CN113795114A - High-heat-dissipation weather-resistant water cooling plate and application thereof - Google Patents
High-heat-dissipation weather-resistant water cooling plate and application thereof Download PDFInfo
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- CN113795114A CN113795114A CN202110698270.4A CN202110698270A CN113795114A CN 113795114 A CN113795114 A CN 113795114A CN 202110698270 A CN202110698270 A CN 202110698270A CN 113795114 A CN113795114 A CN 113795114A
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- water
- cooling plate
- dissipation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20509—Multiple-component heat spreaders; Multi-component heat-conducting support plates; Multi-component non-closed heat-conducting structures
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D133/00—Coating compositions based on homopolymers or copolymers of compounds having one or more unsaturated aliphatic radicals, each having only one carbon-to-carbon double bond, and at least one being terminated by only one carboxyl radical, or of salts, anhydrides, esters, amides, imides, or nitriles thereof; Coating compositions based on derivatives of such polymers
- C09D133/04—Homopolymers or copolymers of esters
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/08—Anti-corrosive paints
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/16—Antifouling paints; Underwater paints
- C09D5/1606—Antifouling paints; Underwater paints characterised by the anti-fouling agent
- C09D5/1612—Non-macromolecular compounds
- C09D5/1625—Non-macromolecular compounds organic
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D5/00—Coating compositions, e.g. paints, varnishes or lacquers, characterised by their physical nature or the effects produced; Filling pastes
- C09D5/16—Antifouling paints; Underwater paints
- C09D5/1656—Antifouling paints; Underwater paints characterised by the film-forming substance
- C09D5/1662—Synthetic film-forming substance
- C09D5/1668—Vinyl-type polymers
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- Chemical & Material Sciences (AREA)
- Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Materials Engineering (AREA)
- Wood Science & Technology (AREA)
- Organic Chemistry (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Paints Or Removers (AREA)
Abstract
The invention relates to the field of H05K7/20, in particular to a high-heat-dissipation weather-resistant water-cooling plate and application thereof, wherein the weather-resistant water-cooling plate comprises a water-cooling plate body (1), a support column (2) and a water distributor assembly (3). The water-cooling plate disclosed by the invention has the advantages of good sealing property and strong pressure resistance, wherein the coating on the inner wall of the copper pipe has strong waterproof capability, does not bubble or warp after being immersed in water for a long time, does not have corrosion phenomenon after being used for a long time, has thin coating amount and good leveling property, does not have microorganism adhesion after being used for a long time, does not need to be periodically dosed and cleaned, and can achieve a good heat dissipation effect under an excellent water-blocking effect.
Description
Technical Field
The invention relates to the field of H05K7/20, in particular to a high-heat-dissipation weather-proof water-cooling plate and application thereof.
Background
The water cooling plate is a heat dissipation system mainly composed of a cold water distribution controller, a back plate heat exchanger and a cold water source, has no parts of traditional heat dissipation systems such as fan blades, motors, refrigerators and the like, has low refrigeration cost, good heat dissipation effect and safe and reliable operation, and is widely used in the processing and heat dissipation links in the fields of electronic component processing, computer rooms, electric automobiles and the like.
CN112201877A discloses a double-deck water-cooling board is used to electric automobile PACK, contains upper plenum and lower cavity in its own structure, mainly used electric automobile's battery heat dissipation, however, the air coefficient of heat conductivity in the cavity is low, and the radiating effect is not good, and water-cooling efficiency is low.
The inlet tube and the outlet pipe of water-cooling board generally are copper pipe, and it causes the inner wall corrosion to block easily to cross water for a long time, and aquatic microorganism also attaches to the inner wall easily, need regularly dose clean, influences water-cooling efficiency, consequently, develop a good heat dissipation, weather resistance is strong, the water-cooling board that microorganism adhesive force is low very meaningful.
Disclosure of Invention
The invention provides a high-heat-dissipation weather-resistant water cooling plate, which comprises a water cooling plate body 1, a support column 2 and a water distributor assembly 3.
As a preferred embodiment, the water-cooling plate body 1 includes an aluminum plate 101 and a copper pipe 102.
Preferably, the copper tube 102 is embedded inside the aluminum plate 101.
Preferably, epoxy glue is filled between the aluminum plate 101 and the copper tube 102.
