WO2022134885A1

WO2022134885A1 - Led thick copper circuit board press-fitting front structure and fabrication method therefor

Info

Publication number: WO2022134885A1
Application number: PCT/CN2021/128764
Authority: WO
Inventors: 王康兵; 周刚
Original assignee: 智恩电子(大亚湾)有限公司
Priority date: 2020-12-21
Filing date: 2021-11-04
Publication date: 2022-06-30
Also published as: CN112888195A

Abstract

Disclosed by the present application is an LED thick copper circuit board press-fitting front structure, which comprises an inner laminate, wherein a first prepreg and a first copper foil are provided on the top surface of the inner laminate, and a second prepreg and a second copper foil are provided on the bottom surface of the inner laminate. The inner laminate comprises a forming plate and an edge plate; a hot melt region of the top surface of the edge plate is fixed by hot melting to the edge of the bottom surface of the first copper foil; and a hot melt region of the bottom surface of the edge plate is fixed by hot melting to the edge of the top surface of the second copper foil. Two rows of staggered NPTH explosion-proof holes are formed in the hot melt region at the side close to the forming plate. Further disclosed by the present application is a method for fabricating an LED thick copper circuit board press-fitting front structure. The present application has rational designs for structure and steps, a combination of eight hot melt regions and four rivet holes, as well as two rows of staggered NPTH explosion-proof holes to thus prevent the occurrence of abnormalities such as sliding plates, cavities, explosion holes and so on, thereby improving the core competitiveness of the product.

Description

A structure of LED thick copper circuit board before pressing and its manufacturing method

technical field

The present application relates to the technical field of LED thick copper circuit board fabrication, and in particular, to a pre-pressing structure of an LED thick copper circuit board and a fabrication method thereof.

Background technique

First, because the LED thick copper circuit board has high board thickness, asymmetric stacking, and multiple PP interlayers in the product design, PP is a prepreg, so during the lamination process, PP will be in a high temperature and high pressure environment, PP After being melted by high temperature, the formed PP glue will flow under the high pressure of the press and its own gravity, which will cause the relative position between the inner layer board and the outer layer copper foil or other boards to shift, that is, As a result, the problem of sliding plate is prone to occur during the pressing process.

Second, in the prior art, in order to solve the above-mentioned technical problem that a sliding plate is prone to occur during the pressing process, the technical means of four-corner hot-melting + four-corner riveting are usually adopted to prevent the occurrence of a sliding plate during the pressing process. However, due to the existence of the four-corner hot-melt + four-corner riveting position, it is easy to cause the air bubbles discharged from the PP to be blocked and return to the forming plate during the pressing process, resulting in the existence of air bubbles between the forming plate of the PP and the inner layer plate. , resulting in the problem of voids in the formed plate.

Third, the existing four-corner hot-melt + four-corner riveting process cannot meet the product design requirements, resulting in high production difficulties and low quality yield.

Application content

The purpose of the present application is to provide a pre-pressing structure of an LED thick copper circuit board, so as to solve the technical problem of easy occurrence of sliding plates and voids during the pressing process.

In order to achieve the above purpose, the technical solution of the present application provides a pre-pressing structure of an LED thick copper circuit board, including an inner layer board, a first prepreg is provided on the top surface of the inner layer board, and the top of the first prepreg is The surface is provided with a first copper foil, the bottom surface of the inner layer board is provided with a second prepreg, and the bottom surface of the second prepreg is provided with a second copper foil; the inner layer board includes a forming board and an edge board, and the edge The plate is fixed on the horizontal edge of the forming plate; the top surface and the bottom surface of the edge plate are respectively provided with several hot-melt areas, and the hot-melt area on the top surface of the edge plate and the first copper foil Hot-melt fixing is performed between the edges of the bottom surface, and hot-melting fixing is performed between the hot-melting area of the bottom surface of the edge plate and the edge of the top surface of the second copper foil; the hot-melting area is close to the forming plate There are two rows of NPTH explosion-proof holes staggered from each other on one side.

