CN202384338U - COB (chip on board) integrated package LED with high color rendering index and high reliability - Google Patents
COB (chip on board) integrated package LED with high color rendering index and high reliability Download PDFInfo
- Publication number
- CN202384338U CN202384338U CN2011205714086U CN201120571408U CN202384338U CN 202384338 U CN202384338 U CN 202384338U CN 2011205714086 U CN2011205714086 U CN 2011205714086U CN 201120571408 U CN201120571408 U CN 201120571408U CN 202384338 U CN202384338 U CN 202384338U
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- Prior art keywords
- solid
- circuit
- solid brilliant
- groove
- circuits
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
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- Led Device Packages (AREA)
Abstract
The utility model relates to a COB (chip on board) integrated package LED with high color rendering index and high reliability, which comprises a metal substrate arranged at the bottom lower, circuits formed at the top layer, and an insulating layer arranged between the circuits and the metal substrate, the metal substrate is provided with a first solid-phase crystallizing groove and a second solid-phase crystallizing groove which extend in the length direction, blue light chips are respectively subjected to solid-phase crystallizing in the first solid-phase crystallizing groove and the second solid-phase crystallizing, first circuits and second circuits are respectively formed on two sides of the first solid-phase crystallizing groove and the second solid-phase crystallizing, middle circuits are formed between the first solid-phase crystallizing groove and the second solid-phase crystallizing groove, red light chips are subjected to solid-phase crystallizing on the middle circuits, the blue light chip and the red light chip are respectively connected to the first circuits, the second circuits and the middle circuits through wires and packaged into an area light source by using package adhesive in one step. According to the utility model, through reasonable layout and use of only one type of silica gel, the area light source is formed directly by simplified package; through the design of the substrate, the blue-light chips with high heat productivity are subjected to solid-phase crystallizing on the substrate and the heat dissipation performance is improved; and through the circuit design, the overall reliability of the product is improved.
Description
Technical field
the present invention relates to the led chip encapsulation field.
Background technology
in the led chip encapsulation field, for color rendering index that improves the COB encapsulation and the influence that reduces the light efficiency reduction, adding red light chips is a kind of means of using always.Shown in accompanying drawing 1, common way is parallel connection after red light chips is connected with blue chip, and red light chips and blue chip are encapsulated respectively, and blue chip is with the encapsulation of yellow fluorescent powder silica gel, and red light chips encapsulates with transparent silica gel.Such packing forms has following shortcoming:
1. each chip all is a point-source of light, for the area source effect that obtains throwing light on required, needs complicated secondary optics design;
2. normally used bipolar electrode red light chips, expensive not only, brightness is also undesirable;
3. red light chips and blue chip need use two kinds of silica gel, cause packaging process complicated;
4. every money substrate can only be applicable to fixing chip-count, the poor compatibility of substrate;
In a single day
5. have a chips to lose efficacy, and 3 chips of whole series connection all lost efficacy, and caused other to increase sharply by the two-way electric current, make other two-way decay fast under big electric current.
Summary of the invention
the present invention seeks to through rational deployment, only use a kind of silica gel, simplify encapsulation, and directly form area source; Make the high blue chip of caloric value solid brilliant on metal substrate through the substrate design, improve thermal diffusivity; Through circuit design, the product global reliability is improved.
are for the problem of the weak heat-dissipating that solves conventional red optical chip COB light source and have, poor reliability, poor compatibility, secondary optics complex design; The present invention designs metal substrate and circuit again; Make the direct and solid crystalline substance of metal substrate of the high blue chip of heating, select the low single electrode red light chips of light efficiency high price also to place intermediate circuit.The all routing parallel connections on circuit of front-seat blue chip both positive and negative polarity even front-seat chip has an inefficacy, do not influence back row's chip yet and use.All chip all is encapsulated in a kind of yellow fluorescent powder silica gel simultaneously, obtains luminous uniform surface light source, has simplified the secondary optics design of subsequent applications.The LED lamp applications that this COB is encapsulated as the high color rendering index (CRI) high reliability provides a kind of ideal designs thinking.
