CN102306694A - Nested radiation bracket for light-emitting diode (LED) packaging, LED lamp and manufacturing method - Google Patents
Nested radiation bracket for light-emitting diode (LED) packaging, LED lamp and manufacturing method Download PDFInfo
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- CN102306694A CN102306694A CN201110135795A CN201110135795A CN102306694A CN 102306694 A CN102306694 A CN 102306694A CN 201110135795 A CN201110135795 A CN 201110135795A CN 201110135795 A CN201110135795 A CN 201110135795A CN 102306694 A CN102306694 A CN 102306694A
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Abstract
The invention provides a nested radiation bracket for light-emitting diode (LED) packaging, an LED lamp and a manufacturing method, which belong to the technical field of radiation. The nested radiation bracket comprises a packaging substrate and an embedded radiation element, wherein the packaging substrate has a sheeted structure; an embedding hole is formed on the packaging substrate and used for accommodating the embedded radiation element; and the embedded radiation element has a heat conductor structure embedded into the embedding hole, and is arranged at a position dead against an LED chip to be packaged. By the packaging substrate and the embedded radiation element, the nested radiation bracket for the LED packaging can more rapidly conduct heat dissipated by the LED chip out to improve radiation performance. In addition, the LED lamp with the nested radiation bracket is endowed with high radiation capability by the nested radiation bracket.
Description
Technical field
The invention belongs to the heat dissipation technology field.
Background technology
The application of LED lamp is progressively popularized, but because the deficiency of heat-sinking capability makes be affected the useful life of LED lamp.In order to solve the heat dissipation problem of LED lamp, developed multiple solution at present.Such as, adopt the heat sink conception of aluminium base, perhaps strengthen size and the area of dissipation of radiator etc., and the material that adopts high heat dispersion, as the pottery etc. that dispels the heat.
Present stage, the cooling stand of LED encapsulation usefulness mainly adopts simple alumina ceramic plate or metal base printed circuit board to realize.These structures mostly exist conductive coefficient lower, with deficiencies such as the thermal expansion coefficient difference of led chip is big, consequence such as can cause the heat radiation of led chip bad, reliability is low.Therefore, the cooling stand that the high-power LED encapsulation of development of new is used just seems very important.
Summary of the invention
The nested cooling stand that the purpose of this invention is to provide a kind of LED of being used for encapsulation; And the supporting manufacturing approach of this nested cooling stand; And a kind of LED lamp with nested cooling stand; And the supporting manufacturing approach of this LED lamp; Utilize the present invention; Can make and cooling stand in the LED encapsulation have better heat dispersion.
A kind of nested cooling stand that is used for the LED encapsulation, this support comprises:
Enclosed chip is its laminated structure that is provided with embedded hole, and this embedded hole is in order to put following embedded heat sink;
Embedded heat sink is in order to being embedded into the heat carrier structure in the aforementioned embedded hole, the position corresponding led chip to be packaged.
Further, the described nested cooling stand that is used for the LED encapsulation also includes following technical characterictic:
Described embedded heat sink is graphite composite material, and corresponding enclosed chip is an insulating material.
Described graphite composite material is graphite-carbon/carbon-copper composite material, graphite-aluminium composite material, graphite-silver composite material, graphite-alumina composite material, graphite-aluminium nitride composite material one of which at least wherein;
Accordingly, described enclosed chip adopts both one of which at least of alumina ceramic plate or al nitride ceramic board.
Described embedded heat sink is the height frustum cone structure identical with enclosed chip thickness, and corresponding embedded hole is the hole of shape and size and this round platform consistent size.
Aforesaid round platform, the inclination angle between its inclined-plane and the round platform bottom surface is between 60 degree-89 degree.
Described round platform, the inclination angle between its inclined-plane and the round platform bottom surface is between 80 degree-87.5 degree.
Described embedded heat sink, by the column part that is positioned at an end, and common composition of round platform part that is positioned at the other end, its total height is identical with enclosed chip thickness;
Accordingly, on enclosed chip, being provided with top is that column structure, bottom are the embedded hole of frustum cone structure, in order to put the described embedded heat sink that includes column part and round platform part.