Further, a large copper block is fixed in the middle of the hot-melt zone, and the large copper block is located outside the NPTH explosion-proof hole; the large copper block in the hot-melt zone on the top surface of the edge plate and the The edge of the bottom surface of a copper foil is hot-melted and fixed by the edge of the first prepreg, and the large copper block in the hot-melt area of the bottom surface of the edge plate and the edge of the top surface of the second copper foil pass through the The edges of the second prepreg are heat-fused.

Further, the distance between the large copper block and the forming plate is greater than 5mm, and the distance between the large copper block and the NPTH explosion-proof hole is 1mm.

Further, the diameter of the NPTH explosion-proof hole is 1.5mm, the distance between the center lines of two adjacent NPTH explosion-proof holes in the same row of the NPTH explosion-proof holes is 3.5mm, and the two adjacent rows of The distance between the center lines of the NPTH explosion-proof holes is 1mm.

Further, the shape of the edge plate is a rectangular ring, and the shape of the forming plate is a rectangular plate; the two sides of each included angle of the top surface of the edge plate are respectively provided with one of the hot melt One of the hot-melt regions is respectively provided on both sides of each included angle of the bottom surface of the edge plate.

Further, the top surface and the bottom surface of the edge plate are respectively provided with a number of rivet holes, and the rivet holes on the top surface of the edge plate and the edge of the first prepreg and the edge of the bottom surface of the first copper foil are connected by rivets. Riveting and fixing; the rivet holes on the bottom surface of the edge plate, the edge of the second prepreg, and the edge of the top surface of the second copper foil are riveted and fixed by rivets.

Further, a plurality of the rivet holes are respectively located at positions close to the middle of the front, rear, left, and right sides of the edge plate.

Further, the edge plate is a rectangular ring, and the forming plate is a rectangular plate; the center line of the rivet hole on the short side of the edge plate and the hot melt zone on the short side of the edge plate The distance between the centerlines is greater than 28mm, and the distance between the centerline of the rivet hole on the long side of the edge plate and the centerline of the hot melt zone on the long side of the edge plate is greater than 40mm.

Further, the rivet holes are circular holes with a diameter of 3.0mm, and the number of the rivet holes is four; the length and width of the hot-melt zone are 40mm and 16mm respectively, and the thermal The number of melting zones is eight, respectively.

The present application also provides a method for manufacturing a pre-pressing structure of an LED thick copper circuit board, comprising the following steps:

S1. Perform the following steps on the inner layer board: target shooting, edge trimming, primary drilling, browning, CO2 laser drilling, plasma degumming, copper sinking, hole-filling electroplating, full-board electroplating, secondary drilling, circuit pretreatment, Lamination, exposure, development, etching, AOI;

S2, pre-stacking: stacking the top surface of the inner layer board with the first prepreg and the first copper foil in turn, and stacking the bottom surface of the inner layer board with the second prepreg and the second copper foil in sequence layer placement;

S3. Hot-melt: hot-melt and fix between the hot-melt area of the top surface of the edge plate of the inner layer board and the edge of the bottom surface of the first copper foil, and heat the bottom surface of the edge plate of the inner layer board. Hot-melt fixing is performed between the fusion zone and the edge of the top surface of the second copper foil;

S4, riveting: riveting and fixing the top surface of the edge plate of the inner layer board, the edge of the first prepreg, and the edge of the bottom surface of the first copper foil, and riveting the bottom surface of the edge plate of the inner layer board with the edge of the bottom surface of the first copper foil. The edges of the top surface of the second prepreg and the second copper foil are riveted and fixed;

During the primary drilling or secondary drilling in step S1, two rows of staggered holes are drilled on the side of the edge plate of the inner layer plate close to the forming plate in the hot-melt zone to be hot-melted and fixed. NPTH blast hole.