technical scheme that the present invention adopted is: the integrated packaged LED of a kind of high color rendering index (CRI) high reliability COB; It comprises the metal substrate at bottom, the circuit that forms in top layer and the insulating barrier between described circuit and metal substrate; It is characterized in that: offer the first solid brilliant groove, the second solid brilliant groove that extend along its length on the described metal substrate; Solid respectively brilliant blue chip in the described first solid brilliant groove, the second solid brilliant groove; The both sides of the described first solid brilliant groove, the second solid brilliant groove have been formed separately first circuit, second circuit; Be formed with intermediate circuit between the described first solid brilliant groove, the second solid brilliant groove; Solid brilliant red light chips on the described intermediate circuit, described blue chip, red light chips routing respectively once are packaged into area source with packaging plastic after being connected in described first circuit, second circuit and intermediate circuit.Through avoid the insulating barrier of poor heat conductivity at the metal substrate fluting, blue chip is directly solid brilliant in metal substrate; The quantity of chip can be selected (some groups) in certain amplitude.
preferably also are provided with silver coating in the described first solid brilliant groove, the second solid brilliant groove.
preferably through circuit design, only need to use the single electrode red light chips.
are further; The blue chip difference routing that is positioned at the described first solid brilliant groove is on first circuit and intermediate circuit, and described single electrode red light chips is connected the back routing on described second circuit with the blue chip that is positioned at the described second solid brilliant groove.Through the optimization of circuit,, do not influence other chips even there is a blue chip to lose efficacy yet.
are further, and described packaging plastic is circular yellow fluorescent powder silica gel.
owing to adopt technique scheme, the COB area source of the present invention's design has high color rendering index (CRI), and is luminous even; Brightness is high; The advantage of thermal diffusivity excellence etc. for the secondary optics design has been simplified in the application of COB light source, will be quickened the application of LED integrated optical source in light fixture.
Description of drawings
Accompanying drawing 1 is the structural representation of COB packaged LED of the prior art;
Accompanying drawing 2 is the structural representation of the integrated packaged LED of high color rendering index (CRI) high reliability COB of the present invention;
Accompanying drawing 3 is the generalized section of the integrated packaged LED of high color rendering index (CRI) high reliability COB of the present invention;
wherein: 1, metal substrate; 2, blue chip; 3, red light chips; 4, circuit; 5, crystal bonding area; 6, routing; 7, packaging plastic; 8, insulating barrier.
Embodiment
Set forth preferred embodiment of the present invention below in conjunction with accompanying drawing in detail
, thereby so that advantage of the present invention and characteristic can be easier to it will be appreciated by those skilled in the art that protection scope of the present invention is made more explicit defining.
are referring to shown in accompanying drawing 2 and the accompanying drawing 3; The integrated packaged LED of high color rendering index (CRI) high reliability COB in the present embodiment; It comprises the metal substrate 1 at bottom, the circuit 4 that forms in top layer and the insulating barrier 8 between circuit 4 and metal substrate 1; Offer the first solid brilliant groove, the second solid brilliant groove 5 that extend along its length on the metal substrate 1; The both sides of solid respectively brilliant blue chip 2, the first solid brilliant grooves, the second solid brilliant groove 5 have been formed separately between first circuit, second circuit 4, the first solid brilliant grooves, the second solid brilliant groove 5 and have been formed with intermediate circuit 4 in the first solid brilliant groove, the second solid brilliant groove 5; Solid brilliant red light chips 3 on the intermediate circuit 4, blue chip 2, red light chips 3 routing respectively once are packaged into area source with packaging plastic 7 after being connected in first circuit, second circuit and intermediate circuit 4.
The twice first solid brilliant groove, the second solid brilliant groove 5 are left at metal substrate 1 in
; Solid respectively brilliant blue chip 2; Gu can be silver-plated in the brilliant groove to improve luminous efficiency, because the blue chip heating is far longer than red light chips, therefore directly place metal substrate to dispel the heat rapidly; Meanwhile, owing to use fluting solid brilliant, blue chip quantity can change, and only needs to select the red light chips of coupling, and same substrate can compatible different power.Like blue chip+red light chips is 4+2, perhaps 6+3, even 8+4 etc.
