CN202103096U - Nesting radiation support for packaging LED and LED lamp - Google Patents
Nesting radiation support for packaging LED and LED lamp Download PDFInfo
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- CN202103096U CN202103096U CN2011201681863U CN201120168186U CN202103096U CN 202103096 U CN202103096 U CN 202103096U CN 2011201681863 U CN2011201681863 U CN 2011201681863U CN 201120168186 U CN201120168186 U CN 201120168186U CN 202103096 U CN202103096 U CN 202103096U
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- heat sink
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- cooling stand
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Abstract
The utility model provides a nesting radiation support for packaging an LED and an LED lamp, which belongs to the technical field of radiation. The nesting radiation support comprises a packaging substrate and an embedded radiating part, wherein the packaging substrate is in a platy structure provided with an embedded hole for containing the embedded radiating part, the embedded radiating part is a heat conductor used for being embedded into the embedded hole, and the embedded position of the embedded radiating part corresponds to the position of an LED chip to be packaged. On one hand, by the aid of the packaging substrate and the embedded radiating part, the nesting radiation support for packaging the LED is capable of leading out heat radiated by the LED chip more quickly so that radiating performance is improved, and on the other hand, the LED lamp with the nesting radiation support is fine in radiating capacity.
Description
Technical field
The utility model belongs to the heat dissipation technology field.
Background technology
The application of LED lamp is progressively popularized, but because the deficiency of heat-sinking capability makes be affected the useful life of LED lamp.In order to solve the heat dissipation problem of LED lamp, developed multiple solution at present.Such as, adopt the heat sink conception of aluminium base, perhaps strengthen size and the area of dissipation of radiator etc., and the material that adopts high heat dispersion, as the pottery etc. that dispels the heat.
Present stage, the cooling stand of LED encapsulation usefulness mainly adopts simple alumina ceramic plate or metal base printed circuit board to realize.These structures mostly exist conductive coefficient lower, with deficiencies such as the thermal expansion coefficient difference of led chip is big, consequence such as can cause the heat radiation of led chip bad, reliability is low.Therefore, the cooling stand that the high-power LED encapsulation of development of new is used just seems very important.
The utility model content
The purpose of the utility model provides the nested cooling stand of a kind of LED of being used for encapsulation, and a kind of LED lamp with nested cooling stand, utilizes the utility model, can make cooling stand in the LED encapsulation to have better heat dispersion.
A kind of nested cooling stand that is used for the LED encapsulation, this support comprises:
Enclosed chip is its laminated structure that is provided with embedded hole, and this embedded hole is in order to put following embedded heat sink;
Embedded heat sink is in order to being embedded into the heat carrier structure in the aforementioned embedded hole, the position corresponding led chip to be packaged.
Further, the nested cooling stand of the aforesaid a kind of LED of being used for encapsulation also comprises following technical characterictic:
Described embedded heat sink is the height frustum cone structure identical with enclosed chip thickness, and corresponding embedded hole is the hole of shape and size and this round platform consistent size.
Described round platform, the inclination angle between its inclined-plane and the round platform bottom surface is between 60 degree-89 degree.
Aforesaid round platform, the inclination angle between its inclined-plane and the round platform bottom surface is between 80 degree-87.5 degree.
Described embedded heat sink is by the column part that is positioned at an end, and common composition of round platform part that is positioned at the other end, and its total height is identical with enclosed chip thickness;
Accordingly, on enclosed chip, being provided with top is that column structure, bottom are the embedded hole of frustum cone structure, in order to put the described embedded heat sink that includes column part and round platform part.
Described round platform, the inclination angle between its inclined-plane and the round platform bottom surface is between 60 degree-120 degree.
Described embedded heat sink is the height column structure identical with enclosed chip thickness.
The utility model also provides a kind of LED lamp with nested cooling stand; This lamp includes the heat-dissipating frame at the shell position that is arranged on lamp, in order to LED control circuit that output current is provided to led chip with in order to the fixing package floor of enclosed chip, this lamp also comprises:
Enclosed chip is to be fixed on the described package floor, and it is provided with the laminated structure in embedded hole, and this embedded hole is in order to put following embedded heat sink;
Embedded heat sink is in order to being embedded into the heat carrier structure in the aforementioned embedded hole, the position corresponding led chip to be packaged;
Described led chip is arranged on the aforesaid enclosed chip, corresponding the position of aforementioned embedded heat sink.