To sum up, using the technical solution of the present application has the following beneficial effects: the structural design and step design of the present application are reasonable, (1) in terms of quality: because the heat of the top surface of the edge plate is pre-heated before pressing The fusion zone and the edge of the bottom surface of the first copper foil are hot-melted and fixed, and the hot-melt zone of the bottom surface of the edge plate and the edge of the top surface of the second copper foil are hot-melted and fixed, so that during the pressing process, the To prevent the abnormality of the sliding plate; and by providing two rows of NPTH explosion-proof holes staggered with each other on the side of the hot-melt zone near the forming plate, the air in the air bubbles in the pressing process can be discharged into the NPTH explosion-proof hole for Stored to prevent anomalies such as voids, burst holes, etc. It can be seen from this that the technical solutions of the present application have solved the problems of skateboards, voids, burst holes, etc. existing in the prior art, and improved the core competitiveness of products. In terms of efficiency: no need to rework, improve process capability.

(2) The present application adopts the reasonable matching of eight hot-melt zones and four rivet holes, that is, by making the center line of the rivet holes on the short side of the edge plate and all the rivet holes on the short side of the edge plate The distance between the center lines of the hot melt zone is greater than 28mm, and the distance between the center line of the rivet hole on the long side of the edge plate and the center line of the hot melt zone on the long side of the edge plate It is larger than 40mm, so as to prevent the abnormality of sliding plate and edge burst during the pressing process, it can also improve the efficiency of discharging the air in the bubble into the explosion-proof hole for storage.

Description of drawings

FIG. 1 is a schematic structural diagram of the structure of the LED thick copper circuit board of the present application before pressing;

Fig. 2 is the top view of the inner layer board of the LED thick copper circuit board structure of the present application before pressing;

3 is a partial enlarged view of the top view of the inner layer board of the structure before the LED thick copper circuit board of the present application is pressed;

Explanation of reference numerals: 1-inner layer board, 101-forming board, 102-edge board, 1021-rivet hole, 1022-hot melt zone, 10221-large copper block, 10222-NPTH explosion-proof hole, 103-forming line, 2 - 1st prepreg, 3- 1st copper foil, 4- 2nd prepreg, 5- 2nd copper foil.

Detailed ways

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present application, but this does not constitute a limitation on the protection scope of the present application.

In this application, for a clearer description, the following description is made: the observer faces the accompanying drawing 2 to observe, the left side of the observer is set as left, the right side of the observer is set as right, the front of the observer is set as down, the observer The rear is set to the top, the top of the observer is set to the front, and the bottom of the observer is set to the rear. The indicated orientation or positional relationship is based on the orientation or positional relationship set in the accompanying drawings, which is only for the convenience of clearly describing the present application, rather than indicating or implying that the structures or components referred to must have a specific orientation or a specific orientation. structure, and therefore should not be construed as a limitation on this application. Furthermore, the terms "first", "second", "third", "fourth" are used only for the purpose of clarity or simplicity of the description and should not be construed to indicate or imply relative importance or quantity.

