CN202190494U - Radiator of high-power power electronic device - Google Patents
Radiator of high-power power electronic device Download PDFInfo
- Publication number
- CN202190494U CN202190494U CN2011202812231U CN201120281223U CN202190494U CN 202190494 U CN202190494 U CN 202190494U CN 2011202812231 U CN2011202812231 U CN 2011202812231U CN 201120281223 U CN201120281223 U CN 201120281223U CN 202190494 U CN202190494 U CN 202190494U
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- power electronic
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Abstract
The utility model relates to a radiator of a high-power power electronic device. The radiator includes substrates, heat conducting tubes, fins and insulating plates. The radiator of the high-power power electronic device in the utility model has a simple structure. Power can be supplied to a silicon controlled rectifier through the substrates. And heat generated by the silicon controlled rectifier can be transmitted to the heat conducting tubes on all the substrates. The heat conducting tubes transmit the heat to the corresponding fins. Compared with a prior water cooling radiation, not only the precious water resource is saved, but also the danger caused by water leakage is avoided. Temperature can be reduced further by 3 DEG C. The radiator of the high-power power electronic device in the utility model has good heat radiation effect.
Description
Technical field
The utility model relates to power electronic device heat dissipation equipment field, especially a kind of device for high-power power electronic radiator.
Background technology
In production processes such as steel mill, colliery; Often to use powerful power consumption equipment; Be provided with a plurality of silicon-controlled devices in these power devices circuit; Each silicon-controlled device all distributes very big heat when work, if there is not good heat dissipation equipment, silicon-controlled device will certainly damage owing to high heat.At present; Manufacturer adopts the radiating mode of water-cooled more, promptly the cold water in the pond is guided in the heat exchanger of silicon-controlled device mounted on surface through water pipe, and the heat that controllable silicon distributes is taken away; But because the relevant device of water-cooled is very complicated; Installation and maintenance are all wasted time and energy very much, in case and water occur to leak, can cause the damage of equipment.
The utility model content
The purpose of the utility model is to overcome the deficiency of prior art, and a kind of device for high-power power electronic radiator of simple in structure, good heat dissipation effect is provided.
The technical scheme that the utility model is taked is:
A kind of device for high-power power electronic radiator; It is characterized in that: comprise substrate, heat pipe, fin and insulation board; All forming one between the setting of three substrate parallel interval and both sides substrate and the Intermediate substrate and clamp the silicon controlled gap, insulate respectively and installs a tie down screw in three substrate both sides, a plurality of heat pipes of the equal parallel interval setting-in in each substrate upper surface; The a plurality of fins of common installation on a plurality of heat pipes on each substrate; Adjacent two substrates are adorned between a plurality of fins on the heat pipe and are vertically clamped an insulation board, are shaped on the screw that is used for the connection bus copper bar in a side of each substrate, in each heat pipe, are filled with conductive fluid.
And, common spiral-lock one insulating top cover in the upper end of a plurality of heat pipes of adorning on each substrate, the upper end of said two insulation boards of this insulating top cover bottom surface setting-in.
And the upper surface of both sides substrate and Intermediate substrate is equipped with two spacing blocks, and these two spacing blocks make to adorn between a plurality of heat pipes on the adjacent substrate and insulate, and these two spacing block upper surfaces are the lower end of said two insulation boards of setting-in respectively.
And the outside end face of both sides substrate is all made a guide pillar, and the outside end face of each guide pillar press-fits an end cap, the end of two said tie down screws of both sides setting-in of each end cap.
And, end cap inner side end and coaxial crimping one butterfly spring of homonymy guide pillar outside end face.
The advantage and the good effect of the utility model are:
The utility model is simple in structure, supply power to controllable silicon through substrate, and the heat that simultaneously controllable silicon is produced conducts on the heat pipe on each substrate; Heat pipe conducts to heat on the corresponding fin; With traditional water-cooling relatively, not only save precious water resource, avoided water to leak the danger that produces; Temperature can reduce by 3 degrees centigrade again, has outstanding radiating effect.
Description of drawings
Fig. 1 is the structural representation of the utility model;
Fig. 2 is that the A-A of Fig. 1 is to sectional view.
Embodiment
Below in conjunction with embodiment, the utility model is further specified, following embodiment is illustrative, is not determinate, can not limit the protection range of the utility model with following embodiment.