Further, aforesaid a kind of LED lamp with nested cooling stand also includes following technical characterictic:
On described enclosed chip, be provided with in order to be communicated with the circuit unit of led chip.
Be connected between described led chip and the described circuit unit, for connecting lead.
Through enclosed chip in the utility model and embedded heat sink, the heat that makes this nested cooling stand that is used for the LED encapsulation more promptly led chip to be distributed is derived, and has improved heat dispersion.On the other hand, the LED lamp with nested cooling stand that utilizes the utility model to realize has obtained good heat-sinking capability through nested cooling stand.
Description of drawings
Fig. 1 is the flow chart of manufacturing process of the nested cooling stand of the described LED of being used for of the utility model encapsulation.
Fig. 2 is the described structural representation with LED lamp of nested cooling stand of the utility model.
Fig. 3 a is the generalized section of the described embedded heat sink of the utility model along center line, and embedded heat sink is a frustum cone structure among this embodiment.
Fig. 3 b is the generalized section of the described embedded heat sink of the utility model along center line, and embedded heat sink is the common structure of forming of cylinder and round platform among this embodiment, is a kind of embodiment.
Fig. 3 c is the generalized section of the described embedded heat sink of the utility model along center line, and embedded heat sink is the common structure of forming of cylinder and round platform among this embodiment, is another kind of embodiment.
Embodiment
The conductive coefficient of graphite composite material, at present high energy reaches more than the 400W/ (mK).Therefore, has the rapid ability that derives of the heat that the led chip place is produced.Its coefficient of linear expansion is about 6 * 10
-6/ K, approaching with Sapphire Substrate (being a kind of coating of LED encapsulation usefulness) coefficient of linear expansion, the chip drawing crack that can avoid thermal mismatching to cause.
But graphite composite material is a conductor, need carry out insulation processing to it and just can be used in the cooling stand of LED, but the process of insulation processing, usually can damage the heat conductivility of graphite composite material.
And in the utility model, graphite composite material and electrical insulator is compound, mutually nested, the deficiency that the heat-sinking capability that can avoid conventional insulation processing to cause declines to a great extent.Simultaneously, utilize the close thermal coefficient of expansion of graphite composite material and enclosed chip, the nested cooling stand of making in order to the LED encapsulation can effectively reduce the thermal stress of bringing because of thermal expansion coefficient difference between the different materials, reduces the failure probability of finished product.
With respect to traditional base plate for packaging; Graphite composite material is nested in the cooling stand that enclosed chip (material such as aluminium oxide ceramics) formed; Its comprehensive heat dissipation is significantly promoted; Thereby reduced the light efficiency decay of led chip, the bad colour temperature drift that causes that reduced to dispel the heat, and can prolong the useful life of led chip.On the other hand, thermal expansion matching has also improved the reliability of device preferably.
Below in conjunction with accompanying drawing the utility model is done further to describe.
Join shown in Figure 1ly, scheme to utilize graphite composite material 100 in the described structure, after processing, make embedded heat sink 110 at this.
This embedded heat sink 110 as preferred embodiment and non-limiting, is fit to be processed to column structure, or frustum cone structure, or the structure that is made up of jointly stylolitic part and round platform part.
Shown in ginseng Fig. 3 a, embedded heat sink 110 has been made into frustum cone structure, and the inclination angle between its round platform inclined-plane and the round platform bottom surface is taken as a.As preferred embodiment, inclination angle a is fit between 60 degree-89 degree.This angle both can also be convenient to processing simultaneously so that can interfix well between described embedded heat sink 110 and the enclosed chip 200; And, when being processed into the LED lamp, embedded heat sink 110 flat a section can also and package floor 600 shown in Figure 2 between realize good contact, help heat conduction.