Referring to FIG. 1 , FIG. 2 , and FIG. 3 , this embodiment provides a pre-pressing structure of an LED thick copper circuit board, including an inner layer board 1 , a first prepreg 2 is provided on the top surface of the inner layer board 1 , and the first prepreg 2 The top surface of the inner layer board 1 is provided with a first copper foil 3 , the bottom surface of the inner layer board 1 is provided with a second prepreg 4 , and the bottom surface of the second prepreg 4 is provided with a second copper foil 5 . The function of the first prepreg 2 and the second prepreg 4 is to be melted into a flowable PP glue at high temperature during the lamination process, and under the action of the high pressure of the press and its own gravity, it is carried out to a low pressure and a lower copper-free area. After the PP glue is cured, the first copper foil 3, the second copper foil 5 and the inner layer board 1 are fixed. It should be noted that the first copper foil 3 and the second copper foil 5 are respectively located on the upper and lower outermost layers of the structure of the present application, and can also be placed between the first copper foil 3 and the top surface of the inner layer board 1 as required The corresponding number of layers of the first prepreg 2 or other inner layer boards 1, so as to form the structure of the multi-layer board before lamination, the second copper foil 5 and the bottom surface of the inner layer board 1 can also be placed between the second copper foil 5 and the bottom surface of the inner layer board 1 as required. Two prepregs 4 or other inner layer boards 1, thereby forming the pre-lamination structure of the multi-layer board. The first prepreg 2 and the second prepreg 4 may be prepregs such as non-woven prepregs or organic glass prepregs. The inner layer board 1 includes a molding board 101 and an edge board 102. The edge board 102 is fixed to the horizontal edge of the molding board 101. 102 refers to the part used to assist positioning in the molding process of the product, which needs to be cut and separated after the product is made. In order to better distinguish between the forming plate 101 and the edge plate 102 , a forming line 103 may be set at the junction of the forming plate 101 and the edge plate 102 . The top surface and the bottom surface of the edge plate 102 are respectively provided with a plurality of hot-melt regions 1022. The hot-melt regions 1022 on the top surface of the edge plate 102 and the edge of the bottom surface of the first copper foil 3 are fixed by hot-melt. The hot-melt area 1022 on the bottom surface and the edge of the top surface of the second copper foil 5 are hot-melted and fixed. Here, the method of hot-melt fixing is preferably the first prepreg 2 and the second prepreg 4 corresponding to the hot-melt area 1022. Local high-temperature heating is performed to form a hot-melt fixation. Of course, additional hot-melt adhesive blocks can be added for hot-melt fixation. Two rows of NPTH explosion-proof holes 10222 staggered from each other are provided on the side of the hot melt zone 1022 close to the forming plate 101 . The reason why the positions of the two rows of NPTH explosion-proof holes are staggered is that it can avoid the problem of gaps between the NPTH explosion-proof holes in the same row, so that the air in the bubbles can be discharged into the NPTH explosion-proof holes as much as possible for storage, thereby preventing voids, Holes, etc.

Beneficial effects of this part: In terms of quality: since the hot-melt area of the top surface of the edge plate and the edge of the bottom surface of the first copper foil are pre-heated and fixed before pressing, the bottom surface of the edge plate is hot-melted. Hot-melt fixing is performed between the edge of the top surface of the second copper foil and the top surface of the second copper foil, so that the abnormality of the sliding plate can be prevented during the pressing process; NPTH explosion-proof hole, so that the air in the air bubbles in the pressing process can be discharged into the NPTH explosion-proof hole for storage, so as to prevent the occurrence of holes, explosion holes and other abnormalities. It can be seen from this that the technical solutions of the present application have solved the problems of skateboards, voids, burst holes, etc. existing in the prior art, and improved the core competitiveness of products. In terms of efficiency: no need to rework, improve process capability.

Specifically, a large copper block 10221 is fixed in the middle of the hot melt zone 1022, and the large copper block 10221 is located outside the NPTH explosion-proof hole 10222; The edge of the bottom surface of 3 is fixed by heat fusion through the edge of the first prepreg 2 , and the large copper block 10221 in the hot melt zone 1022 of the bottom surface of the edge plate 102 and the edge of the top surface of the second copper foil 5 pass through the edge of the second prepreg 4 . The edges are hot-melt fixed. The role of the large copper block 10221 is to rapidly conduct high temperature to the first prepreg 2 and the second prepreg 4, so that the first prepreg 2 and the second prepreg 4 can be quickly fixed by hot melt. Specifically, a local high temperature can be generated by means of a hot-melting machine during hot-melting.

Specifically, the distance between the large copper block 10221 and the forming plate 101 is greater than 5 mm, and the distance between the large copper block 10221 and the NPTH explosion-proof hole 10222 is 1 mm.

Specifically, the diameter of the NPTH explosion-proof hole 10222 is 1.5mm, the distance between the center lines of two adjacent NPTH explosion-proof holes 10222 in the same row of NPTH explosion-proof holes 10222 is 3.5mm, and the two adjacent rows of NPTH explosion-proof holes 10222 The centerline spacing is 1mm.

Specifically, the shape of the edge plate 102 is a rectangular ring shape, and the shape of the forming plate 101 is a rectangular plate shape; the two sides of each included angle of the top surface of the edge plate 102 are respectively provided with a hot melt zone 1022, and the edge plate A hot melt zone 1022 is respectively provided on both sides of each included angle of the bottom surface of the bottom surface 102 . Therefore, the positional distribution of the hot melt zone 1022 is more reasonable, and the force generated by the fixing is evenly distributed.