Preferably, the epoxy glue has a thermal conductivity of 5W/(m deg.c).
Preferably, the copper tubes 102 are arranged in a serpentine shape inside the aluminum plate 101.
Preferably, the length of the water-cooling plate body 1 is 180cm, the width is 90-120cm, and the thickness is 5-12 cm.
Preferably, the copper tube is cylindrical.
Preferably, the diameter of the cylinder is 1-3 cm.
As a preferred embodiment, the strut 2 comprises a rear strut 201 and a lower strut 202.
Preferably, the number of the rear pillars 201 is 3 to 6.
Preferably, the number of the lower struts 202 is 2.
Preferably, the rear pillar 201 is located at a side of the water-cooling plate body 1.
Preferably, the lower support column 202 is located at the lower bottom edge of the water-cooling plate body 1.
In a preferred embodiment, the diverter assembly 3 includes a left diverter assembly 301 and a right diverter assembly 302.
Preferably, the left water separator assembly 301 is located at the bottom of the front surface of the water-cooling plate body 1.
Preferably, the right water distributor assembly 302 is located at the bottom of the reverse side of the water cooling plate body 1.
In a preferred embodiment, the water-cooling plate body 1 and the water separator assembly 3 are connected by welding.
As a preferred embodiment, the inner wall of the copper tube 102 is coated with a coating, and the coating is prepared from the following raw materials in parts by weight: 10-20 parts of acrylic resin, 0.2-3 parts of defoaming agent, 0.1-5 parts of flatting agent, 0.2-3 parts of dispersing agent, 0.5-5 parts of filler and 0.2-3 parts of mildew preventive.
As a preferred embodiment, the acrylic resin is a thermoplastic acrylic resin.
Preferably, the viscosity (25 ℃) of the thermoplastic acrylic resin is 1500-3000cP.
Preferably, the mass fraction of hydroxyl groups in the thermoplastic acrylic resin is 3 to 4%.
The defoaming agent is not particularly limited, and any defoaming agent capable of reducing or eliminating foam can be used, and the defoaming agent can be selected from mineral oil, alcohols, fatty acids, fatty acid esters, amides, phosphates, silicones, polyethers, polyether modified polysiloxane defoaming agents, such as silicone defoaming agents.
As a preferred embodiment, the leveling agent includes at least one of a fluorine modified acrylate leveling agent, polyacrylic acid, carboxymethyl cellulose, isophorone, diacetone alcohol, and polydimethylsiloxane.
Preferably, the leveling agent is polyacrylic acid.
Preferably, the polyacrylic acid has an ultimate viscosity of 0.06 to 0.1 dl/g.
The invention does not specially limit the dispersant, and the dispersant can be any dispersant which can disperse substances in a system, and the dispersant can be selected from fatty acids, aliphatic amides and esters, paraffin, metal soaps and low molecular waxes, such as paraffin.
As a preferred embodiment, the filler comprises at least one of fumed silica, zinc oxide, titanium dioxide, kaolin, alumina.
Preferably, the filler is fumed silica.
Preferably, the particle size of the fumed silica is 10 to 20 nm.
Preferably, the fumed silica has a specific surface area of 200. + -.25 m2/g。
As a preferred embodiment, the mildew preventive comprises at least one of sodium pentachlorophenol, 2, 4, 6-trichlorophenol and tetrachloroisophthalonitrile.
Preferably, the mildew preventive is sodium pentachlorophenol and tetrachloroisophthalonitrile.
Preferably, the mass ratio of the sodium pentachlorophenol to the tetrachloroisophthalonitrile is (1-3): (0.5-1).
Preferably, the mass ratio of the sodium pentachlorophenol to the tetrachloroisophthalonitrile is 2.5: 0.7.
as a preferred embodiment, the coating is prepared from the following raw materials in parts by weight: 0.5-5 parts of graphene.
Preferably, the mass fraction of the graphene in the system is not less than 1.5%.
Preferably, the sheet diameter size of the graphene is 0.06-0.12 μm.
Preferably, the specific surface area of the graphene is 150-200m2/g。
The preparation method of the coating comprises the following steps: uniformly mixing acrylic resin, a defoaming agent, a flatting agent, a dispersing agent, a filler, a mildew preventive and graphene in a mixer, putting into a reaction kettle for full reaction to obtain a coating, filling the coating on the inner wall of a copper pipe, blowing by using compressed air, and drying for 1-100h at 30-60 ℃ to obtain the copper pipe.
