CN202401126U - Magnetic-control double-target sputtering device for powder particle surface film coating - Google Patents
Magnetic-control double-target sputtering device for powder particle surface film coating Download PDFInfo
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- CN202401126U CN202401126U CN2011205340675U CN201120534067U CN202401126U CN 202401126 U CN202401126 U CN 202401126U CN 2011205340675 U CN2011205340675 U CN 2011205340675U CN 201120534067 U CN201120534067 U CN 201120534067U CN 202401126 U CN202401126 U CN 202401126U
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Abstract
A magnetic-control double-target sputtering device for powder particle surface film coating comprises a vacuum chamber, a drum with two ends open, two support rolls with limit inclined surfaces, a motor, a speed regulator, two magnetic-control sputtering target rack and a sputtering power supply. The support rolls and the speed regulator are connected, and the drum is directly disposed on the support rolls and is driven to rotate by the same. Target materials are arranged at two end openings of the drum. When in magnetic-control sputtering film coating, mill balls and powder are placed into the drum at the same time and can fall in a parabola manner by adjusting rotation speed of the motor, sputtering flow sputtered from the openings of the drum is deposited to the falling powder, and a film fine in uniformity is obtained after some time. The magnetic-control double-target sputtering device for powder particle surface film coating is large in process treatment capacity, low in running cost and suitable for industrialized production.
Description
Technical field
The utility model relates to a kind of powder granule surface coating technology, is specifically related to be applicable to the vacuum coater of dynamic magnetron sputtering plating.
Background technology
Along with developing rapidly of progress of science and technology and new material industry, people improve constantly the requirement of powder characteristic is also corresponding.Through methods such as physics, chemistry, machineries powder body material surface or interface are handled, can be improved or change the performance of powder body material, satisfy the needs of novel material, novel process and development of new techniques.Wherein, the surface coating technology is to use maximum powder surface treatment technologies.
The method of powder granule surface coating mainly contains electroless plating, plating, vacuum sputtering plating, vacuum evaporation, chemical vapour deposition and sol-gel method etc.Adopt chemical process plated films such as electroless plating, plating, sol-gel method, institute obtains that the powder surface film is inhomogeneous, compactness is poor, purity is low, and the material system of superficial film is restricted, owing to will adopt chemical agent also to cause environmental pollution easily.Adopt vacuum sputtering coating (hereinafter to be referred as " sputter plating "), vacuum evaporation deposition plated film physical methods such as (hereinafter to be referred as " vapor depositions ") need not adopt chemical agent; Institute's powder surface film purity that obtains is high and do not have environmental pollution, receives increasing application.
During physical methods such as employing sputter plating and vapor deposition; In order to obtain the film of good uniformity at powder surface; Need let each particle when film growth, all have the chance of being equal to fully to expose its surface, and the deposition probability that makes the target as sputter of powder granule surface all directions go out material as far as possible equate.Patent CN 1718845 A, patent CN101798677 A and patent CN201665704 U disclose a kind of powder granule magnetron sputtering coating method that adopts vertical shaft type ultrasonic vibration sample table.This method single treatment amount is little, only can satisfy scientific research and laboratory needs.Patent CN 101082120A discloses the Processes and apparatus that a kind of powder surface carries out plated film.It is through making the powder motion of in conical hopper, spinning, to reach the even exposure of powder granule in the sputter field.The thickness of this equipment plated film is relatively fixing, difficult adjusted and have only a target can not realize cosputtering.The horizontal axis drum-type sample stage that patent CN101805893 A provides magnetron sputtering to use, it comprises vibration of ultrasonic wave mechanism and screen cloth etc., the even and coating film thickness of its plated film is adjusted easily, but its structure more complicated, and can only folk prescription to sputter coating.
The utility model content
To the problems referred to above of prior art, the utility model provides a kind of facing-target magnetron sputtering system device of powder granule surface coating, and this device can plate the layer of even film on the powder granule surface, and two kinds of mould materials of sputter simultaneously.