Specifically, several rivet holes 1021 are respectively provided on the top surface and bottom surface of the edge plate 102 , and the rivet holes 1021 on the top surface of the edge plate 102 pass through the edge of the first prepreg 2 and the edge of the bottom surface of the first copper foil 3 . The rivets are riveted and fixed; the rivet holes 1021 on the bottom surface of the edge plate 102 and the edge of the second prepreg 4 and the edge of the top surface of the second copper foil 5 are riveted and fixed by rivets, so that the hot melt zone 1022 can be considered. The unreachable area is fixed, so that the distribution of the fixed force is more balanced.

Specifically, the plurality of rivet holes 1021 are respectively located at positions close to the middle of the front, rear, left, and right sides of the edge plate 102 , which can make the distribution of the fixing force more balanced.

Specifically, the edge plate 102 is a rectangular ring, and the forming plate 101 is a rectangular plate; The distance is greater than 28mm, and the distance between the center line of the rivet hole 1021 on the long side of the edge plate 102 and the center line of the hot melt zone 1022 on the long side of the edge plate 102 is greater than 40mm, so that the rivet hole 1021 and the hot melt zone 1022 can be separated from each other. The collocation is more reasonable, so that the distribution of the fixed force is more balanced. For asymmetric pressing, because the wettability of the contact surface between the resin (ie PP glue) and the inner layer board is different, when the temperature is 3-5 degrees Celsius higher than the glass transition temperature of the resin, the higher the pressure, the better the fluidity of the resin. Considering In addition to the vector of the vertical downward force, the plate is also subjected to its own gravitational force. In view of the above, it is preferable that the side with poor wettability or the side with an excessively high copper thickness face downward. The short-side hot-melt area 1022 exceeds the molding line by 6mm, and the long-side hot-melt area 1022 shrinks the molding line by 6mm. Of course, other distances are also possible. You can choose according to your needs, so as to ensure that the hot-melt area 1022 has a good effect on the entire board surface. overall control.

Specifically, the rivet holes 1021 are circular holes with a diameter of 3.0 mm, and the number of rivet holes 1021 is four; The number is eight.

Beneficial effects of this part: the present application adopts the reasonable matching of eight hot-melt zones and four rivet holes, that is, by making the center line of the rivet holes on the short side of the edge plate and the short side of the edge plate The distance between the centerlines of the hot-melt zone of the edge is greater than 28mm, the centerline of the rivet hole on the long side of the edge plate and the center of the hot-melt zone on the long side of the edge plate The spacing of the lines is greater than 40mm, so as to prevent the abnormality of sliding plates and edge bursts during the pressing process, it can also improve the efficiency of discharging the air in the bubbles into the explosion-proof holes for storage. The reason for this beneficial effect is as follows: when the entire board is under pressure, if the moving speed of the air bubbles in the resin (ie PP glue) is constant, the shorter the distance between the explosion-proof hole and the rivet hole, the air bubbles can be eliminated within a certain period of time. The higher the air efficiency inside, the lower the residual air bubbles. At the same time, because the two ends of each side of the inner layer board of the present application are provided with hot-melt zones, and the rivet hole is located between the two hot-melt zones, it is necessary to align the centerlines of the rivet holes on each side with the The distance between the center lines of the hot-melt zone is reasonably distributed, so as to prevent the abnormality of slippage and edge explosion during the pressing process, and at the same time, it can also improve the efficiency of discharging the air in the bubbles into the explosion-proof hole for storage. After multiple cycles and long-term trial and error, it is found that this distance matching is the most reasonable. This can meet product design requirements, reduce production difficulty, and improve quality yield.

S1. Perform the following steps on the inner layer board 1: target shooting, edge trimming, primary drilling, browning, CO2 laser drilling, plasma degumming, copper sinking, hole-filling electroplating, full-board electroplating, secondary drilling, and circuit pretreatment , Lamination, exposure, development, etching, AOI. Targeting, edge trimming, primary drilling, browning, CO2 laser drilling, plasma degumming, copper immersion, hole-filling electroplating, full-board electroplating, secondary drilling, circuit pretreatment, lamination, exposure, Development, etching, and AOI are common processes in the art, and will not be repeated here.