In a preferred embodiment, the thickness of the coating is 0.03 to 0.08 mm.
The invention provides an application of a high-heat-dissipation weather-resistant water-cooling plate in the field of heat dissipation of electronic components.
Compared with the prior art, the invention has the following beneficial effects: the water-cooling plate disclosed by the invention has the advantages of good sealing property and strong pressure resistance, wherein the coating on the inner wall of the copper pipe has strong waterproof capability, does not bubble or warp after being immersed in water for a long time, does not have corrosion phenomenon after being used for a long time, has thin coating amount and good leveling property, does not have microorganism adhesion after being used for a long time, does not need to be periodically dosed and cleaned, and can achieve a good heat dissipation effect under an excellent water-blocking effect.
In addition, the epoxy glue with the heat conductivity coefficient of 5W/(m DEG C) is filled between the copper pipe and the aluminum plate in the water cooling plate, so that on one hand, the gap between the copper pipe and the aluminum pipe is filled, the mechanical friction is reduced, on the other hand, the heat conductivity between the copper pipe and the aluminum pipe is improved, the problems that in the prior art, air exists between the copper pipe and the aluminum plate and the heat conductivity is poor are solved, and the heat dissipation effect of the whole water cooling plate is further improved.
The relevant information of the material of the invention is as follows:
thermoplastic acrylic resin (3.3% by weight of hydroxyl group) was purchased from Wuhanshi Quanxing New materials science & technology Co., Ltd, model No. 2233
Thermoplastic acrylic resin (1.5% by weight of hydroxyl group) was purchased from Wuhanshi Quanxing New Material science and technology Co., Ltd, model No. 3230
The silicone defoamer is purchased from Shaanxi Kaili cleaning Co Ltd, and has the model of KL-501
Polyacrylic acid was purchased from Juxinglong Water treatment Co., Ltd
Fumed silica was purchased from Kjem industries, Shanghai, under type A200
Graphene was purchased from Suzhou Beike New Material science and technology Co., Ltd
Epoxy glue was purchased from bordeaux chemicals (shanghai) limited
Paraffin wax is purchased from Yu-Fang chemical Co., Ltd, No. 52
Sodium pentachlorophenol CAS: 131-52-2
Tetrachloroisophthalonitrile CAS: 1897-45-6
Drawings
FIGS. 1-2 are schematic illustrations of the present invention.
The water cooling plate comprises a water cooling plate body (1), a support column (2), a water distributor component (3), an aluminum plate (101), a copper pipe (102), a rear support column (201), a lower support column (202), a left water distributor component (301) and a right water distributor component (302).
Detailed Description
Example 1
The first aspect of this embodiment provides a high heat dissipation resistant water-cooling board that waits, includes water-cooling board body, pillar, water knockout drum subassembly.
This body of water-cooling board includes aluminum plate and copper pipe, and the copper pipe is snakelike arranging and inlays and is filled the epoxy glue (coefficient of heat conductivity is 5W/(m x degree C)) inside and aluminum plate and copper pipe between, and the length of the water-cooling board body is 150cm, and the width is 110cm, and thickness is 7cm, and the copper pipe is cylindrical, and the diameter is 2cm, and thickness is 0.8 mm.
The pillar includes 4 back pillars and 2 lower pillars, the side of back pillar water-cooling board body, and lower pillar is located the lower base of water-cooling board body.
The water distributor component is welded with the water cooling plate body and comprises a left water distributor component and a right water distributor component, the left water distributor component is located at the bottom of the front face of the water cooling plate body, and the right water distributor component is located at the bottom of the back face of the water cooling plate body.
The inner wall of the copper pipe is coated with a coating, and the coating is prepared from the following raw materials in parts by weight: 16 parts of thermoplastic acrylic resin (the viscosity (25 ℃) is 2500cP.s, the mass fraction of hydroxyl is 3.3 percent), 1.3 parts of organic silicon defoaming agent, 3 parts of polyacrylic acid (the limiting viscosity is 0.08dl/g), 1 part of paraffin, and fumed silica (the particle size is 15nm, and the specific surface area is 200 +/-25 m)22.6 parts of mildew preventive, 1.5 parts of graphene (the sheet diameter is 0.09 mu m, and the specific surface area is 180 m)2Per g)2 parts.
