CN202189389U - Ultra-thin non-contact IC card based on gold bump packaging - Google Patents
Ultra-thin non-contact IC card based on gold bump packaging Download PDFInfo
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- CN202189389U CN202189389U CN201120256459XU CN201120256459U CN202189389U CN 202189389 U CN202189389 U CN 202189389U CN 201120256459X U CN201120256459X U CN 201120256459XU CN 201120256459 U CN201120256459 U CN 201120256459U CN 202189389 U CN202189389 U CN 202189389U
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Abstract
The utility model discloses an ultra-thin non-contact IC card based on a gold bump packaging, relating to the intelligent card manufacturing technology field. The ultra-thin non-contact IC card based on the gold bump packaging is composed of an intermediate INLAY layer and at least two transparent PET/PVC plastic layers of which the thicknesses are not more than 0.1mm. The IC card employs a gold bump growth technology to carry out a high density packaging on a chip, reducing the package volume; by employing an electroless gold plating technology to manufacture the bump on an aluminium electrode, a mass production is easy to realize, and a lot of cost is reduced than employing the conventional manner, and the ultra-thin non-contact IC card is finally manufactured by cooperating with the mirror image printing and superposition.
Description
Technical field
The utility model relates to physical field and smart card manufacturing technology, relates in particular to a kind of ultra-thin non-contact IC card based on the au bump encapsulation.
Background technology
As everyone knows, in common Chip Packaging, comprise operations such as chip attach and lead-in wire bonding, this type of processing chip volume is bigger; IC encapsulation back card thickness is blocked up and can't handle; Simultaneously along with the increase with the I/O terminal number that reduces of chip size, electrode size and electrode separation become littler, and this can make the chip package lead bonding become difficult more; Also can make the electromagnetic interference (EMI) between lead-in wire become bigger, influence the electrical property of Chip Packaging.In order to make Chip Packaging obtain better electrical property and to increase the I/O terminal number, press for and seek the encapsulation that a kind of new packing forms satisfies the high property superthin device.
So Flip-Chip Using is arisen at the historic moment, this encapsulation unites two into one the stickup of chip with being connected.Connection is to realize through salient point that is array distribution on the chip and the electrode alignment bonding on the substrate.Compare with the lead-in wire bonding of routine; Through bump structure, make interconnection length shorter, the resistance and the inductance of interconnection are littler; The electrical property of device is significantly improved and improves; Salient point that the more important thing is flip-chip can be perimetric pattern and planar array type distribution, thereby has improved the density of encapsulation, has reduced the volume of encapsulation.
Summary of the invention
The purpose of the utility model provides a kind of ultra-thin non-contact IC card based on the au bump encapsulation; This IC-card uses the au bump growing technology that chip is carried out high-density packages; Dwindled the volume of encapsulation, the au bump growing technology is the expensive low stud bump making technology of a kind of reliability, and the operation of a key was that the aluminium electrode metallizes again during chip bump was made; Thin-film technique, photoetching process and etching process etc. are used in the metallization again of most aluminium electrodes; Can increase manufacturing cost, and on the aluminium electrode, adopt the chemical gilding bump making process, not only need not use equipment expensive in the above-mentioned operation; But also can be easy to realize quantizing to produce, so chemical gilding fabrication techniques salient point has a extensive future.
This ultra-thin non-contact IC card based on au bump encapsulation of the utility model is not more than clear PET/PVC plastic layer formation of 0.1mm at least by INLAY layer in the middle of and two thickness.
Be provided with in the INLAY layer in the middle of described and adopt au bump growing technology packaged electronic tag; The equal in length of the length of described clarity plastic layer and described middle INLAY layer; The width of described clarity plastic layer equates that with the width of described middle INLAY layer the flat shape of described clarity plastic layer is identical with the flat shape of described middle INLAY layer.
Wherein, Middle INLAY layer is the electronic tag and the multilayer PET/PVC plastic layer of the various respective model of employing au bump growing technology encapsulation; Electronic tag is realized coupling through the spatial high-frequency alternating magnetic field, in coupling channel according to the law of electromagnetic induction; According to sequential relationship, realize the transmission of energy, the exchange of data.
Further; Respectively there is a described clarity plastic layer to be fixedly installed on the both side surface of affiliated middle INLAY layer; Be provided with printing ink layer between the both side surface of described clarity plastic layer and middle INLAY layer, described printing ink layer is fixedly attached in the inner surface of described clarity plastic layer.
Further, described clarity plastic layer is connected through the hot pressing structure with middle INLAY layer, adopts corresponding technological parameter to reach to prevent the effect that comes off, and interlaminar strength is greater than 3.5N/cm.
Concrete, described au bump encapsulation is with putting into 10% hydrochloric acid solution after the wafer flushing, soaking 100 seconds post-flush; Put immediately then in the gold plating liquid that the people prepares, this gold plating liquid mainly contains sulphite and thiosulfate for no cyanogen; Reductive agent is a hydrazine; Contain a spot of stabilizing agent, operating temperature is 60 ℃, can obtain the gold layer of 0.2 μ m in 30 minutes.
Concrete, being formed with pattern in the described printing ink layer, described pattern becomes the mirror image symmetry with normal pattern.
Concrete, described clarity plastic layer is made up of the PET/PVC material, and thickness is not more than 0.1mm, and middle INLAY layer is made up of multilayer PET/PVC material and electronic tag layer, finally blocks body thickness and is not more than 0.50mm.