respectively have first circuit, second circuit 4 up and down blue chip 2; Be formed with intermediate circuit 4 between the first solid brilliant groove, the second solid brilliant groove 5; Single electrode red light chips 3 is solid brilliant in intermediate circuit 4, through routing chip is linked to each other with circuit.Concrete, the blue chip 2 that is positioned at the first solid brilliant groove 5 respectively routings on first circuit and intermediate circuit 4, single electrode red light chips 3 be positioned at second the blue chip 2 of brilliant groove 5 connected admittedly after routing on second circuit 4.Last row's blue chip routing is on intermediate circuit, and the single electrode red light chips is connected with arranging blue chip down, even so upward row's a blue chip lost efficacy, does not also influence down and two arranges the chips use; Need to prove that the single electrode red light chips is more cheap than bipolar electrode red light chips, and the high choice of brightness is big.At last all chips are once encapsulated with circular yellow fluorescent powder silica gel 7 and form the good uniformity area source, need not complicated secondary optics design.
Above execution mode only is explanation technical conceive of the present invention and characteristics; Its purpose is to let the people that is familiar with this technology understand content of the present invention and implements; Can not limit protection scope of the present invention with this; All equivalences that spirit is done according to the present invention change or modify, and all should be encompassed in protection scope of the present invention
Claims (5)
1. integrated packaged LED of high color rendering index (CRI) high reliability COB; It comprises metal substrate (1), the circuit (4) that forms in top layer that is positioned at bottom and be positioned at described circuit (4) and metal substrate (1) between insulating barrier (8); It is characterized in that: offer the first solid brilliant groove, the second solid brilliant groove (5) that extend along its length on the described metal substrate (1); Solid respectively brilliant blue chip (2) in the described first solid brilliant groove, the second solid brilliant groove (5); The both sides of the described first solid brilliant groove, the second solid brilliant groove (5) have been formed separately first circuit, second circuit (4); Be formed with intermediate circuit (4) between the described first solid brilliant groove, the second solid brilliant groove (5); Described intermediate circuit (4) is gone up solid brilliant red light chips (3), and described blue chip (2), red light chips (3) routing respectively once are packaged into area source with packaging plastic (7) after being connected in described first circuit, second circuit and intermediate circuit (4).
2. the integrated packaged LED of high color rendering index (CRI) high reliability COB according to claim 1 is characterized in that: also be provided with silver coating in the described first solid brilliant groove, the second solid brilliant groove (5).
3. the integrated packaged LED of high color rendering index (CRI) high reliability COB according to claim 1 is characterized in that: described red light chips (3) is the single electrode red light chips.
4. the integrated packaged LED of high color rendering index (CRI) high reliability COB according to claim 3; It is characterized in that: the blue chip (2) that is positioned at the described first solid brilliant groove (5) respectively routing on first circuit and intermediate circuit (4), described single electrode red light chips (3) routing (4) on described second circuit afterwards of connecting with the blue chip (2) that is positioned at the described second solid brilliant groove (5).
5. the integrated packaged LED of high color rendering index (CRI) high reliability COB according to claim 1 is characterized in that: described packaging plastic (7) is circular yellow fluorescent powder silica gel.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205714086U CN202384338U (en) | 2011-12-31 | 2011-12-31 | COB (chip on board) integrated package LED with high color rendering index and high reliability |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011205714086U CN202384338U (en) | 2011-12-31 | 2011-12-31 | COB (chip on board) integrated package LED with high color rendering index and high reliability |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202384338U true CN202384338U (en) | 2012-08-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011205714086U Withdrawn - After Issue CN202384338U (en) | 2011-12-31 | 2011-12-31 | COB (chip on board) integrated package LED with high color rendering index and high reliability |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202384338U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522398A (en) * | 2011-12-31 | 2012-06-27 | 苏州玄照光电有限公司 | COB (Chip On Board) integrated-packaged LED (Light-Emitting Diode) with high color-rendering index and high reliability |
-
2011
- 2011-12-31 CN CN2011205714086U patent/CN202384338U/en not_active Withdrawn - After Issue
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102522398A (en) * | 2011-12-31 | 2012-06-27 | 苏州玄照光电有限公司 | COB (Chip On Board) integrated-packaged LED (Light-Emitting Diode) with high color-rendering index and high reliability |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20120815 Effective date of abandoning: 20131106 |
|
| RGAV | Abandon patent right to avoid regrant |