CN202385412U

CN202385412U - Electronic device shell with an electromagnetic wave interference resistance drape structure

Info

Publication number: CN202385412U
Application number: CN2011204808692U
Authority: CN
Inventors: 林忠炫
Original assignee: Individual
Current assignee: Individual
Priority date: 2011-11-28
Filing date: 2011-11-28
Publication date: 2012-08-15
Anticipated expiration: 2021-11-28

Abstract

The utility model relates to an electronic device shell with an electromagnetic wave interference resistance drape structure. The electronic device shell comprises a shell, which is provided with an inner side; a metal coating adhesive layer, which is arranged on the inner side of the shell; a copper plating medium layer, which is positioned on the inner side of the shell and attached to the surface of the metal coating adhesive layer; an electrolytic copper plating conductive layer, which is positioned on the inner side of the shell and attached to the surface of the copper plating medium layer. Because the relatively high adhesive strength is provided on the shell and the properties of the copper plating medium layer and the electrolytic copper plating conductive layer are the same, the relatively good adhesive effect is obtained and the electrolytic copper plating conductive layer with low resistance and high conductivity provides the relatively good electromagnetic wave screening effect.

Description

The tool anti-electromagnetic wave disturbs the electronic equipment shell of draping structure

Technical field

The utility model relates to a kind of electronic equipment shell, and especially a kind of tool anti-electromagnetic wave disturbs the electronic equipment shell of draping structure.

Background technology

Because science and technology is flourish; The Related product of electronics is come out one after another, and also is full of in the middle of our context simultaneously, and computer, notebook computer, mobile phone .. etc. are too numerous to enumerate such as; But; Be accompanied by the utilization exploitation of electronic product, the human harm that frequency electromagnetic waves caused that produces when using is to be one of the topic of every profession and trade institute extensive discussions at present.

In order to reduce the electromagnetic wave that each electronic product produces; And reduction is to the extent of injury of human body; Many electronic products can prevent covering electromagnetic processing at its shell at present; For example: the shell of products such as notebook computer, mobile phone is provided with the coating device of anti electromagnetic wave, and present anti-covering handled the knowledge person of institute conductive paint coated structure, electroless plating structure, metallic plate isolation structure, vacuum coating structure are arranged.

This conductive paint coated structure is to utilize conductive powder and acrylic resin and polyurethane mixed with resin to form a conduction enamelled coating; And its sprinkling is coated on shell, but conducting electricity enamelled coating is easy to generate wearing and tearing, peels off and the higher problem such as the not good and then reduction shield effectiveness of conductive effect that causes of resistance.

This electroless plating structure; Be utilize plating mode just plastic shell immersion plating in containing compositions such as hydrochloric acid, nickelous sulfate, inferior sodium phosphate, formaldehyde, NaOH, constitute an electroless plating layer; But owing to participate in a large amount of noxious substances in the manufacture process,, can't meet the environmental requirement of advanced country such as American-European-Japanese so be easy to generate environmental pollution problems; And when shell abandon after can't reclaim and its conductive resistance poor effect disappearances such as anti-covering property deficiency.

The metallic plate isolation structure is that to utilize a metallic plate to be installed in shell inboard or replace shell, with as further covering, and the shell of general closed planar formula to put the metallic plate of establishing be formless consideration; But usually enclosure is for cooperating the design of various functions, for example: fixing circuit board, cooling fan .. etc., and need the concave-convex design of given configuration; In order to cooperate this design; This metallic plate need be processed, since the problems such as mould, thickness and precision of processing metal plate, the higher and difficult manufacturing of required cost; And the installing of metallic plate also causes the weight load of electronic product, is unfavorable for manufacturing.

Therefore; General anti-shield structure is good with the vacuum coating structure; This vacuum coating structure is to need earlier the plastic shell inboard of electronic product to be carried out earlier surface treatment such as sandblast alligatoring, high-pressure wash, oven dry or the spray paint bottom adheres to bad problem with solution; Plate copper film in the plastic shell inner surface with sputter or vapor deposition mode again and form conductive layer, again on this conductive layer with stainless steel material, utilize sputter or vapor deposition mode to be attached to and form protective layer on this conductive layer; But the resistance of this protective layer is higher, impedance is big, isolating electromagnetic effect and rete tack are not good; In addition, if use the cost of spray paint bottom in advance higher, also have environmental issue.

The utility model content

Higher in order to solve above-mentioned existing electronic equipment housing shroud poor effect, adhesion effect deficiency and production cost with anti electromagnetic wave; Etc. problem, the main purpose of the utility model is to provide a kind of tool anti-electromagnetic wave to disturb the electronic equipment shell of draping structure.

The technological means that the utility model used is to be to provide a kind of tool anti-electromagnetic wave to disturb the electronic equipment shell of draping structure, comprises a housing, and it is provided with an inboard; One metal coating following layer, it is arranged at the inboard of this housing; One copper facing dielectric layer, the surface that it is positioned at this housing inboard and is attached to this metal coating following layer; And an electrolytic copper plating conductive layer, it is inboard and be attached to the surface of this copper facing dielectric layer that it is positioned at this housing.

The electronic equipment shell of the utility model has following effect and promotes:

1, the electrolytic copper plating conductive layer of the utility model has lower resistance, less impedance, and effectively the electromagnetic wave that produced of screening electron product is dissipated into the external world, and the isolation effect of preferable electromagnetic wave shielding is provided.

2, copper facing dielectric layer of the utility model and electrolytic copper plating conductive layer all have same nature with copper as medium; Therefore copper facing dielectric layer and electrolytic copper plating conductive layer between the rete tack preferable, can avoid this electrolytic copper plating conductive layer to come off and influence the performance of anti electromagnetic wave.