The mildew preventive is composed of sodium pentachlorophenate and tetrachloroisophthalonitrile in a mass ratio of (2.5): 0.7 compounding.
The preparation method of the coating comprises the following steps: uniformly mixing thermoplastic acrylic resin, an organic silicon defoamer, polyacrylic acid, paraffin, fumed silica, a mildew preventive and graphene in a mixer, putting into a reaction kettle for full reaction to obtain a coating, spraying the coating on the inner wall of a copper pipe, wherein the spraying thickness is 0.05mm, and drying for 24h at 50 ℃ to obtain the copper pipe.
The second aspect of the embodiment provides an application of a high-heat-dissipation weather-resistant water-cooling plate in the heat dissipation field of electronic components.
Comparative example 1
The first aspect of the present comparative example provides a weather-resistant water-cooled panel with high heat dissipation, which is similar to example 1, except that the fumed silica has a particle size of 50 nm.
The second aspect of the comparative example provides application of the high-heat-dissipation weather-resistant water cooling plate in the field of heat dissipation of electronic components.
Comparative example 2
The first aspect of the present comparative example provides a weather-resistant water-cooling plate with high heat dissipation performance, and the specific implementation manner is the same as that in example 1, except that the weight part of graphene is 10 parts.
The second aspect of the comparative example provides application of the high-heat-dissipation weather-resistant water cooling plate in the field of heat dissipation of electronic components.
Comparative example 3
The first aspect of the present comparative example provides a weather-resistant water-cooled panel with high heat dissipation, which is similar to example 1, except that the mass fraction of hydroxyl groups in the thermoplastic acrylic resin is 1.5%.
The second aspect of the comparative example provides application of the high-heat-dissipation weather-resistant water cooling plate in the field of heat dissipation of electronic components.
Comparative example 4
The first aspect of the present comparative example provides a weather-resistant water-cooling plate with high heat dissipation performance, which is implemented in the same manner as in example 1, except that the mildew preventive is sodium pentachlorophenol and tetrachloroisophthalonitrile at a mass ratio of 1: 1, compounding.
The second aspect of the comparative example provides application of the high-heat-dissipation weather-resistant water cooling plate in the field of heat dissipation of electronic components.
Performance testing
Weather resistance test method: the water-cooled plates of the above examples and comparative examples were used by introducing cold water for 300d, and the inner wall of the copper pipe was examined for any adverse phenomena such as peeling of the coating, peeling, and adhesion of microorganisms.
| Weather resistance | |
| Example 1 | The inner wall is smooth. Without adverse changes |
| Comparative example 1 | With microorganism attached |
| Comparative example 2 | With microorganism attached |
| Comparative example 3 | The coating partially comes off and peels off |
| Comparative example 4 | The coating partially comes off and peels off |
Standard reference for dwell test: TSG D0001-2009
Standard reference for extreme pressure testing: GB 6306.2-1986
Standard reference for static pressure test: GB/T33634-2017
| Example 1 | |
| Pressure holding test | 0.7bar |
| Ultimate pressure test | 12bar，15min |
| Static pressure test | 21bar，30min |
Claims (10)
1. A high-heat-dissipation weather-resistant water cooling plate is characterized by comprising a water cooling plate body (1), a support column (2) and a water distributor assembly (3).
2. The high-heat-dissipation weather-resistant water-cooling plate as claimed in claim 1, wherein the water-cooling plate body (1) comprises an aluminum plate (101) and a copper tube (102).
3. A high heat dissipation weatherable water-cooled plate as claimed in claim 1, wherein said pillars (2) comprise rear pillars (201) and lower pillars (202).
4. A high heat dissipation weatherproof water-cooled plate as claimed in claim 3, wherein the number of said rear pillars (201) is 3-6.
5. A high heat dissipation weatherproof water-cooled plate according to claim 1, characterized in that the water knockout drum assembly (3) comprises a left water knockout drum assembly (301) and a right water knockout drum assembly (302).
6. The high-heat-dissipation weather-resistant water-cooling plate as claimed in claim 1, wherein the water-cooling plate body (1) and the water separator assembly (3) are connected by welding.