Described round platform, the inclination angle between its inclined-plane and the round platform bottom surface is between 60 degree-120 degree.
Described embedded heat sink is the height column structure identical with enclosed chip thickness.
The present invention also provides a kind of manufacturing approach of nested cooling stand of the LED of being used for encapsulation, and this method includes following steps:
And prepare enclosed chip with embedded hole, and this embedded hole is in order to put aforementioned embedded heat sink, and its size is corresponding with aforementioned embedded heat sink;
Step 2 is embedded into described embedded heat sink in the embedded hole of enclosed chip, embedded heat sink inlay the position, corresponding led chip position to be fixed.
Further, a kind of manufacturing approach that is used for the nested cooling stand of LED encapsulation provided by the present invention also has following technical characterictic:
In step 2, the upper and lower surface of embedded heat sink is concordant with the upper and lower surface of place enclosed chip.
Described embedded heat sink adopts to comprise the graphite composite material of one of which realization at least in graphite-carbon/carbon-copper composite material, graphite-aluminium composite material, graphite-silver composite material, graphite-alumina composite material, the graphite-aluminium nitride composite material;
Accordingly, described enclosed chip adopts both one of which at least of alumina ceramic plate or al nitride ceramic board.
The present invention also provides a kind of LED lamp with nested cooling stand, and this lamp includes the heat-dissipating frame at the shell position that is arranged on lamp, in order to LED control circuit that output current is provided to led chip with in order to the fixing package floor of enclosed chip, and this lamp also comprises:
Enclosed chip is to be fixed on the described package floor, and it is provided with the laminated structure in embedded hole, and this embedded hole is in order to put following embedded heat sink;
Embedded heat sink is in order to being embedded into the heat carrier structure in the aforementioned embedded hole, the position corresponding led chip to be packaged;
Described led chip is arranged on the aforesaid enclosed chip, corresponding the position of aforementioned embedded heat sink.
Further, a kind of LED lamp with nested cooling stand provided by the present invention also has following technical characterictic:
On described enclosed chip, be provided with in order to be communicated with the circuit unit of led chip.
Be connected between described led chip and the described circuit unit, for connecting lead.
Described embedded heat sink adopts to comprise the graphite composite material of one of which realization at least in graphite-carbon/carbon-copper composite material, graphite-aluminium composite material, graphite-silver composite material, graphite-alumina composite material, the graphite-aluminium nitride composite material;
Accordingly, described enclosed chip adopts both one of which at least of alumina ceramic plate or al nitride ceramic board.
The present invention also provides a kind of manufacturing approach with LED lamp of nested cooling stand, and this method includes following steps:
And the preparation enclosed chip, on this enclosed chip, being provided with in order to put and to fix the embedded hole of aforementioned embedded heat sink, the size in this embedded hole is corresponding with the size of aforementioned embedded heat sink;
Step 2 is embedded into described embedded heat sink in the embedded hole of enclosed chip, makes the upper and lower surface of its embedded heat sink concordant with the upper and lower surface of place enclosed chip;
Step 3 with led chip corresponding fixed-site of embedded heat sink on enclosed chip, is provided with between led chip and enclosed chip and is connected lead;
Step 4, the enclosed chip with after completing steps 3 operations is fixed on the package floor;
Step 5 is directed to aforesaid package floor supporting LED control circuit and heat-dissipating frame is set, and processes the LED lamp.
Further, a kind of manufacturing approach with LED lamp of nested cooling stand provided by the present invention also has following technical characterictic:
Corresponding step 1 or step 2 or step 3, on described enclosed chip, the position outside the embedded hole is provided with circuit unit, and this circuit unit is in order to connecting described led chip through connecting lead, and the circuit on the package floor.
Described embedded heat sink adopts to comprise the graphite composite material of one of which realization at least in graphite-carbon/carbon-copper composite material, graphite-aluminium composite material, graphite-silver composite material, graphite-alumina composite material, the graphite-aluminium nitride composite material;
Accordingly, described enclosed chip adopts both one of which at least of alumina ceramic plate or al nitride ceramic board.