3, the metal coating following layer of the utility model is that stainless steel, nickel, chromium, nickel chromium triangle or titanium utilize sputter or vapor deposition mode to be attached to this housing; Because materials such as stainless steel, nickel, chromium, nickel chromium triangle or titanium have high adhesion; And then preferable adhesion effect is provided; So also can carry out surface treatments such as sandblast alligatoring, high-pressure wash, oven dry in advance,, can reduce production costs to reduce the thicknesses of layers of sputter or vapor deposition to the housing inboard.

Description of drawings

Fig. 1 is the stereoscopic figure of the utility model preferred embodiment.

Fig. 2 is the generalized section of the utility model preferred embodiment.

[main element symbol description]

10 housings, 11 inboards

20 metal coating following layers, 30 copper facing dielectric layers

40 electrolytic copper plating conductive layers.

Embodiment

For technical characterictic and practical effect that can this creation of detail knowledge, and can implement,, specify as the back further with like the preferred embodiment shown in graphic according to the content of specification:

The utility model is the electronic equipment shell that a kind of tool anti-electromagnetic wave disturbs draping structure, and please referring to figs. 1 through the preferred embodiment of Fig. 2, it comprises a housing 10, a metal coating following layer 20, a copper facing dielectric layer 30 and an electrolytic copper plating conductive layer 40.

This housing 10 is to can be plastic cement material or formed by not having other materials of conductive effect; Can use the inner assembling of different electronic product and tool is provided with different profiles; Such as: portable computer, mobile phone, music player etc., this housing 10 are to be provided with one inboard 11.

This metal coating following layer 20 is the inboards 11 that are arranged at this housing 10; The material of this metal coating following layer 20 can be wherein one or its combination of stainless steel (grade of steel SUS), nickel (Ni), chromium (Cr), nickel chromium triangle (NiCr) or titanium (Ti); Utilize sputter or vapor deposition mode this metal coating following layer 20 to be attached to the inboard 11 of this housing 10; Because metal materials such as this stainless steel, nickel, chromium, nickel chromium triangle or titanium have higher then characteristic; Therefore this housing 10 also can not need to carry out in advance sandblast alligatoring, high-pressure wash and oven dry or the like surface treatment; And can directly this metal coating following layer 20 directly be arranged on this housing 10, and make the thicknesses of layers of this metal coating following layer 20 to reduce.

This copper facing dielectric layer 30 is the surfaces that are positioned at the inboard 11 of this housing 10 and are attached to this metal coating following layer 20, and this copper facing dielectric layer 30 is to utilize sputter or vapor deposition mode to be attached on this metal coating following layer 20.

This electrolytic copper plating conductive layer 40 is the surfaces that are positioned at the inboard 11 of this housing 10 and are attached to this copper facing dielectric layer 30; This electrolytic copper plating conductive layer 40 is to utilize the electrolytic copper plating mode that copper film is attached to this copper facing dielectric layer 30, because this electrolytic copper plating conductive layer 40 is close with the character of this copper facing dielectric layer 30, all is the composition with copper; Therefore this electrolytic copper plating conductive layer 40 is attached to each other easily with this copper facing dielectric layer 30 and can avoids this electrolytic copper plating conductive layer 40 to come off in one; Because this electrolytic copper plating conductive layer 40 is to be the higher copper film of conductance, so the impedance of this electrolytic copper plating conductive layer 40 is less, more preferably; This electrolytic copper plating conductive layer 40 is less than 1 ohm in cornerwise resistance value of this housing 10 inboard 11; Because the material of high conductivity will produce bigger induced current under electromagnetic effect, this induced current can weaken the electromagnetic effect that penetrates according to cold law, and electromagnetic wave will constantly be decayed when large-scale metal penetrates; Up to decaying to zero; The degree of decay strengthens along with the increase of conductivity of electrolyte materials, magnetic permeability and wave frequency, therefore, is arranged at the inboard of this shell 10 by this electrolytic copper plating conductive layer 40 with high conductivity; Effectively the electromagnetic wave that produced of screening electron product is dissipated into the external world, and can reduce the impairment of electromagnetic wave to human body.

The utility model utilizes this vapor deposition or sputter for this housing 10 higher adhesion to be provided with the inboard 11 that this metal coating following layer 20 of stainless steel, nickel, chromium, nickel chromium triangle or titanium material is attached to this housing 10, and the additional processing that can just lack this housing 10 is handled; And utilize sputter or vapor deposition that this copper facing dielectric layer 30 is attached on this metal coating following layer 20, and increase the fixed effect of this electrolytic copper plating conductive layer 40 as the medium of a binding; Utilize electrolytic copper plating that this electrolytic copper plating conductive layer 40 is attached on this copper facing dielectric layer 30 again, preferable shielding electromagnetic wave effect is provided by this electrolytic copper plating conductive layer 40 of low resistance and high conductivity; So the utility model is that a kind of shell that reduces processing cost, higher tack and higher shield effectiveness can be provided.

The above; It only is the preferred embodiment of the utility model; Be not that the utility model is done any pro forma restriction, have common knowledge the knowledgeable in any affiliated technical field, if in the scope that does not break away from technical characterictic that the utility model is carried; Utilize technology contents that the utility model discloses to do the local equivalent embodiment that changes or modify, all still belong in the scope of the utility model technical characterictic.

Claims

1. a tool anti-electromagnetic wave disturbs the electronic equipment shell of draping structure, comprising:

One housing, it is provided with an inboard;

One metal coating following layer, it is arranged at the inboard of this housing;

One copper facing dielectric layer, the surface that it is positioned at this housing inboard and is attached to this metal coating following layer; And

One electrolytic copper plating conductive layer, the surface that it is positioned at this housing inboard and is attached to this copper facing dielectric layer.