A kind of device for high-power power electronic radiator; Shown in Fig. 1~4; The innovation of the utility model is: comprise substrate 6, heat pipe 4, fin 2 and insulation board 3; All form between the setting of three substrate parallel interval and both sides substrate and the Intermediate substrate one clamp controllable silicon 12 the gap, the extension 11 of three substrate both sides installs a tie down screw 9, three heat pipes of the equal parallel interval setting-in in each substrate upper surface through outer tube 13 insulation respectively; The a plurality of fins of common installation on three heat pipes on each substrate; Adjacent two substrates are adorned between a plurality of fins on three heat pipes and are vertically clamped an insulation board, are shaped on the screw 15 that is used for the connection bus copper bar in a side of each substrate, in each heat pipe, are filled with conductive fluid 14.
In the present embodiment, common spiral-lock one insulating top cover 1 in the upper end of three heat pipes of adorning on each substrate, the upper end of said two insulation boards of this insulating top cover bottom surface setting-in.The upper surface of both sides substrate and Intermediate substrate is equipped with two spacing blocks 5, and these two spacing blocks make to adorn between a plurality of heat pipes on the adjacent substrate and insulate, and these two spacing block upper surfaces are the lower end of said two insulation boards of setting-in respectively.
The outside end face of both sides substrate is all made a guide pillar 10, and the outside end face of each guide pillar press-fits an end cap 7, the end of two said tie down screws of both sides setting-in of each end cap.End cap inner side end and coaxial crimping one butterfly spring 8 of homonymy guide pillar outside end face.When substrate expanded with heat and contract with cold, butterfly spring can guarantee closely to contact between end cap, substrate and tie down screw and the controllable silicon, and guide pillar can be avoided the radial-play of butterfly spring.
The utility model is simple in structure, supply power to controllable silicon through substrate, and the heat that simultaneously controllable silicon is produced conducts on the heat pipe on each substrate; Heat pipe conducts to heat on the corresponding fin; With traditional water-cooling relatively, not only save precious water resource, avoided water to leak the danger that produces; Temperature can reduce by 3 degrees centigrade again, has outstanding radiating effect.
Claims (5)
1. device for high-power power electronic radiator; It is characterized in that: comprise substrate, heat pipe, fin and insulation board; All forming one between the setting of three substrate parallel interval and both sides substrate and the Intermediate substrate and clamp the silicon controlled gap, insulate respectively and installs a tie down screw in three substrate both sides, a plurality of heat pipes of the equal parallel interval setting-in in each substrate upper surface; The a plurality of fins of common installation on a plurality of heat pipes on each substrate; Adjacent two substrates are adorned between a plurality of fins on the heat pipe and are vertically clamped an insulation board, are shaped on the screw that is used for the connection bus copper bar in a side of each substrate, in each heat pipe, are filled with conductive fluid.
2. device for high-power power electronic radiator according to claim 1 is characterized in that: common spiral-lock one insulating top cover in the upper end of a plurality of heat pipes of adorning on each substrate, the upper end of said two insulation boards of this insulating top cover bottom surface setting-in.
3. device for high-power power electronic radiator according to claim 1; It is characterized in that: the upper surface of both sides substrate and Intermediate substrate is equipped with two spacing blocks; These two spacing blocks make to adorn between a plurality of heat pipes on the adjacent substrate and insulate, and these two spacing block upper surfaces are the lower end of said two insulation boards of setting-in respectively.
4. according to claim 1 or 2 or 3 described device for high-power power electronic radiators; It is characterized in that: the outside end face of both sides substrate is all made a guide pillar; The outside end face of each guide pillar press-fits an end cap, the end of two said tie down screws of both sides setting-in of each end cap.
5. device for high-power power electronic radiator according to claim 4 is characterized in that: end cap inner side end and coaxial crimping one butterfly spring of homonymy guide pillar outside end face.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202812231U CN202190494U (en) | 2011-08-04 | 2011-08-04 | Radiator of high-power power electronic device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011202812231U CN202190494U (en) | 2011-08-04 | 2011-08-04 | Radiator of high-power power electronic device |
Publications (1)
Publication Number | Publication Date |
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CN202190494U true CN202190494U (en) | 2012-04-11 |
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN2011202812231U Expired - Fee Related CN202190494U (en) | 2011-08-04 | 2011-08-04 | Radiator of high-power power electronic device |
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CN (1) | CN202190494U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104577809B (en) * | 2013-10-18 | 2017-05-10 | 佳兴电机股份有限公司 | Radiator for switchboard copper bar |
-
2011
- 2011-08-04 CN CN2011202812231U patent/CN202190494U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104577809B (en) * | 2013-10-18 | 2017-05-10 | 佳兴电机股份有限公司 | Radiator for switchboard copper bar |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120411 Termination date: 20140804 |
|
EXPY | Termination of patent right or utility model |