CN202306619U - Non-contact intelligent card based on gold protruding point encapsulation - Google Patents
Non-contact intelligent card based on gold protruding point encapsulation Download PDFInfo
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- CN202306619U CN202306619U CN2011204025669U CN201120402566U CN202306619U CN 202306619 U CN202306619 U CN 202306619U CN 2011204025669 U CN2011204025669 U CN 2011204025669U CN 201120402566 U CN201120402566 U CN 201120402566U CN 202306619 U CN202306619 U CN 202306619U
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Abstract
The utility model relates to a non-contact intelligent card based on gold protruding point encapsulation. The non-contact intelligent card comprises an upper plastic layer, an INLAY layer and a lower plastic layer arranged from top to bottom, wherein the INLAY layer is provided with an electronic tag; and printing ink layers are arranged between the upper plastic layer and the INLAY layer as well as between the lower plastic layer and the INLAY layer. Compared with the prior art, the non-contact intelligent card has the advantages of increasing the electrical property of a card body, reducing the cost, and the like.
Description
Technical field
The utility model relates to a kind of smart card, especially relates to a kind of contact type intelligent card based on the au bump encapsulation.
Background technology
As everyone knows, in common Chip Packaging, comprise operations such as chip attach and lead-in wire bonding, this type of processing chip volume is bigger; IC encapsulation back card thickness is blocked up and can't handle; Simultaneously along with the increase with the I/O terminal number that reduces of chip size, electrode size and electrode separation become littler, and this can make the chip package lead bonding become difficult more; Also can make the electromagnetic interference (EMI) between lead-in wire become bigger, influence the electrical property of Chip Packaging.In order to make Chip Packaging obtain better electrical property and to increase the I/O terminal number, press for and seek the encapsulation that a kind of new packing forms satisfies the high property superthin device.
The utility model content
The purpose of the utility model is exactly for the defective that overcomes above-mentioned prior art existence a kind of contact type intelligent card based on the au bump encapsulation to be provided.
The purpose of the utility model can realize through following technical scheme:
A kind of contact type intelligent card based on the au bump encapsulation is characterized in that comprise the last plastic layer, INLAY layer and the following plastic layer that set gradually from top to bottom, described INLAY layer is provided with electronic tag.
Described going up between plastic layer and INLAY layer, following plastic layer and the INLAY layer is equipped with printing ink layer.
Described printing ink layer is fixedly attached to the inside surface of plastic layer and following plastic layer respectively.
Described electronic tag is the au bump packaged electronic tag.
The described thickness of going up plastic layer and following plastic layer is 0.01～0.1mm.
The thickness of this smart card is 0.03～0.50mm.
Compared with prior art, the utlity model has following advantage:
Through the au bump encapsulation technology, increased the electrical property of card body own, reduced cost; Make card body thickness standard be less than 0.50mm; The printing ink layer that will form pattern simultaneously is arranged between the INLAY layer upper and lower side hyaline layer of card and middle, can prevent the pattern wearing and tearing, can not increase card thickness simultaneously; Just can see normal pattern from the outside of card through hyaline layer, prolong the serviceable life of IC-card.
Description of drawings
Fig. 1 is the structural representation of the utility model;
Fig. 2 is the decomposition texture synoptic diagram of the utility model.
Embodiment
Below in conjunction with accompanying drawing and specific embodiment the utility model is elaborated.
Embodiment
Like Fig. 1, shown in Figure 2, a kind of contact type intelligent card based on the au bump encapsulation comprises the last plastic layer 2, INLAY layer 1 and the following plastic layer 4 that set gradually from top to bottom, and described INLAY layer 1 is provided with electronic tag 3.Be provided with between printing ink layer 21, following plastic layer 4 and the INLAY layer 1 between described upward plastic layer 2 and the INLAY layer 1 and be provided with down printing ink layer 41.
Be provided with in the INLAY layer 1 and adopt au bump growing technology packaged electronic tag 3; Described plastic layer 2, the length of following plastic layer 4 and the equal in length of INLAY layer 1 of going up; The described width of going up plastic layer 2, following plastic layer 4 equates that with the width of INLAY layer 1 flat shape of described upward plastic layer 2, following plastic layer 4 is identical with the flat shape of described INLAY layer 1.
Wherein, INLAY layer 1 is the electronic tag and the multilayer PET/PVC plastic layer of the various respective model of employing au bump growing technology encapsulation; Electronic tag 3 is realized coupling through the spatial high-frequency alternating magnetic field, in coupling channel according to the law of electromagnetic induction; According to sequential relationship, realize the transmission of energy, the exchange of data.
Plastic layer is connected through the hot pressing structure with INLAY layer 1, adopts corresponding technological parameter to reach to prevent the effect that comes off, and interlaminar strength is greater than 3.5N/cm.
Au bump encapsulation is with putting into 10% hydrochloric acid solution after the wafer flushing, soak 100 seconds post-flush, puts immediately then in the gold plating liquid that the people prepares; This gold plating liquid is no cyanogen; Mainly contain sulphite and thiosulfate, reductive agent is a hydrazine, contains a spot of stabilizing agent; Operating temperature is 60 ℃, can obtain the gold layer of 0.2 μ m in 30 minutes.
Be formed with pattern in the printing ink layer, described pattern becomes the mirror image symmetry with normal pattern.
Plastic layer is made up of the PET/PVC material, and thickness is not more than 0.1mm, and the INLAY layer is made up of multilayer PET/PVC material and electronic tag layer, finally blocks body thickness and is not more than 0.50mm.
Claims (6)
1. the contact type intelligent card based on the au bump encapsulation is characterized in that comprise the last plastic layer, INLAY layer and the following plastic layer that set gradually from top to bottom, described INLAY layer is provided with electronic tag.
2. a kind of contact type intelligent card based on the au bump encapsulation according to claim 1 is characterized in that, described going up between plastic layer and INLAY layer, following plastic layer and the INLAY layer is equipped with printing ink layer.
3. a kind of contact type intelligent card based on the au bump encapsulation according to claim 2 is characterized in that described printing ink layer is fixedly attached to the inside surface of plastic layer and following plastic layer respectively.
4. a kind of contact type intelligent card based on the au bump encapsulation according to claim 1 is characterized in that described electronic tag is the au bump packaged electronic tag.
5. a kind of contact type intelligent card based on the au bump encapsulation according to claim 1 is characterized in that, the described thickness of going up plastic layer and following plastic layer is 0.01～0.1mm.
6. a kind of contact type intelligent card based on the au bump encapsulation according to claim 1 is characterized in that the thickness of this smart card is 0.03～0.50mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204025669U CN202306619U (en) | 2011-10-20 | 2011-10-20 | Non-contact intelligent card based on gold protruding point encapsulation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011204025669U CN202306619U (en) | 2011-10-20 | 2011-10-20 | Non-contact intelligent card based on gold protruding point encapsulation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202306619U true CN202306619U (en) | 2012-07-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011204025669U Expired - Lifetime CN202306619U (en) | 2011-10-20 | 2011-10-20 | Non-contact intelligent card based on gold protruding point encapsulation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202306619U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106203606A (en) * | 2016-08-22 | 2016-12-07 | 无锡品冠物联科技有限公司 | A kind of high durable PVC electronic tag and production technology thereof |
-
2011
- 2011-10-20 CN CN2011204025669U patent/CN202306619U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106203606A (en) * | 2016-08-22 | 2016-12-07 | 无锡品冠物联科技有限公司 | A kind of high durable PVC electronic tag and production technology thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120704 |
|
| CX01 | Expiry of patent term |