Further, the inclination angle a between this round platform inclined-plane and the round platform bottom surface, preferred selection is between 80 degree-87.5 degree.
Shown in ginseng Fig. 3 b or Fig. 3 c, described embedded heat sink 110 includes the column part that is positioned at an end, and the round platform part that is positioned at the other end, and both total heights are fit to identical with enclosed chip thickness.Certainly, the ratio enclosed chip that also can the thickness of embedded heat sink 110 be done after embedded heat sink 110 is nested in enclosed chip, removes redundance slightly more greatly again, that's all.
Accordingly, on supporting enclosed chip 200, being provided with top is that column structure, bottom are the embedded hole of frustum cone structure, in order to put the aforesaid embedded heat sink 110 that includes column part and round platform part.
Shown in ginseng Fig. 3 b or Fig. 3 c, for the embedded heat sink 110 that includes column part and round platform part simultaneously, in its round platform part, the inclination angle between round platform inclined-plane and the round platform bottom surface is taken as b, and this angle is fit between 60 degree-120 degree.
Wherein, in the embodiment shown in Fig. 3 b, the angular range of the inclination angle b between round platform inclined-plane and the round platform bottom surface is between 60 degree-90 degree.
Wherein, in the embodiment shown in Fig. 3 c, the angular range of the inclination angle b between round platform inclined-plane and the round platform bottom surface is between 90 degree-120 degree.
Described graphite composite material 100, in the utility model, and non-limiting, through being base material with graphite, the infiltration metal material is realized as embodiment.The advantage of utilizing this mode to make is that the thermal coefficient of expansion of graphite-structure is low, and after having soaked into metal material, manufactured goods have the advantage of low thermal coefficient of expansion equally.
The metal material mutually compound with graphite material as preferred embodiment and non-limiting, is fit to realize through metallic copper.So the embedded heat sink 110 in the utility model can adopt graphite-carbon/carbon-copper composite material to make.This material has the thermal conductivity height, the advantage that thermal coefficient of expansion is low.
Further; Graphite composite material 100 can also be one of them or a mixture of materials such as graphite-aluminium composite material, graphite-silver composite material, graphite-alumina composite material, graphite-aluminium nitride composite material; If mixture can also comprise aforesaid graphite-carbon/carbon-copper composite material.These structures have good heat-sinking capability and suitable thermal coefficient of expansion, can be applied to the utility model.
On the other hand, the enclosed chip 200 after adding is flake structure.Such as, thickness is about between the 0.5-1.0 millimeter.And the size of the upper and lower surfaces of this flake structure is non-limiting as giving an example, and can it be made 3 * 3 millimeters square structure.
On enclosed chip 200, offer embedded hole 300, this embedded hole 300, its size is fit to be set to just in order to put aforesaid embedded heat sink 110.Certainly, as long as can realize putting and fixing purpose, its size also can be floated among a small circle.And non-limiting, this embedded hole 300 can process through mechanical drill as for example, or the fluid of high speed and high pressure processes, or process through laser etc.
Described embedded heat sink 110, in order to realize good embedding purpose with enclosed chip 200, the height of embedded heat sink 110 is fit to identical with enclosed chip thickness.Certainly, also can the height that embedded heat sink 110 is done be a bit larger tham the thickness of enclosed chip, after accomplishing embedding operation, remove through the part that polishing or other mode will exceed, that's all.
Described enclosed chip 200 as preferred embodiment and non-limiting, can be realized through alumina ceramic plate.Alumina ceramic plate, its insulation property are good, have higher rate of heat dissipation simultaneously.Non-limiting as giving an example, the about 24W/ of its rate of heat dissipation (mK).
In addition, al nitride ceramic board, its insulation property are good, and the capacity of heat transmission is stronger, as for example, can reach 200W/ (mK).Therefore, this al nitride ceramic board is fit to manufacture enclosed chip 200 equally, and just cost is high slightly.
With aforesaid embedded heat sink 110, be embedded in the embedded hole 300 on the ceramic heat-dissipating sheet, after realizing well secured and fully contacting, just can make the described nested cooling stand 400 that encapsulates in order to LED of the utility model.