For realizing above-mentioned purpose, the utility model comprises following technical scheme:
A kind of facing-target magnetron sputtering system device that is used for the powder granule surface coating, this device comprise the cylinder of Vakuumkammer, both ends open, two supporting rolls with spacing inclined-plane, motor and speed regulation device, two magnetron sputtering target holders and shielding power supply; Wherein, this supporting roll links to each other with motor and speed regulation device, the axial level of each supporting roll, is parallel to each other and is positioned at the par height; This drum shaft is to lying in a horizontal plane on the supporting roll, in the cylinder loading powder particle and/or with the mill ball of the identical material of powder; These two magnetron sputtering target holders place the both ends open outside of this cylinder respectively, place target on the target holder, and the axle center and the cylinder of target are axially aligned; This Vakuumkammer is connected with vacuum suction device, and viewing window and purging valve are set on the Vakuumkammer, and this cylinder, supporting roll and target holder place Vakuumkammer.
Aforesaid device, wherein, the opening part edge of this cylinder can be formed slopely the inclined-plane to the inside, and tilt angle theta is 120～160 degree, the inner diameter d of cylinder opening part
1=d
2/ 3～3d
2/ 4, wherein, d
2Be the cylinder internal diameter.
Aforesaid device, wherein, the length of this supporting roll is identical with drum length, and the angle of inclination on its spacing inclined-plane is identical with the tilt angle theta of the opening part bezel of said cylinder.
Aforesaid device, wherein, the outside diameter d of this supporting roll
3=(d
2+ δ)/2～3 (d
2+ δ)/2, δ is the wall thickness of cylinder, the spacing surface width b of supporting roll
1=b
2/ 3～b
2, b
2Surface width for the cylinder opening part.
Aforesaid device wherein, is provided with fin equably on the inwall of this cylinder, the trend of fin and cylinder axially parallel, and the quantity of fin is 4～12, the height h=d of fin
2/ 25～d
2/ 5, the width a=h/6～h of fin.
Aforesaid device, wherein, the distance between this sputter target holder and the cylinder opening part is 3cm～20cm.
Aforesaid device, wherein, surface-coated one deck nonskidcoating of this supporting roll.
Aforesaid device, wherein, the material of this mill ball is identical with the material of powder, perhaps can not pollute powder, and the diameter of mill ball is 3～20mm.
Aforesaid device, wherein, the mass ratio of this powder and mill ball is 0.2～3: 1, the TV of powder and mill ball is no more than 45% of cylinder volume.
Aforesaid device, wherein, the distance between this sputter target holder and the cylinder opening part is 3cm～20cm.
Aforesaid device, wherein, the particle diameter of this powder granule can be 0.1～2000 μ m.
The beneficial effect of the utility model is: this device adopts the horizontal axis drum-type sample stage of both ends open; Be put in the cylinder with the mill ball and the powder granule of the identical material of powder; The speed of rotation of regulating cylinder makes mill ball and powder granule be brought to the cylinder top; Under the effect of gravity, be para-curve, the plasma sputtering corradiation district that forms through the relative target in two ends will can plate the layer of even film through the certain hour powder surface at powder surface deposition targets material.Mill ball grinds powder, destroys the reunion of powder, and mill ball can play the effect of vibration, is come out fully in the surface of powder granule, helps the film at powder granule surface deposition good uniformity.Fin through in inner wall of rotary drum welding some amount comes to drive better the rotation of mill ball and powder, improves the efficient of plated film.The apparatus and method of the utility model can be carried out target co-sputtering, and two kinds of mould materials of sputter simultaneously also can two a kind of materials of target sputter simultaneously, when a kind of material of sputter, can improve the efficient of plated film.
In sum, the apparatus structure of the utility model is simple, operating procedure is easy, running cost is low, handles that the powder amount is big, efficient is high, make the powder plated film evenly, fine and close, purity is high, is fit to industrial production.
Description of drawings
Fig. 1 is the facing-target magnetron sputtering system apparatus structure synoptic diagram that embodiment 1 is used for the powder granule surface coating.
Fig. 2 is that Fig. 1 is along the A-A sectional view.
Fig. 3 is the optical microscope photograph of the copper plating film glass powder of embodiment 2 preparations.
Embodiment
To combine accompanying drawing and practical implementation example that the utility model is described further below.
