CN202218478U - 一种能够贴装于pcb板的复合金属连接件 - Google Patents
一种能够贴装于pcb板的复合金属连接件 Download PDFInfo
- Publication number
- CN202218478U CN202218478U CN2011203197140U CN201120319714U CN202218478U CN 202218478 U CN202218478 U CN 202218478U CN 2011203197140 U CN2011203197140 U CN 2011203197140U CN 201120319714 U CN201120319714 U CN 201120319714U CN 202218478 U CN202218478 U CN 202218478U
- Authority
- CN
- China
- Prior art keywords
- pcb
- copper sheet
- pcb board
- connecting piece
- nickel
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000002184 metal Substances 0.000 title claims abstract description 32
- 229910052751 metal Inorganic materials 0.000 title claims abstract description 32
- 239000002131 composite material Substances 0.000 title abstract description 14
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims abstract description 71
- 229910052802 copper Inorganic materials 0.000 claims abstract description 52
- 239000010949 copper Substances 0.000 claims abstract description 52
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 51
- 229910052759 nickel Inorganic materials 0.000 claims abstract description 36
- 239000000758 substrate Substances 0.000 claims abstract description 18
- 238000000034 method Methods 0.000 claims abstract description 12
- 238000005272 metallurgy Methods 0.000 claims abstract description 6
- 239000000203 mixture Substances 0.000 claims description 22
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims description 9
- 150000002815 nickel Chemical class 0.000 claims description 5
- 238000005516 engineering process Methods 0.000 abstract description 5
- 238000005096 rolling process Methods 0.000 abstract description 4
- 230000007613 environmental effect Effects 0.000 abstract description 3
- 238000009713 electroplating Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229910000679 solder Inorganic materials 0.000 abstract 1
- 239000000463 material Substances 0.000 description 24
- 238000000576 coating method Methods 0.000 description 10
- 239000011248 coating agent Substances 0.000 description 8
- 238000005452 bending Methods 0.000 description 6
- 150000001875 compounds Chemical class 0.000 description 4
- 238000007747 plating Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229910000570 Cupronickel Inorganic materials 0.000 description 2
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 2
- 239000006071 cream Substances 0.000 description 2
- 230000032798 delamination Effects 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 230000033228 biological regulation Effects 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009792 diffusion process Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004070 electrodeposition Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
- 238000004804 winding Methods 0.000 description 1
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Abstract
Description
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011203197140U CN202218478U (zh) | 2011-08-30 | 2011-08-30 | 一种能够贴装于pcb板的复合金属连接件 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011203197140U CN202218478U (zh) | 2011-08-30 | 2011-08-30 | 一种能够贴装于pcb板的复合金属连接件 |
Publications (1)
Publication Number | Publication Date |
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CN202218478U true CN202218478U (zh) | 2012-05-09 |
Family
ID=46017699
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2011203197140U Expired - Lifetime CN202218478U (zh) | 2011-08-30 | 2011-08-30 | 一种能够贴装于pcb板的复合金属连接件 |
Country Status (1)
Country | Link |
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CN (1) | CN202218478U (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103165284A (zh) * | 2013-03-01 | 2013-06-19 | 溧阳华晶电子材料有限公司 | 一种具有复合基板的薄膜电容器的制造方法 |
CN103165282A (zh) * | 2013-03-01 | 2013-06-19 | 溧阳华晶电子材料有限公司 | 一种薄膜电容器用复合基板 |
CN103715586A (zh) * | 2014-01-14 | 2014-04-09 | 深圳市中金岭南科技有限公司 | 制备与pcb板连接的金属导电连接件的方法及连接件 |
CN103928651A (zh) * | 2013-01-16 | 2014-07-16 | 徐卓辉 | 镶嵌复合金属结构极耳单体、排式极耳及制造方法 |
CN104183295A (zh) * | 2013-05-22 | 2014-12-03 | 徐卓辉 | 一种铝基镶嵌复合金属带材及其制造方法 |