7. The high-heat-dissipation weather-resistant water-cooling plate as recited in claim 2, wherein epoxy glue is filled between the aluminum plate (101) and the copper tube (102).
8. The high-heat-dissipation weather-resistant water-cooling plate as recited in claim 2, wherein the inner wall of the copper pipe (102) is coated with a coating, and the coating is prepared from the following raw materials in parts by weight: 10-20 parts of acrylic resin, 0.2-3 parts of defoaming agent, 0.1-5 parts of flatting agent, 0.2-3 parts of dispersing agent, 0.5-5 parts of filler and 0.2-3 parts of mildew preventive.
9. The high-heat-dissipation weather-resistant water-cooling plate as recited in claim 8, wherein the coating is prepared from the following raw materials in parts by weight: 0.5-5 parts of graphene.
10. Use of a high thermal dissipation weatherproof water-cooled plate according to any one of claims 1 to 9 in the field of heat dissipation of electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110698270.4A CN113795114A (en) | 2021-06-23 | 2021-06-23 | High-heat-dissipation weather-resistant water cooling plate and application thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202110698270.4A CN113795114A (en) | 2021-06-23 | 2021-06-23 | High-heat-dissipation weather-resistant water cooling plate and application thereof |
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| CN113795114A true CN113795114A (en) | 2021-12-14 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202110698270.4A Pending CN113795114A (en) | 2021-06-23 | 2021-06-23 | High-heat-dissipation weather-resistant water cooling plate and application thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115627464A (en) * | 2022-09-23 | 2023-01-20 | 靖江先锋半导体科技有限公司 | Novel cooling disc and manufacturing process thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204425868U (en) * | 2015-01-04 | 2015-06-24 | 东莞市威力固电路板设备有限公司 | Water-cooling plate |
| CN107903789A (en) * | 2017-11-24 | 2018-04-13 | 湖南太子化工涂料有限公司 | A kind of one-component coating and preparation method applied to pipe inner wall |
| CN210773606U (en) * | 2019-05-27 | 2020-06-16 | 昆山海益博散热器有限公司 | Copper pipe water-cooling plate with double-sided heat dissipation |
| CN210808078U (en) * | 2019-11-14 | 2020-06-19 | 苏州韦恩特电气有限公司 | Deep-buried copper pipe water cooling plate |
| CN211012549U (en) * | 2019-11-13 | 2020-07-14 | 苏州韦恩特电气有限公司 | Copper pipe type water cooling plate containing refrigerant medium |
| CN211860914U (en) * | 2020-04-21 | 2020-11-03 | 南宁八菱科技股份有限公司 | Graphene electronic component water-cooling plate |
| CN112201877A (en) * | 2020-09-08 | 2021-01-08 | 安徽鸿创新能源动力有限公司 | Electric automobile PACK is with double-deck water-cooling board |
-
2021
- 2021-06-23 CN CN202110698270.4A patent/CN113795114A/en active Pending
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN204425868U (en) * | 2015-01-04 | 2015-06-24 | 东莞市威力固电路板设备有限公司 | Water-cooling plate |
| CN107903789A (en) * | 2017-11-24 | 2018-04-13 | 湖南太子化工涂料有限公司 | A kind of one-component coating and preparation method applied to pipe inner wall |
| CN210773606U (en) * | 2019-05-27 | 2020-06-16 | 昆山海益博散热器有限公司 | Copper pipe water-cooling plate with double-sided heat dissipation |
| CN211012549U (en) * | 2019-11-13 | 2020-07-14 | 苏州韦恩特电气有限公司 | Copper pipe type water cooling plate containing refrigerant medium |
| CN210808078U (en) * | 2019-11-14 | 2020-06-19 | 苏州韦恩特电气有限公司 | Deep-buried copper pipe water cooling plate |
| CN211860914U (en) * | 2020-04-21 | 2020-11-03 | 南宁八菱科技股份有限公司 | Graphene electronic component water-cooling plate |
| CN112201877A (en) * | 2020-09-08 | 2021-01-08 | 安徽鸿创新能源动力有限公司 | Electric automobile PACK is with double-deck water-cooling board |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115627464A (en) * | 2022-09-23 | 2023-01-20 | 靖江先锋半导体科技有限公司 | Novel cooling disc and manufacturing process thereof |
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