Referring to illustrated in figures 1 and 2; In a kind of preferred implementation of the utility model, this magnetic control sputtering film plating device comprises the cylinder 2 of Vakuumkammer 1, both ends open, two supporting rolls 3 with spacing inclined-plane, motor and speed regulation device 4, two magnetron sputtering target holders 5 and shielding power supplies 6.
Wherein, supporting roll 3 links to each other with motor and speed regulation device 4, two supporting rolls, 3 axial levels, is parallel to each other and is positioned at the par height.Supporting roll 3 axial lengths are 20cm, and the outside diameter d 3 of supporting roll is 8cm, and the tilt angle theta on the spacing inclined-plane of supporting roll is 145 °, the spacing surface width b of supporting roll
1Be 2cm.
The wall thickness δ of cylinder is 0.2cm, and axial length is 20cm, inner diameter d
2Be 12cm.The opening part edge of cylinder is formed slopely the inclined-plane to the inside, and tilt angle theta is 145 °, the inner diameter d of cylinder opening part
1Be 85mm.Cylinder 2 axially lies in a horizontal plane on the supporting roll 3, and the spacing inclined-plane at the two ends of supporting roll plays resting barrel.Drive supporting rolls 3 rotations through motor and speed regulation device 4, the friction through 2 on support roller 3 and cylinder etc. interacts and drives cylinder 2 and rotate.In order to increase the friction of 2 on supporting roll 3 and cylinder, prevent to skid the surfaces coated last layer nonskidcoating of supporting roll 3.In the cylinder 2 the loading powder particles and/or with the mill ball of the identical material of powder.Be provided with fin 7 on the inwall of cylinder equably, the trend of fin 7 and cylinder 2 axially parallels, the quantity of fin is 8, and height h is 8mm, and width a is 3mm.
Two magnetron sputtering target holders 5 place the both ends open outside of this cylinder 2 respectively, and the distance between magnetron sputtering target holder 5 and the cylinder opening part is 3cm～20cm, and magnetron sputtering target holder 5 is connected with shielding power supply 6.Place target on the target holder 5, the axle center and the cylinder of target are axially aligned.
Embodiment 2 adopts embodiment 1 said device that the magnetron sputtering tin-copper alloy film is carried out on solid glass ball powder granule surface
Process step is following:
1. opening Vakuumkammer, is that 50 μ m solid glass ball powder granules and 150 gram glass grinding balls are put into cylinder with 150 gram particle degree, and cylinder places to be supported to roll, and the diameter of glass grinding ball is 4mm; Required two copper targets are installed on the target holder respectively, and are alignd with the axle center of cylinder in the axle center of target;
2. close Vakuumkammer, open vacuum suction device, the vacuum of Vakuumkammer is extracted into 0.5 * 10
-3Pa;
3. charge into argon gas to Vakuumkammer, use the mass flowmeter dominant discharge, the Vakuumkammer operating air pressure is 0.5Pa when guaranteeing sputter;
4. the unlatching motor is regulated rotating speed of motor, makes mill ball and powder granule in the cylinder be para-curve, and drum rotational speed is 90 rev/mins;
5. open shielding power supply, regulate power and make power on the target unit surface at 4W/cm
2, the beginning sputter coating;
6. behind the magnetron sputtering 60min, close the power supply of target, stop sputter;
7. close under meter, vacuum system in order, open purging valve and slowly in Vakuumkammer, exit, after vacuum room pressure and barometric point balance, open Vakuumkammer, take out cylinder, mill ball and powder are sieved, obtain the powder of plated film.
Powder behind the plated film is at optical microscope, as shown in Figure 3, can see that there is one deck copper film relatively uniformly on the surface of solid glass ball powder granule.
