CN107148168A - A kind of fusion process of pressure programming - Google Patents
A kind of fusion process of pressure programming Download PDFInfo
- Publication number
- CN107148168A CN107148168A CN201710316749.0A CN201710316749A CN107148168A CN 107148168 A CN107148168 A CN 107148168A CN 201710316749 A CN201710316749 A CN 201710316749A CN 107148168 A CN107148168 A CN 107148168A
- Authority
- CN
- China
- Prior art keywords
- pcb board
- hot melt
- target
- plates
- fusion process
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
- H05K3/4638—Aligning and fixing the circuit boards before lamination; Detecting or measuring the misalignment after lamination; Aligning external circuit patterns or via connections relative to internal circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Pressure Welding/Diffusion-Bonding (AREA)
Abstract
The invention provides a kind of fusion process of pressure programming, it comprises the following steps：The first step, get the raw materials ready, prepare multilayer and meet pcb board and PP plates size requirement, to be laminated；Prepared by second step, hot melt target, several hot melt targets are prepared in the edges of boards region of each pcb board, and ensure that the position of target on each pcb board is corresponding；3rd step, stack, pcb board and PP plates are stacked alternately to form combination layer, and ensure the edges of boards alignment of each pcb board and PP plates；4th step, hot melt, are heated using fuse machine to the hot melt target on combination layer so that the PP at the hot melt target on each pcb board melts to realize the combination of each pcb board and PP plates.Compared with technique for riveting of the prior art, the present invention does not need punch rivet holes to complete pcb board, the combination of PP plates, and the layer which obviated in process for pressing is inclined, and shortens life cycle of the product.
Description
Technical field
The present invention relates to PCB printed substrate production fields, and in particular to a kind of fusion process of pressure programming.
Background technology
Fig. 1 is refer to, in the prior art, pcb board realizes the combination with PP plates through technique for riveting, and its technological process is as follows：
Step 1: preparing several circular targets 2 in the edges of boards region 1 of each pcb board, and ensure the position of the target 2 on each pcb board
Put corresponding；Step 2: going out rivet hole at the target 2 of each pcb board using CCD perforating press；Step 3, is existed using puncher
Get rivet hole in the corresponding position of PP plates；Step 4: each pcb board and PP plates are stacked together, rivet is beaten using rivet driver
Enter in rivet hole to complete the combination of each pcb board and PP plates.
There is following defect in technique for riveting of the prior art：1st, there is gap between rivet hole and rivet, subsequently pressed
Cheng Zhong, PP are by after high temperature melting, and the flowing of PP glue causes pcb board to slide slightly, causes layer inclined；2nd, technological process is complicated, power auger
Hole takes, and extends the production cycle of product.
The content of the invention
In order to solve the above technical problems, the present invention proposes a kind of fusion process of pressure programming, its concrete technical scheme
It is as follows：
A kind of fusion process of pressure programming, it comprises the following steps：
The first step, get the raw materials ready, prepare multilayer and meet pcb board and PP plates size requirement, to be laminated；
Prepared by second step, hot melt target, several hot melt targets are prepared in the edges of boards region of each pcb board, and ensure each
The position of target on pcb board is corresponding；
3rd step, stack, pcb board and PP plates are stacked alternately to form combination layer, and ensure the plate of each pcb board and PP plates
Align on side；
4th step, hot melt, are heated so that the heat on each pcb board using fuse machine to the hot melt target on combination layer
PP at molten target melts to realize the combination of each pcb board and PP plates.
As a further improvement on the present invention, in the hot melt target preparation process, in the edges of boards of the right and left of pcb board
Six targets are prepared in region respectively.
As a further improvement on the present invention, the hot melt target is long 20mm, wide 8mm rectangle target.
As a further improvement on the present invention, in the heat fusion step, extruded using above and below the hot melt block on hot melting equipment
The hot melt target covered on the pcb board by PP.
The fusion process of pressure programming proposed by the present invention prepares hot melt target in the edges of boards region of pcb board, then uses
Fuse machine heating hot melt target so that the PP melt materials at hot melt target, from the combination for realizing pcb board, PP plates.
Compared with technique for riveting of the prior art, the present invention does not need machine drilling to complete the combination of pcb board, its
The layer avoided in anabolic process is inclined, and shortens the production cycle.
Brief description of the drawings
Fig. 1 is the schematic diagram that the pcb board after riveted target makes is completed in existing technique for riveting；
Fig. 2 heats the schematic diagram of the pcb board after target makes for completion in fusion process proposed by the present invention；
Fig. 3 is the structure chart for heating target in Fig. 2.
Embodiment
In order to facilitate the understanding of the purposes, features and advantages of the present invention, it is below in conjunction with the accompanying drawings and specific real
Applying mode, the present invention is further detailed explanation.
Fig. 2 is refer to, in a specific embodiment, the fusion process of pressure programming proposed by the present invention, it is included such as
Lower step：
The first step, get the raw materials ready, prepare multilayer and meet pcb board and PP plates size requirement, to be laminated；
Prepared by second step, target, prepare six sizes respectively in the edges of boards region 1 of the pcb board left and right sides for 20mm*
8mm rectangle target 3, and ensure that the position of target 3 on each pcb board is corresponding；
In the present embodiment, target 3 is etched to be formed, and it includes the Pu Tong areas 32 without copper area 31 and surrounding in center.
3rd step, stack, pcb board and PP plates are stacked alternately to form combination layer, and ensure the plate of each pcb board and PP plates
Align on side；
4th step, hot melt, are heated, heating-up temperature using the hot melt block on fuse machine to the hot melt target on combination layer
Reach the melting temperature (80-100 DEG C) of PP materials so that the PP at the hot melt target on each pcb board melts to realize each pcb board
With the combination of PP plates.
