CN204425868U - Water-cooling plate - Google Patents
Water-cooling plate Download PDFInfo
- Publication number
- CN204425868U CN204425868U CN201520009290.6U CN201520009290U CN204425868U CN 204425868 U CN204425868 U CN 204425868U CN 201520009290 U CN201520009290 U CN 201520009290U CN 204425868 U CN204425868 U CN 204425868U
- Authority
- CN
- China
- Prior art keywords
- copper pipe
- water
- cooling plate
- substrate
- obturator
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model provides a kind of water-cooling plate.Described water-cooling plate comprises substrate, copper pipe and obturator, and described substrate comprises groove, and described copper pipe is embedded in described groove, makes described substrate surface keep smooth in the gap that described obturator is filled in described copper pipe and groove.The water-cooling plate that the utility model provides is by being embedded copper pipe as cooling passage in substrate inside, copper pipe not easily with cooling fluid generation chemical reaction, thus avoid the extremely low material of thermal conductivity gathering at pipeline wall, ensure that the heat exchange between heating panel and cooling fluid, good radiating effect can be kept for a long time, improve the reliability of water-cooling plate, and obturator is filled in the gap of copper pipe and substrate recess, both can fix copper pipe, the evenness of substrate surface can be ensured again.
Description
Technical field
The utility model relates to technical field of heat dissipation, particularly a kind of water-cooling plate.
Background technology
Tradition water-cooling plate adopts aluminium sheet central bore road as cooling fluid circulation passage, utilize the circulation of cooling fluid in duct to take away heat, but because aluminum chemistry Nature comparison is active, during at high temperature or by acid water, easily there is chemical reaction in duct inwall, the extremely low material of one deck thermal conductivity is formed on cell walls surface, have a strong impact on the heat-conducting effect of heating panel, and adopt the mode of boring as heat radiation duct, easily cause duct wall coarse, the easy fouling of the material under the function of current in cooling fluid is attached on the wall of duct.
Utility model content
The utility model mainly solves that existing water-cooling plate radiating effect is poor, the technical problem of the coarse easy fouling of duct wall.
In order to solve the problems of the technologies described above, the utility model embodiment discloses a kind of water-cooling plate, comprise substrate, copper pipe and obturator, described substrate comprises groove, described copper pipe is embedded in described groove, makes described substrate surface keep smooth in the gap that described obturator is filled in described copper pipe and groove.
In a preferred embodiment of the present utility model, the degree of depth of described groove is greater than the diameter of described copper pipe.
In a preferred embodiment of the present utility model, also comprise water supply connector and water out adapter, described water supply connector and water out adapter are installed on described copper pipe two ends respectively, and are connected with described copper pipe.
In a preferred embodiment of the present utility model, described copper pipe is U-shaped.
In a preferred embodiment of the present utility model, described obturator is the mixture of epoxy resin and aluminium oxide.
In a preferred embodiment of the present utility model, described obturator to be filled in the gap of described copper pipe and groove by reperfusion mode and to make described substrate surface keep smooth.
In a preferred embodiment of the present utility model, described substrate also comprises multiple installing holes of constant power device.
In a preferred embodiment of the present utility model, also comprise draw ring, described draw ring is fixedly connected with described substrate.
Compared to prior art, the water-cooling plate that the utility model provides is by being embedded copper pipe as cooling passage in substrate inside, copper pipe not easily with cooling fluid generation chemical reaction, thus avoid the extremely low material of thermal conductivity gathering at pipeline wall, ensure that the heat exchange between heating panel and cooling fluid, good radiating effect can be kept for a long time, improve the reliability of water-cooling plate, and obturator is filled in the gap of copper pipe and substrate recess, both can fix copper pipe, the evenness of substrate surface can be ensured again.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, below the accompanying drawing used required in describing embodiment is briefly described, apparently, accompanying drawing in the following describes is only embodiments more of the present utility model, for those of ordinary skill in the art, under the prerequisite not paying creative work, other accompanying drawing can also be obtained according to these accompanying drawings, wherein:
Fig. 1 is the structural representation of water-cooling plate one preferred embodiment that the utility model provides;
Fig. 2 is the three-dimensional exploded view of water-cooling plate shown in Fig. 1.
Embodiment
Be clearly and completely described to the technical scheme in the utility model embodiment below, obviously, described embodiment is only a part of embodiment of the present utility model, instead of whole embodiments.Based on the embodiment in the utility model, those of ordinary skill in the art are not making other embodiments all obtained under creative work prerequisite, all belong to the scope of the utility model protection.
Please refer to Fig. 1 and Fig. 2, wherein Fig. 1 is the structural representation of water-cooling plate one preferred embodiment that the utility model provides, and Fig. 2 is the three-dimensional exploded view of water-cooling plate shown in Fig. 1.Described water-cooling plate 100 comprises substrate 1, copper pipe 2, obturator 3, water supply connector 4 and water out adapter 5.
Described substrate 1 comprises groove 11 and the multiple installing holes 12 for constant power device.Particularly, described substrate 1 is rectangular plate-like structure.Described groove 11 is carved in the surperficial milling of substrate 1 and is formed, and its shape is consistent with the shape of described copper pipe 2.The degree of depth of described groove 11 is greater than the diameter of described copper pipe 2, and its width is embedded as suitable can make described copper pipe 2.Described installing hole 12 can be screwed hole, is convenient to the installation and removal of power device.
Described copper pipe 2 is embedded in described groove 11.In order to the impurity reduced in cooling fluid is adsorbed in duct internal face and fouling under the function of current, described copper pipe 2 adopts smooth internal face.In the present embodiment, described copper pipe 2 is U-shaped.