-
2011
- 2011-08-30 CN CN2011203197140U patent/CN202218478U/zh not_active Expired - Lifetime
Cited By (8)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103928651A (zh) * | 2013-01-16 | 2014-07-16 | 徐卓辉 | 镶嵌复合金属结构极耳单体、排式极耳及制造方法 |
CN103928651B (zh) * | 2013-01-16 | 2016-10-19 | 徐卓辉 | 镶嵌复合金属结构极耳单体、排式极耳及制造方法 |
CN103165284A (zh) * | 2013-03-01 | 2013-06-19 | 溧阳华晶电子材料有限公司 | 一种具有复合基板的薄膜电容器的制造方法 |
CN103165282A (zh) * | 2013-03-01 | 2013-06-19 | 溧阳华晶电子材料有限公司 | 一种薄膜电容器用复合基板 |
CN103165284B (zh) * | 2013-03-01 | 2016-02-17 | 溧阳华晶电子材料有限公司 | 一种具有复合基板的薄膜电容器的制造方法 |
CN104183295A (zh) * | 2013-05-22 | 2014-12-03 | 徐卓辉 | 一种铝基镶嵌复合金属带材及其制造方法 |
CN103715586A (zh) * | 2014-01-14 | 2014-04-09 | 深圳市中金岭南科技有限公司 | 制备与pcb板连接的金属导电连接件的方法及连接件 |
WO2015106555A1 (zh) * | 2014-01-14 | 2015-07-23 | 深圳市中金岭南科技有限公司 | 制备与pcb板连接的金属导电连接件的方法及连接件 |
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Owner name: SHENZHEN ZHONGJIN LINGNAN SCIENCE + TECHNOLOGY CO. Free format text: FORMER OWNER: XU ZHUOHUI Effective date: 20130913 |
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Free format text: CORRECT: ADDRESS; FROM: 528000 FOSHAN, GUANGDONG PROVINCE TO: 518000 SHENZHEN, GUANGDONG PROVINCE |
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Effective date of registration: 20130913 Address after: Jinxiu road 518000 in Guangdong province Shenzhen City Pingshan New District Industrial Zone No. 2 Patentee after: Shenzhen Nonfemet Technology Co., Ltd. Address before: Chancheng District of Guangdong city in Foshan province 528000 Qin Ren LU Hong Mian yuan 14 No. 802 Patentee before: Xu Zhuohui |
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ASS | Succession or assignment of patent right |
Owner name: SHENZHEN XINYUE MATERIAL TECHNOLOGY CO., LTD. Free format text: FORMER OWNER: SHENZHEN ZHONGJIN LINGNAN SCIENCE + TECHNOLOGY CO., LTD. Effective date: 20150707 |
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C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20150707 Address after: Jinxiu Road, Pingshan Pingshan large industrial district of Shenzhen City, Guangdong Province, No. 2 518122 Patentee after: Shenzhen Xin Yue Mstar Technology Ltd Address before: Jinxiu road 518000 in Guangdong province Shenzhen City Pingshan New District Industrial Zone No. 2 Patentee before: Shenzhen Nonfemet Technology Co., Ltd. |
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CU03 | Correction of utility model patent gazette |
Correction item: Patentee|Address Correct: SHENZHEN NONFEMET TECHNOLOGY CO., LTD.|Jinxiu Road, Pingshan Pingshan large industrial district of Shenzhen City, Guangdong Province, No. 2 518122 False: Shenzhen Xin Yue Mstar Technology Ltd|Jinxiu Road, Pingshan Pingshan large industrial district of Shenzhen City, Guangdong Province, No. 2 518122 Number: 30 Volume: 31 |
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ERR | Gazette correction | ||
C41 | Transfer of patent application or patent right or utility model | ||
CU03 | Correction of utility model patent gazette |
Correction item: Patentee|Address Correct: Shenzhen Nonfemet Technology Co., Ltd.|Jinxiu road 518000 in Guangdong province Shenzhen City Pingshan New District Industrial Zone No. 2 False: SHENZHEN NONFEMET TECHNOLOGY CO., LTD.|Jinxiu Road, Pingshan Pingshan large industrial district of Shenzhen City, Guangdong Province, No. 2 518122 Number: 45 Volume: 31 |
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ERR | Gazette correction | ||
TR01 | Transfer of patent right |
Effective date of registration: 20151217 Address after: Jinxiu Road, Pingshan Pingshan large industrial district of Shenzhen City, Guangdong Province, No. 2 518122 Patentee after: SHENZHEN NONFEMET TECHNOLOGY CO., LTD. Address before: Jinxiu road 518000 in Guangdong province Shenzhen City Pingshan New District Industrial Zone No. 2 Patentee before: Shenzhen Nonfemet Technology Co., Ltd. |
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CX01 | Expiry of patent term | ||
CX01 | Expiry of patent term |
Granted publication date: 20120509 |