Through enclosed chip among the present invention and embedded heat sink, the heat that makes this nested cooling stand that is used for the LED encapsulation more promptly led chip to be distributed is derived, and has improved heat dispersion.On the other hand, the LED lamp with nested cooling stand that utilizes the present invention to realize has obtained good heat-sinking capability through nested cooling stand.
Description of drawings
Fig. 1 is the flow chart of the manufacturing process of the nested cooling stand that is used for the LED encapsulation described in the invention.
Fig. 2 is the structural representation of the LED lamp with nested cooling stand described in the invention.
Fig. 3 a is an embedded heat sink described in the invention generalized section along center line, and embedded heat sink is a frustum cone structure among this embodiment.
Fig. 3 b is an embedded heat sink described in the invention generalized section along center line, and embedded heat sink is the common structure of forming of cylinder and round platform among this embodiment, is a kind of embodiment.
Fig. 3 c is an embedded heat sink described in the invention generalized section along center line, and embedded heat sink is the common structure of forming of cylinder and round platform among this embodiment, is another kind of embodiment.
Embodiment
The conductive coefficient of graphite composite material, at present high energy reaches more than the 400W/ (mK).Therefore, has the rapid ability that derives of the heat that the led chip place is produced.Its coefficient of linear expansion is about 6 * 10
-6/ K, approaching with Sapphire Substrate (being a kind of coating of LED encapsulation usefulness) coefficient of linear expansion, the chip drawing crack that can avoid thermal mismatching to cause.
But graphite composite material is a conductor, need carry out insulation processing to it and just can be used in the cooling stand of LED, but the process of insulation processing, usually can damage the heat conductivility of graphite composite material.
And in the present invention, graphite composite material and electrical insulator is compound, mutually nested, the deficiency that the heat-sinking capability that can avoid conventional insulation processing to cause declines to a great extent.Simultaneously, utilize the close thermal coefficient of expansion of graphite composite material and enclosed chip, the nested cooling stand of making in order to the LED encapsulation can effectively reduce the thermal stress of bringing because of thermal expansion coefficient difference between the different materials, reduces the failure probability of finished product.
With respect to traditional base plate for packaging; Graphite composite material is nested in the cooling stand that enclosed chip (material such as aluminium oxide ceramics) formed; Its comprehensive heat dissipation is significantly promoted; Thereby reduced the light efficiency decay of led chip, the bad colour temperature drift that causes that reduced to dispel the heat, and can prolong the useful life of led chip.On the other hand, thermal expansion matching has also improved the reliability of device preferably.
Below in conjunction with accompanying drawing the present invention is done further description.
Join shown in Figure 1ly, scheme to utilize graphite composite material 100 in the described structure, after processing, make embedded heat sink 110 at this.
This embedded heat sink 110 as preferred embodiment and non-limiting, is fit to be processed to column structure, or frustum cone structure, or the structure that is made up of jointly stylolitic part and round platform part.
Shown in ginseng Fig. 3 a, embedded heat sink 110 has been made into frustum cone structure, and the inclination angle between its round platform inclined-plane and the round platform bottom surface is taken as a.As preferred embodiment, inclination angle a is fit between 60 degree-89 degree.This angle both can also be convenient to processing simultaneously so that can interfix well between described embedded heat sink 110 and the enclosed chip 200; And, when being processed into the LED lamp, embedded heat sink 110 flat a section can also and package floor 600 shown in Figure 2 between realize good contact, help heat conduction.
Further, the inclination angle a between this round platform inclined-plane and the round platform bottom surface, preferred selection is between 80 degree-87.5 degree.
Shown in ginseng Fig. 3 b or Fig. 3 c, described embedded heat sink 110 includes the column part that is positioned at an end, and the round platform part that is positioned at the other end, and both total heights are fit to identical with enclosed chip thickness.Certainly, also the ratio enclosed chip that the thickness of embedded heat sink 110 can be done is slightly bigger, after embedded heat sink 110 is nested in enclosed chip, again redundance is removed, that's all.