S2. Pre-stacking: Lay the top surface of the inner layer board 1 with the first prepreg 2 and the first copper foil 3 in sequence, and place the bottom surface of the inner layer board 1 with the second prepreg 4 and the second copper foil 5 in sequence. Laminate placement;

S3. Hot-melt: hot-melt and fix the hot-melt zone 1022 on the top surface of the edge plate 102 of the inner layer board 1 and the edge of the bottom surface of the first copper foil 3, and fix the bottom surface of the edge plate 102 of the inner layer board 1 by hot-melting. Hot-melt fixing is performed between the hot-melt zone 1022 and the edge of the top surface of the second copper foil 5;

S4, riveting: the top surface of the edge plate 102 of the inner layer board 1 is riveted and fixed with the edge of the first prepreg 2 and the bottom surface of the first copper foil 3, and the edge plate 102 of the inner layer board 1 is riveted and fixed. The bottom surface is riveted and fixed with the edges of the top surface of the second prepreg 4 and the second copper foil 5;

During the primary drilling or secondary drilling in step S1, two rows of staggered holes are drilled on the side of the edge plate 102 of the inner layer board 1 near the forming plate 101 in the hot-melt zone 1022 to be hot-melted and fixed. NPTH blast hole 10222.

After the above-mentioned pre-pressing structure of the LED thick copper circuit board is completed, the pressing can be performed next, and the next process can be performed after the pressing is completed.

The above are the preferred embodiments of the present application. It should be pointed out that for those skilled in the art, without departing from the principles of the present application, several improvements and modifications can also be made, and these improvements and modifications may also be regarded as The protection scope of this application.