Claims (7)
1. facing-target magnetron sputtering system device that is used for the powder granule surface coating is characterized in that: this device comprises the cylinder of Vakuumkammer, both ends open, two supporting rolls with spacing inclined-plane, motor and speed regulation device, two magnetron sputtering target holders and shielding power supply;
Wherein, this supporting roll links to each other with motor and speed regulation device, the axial level of each supporting roll, is parallel to each other and is positioned at the par height;
This drum shaft is to lying in a horizontal plane on the supporting roll, in the cylinder loading powder particle and/or with the mill ball of the identical material of powder;
These two magnetron sputtering target holders place the both ends open outside of this cylinder respectively, place target on the target holder, and the axle center and the cylinder of target are axially aligned;
This Vakuumkammer is connected with vacuum suction device, and viewing window and purging valve are set on the Vakuumkammer, and this cylinder, supporting roll and target holder place Vakuumkammer.
2. device according to claim 1 is characterized in that: the opening part edge of said cylinder is formed slopely the inclined-plane to the inside, and tilt angle theta is 120～160 degree, the inner diameter d of cylinder opening part
1=d
2/ 3～3d
2/ 4, wherein, d
2Be the cylinder internal diameter.
3. device according to claim 2 is characterized in that: the length of said supporting roll is identical with drum length, and the angle of inclination on its spacing inclined-plane is identical with the tilt angle theta of the opening part bezel of said cylinder.
4. device according to claim 3 is characterized in that: the outside diameter d of said supporting roll
3=(d
2+ δ)/2～3 (d
2+ δ)/2, δ is the wall thickness of cylinder, the spacing surface width b of supporting roll
1=b
2/ 3～b
2, b
2Surface width for the cylinder opening part.
5. device according to claim 3 is characterized in that: be provided with fin on the inwall of said cylinder equably, and the trend of fin and cylinder axially parallel, the quantity of fin is 4～12, the height h=d of fin
2/ 25～d
2/ 5, the width a=h/6～h of fin.
6. according to each described device among the claim 1-5, it is characterized in that: the distance between said sputter target holder and the cylinder opening part is 3cm～20cm.
7. according to each described device among the claim 1-5, it is characterized in that: surface-coated one deck nonskidcoating of said supporting roll.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205340675U CN202401126U (en) | 2011-12-19 | 2011-12-19 | Magnetic-control double-target sputtering device for powder particle surface film coating |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205340675U CN202401126U (en) | 2011-12-19 | 2011-12-19 | Magnetic-control double-target sputtering device for powder particle surface film coating |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202401126U true CN202401126U (en) | 2012-08-29 |
Family
ID=46698787
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205340675U Expired - Lifetime CN202401126U (en) | 2011-12-19 | 2011-12-19 | Magnetic-control double-target sputtering device for powder particle surface film coating |
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|---|---|
| CN (1) | CN202401126U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107022743A (en) * | 2016-02-01 | 2017-08-08 | 上海朗亿功能材料有限公司 | A kind of magnetic-control sputtering continuous plating equipment for micro-nano powder |
| CN110010441A (en) * | 2019-03-28 | 2019-07-12 | 苏州科技大学 | A kind of powder processing apparatus and application method |
| CN110090582A (en) * | 2019-03-29 | 2019-08-06 | 苏州科技大学 | A kind of far field plasma powder processing apparatus and application method |
-
2011
- 2011-12-19 CN CN2011205340675U patent/CN202401126U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107022743A (en) * | 2016-02-01 | 2017-08-08 | 上海朗亿功能材料有限公司 | A kind of magnetic-control sputtering continuous plating equipment for micro-nano powder |
| CN107022743B (en) * | 2016-02-01 | 2019-04-02 | 上海朗亿功能材料有限公司 | A kind of magnetic-control sputtering continuous plating equipment for micro-nano powder |
| CN110010441A (en) * | 2019-03-28 | 2019-07-12 | 苏州科技大学 | A kind of powder processing apparatus and application method |
| CN110090582A (en) * | 2019-03-29 | 2019-08-06 | 苏州科技大学 | A kind of far field plasma powder processing apparatus and application method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190625 Address after: 101407 No. 11 Xingke East Street, Yanqi Economic Development Zone, Huairou District, Beijing Patentee after: Research Institute of engineering and Technology Co., Ltd. Address before: 100088 No. 2 Xinjiekouwai Street, Xicheng District, Beijing Patentee before: General Research Institute for Nonferrous Metals |
|
| TR01 | Transfer of patent right | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120829 |
|
| CX01 | Expiry of patent term |