Accordingly, on supporting enclosed chip 200, being provided with top is that column structure, bottom are the embedded hole of frustum cone structure, in order to put the aforesaid embedded heat sink 110 that includes column part and round platform part.
Shown in ginseng Fig. 3 b or Fig. 3 c, for the embedded heat sink 110 that includes column part and round platform part simultaneously, in its round platform part, the inclination angle between round platform inclined-plane and the round platform bottom surface is taken as b, and this angle is fit between 60 degree-120 degree.
Wherein, in the embodiment shown in Fig. 3 b, the angular range of the inclination angle b between round platform inclined-plane and the round platform bottom surface is between 60 degree-90 degree.
Wherein, in the embodiment shown in Fig. 3 c, the angular range of the inclination angle b between round platform inclined-plane and the round platform bottom surface is between 90 degree-120 degree.
Described graphite composite material 100, in the present invention, and non-limiting, through being base material with graphite, the infiltration metal material is realized as embodiment.The advantage of utilizing this mode to make is that the thermal coefficient of expansion of graphite-structure is low, and after having soaked into metal material, manufactured goods have the advantage of low thermal coefficient of expansion equally.
The metal material mutually compound with graphite material as preferred embodiment and non-limiting, is fit to realize through metallic copper.So the embedded heat sink 110 among the present invention can adopt graphite-carbon/carbon-copper composite material to make.This material has the thermal conductivity height, the advantage that thermal coefficient of expansion is low.
Further; Graphite composite material 100 can also be one of them or a mixture of materials such as graphite-aluminium composite material, graphite-silver composite material, graphite-alumina composite material, graphite-aluminium nitride composite material; If mixture can also comprise aforesaid graphite-carbon/carbon-copper composite material.These structures have good heat-sinking capability and suitable thermal coefficient of expansion, can be applied to the present invention.
On the other hand, the enclosed chip 200 after adding is flake structure.Such as, thickness is about between the 0.5-1.0 millimeter.And the size of the upper and lower surface of this flake structure is non-limiting as giving an example, and it can be made 3 * 3 millimeters square structure.
On enclosed chip 200, offer embedded hole 300, this embedded hole 300, its size is fit to be set to just in order to put aforesaid embedded heat sink 110.Certainly, as long as can realize putting and fixing purpose, its size also can be floated among a small circle.And non-limiting, this embedded hole 300 can process through mechanical drill as for example, or the fluid of high speed and high pressure processes, or process through laser etc.
Described embedded heat sink 110, in order to realize good embedding purpose with enclosed chip 200, the height of embedded heat sink 110 is fit to identical with enclosed chip thickness.Certainly, also the height that embedded heat sink 110 is done can be a bit larger tham the thickness of enclosed chip, after accomplishing embedding operation, remove through the part that polishing or other mode will exceed, that's all.
Described enclosed chip 200 as preferred embodiment and non-limiting, can be realized through alumina ceramic plate.Alumina ceramic plate, its insulation property are good, have higher rate of heat dissipation simultaneously.Non-limiting as giving an example, the about 24W/ of its rate of heat dissipation (mK).
In addition, al nitride ceramic board, its insulation property are good, and the capacity of heat transmission is stronger, as for example, can reach 200W/ (mK).Therefore, this al nitride ceramic board is fit to manufacture enclosed chip 200 equally, and just cost is high slightly.
With aforesaid embedded heat sink 110, be embedded in the embedded hole 300 on the ceramic heat-dissipating sheet, after realizing well secured and fully contacting, just can make the nested cooling stand 400 that encapsulates in order to LED described in the invention.
After the making of accomplishing nested cooling stand 400, just can be on this nested cooling stand 400 other accessory of packaged LED lamp.
The embedded heat sink 110 that the present invention is set adopts graphite-carbon/carbon-copper composite material to make, and non-limiting, its thermal conductivity can be up to 450W/ (mK) as for example.In concrete use, derive through the heat that this embedded heat sink 110 can be sent the LED device more apace.
