area influences the PCS plate.
Because general wiring board is a rectangle, therefore, no copper sheet district 2 all is square with internal layer hot melt piece in the present embodiment, and size is identical, to adapt to the shape of wiring board, promotes the substrate utilance.Heat absorption rate under hot melt high temperature is fast for the copper layer, and the heat that shop insulation PP interlayer above that absorbs the transmission of copper layer spreads rapidly, is prone to cause thickness of slab uneven.Therefore through no copper sheet district is set, reduce the flowing velocity of insulation PP interlayer when high-temperature fusion, avoid causing thickness of slab uneven.
The foregoing description is the preferred implementation of the utility model, and in addition, the utility model can also have other implementations.That is to say that under the prerequisite that does not break away from the utility model design, any conspicuous replacement also should fall within the protection range of the utility model.
Claims (9)
1. the fixing supplementary structure of a multi-layer PCB core material is characterized in that: comprise vertically penetrate in each layer of wiring board go up a plurality of explosionproof hole groups (1) beyond the form wire, be arranged on wiring board up and down a plurality of no copper sheet district (2) beyond two outer form wires be arranged on two form wire a plurality of internal layer hot melt pieces (3) in addition on each internal layer the next skin.
2. a kind of multi-layer PCB core material according to claim 1 is supplementary structure fixedly, it is characterized in that: said explosionproof hole group (1), no copper sheet district (2) and internal layer hot melt piece (3) align in vertical direction at same center line.
3. a kind of multi-layer PCB core material according to claim 1 is supplementary structure fixedly, it is characterized in that: said explosionproof hole group (1) comprises the explosionproof hole that two to six straight line equidistance are arranged.
4. a kind of multi-layer PCB core material according to claim 3 is supplementary structure fixedly, it is characterized in that: the diameter of said explosionproof hole (1) is 0.5-1.5MM, and the spacing of explosionproof hole is 2.0-5.0MM.
5. a kind of multi-layer PCB core material according to claim 1 is supplementary structure fixedly, it is characterized in that: said no copper sheet district (2) all is square with internal layer hot melt piece (3), and size is identical.
6. a kind of multi-layer PCB core material according to claim 1 is supplementary structure fixedly; It is characterized in that: the concrete number of said internal layer hot melt piece (3) on each internal layer is 10-60; According to every long limit 4-10 is set, every minor face is provided with 1-5; Equidistance, be set in parallel in each internal layer four limit, and the back gauge of said internal layer hot melt piece and form wire is 6-15MM.
7. according to the fixing supplementary structure of claim 1 or 6 described a kind of multi-layer PCB core materials; It is characterized in that: said internal layer hot melt piece (3) comprises internal layer copper bar grid (31) and a plurality of internal layer Wu Tong districts (32) that the long copper bar of internal layer that the short copper bar of internal layer arranged by a plurality of parallel transverse equidistance and a plurality of parallel longitudinal direction equidistance are arranged intersects vertically and forms, and said internal layer Wu Tong district (32) is arranged between internal layer copper bar grid (31).
8. a kind of multi-layer PCB core material according to claim 7 is supplementary structure fixedly, it is characterized in that: the number of the long copper bar of said internal layer is 3-6, and the number of the short copper bar of internal layer is 4-10.
9. a kind of multi-layer PCB core material according to claim 8 is supplementary structure fixedly; It is characterized in that: the width of short copper bar of said internal layer and the long copper bar of internal layer is 0.3-0.8MM; Spacing between the short copper bar of internal layer is 1.0-2.5MM, and the spacing between the long copper bar of internal layer is 1.5-3.0MM.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205566370U CN202406395U (en) | 2011-12-28 | 2011-12-28 | Auxiliary joint for fixing multilayer PCB inner core board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205566370U CN202406395U (en) | 2011-12-28 | 2011-12-28 | Auxiliary joint for fixing multilayer PCB inner core board |
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| Publication Number | Publication Date |
|---|---|
| CN202406395U true CN202406395U (en) | 2012-08-29 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205566370U Expired - Fee Related CN202406395U (en) | 2011-12-28 | 2011-12-28 | Auxiliary joint for fixing multilayer PCB inner core board |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104427743A (en) * | 2013-08-29 | 2015-03-18 | 北大方正集团有限公司 | Multilayer printed circuit board and manufacturing method thereof |
| CN105722301A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Connection module, multi-layer printed circuit board and connection module production method |
| CN108617076A (en) * | 2018-04-25 | 2018-10-02 | 深圳崇达多层线路板有限公司 | The setting method of position is fused on a kind of wiring board |
| CN109587977A (en) * | 2018-12-14 | 2019-04-05 | 深圳崇达多层线路板有限公司 | A kind of improvement fusion undesirable method of position making sheet |
| WO2022134885A1 (en) * | 2020-12-21 | 2022-06-30 | 智恩电子(大亚湾)有限公司 | Led thick copper circuit board press-fitting front structure and fabrication method therefor |
-
2011
- 2011-12-28 CN CN2011205566370U patent/CN202406395U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104427743A (en) * | 2013-08-29 | 2015-03-18 | 北大方正集团有限公司 | Multilayer printed circuit board and manufacturing method thereof |
| CN104427743B (en) * | 2013-08-29 | 2018-06-15 | 北大方正集团有限公司 | A kind of multilayer printed circuit board and preparation method thereof |
| CN105722301A (en) * | 2014-12-03 | 2016-06-29 | 北大方正集团有限公司 | Connection module, multi-layer printed circuit board and connection module production method |
| CN108617076A (en) * | 2018-04-25 | 2018-10-02 | 深圳崇达多层线路板有限公司 | The setting method of position is fused on a kind of wiring board |
| CN109587977A (en) * | 2018-12-14 | 2019-04-05 | 深圳崇达多层线路板有限公司 | A kind of improvement fusion undesirable method of position making sheet |
| WO2022134885A1 (en) * | 2020-12-21 | 2022-06-30 | 智恩电子(大亚湾)有限公司 | Led thick copper circuit board press-fitting front structure and fabrication method therefor |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120829 Termination date: 20191228 |