After the making of accomplishing nested cooling stand 400, just can be on this nested cooling stand 400 other accessory of packaged LED lamp.
The embedded heat sink 110 that the utility model is set adopts graphite-carbon/carbon-copper composite material to make, and non-limiting, its thermal conductivity can be up to 450W/ (mK) as for example.In concrete use, derive through the heat that this embedded heat sink 110 can be sent the LED device more apace.
Ginseng Fig. 1 and shown in Figure 2, when carrying out the LED device package, should with LED chip 500 corresponding the position of the embedded heat sink 110 on the nested cooling stand 400, be close to and be provided with.Like this, through the heat that led chip 500 is come out, can derive via nested cooling stand 400 more efficiently.
The heat of being derived points to two aspects, and one of them points to the enclosed chip 200 of periphery, wherein two, point to package floor 600 (as shown in Figure 2) that an other side of embedded heat sink 110 is connected on.
On the other hand, on nested cooling stand 400, accomplish after the encapsulation of led chip 500, just can be expediently the circuit structure of package floor 600 be communicated with circuit unit 510 on the nested cooling stand 400.
Described circuit unit 510, non-limiting as giving an example, can realize through printed circuit.Circuit unit 510 is arranged on the enclosed chip 200, the position outside the embedded hole 300.Circuit unit 510 can just be manufactured on enclosed chip 200 before processing embedded hole 300; Also can after processing embedded hole 300, on enclosed chip 200, manufacture.This circuit unit 510 is connected described led chip 500 in order to pass through connecting lead 520, and in order to be communicated with the circuit on the package floor 600.And the power supply on the package floor 600 is supplied with, and then can provide through supporting control circuit 700.
Join shown in Figure 2ly, described nested cooling stand 400 is close to package floor 600 and is provided with.On package floor 600, non-limiting as giving an example, be provided with the turning circuit structure; And adopt the stronger material of the capacity of heat transmission to be used as substrate, at present, adopt aluminium sheet to realize mostly.
It is shown in Figure 2 to continue ginseng, at the downside of package floor 600, also is provided with control circuit 700.This control circuit 700 in order to the electric current of led chip 500 output behind over commutation, thereby can be controlled the luminous situation of led chip 500.
In the outside of package floor 600, can also be according to being provided with heat-dissipating frame 800.This heat-dissipating frame 800 closely contacts with package floor 600 under user mode, in order to the heat that comes from led chip 500 in the package floor 600, distributes to the external world.Described heat-dissipating frame 800 is fit to adopt the strong material of heat-sinking capability to realize too, at present, adopts aluminum material to make mostly.And, in order to increase heat-sinking capability,, also often be carved with groove, to increase area of dissipation, to improve radiating efficiency in the outside of this heat-dissipating frame 800.
The aforesaid nested cooling stand 400 that is packaged with led chip 500; And package floor 600; And corresponding control circuit 700, and as the heat-dissipating frame 800 of shell etc., formed the described LED lamp 900 of the utility model jointly with nested cooling stand.
More than be to the description of the utility model and non-limiting, based on other embodiment of the utility model thought, all among the protection range of the utility model.
Claims (10)
1. one kind is used for the nested cooling stand that LED encapsulates, and it is characterized in that this support comprises:
Enclosed chip is its laminated structure that is provided with embedded hole, and this embedded hole is in order to put following embedded heat sink;
Embedded heat sink is in order to being embedded into the heat carrier structure in the aforementioned embedded hole, the position corresponding led chip to be packaged.
2. a kind of nested cooling stand that is used for the LED encapsulation according to claim 1; It is characterized in that: described embedded heat sink is the height frustum cone structure identical with enclosed chip thickness, and corresponding embedded hole is the hole of shape and size and this round platform consistent size.
3. a kind of nested cooling stand that is used for the LED encapsulation according to claim 2 is characterized in that: described round platform, the inclination angle between its inclined-plane and the round platform bottom surface is between 60 degree-89 degree.