Ginseng Fig. 1 and shown in Figure 2, when carrying out the LED device package, should with led chip 500 corresponding the position of the embedded heat sink 110 on the nested cooling stand 400, be close to and be provided with.Like this, through the heat that led chip 500 is come out, can derive via nested cooling stand 400 more efficiently.
The heat of being derived points to two aspects, and one of them points to the enclosed chip 200 of periphery, wherein two, point to package floor 600 (as shown in Figure 2) that an other side of embedded heat sink 110 is connected on.
On the other hand, on nested cooling stand 400, accomplish after the encapsulation of led chip 500, just can be expediently the circuit structure of package floor 600 be communicated with circuit unit 510 on the nested cooling stand 400.
Described circuit unit 510, non-limiting as giving an example, can realize through printed circuit.Circuit unit 510 is arranged on the enclosed chip 200, the position outside the embedded hole 300.Circuit unit 510 can just be manufactured on enclosed chip 200 before processing embedded hole 300; Also can after processing embedded hole 300, on enclosed chip 200, manufacture.This circuit unit 510 is connected described led chip 500 in order to pass through connecting lead 520, and in order to be communicated with the circuit on the package floor 600.And the power supply on the package floor 600 is supplied with, and then can provide through supporting control circuit 700.
Join shown in Figure 2ly, described nested cooling stand 400 is close to package floor 600 and is provided with.On package floor 600, non-limiting as giving an example, be provided with the turning circuit structure; And adopt the stronger material of the capacity of heat transmission to be used as substrate, at present, adopt aluminium sheet to realize mostly.
It is shown in Figure 2 to continue ginseng, at the downside of package floor 600, also is provided with control circuit 700.This control circuit 700 in order to the electric current of led chip 500 output behind over commutation, thereby can be controlled the luminous situation of led chip 500.
In the outside of package floor 600, can also be according to being provided with heat-dissipating frame 800.This heat-dissipating frame 800 closely contacts with package floor 600 under user mode, in order to coming from the heat of led chip 500 in the package floor 600, distributes to the external world.Described heat-dissipating frame 800 is fit to adopt the strong material of heat-sinking capability to realize too, at present, adopts aluminum material to make mostly.And, in order to increase heat-sinking capability,, also often be carved with groove, to increase area of dissipation, to improve radiating efficiency in the outside of this heat-dissipating frame 800.
The aforesaid nested cooling stand 400 that is packaged with led chip 500, and package floor 600, and corresponding control circuit 700, and as the heat-dissipating frame 800 of shell etc., the LED lamp 900 with nested cooling stand described in the invention formed jointly.
More than be the description of this invention and non-limiting, based on other embodiment of inventive concept, all among protection scope of the present invention.
Claims (19)
1. one kind is used for the nested cooling stand that LED encapsulates, and it is characterized in that this support comprises:
Enclosed chip is its laminated structure that is provided with embedded hole, and this embedded hole is in order to put following embedded heat sink;
Embedded heat sink is in order to being embedded into the heat carrier structure in the aforementioned embedded hole, the position corresponding led chip to be packaged.
2. a kind of nested cooling stand that is used for the LED encapsulation according to claim 1 is characterized in that: described embedded heat sink, be graphite composite material, and corresponding enclosed chip is an insulating material.
3. a kind of nested cooling stand that is used for the LED encapsulation according to claim 1 and 2; It is characterized in that: described graphite composite material is graphite-carbon/carbon-copper composite material, graphite-aluminium composite material, graphite-silver composite material, graphite-alumina composite material, graphite-aluminium nitride composite material one of which at least wherein;
Accordingly, described enclosed chip adopts both one of which at least of alumina ceramic plate or al nitride ceramic board.
4. a kind of nested cooling stand that is used for the LED encapsulation according to claim 1; It is characterized in that: described embedded heat sink is the height frustum cone structure identical with enclosed chip thickness, and corresponding embedded hole is the hole of shape and size and this round platform consistent size.
5. a kind of nested cooling stand that is used for the LED encapsulation according to claim 4 is characterized in that: described round platform, the inclination angle between its inclined-plane and the round platform bottom surface is between 60 degree-89 degree.