The beneficial effect of the utility model is: a kind of ultra-thin non-contact IC card based on the au bump encapsulation successfully is provided, has contrasted with prior art, its effect is actively with tangible; Through the au bump encapsulation technology, increased the electrical property of card body own, reduced cost; Make card body thickness standard be less than 0.50mm; The printing ink layer that will form pattern simultaneously is arranged between the INLAY layer upper and lower side hyaline layer of card and middle, can prevent the pattern wearing and tearing, can not increase card thickness simultaneously; Just can see normal pattern from the outside of card through hyaline layer, prolong the serviceable life of IC-card.
Description of drawings
Below in conjunction with accompanying drawing and embodiment the utility model is further specified.
Fig. 1 is the side structure synoptic diagram based on a preferred embodiment of the ultra-thin non-contact IC card of au bump encapsulation of the utility model.
Fig. 2 is the decomposition texture synoptic diagram based on a preferred embodiment of the ultra-thin non-contact IC card of au bump encapsulation of the utility model.
Embodiment
As depicted in figs. 1 and 2, the utility model be not more than clear PET/PVC plastic layer 2 formations of 0.1mm at least by INLAY layer 1 in the middle of and two thickness based on the ultra-thin non-contact IC card of au bump encapsulation.
Be provided with in the INLAY layer in the middle of described and adopt au bump growing technology packaged electronic tag 3; The equal in length of the length of described clarity plastic layer 2 and described middle INLAY layer 1; The width of described clarity plastic layer 2 equates that with the width of described middle INLAY layer 1 flat shape of described clarity plastic layer 2 is identical with the flat shape of described middle INLAY layer 1.
Further; Respectively there is a described clarity plastic layer 2,4 to be fixedly installed on the both side surface of affiliated middle INALY layer 1; Be provided with printing ink layer 21,41 between the both side surface of described clarity plastic layer 2,4 and middle INLAY layer 1, described printing ink layer 21,41 is fixedly attached in the inner surface of described clarity plastic layer 2,4.
Further, described clarity plastic layer 2, second clarity plastic layer 4 are connected through the hot pressing structure with middle INLAY layer 1, adopt corresponding technological parameter to reach to prevent the effect that comes off, and interlaminar strength is greater than 3.5N/cm.
Concrete, described au bump is that wafer is put into the gold plating liquid for preparing, and this gold plating liquid is for no cyanogen; Mainly contain sulphite and thiosulfate, reductive agent is a hydrazine, contains a spot of stabilizing agent; Operating temperature is 60 ℃, can obtain the gold layer of 0.2 μ m in 30 minutes.
Concrete, being formed with pattern in described printing ink layer 21 and the printing ink layer 41, described pattern becomes the mirror image symmetry with normal pattern.
Concrete, described clarity plastic layer 2, second clarity plastic layer 4 are made up of the PET/PVC material, and thickness is not more than 0.1mm, and middle INLAY layer is made up of multilayer PET/PVC material and electronic tag layer, finally blocks body thickness and is not more than 0.50mm.
Claims (4)
1. the ultra-thin non-contact IC card that encapsulates based on au bump; It is characterized in that: the clear PET/PVC plastic layer that is not more than 0.1mm at least by INLAY layer in the middle of and two thickness constitutes, and is equipped with in the INLAY layer in the middle of described and adopts the au bump packaged electronic tag.
2. according to right 1 described ultra-thin non-contact IC card based on the au bump encapsulation; It is characterized in that: respectively have a described clarity plastic layer to be fixedly installed on the both side surface of described middle INLAY layer; Be provided with printing ink layer between the both side surface of described clarity plastic layer and middle INLAY layer, described printing ink layer is fixedly attached in the inner surface of described clarity plastic layer.
3. according to right 1 described ultra-thin non-contact IC card based on the au bump encapsulation, it is characterized in that: described au bump encapsulation is meant that it is the gold layer of 0.2 μ m that thickness is arranged on two salient points of wafer.
4. according to right 1 described ultra-thin non-contact IC card based on the au bump encapsulation, it is characterized in that: described clarity plastic layer is connected through the hot pressing structure with middle INLAY layer, and final card thickness is not more than 0.50mm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120256459XU CN202189389U (en) | 2011-07-20 | 2011-07-20 | Ultra-thin non-contact IC card based on gold bump packaging |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201120256459XU CN202189389U (en) | 2011-07-20 | 2011-07-20 | Ultra-thin non-contact IC card based on gold bump packaging |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202189389U true CN202189389U (en) | 2012-04-11 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201120256459XU Expired - Lifetime CN202189389U (en) | 2011-07-20 | 2011-07-20 | Ultra-thin non-contact IC card based on gold bump packaging |
Country Status (1)
| Country | Link |
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| CN (1) | CN202189389U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103279787A (en) * | 2013-06-20 | 2013-09-04 | 杨晓园 | Ultrathin intelligent gold card |
| CN105670476A (en) * | 2016-01-12 | 2016-06-15 | 常州百佳薄膜科技有限公司 | Aqueous coating used for PVC scratch-resistant membrane, PVC scratch-resistant membrane thereof, IC card and preparation method thereof |
-
2011
- 2011-07-20 CN CN201120256459XU patent/CN202189389U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103279787A (en) * | 2013-06-20 | 2013-09-04 | 杨晓园 | Ultrathin intelligent gold card |
| CN105670476A (en) * | 2016-01-12 | 2016-06-15 | 常州百佳薄膜科技有限公司 | Aqueous coating used for PVC scratch-resistant membrane, PVC scratch-resistant membrane thereof, IC card and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20120411 |
|
| CX01 | Expiry of patent term |