4. a kind of nested cooling stand that is used for the LED encapsulation according to claim 3 is characterized in that: described round platform, the inclination angle between its inclined-plane and the round platform bottom surface is between 80 degree-87.5 degree.
5. a kind of nested cooling stand that is used for the LED encapsulation according to claim 1; It is characterized in that: described embedded heat sink is by the column part that is positioned at an end; And common composition of round platform part that is positioned at the other end, its total height is identical with enclosed chip thickness;
Accordingly, on enclosed chip, being provided with top is that column structure, bottom are the embedded hole of frustum cone structure, in order to put the described embedded heat sink that includes column part and round platform part.
6. a kind of nested cooling stand that is used for the LED encapsulation according to claim 5 is characterized in that: described round platform, the inclination angle between its inclined-plane and the round platform bottom surface is between 60 degree-120 degree.
7. a kind of nested cooling stand that is used for the LED encapsulation according to claim 1 is characterized in that: described embedded heat sink is the height column structure identical with enclosed chip thickness.
8. LED lamp with nested cooling stand, this lamp include the heat-dissipating frame at the shell position that is arranged on lamp, in order to LED control circuit that output current is provided to led chip with in order to the fixing package floor of enclosed chip, it is characterized in that this lamp also comprises:
Enclosed chip is to be fixed on the described package floor, and it is provided with the laminated structure in embedded hole, and this embedded hole is in order to put following embedded heat sink;
Embedded heat sink is in order to being embedded into the heat carrier structure in the aforementioned embedded hole, the position corresponding led chip to be packaged;
Described led chip is arranged on the aforesaid enclosed chip, corresponding the position of aforementioned embedded heat sink.
9. a kind of LED lamp with nested cooling stand according to claim 8 is characterized in that: on described enclosed chip, be provided with in order to be communicated with the circuit unit of led chip.
10. according to Claim 8 or 9 described a kind of LED lamps with nested cooling stand, it is characterized in that: being connected between described led chip and the described circuit unit, is to connect lead.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201681863U CN202103096U (en) | 2011-05-24 | 2011-05-24 | Nesting radiation support for packaging LED and LED lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201681863U CN202103096U (en) | 2011-05-24 | 2011-05-24 | Nesting radiation support for packaging LED and LED lamp |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202103096U true CN202103096U (en) | 2012-01-04 |
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ID=45389097
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201681863U Expired - Lifetime CN202103096U (en) | 2011-05-24 | 2011-05-24 | Nesting radiation support for packaging LED and LED lamp |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202103096U (en) |
-
2011
- 2011-05-24 CN CN2011201681863U patent/CN202103096U/en not_active Expired - Lifetime
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| DD01 | Delivery of document by public notice |
Addressee: Xu Shizhong Document name: Notification of Passing Examination on Formalities |
|
| C56 | Change in the name or address of the patentee |
Owner name: JIANGSU TANYUAN TECHNOLOGY CO., LTD Free format text: FORMER NAME: CHANGZHOU TANYUAN TECHNOLOGY DEVELOPMENT CO., LTD. Owner name: TANYUAN SCIENCE AND TECHNOLOGY CO., LTD. Free format text: FORMER NAME: JIANGSU TANYUAN TECHNOLOGY CO., LTD |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 306 room 213122, building A, 18 Huashan Road, Xinbei District, Jiangsu, Changzhou Patentee after: TANYUAN TECHNOLOGY Co.,Ltd. Address before: 306 room 213122, building A, 18 Huashan Road, Xinbei District, Jiangsu, Changzhou Patentee before: Jiangsu carbon dollar Polytron Technologies Inc. Address after: 306 room 213122, building A, 18 Huashan Road, Xinbei District, Jiangsu, Changzhou Patentee after: Jiangsu carbon dollar Polytron Technologies Inc. Address before: 306 room 213122, building A, 18 Huashan Road, Xinbei District, Jiangsu, Changzhou Patentee before: CHANGZHOU TANYUAN TECHNOLOGY DEVELOPMENT Co.,Ltd. |
|
| CX01 | Expiry of patent term |
Granted publication date: 20120104 |
|
| CX01 | Expiry of patent term |