In order to be lifted in the combined strength of pcb board and PP plates, reflow process, it can use and be squeezed above and below the hot melt block of fuse machine
The hot melt target covered on pressure pcb board by PP materials.
It can be seen that, the fusion process of pressure programming proposed by the present invention prepares hot melt target in the edges of boards region of pcb board, then
Using fuse machine heating hot melt target so that the PP melt materials at hot melt target, from the combination for realizing pcb board, PP plates.
Compared with technique for riveting of the prior art, the present invention does not need machine drilling to complete the combination of pcb board, its
The layer avoided in anabolic process is inclined, and shortens the production cycle.
The description with certain particularity detailed enough has been carried out to the present invention above.Ordinary skill in art
Personnel are it should be understood that what the description in embodiment was merely exemplary, before without departing from true spirit and scope of the present invention
Put make it is all change should all belong to protection scope of the present invention.Scope of the present invention is by described power
What sharp claim was defined, rather than limited by the foregoing description in embodiment.
Claims (4)
1. a kind of fusion process of pressure programming, it is characterised in that it comprises the following steps：
The first step, get the raw materials ready, prepare multilayer and meet pcb board and PP plates size requirement, to be laminated；
Prepared by second step, hot melt target, several hot melt targets are prepared in the edges of boards region of each pcb board, and ensure each pcb board
On target position it is corresponding；
3rd step, stack, pcb board and PP plates are stacked alternately to form combination layer, and ensure the edges of boards pair of each pcb board and PP plates
Together；
4th step, hot melt, are heated so that the hot melt target on each pcb board using fuse machine to the hot melt target on combination layer
PP at mark melts to realize the combination of each pcb board and PP plates.
2. the fusion process of pressure programming as claimed in claim 1, it is characterised in that in the hot melt target preparation process,
Prepare six hot melt targets respectively in the edges of boards region of the right and left of pcb board.
3. the fusion process of pressure programming as claimed in claim 2, it is characterised in that the hot melt target is long 20mm, wide
8mm rectangle target.
4. the fusion process of pressure programming as claimed in claim 1, it is characterised in that in the heat fusion step, utilize hot melt
The hot melt target covered on the pcb board by PP is extruded above and below hot melt block on machine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710316749.0A CN107148168A (en) | 2017-05-08 | 2017-05-08 | A kind of fusion process of pressure programming |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710316749.0A CN107148168A (en) | 2017-05-08 | 2017-05-08 | A kind of fusion process of pressure programming |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107148168A true CN107148168A (en) | 2017-09-08 |
Family
ID=59778435
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710316749.0A Pending CN107148168A (en) | 2017-05-08 | 2017-05-08 | A kind of fusion process of pressure programming |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107148168A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108323041A (en) * | 2018-03-15 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of edges of boards design method of multiple pressing HDI plates |
| CN109451680A (en) * | 2018-12-06 | 2019-03-08 | 奥士康科技股份有限公司 | Large scale lamination pressing device and method |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056414A (en) * | 2010-12-29 | 2011-05-11 | 北大方正集团有限公司 | Manufacturing method of printed circuit board |
| CN202374556U (en) * | 2011-12-15 | 2012-08-08 | 北大方正集团有限公司 | Multi-layer printed circuit board |
| CN103857214A (en) * | 2012-12-07 | 2014-06-11 | 深南电路有限公司 | Multi-layer PCB hot melting bonding mechanism |
| CN105392304A (en) * | 2015-10-21 | 2016-03-09 | 胜宏科技（惠州）股份有限公司 | Circuit board press-fit method |
| CN106358387A (en) * | 2016-11-17 | 2017-01-25 | 百硕电脑(苏州)有限公司 | Combining method of PCB inner-layer boards |
| CN106376188A (en) * | 2016-11-01 | 2017-02-01 | 苏州艾美德国际贸易有限公司 | PCB production line and PCB produced by PCB production line |
-
2017
- 2017-05-08 CN CN201710316749.0A patent/CN107148168A/en active Pending
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102056414A (en) * | 2010-12-29 | 2011-05-11 | 北大方正集团有限公司 | Manufacturing method of printed circuit board |
| CN202374556U (en) * | 2011-12-15 | 2012-08-08 | 北大方正集团有限公司 | Multi-layer printed circuit board |
| CN103857214A (en) * | 2012-12-07 | 2014-06-11 | 深南电路有限公司 | Multi-layer PCB hot melting bonding mechanism |
| CN105392304A (en) * | 2015-10-21 | 2016-03-09 | 胜宏科技（惠州）股份有限公司 | Circuit board press-fit method |
| CN106376188A (en) * | 2016-11-01 | 2017-02-01 | 苏州艾美德国际贸易有限公司 | PCB production line and PCB produced by PCB production line |
| CN106358387A (en) * | 2016-11-17 | 2017-01-25 | 百硕电脑(苏州)有限公司 | Combining method of PCB inner-layer boards |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108323041A (en) * | 2018-03-15 | 2018-07-24 | 深圳崇达多层线路板有限公司 | A kind of edges of boards design method of multiple pressing HDI plates |
| CN109451680A (en) * | 2018-12-06 | 2019-03-08 | 奥士康科技股份有限公司 | Large scale lamination pressing device and method |
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| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| CB02 | Change of applicant information | ||
| CB02 | Change of applicant information |
Address after: 224100 No. 9, Yong Sheng Road, Dafeng Development Zone, Yancheng City, Jiangsu. Applicant after: JIANGSU BOMIN ELECTRONICS CO., LTD. Address before: 224100 Electronic Information Industry Park, Yancheng City, Jiangsu. Applicant before: JIANGSU BOMIN ELECTRONICS CO., LTD. |
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| RJ01 | Rejection of invention patent application after publication | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20170908 |