Described obturator 3 to be filled in described copper pipe 2 and the gap of groove 11 and to make that described substrate 1 is surperficial keeps smooth.Preferably, described obturator 3 is the mixture of epoxy resin and aluminium oxide, it can be filled in described copper pipe 2 and the gap of groove 11 by reperfusion mode and make described substrate 1 surface keep smooth, on the one hand, described obturator 3 plays the effect of fixing copper pipe 2, on the other hand, ensures the evenness on described substrate 1 surface, and described obturator 3 itself has good thermal diffusivity, can not affect the radiating effect of substrate 1.
Described water supply connector 4 and water out adapter 5 are installed on described copper pipe 2 two ends respectively, and are connected with described copper pipe 2.Described copper pipe 2, by water supply connector 4 and water out adapter 5 and external refrigeration system docking, forms cooling circuit, the carry heat that power device work sends is gone out, thus realize the cooling of power device.
Usual described water-cooling plate 100 is heavier, and conveniently it moves, and can also arrange draw ring 6.Described draw ring 6 is fixedly connected with described substrate 1, hooks draw ring 6 by boom hoisting, with mobile whole water-cooling plate 100.
Compared to prior art, the water-cooling plate that the utility model provides is by being embedded copper pipe as cooling passage in substrate inside, copper pipe not easily with cooling fluid generation chemical reaction, thus avoid the extremely low material of thermal conductivity gathering at pipeline wall, ensure that the heat exchange between heating panel and cooling fluid, good radiating effect can be kept for a long time, improve the reliability of water-cooling plate, and obturator is filled in the gap of copper pipe and substrate recess, both can fix copper pipe, the evenness of substrate surface can be ensured again.
The foregoing is only embodiment of the present utility model; not thereby the scope of the claims of the present utility model is limited; every utilize the utility model description to do equivalent structure or equivalent flow process conversion; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (8)
1. a water-cooling plate, is characterized in that, comprises substrate, copper pipe and obturator, and described substrate comprises groove, and described copper pipe is embedded in described groove, makes described substrate surface keep smooth in the gap that described obturator is filled in described copper pipe and groove.
2. water-cooling plate according to claim 1, is characterized in that, the degree of depth of described groove is greater than the diameter of described copper pipe.
3. water-cooling plate according to claim 1, is characterized in that, also comprises water supply connector and water out adapter, and described water supply connector and water out adapter are installed on described copper pipe two ends respectively, and are connected with described copper pipe.
4. water-cooling plate according to claim 1, is characterized in that, described copper pipe is U-shaped.
5. water-cooling plate according to claim 1, is characterized in that, described obturator is the mixture of epoxy resin and aluminium oxide.
6. water-cooling plate according to claim 5, is characterized in that, described obturator to be filled in the gap of described copper pipe and groove by reperfusion mode and to make described substrate surface keep smooth.
7. water-cooling plate according to claim 1, is characterized in that, described substrate also comprises multiple installing holes of constant power device.
8. water-cooling plate according to claim 1, is characterized in that, also comprises draw ring, and described draw ring is fixedly connected with described substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520009290.6U CN204425868U (en) | 2015-01-04 | 2015-01-04 | Water-cooling plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520009290.6U CN204425868U (en) | 2015-01-04 | 2015-01-04 | Water-cooling plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204425868U true CN204425868U (en) | 2015-06-24 |
Family
ID=53476187
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520009290.6U Expired - Fee Related CN204425868U (en) | 2015-01-04 | 2015-01-04 | Water-cooling plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204425868U (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017000746A1 (en) * | 2015-06-30 | 2017-01-05 | 比亚迪股份有限公司 | Cooling plate, lithium-ion battery module, and automobile |
| CN110176649A (en) * | 2019-04-17 | 2019-08-27 | 广东工业大学 | A kind of thermal management device of battery |
| CN111180399A (en) * | 2018-11-09 | 2020-05-19 | 宁波江丰电子材料股份有限公司 | Cooling plate and manufacturing method thereof |
| CN113795114A (en) * | 2021-06-23 | 2021-12-14 | 上海市富力达科技股份有限公司 | High-heat-dissipation weather-resistant water cooling plate and application thereof |
| CN115627464A (en) * | 2022-09-23 | 2023-01-20 | 靖江先锋半导体科技有限公司 | Novel cooling disc and manufacturing process thereof |
-
2015
- 2015-01-04 CN CN201520009290.6U patent/CN204425868U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017000746A1 (en) * | 2015-06-30 | 2017-01-05 | 比亚迪股份有限公司 | Cooling plate, lithium-ion battery module, and automobile |
| CN111180399A (en) * | 2018-11-09 | 2020-05-19 | 宁波江丰电子材料股份有限公司 | Cooling plate and manufacturing method thereof |
| CN111180399B (en) * | 2018-11-09 | 2021-09-07 | 宁波江丰电子材料股份有限公司 | Cooling plate and manufacturing method thereof |
| CN110176649A (en) * | 2019-04-17 | 2019-08-27 | 广东工业大学 | A kind of thermal management device of battery |
| CN113795114A (en) * | 2021-06-23 | 2021-12-14 | 上海市富力达科技股份有限公司 | High-heat-dissipation weather-resistant water cooling plate and application thereof |
| CN115627464A (en) * | 2022-09-23 | 2023-01-20 | 靖江先锋半导体科技有限公司 | Novel cooling disc and manufacturing process thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150624 Termination date: 20180104 |