Claims

A pre-pressing structure of an LED thick copper circuit board, comprising an inner layer board (1), characterized in that: the top surface of the inner layer board (1) is provided with a first prepreg (2), and the first prepreg ( 2) the top surface is provided with a first copper foil (3), the bottom surface of the inner layer board (1) is provided with a second prepreg (4), and the bottom surface of the second prepreg (4) is provided with a second copper foil (5); the inner layer board (1) includes a forming board (101) and an edge board (102), and the edge board (102) is fixed to the horizontal edge of the forming board (101); the edge The top surface and the bottom surface of the board (102) are respectively provided with a plurality of hot-melt regions (1022), and the hot-melt regions (1022) on the top surface of the edge board (102) and the bottom surface of the first copper foil (3) Hot-melt fixing is performed between the edges of the edge plate (102), and hot-melting is performed between the hot-melt region (1022) on the bottom surface of the edge plate (102) and the edge of the top surface of the second copper foil (5); Two rows of NPTH explosion-proof holes (10222) staggered from each other are provided on the side of the melting zone (1022) close to the forming plate (101).
The structure of the LED thick copper circuit board before lamination according to claim 1, characterized in that: a large copper block (10221) is fixed in the middle of the hot-melt zone (1022), and the large copper block (10221) is located in the middle of the hot melt zone (1022). The outer side of the NPTH explosion-proof hole (10222); the edge of the large copper block (10221) in the hot melt zone (1022) on the top surface of the edge plate (102) and the bottom surface of the first copper foil (3) The edge of the first prepreg (2) is hot-melted and fixed, and the large copper block (10221) in the hot-melt area (1022) on the bottom surface of the edge plate (102) and the second copper foil (5) The edge of the top surface of the second prepreg (4) is hot-melted and fixed.
The structure of the LED thick copper circuit board before pressing according to claim 2, characterized in that: the distance between the large copper block (10221) and the forming board (101) is greater than 5 mm, and the large copper block (10221) ) and the NPTH explosion-proof hole (10222) at a distance of 1 mm.
The structure of the LED thick copper circuit board before pressing according to any one of claims 1 to 3, characterized in that: the NPTH explosion-proof hole (10222) has a diameter of 1.5 mm, and the NPTH explosion-proof holes (10222) in the same row have a diameter of 1.5 mm. The distance between the center lines of two adjacent NPTH explosion-proof holes (10222) in 10222) is 3.5 mm, and the distance between the center lines of two adjacent rows of the NPTH explosion-proof holes (10222) is 1 mm.
The pre-pressing structure of the LED thick copper circuit board according to any one of claims 1 to 3, characterized in that: the shape of the edge board (102) is a rectangular ring, and the shape of the forming board (101) It is in the shape of a rectangular plate; the two sides of each included corner of the top surface of the edge plate (102) are respectively provided with one of the hot-melt regions (1022), and each of the bottom surfaces of the edge plate (102) One of the hot-melt regions (1022) is respectively provided on both sides of the included angle.
The structure of the LED thick copper circuit board before pressing according to claim 5, characterized in that: the top surface and the bottom surface of the edge board (102) are respectively provided with a plurality of rivet holes (1021), and the edge board (102) The rivet holes (1021) on the top surface of 102) and the edge of the first prepreg (2) and the edge of the bottom surface of the first copper foil (3) are riveted and fixed by rivets; the bottom surface of the edge plate (102) The rivet hole (1021) of the second prepreg (4) and the edge of the top surface of the second copper foil (5) are riveted and fixed by rivets.
The pre-pressing structure of the LED thick copper circuit board according to claim 6, characterized in that: a plurality of the rivet holes (1021) are respectively located near the middle of the front, rear, left, right, and right sides of the edge board (102).
The pre-pressing structure of an LED thick copper circuit board according to claim 7, characterized in that: the edge board (102) is a rectangular ring, and the forming board (101) is a rectangular board; The distance between the center line of the rivet hole (1021) on the short side of the edge plate (102) and the center line of the hot melt zone (1022) on the short side of the edge plate (102) is greater than 28 mm, and the distance between the center line of the hot melt zone (1022) on the short side of the edge plate (102) The distance between the center line of the rivet hole (1021) on the long side of the edge plate (102) and the center line of the hot melt zone (1022) on the long side of the edge plate (102) is greater than 40 mm.
The structure of the LED thick copper circuit board before pressing according to any one of claims 6 to 8, wherein the rivet hole (1021) is a circular hole with a diameter of 3.0 mm, and the rivet hole (1021) is a circular hole with a diameter of 3.0 mm. The number is four; the length and width of the hot melt zone (1022) are 40mm and 16mm respectively, and the number of hot melt zones (1022) on the top surface and the bottom surface of the edge plate (102) is eight respectively.
A method for manufacturing a pre-pressing structure of an LED thick copper circuit board, comprising the following steps:

S1. Perform the following steps on the inner layer board (1): target shooting, edge trimming, primary drilling, browning, CO2 laser drilling, plasma degumming, copper sinking, hole-filling electroplating, full-board electroplating, secondary drilling, circuit Pretreatment, lamination, exposure, development, etching, AOI;

S2. Pre-stacking: Lay the top surface of the inner layer board (1) with the first prepreg (2) and the first copper foil (3) in sequence, and place the bottom surface of the inner layer board (1). The second prepreg (4) and the second copper foil (5) are stacked and placed in sequence;

S3. Hot-melting: hot-melting is performed between the hot-melting zone (1022) on the top surface of the edge plate (102) of the inner layer board (1) and the edge of the bottom surface of the first copper foil (3), and the Hot-melt fixing is performed between the hot-melt region (1022) on the bottom surface of the edge board (102) of the inner layer board (1) and the edge of the top surface of the second copper foil (5);

S4, riveting: riveting and fixing the top surface of the edge board (102) of the inner layer board (1) with the edge of the first prepreg (2) and the edge of the bottom surface of the first copper foil (3), and riveting and fixing the bottom surface of the edge board (102) of the inner layer board (1) with the edges of the top surface of the second prepreg (4) and the second copper foil (5);

It is characterized in that: during the primary drilling or the secondary drilling in step S1, the edge plate (102) of the inner layer board (1) in the hot-melt zone (1022) to be hot-melted and fixed is close to the Two rows of NPTH explosion-proof holes (10222) staggered from each other are drilled on one side of the forming plate (101).