6. a kind of nested cooling stand that is used for the LED encapsulation according to claim 5 is characterized in that: described round platform, the inclination angle between its inclined-plane and the round platform bottom surface is between 80 degree-87.5 degree.
7. a kind of nested cooling stand that is used for the LED encapsulation according to claim 1; It is characterized in that: described embedded heat sink is by the column part that is positioned at an end; And common composition of round platform part that is positioned at the other end, its total height is identical with enclosed chip thickness;
Accordingly, on enclosed chip, being provided with top is that column structure, bottom are the embedded hole of frustum cone structure, in order to put the described embedded heat sink that includes column part and round platform part.
8. a kind of nested cooling stand that is used for the LED encapsulation according to claim 7 is characterized in that: described round platform, the inclination angle between its inclined-plane and the round platform bottom surface is between 60 degree-120 degree.
9. a kind of nested cooling stand that is used for the LED encapsulation according to claim 1 is characterized in that: described embedded heat sink is the height column structure identical with enclosed chip thickness.
10. manufacturing approach that is used for the nested cooling stand of LED encapsulation is characterized in that this method includes following steps:
Step 1 adopts the graphite composite material preparation in order to be embedded in the embedded heat sink in the enclosed chip;
And prepare enclosed chip with embedded hole, and this embedded hole is in order to put aforementioned embedded heat sink, and its size is corresponding with aforementioned embedded heat sink;
Step 2 is embedded into described embedded heat sink in the embedded hole of enclosed chip, embedded heat sink inlay the position, corresponding led chip position to be fixed.
11. a kind of manufacturing approach that is used for the nested cooling stand of LED encapsulation according to claim 10, it is characterized in that: in step 2, the upper and lower surface of embedded heat sink is concordant with the upper and lower surface of place enclosed chip.
12. a kind of manufacturing approach that is used for the nested cooling stand of LED encapsulation according to claim 10; It is characterized in that: described embedded heat sink, adopt to comprise the graphite composite material of one of which realization at least in graphite-carbon/carbon-copper composite material, graphite-aluminium composite material, graphite-silver composite material, graphite-alumina composite material, the graphite-aluminium nitride composite material;
Accordingly, described enclosed chip adopts both one of which at least of alumina ceramic plate or al nitride ceramic board.
13. LED lamp with nested cooling stand; This lamp includes the heat-dissipating frame at the shell position that is arranged on lamp, in order to LED control circuit that output current is provided to led chip with in order to the fixing package floor of enclosed chip, it is characterized in that this lamp also comprises:
Enclosed chip is to be fixed on the described package floor, and it is provided with the laminated structure in embedded hole, and this embedded hole is in order to put following embedded heat sink;
Embedded heat sink is in order to being embedded into the heat carrier structure in the aforementioned embedded hole, the position corresponding led chip to be packaged;
Described led chip is arranged on the aforesaid enclosed chip, corresponding the position of aforementioned embedded heat sink.
14. a kind of LED lamp with nested cooling stand according to claim 13 is characterized in that: on described enclosed chip, be provided with in order to be communicated with the circuit unit of led chip.
15., it is characterized in that: be connected between described led chip and the described circuit unit, for connecting lead according to claim 13 or 14 described a kind of LED lamps with nested cooling stand.
16. a kind of LED lamp according to claim 13 with nested cooling stand; It is characterized in that: described embedded heat sink, adopt to comprise the graphite composite material of one of which realization at least in graphite-carbon/carbon-copper composite material, graphite-aluminium composite material, graphite-silver composite material, graphite-alumina composite material, the graphite-aluminium nitride composite material;
Accordingly, described enclosed chip adopts both one of which at least of alumina ceramic plate or al nitride ceramic board.
17. the manufacturing approach with LED lamp of nested cooling stand is characterized in that this method includes following steps:
Step 1 adopts the graphite composite material preparation in order to be embedded into the embedded heat sink in the following enclosed chip;
And the preparation enclosed chip, on this enclosed chip, being provided with in order to put and to fix the embedded hole of aforementioned embedded heat sink, the size in this embedded hole is corresponding with the size of aforementioned embedded heat sink;
Step 2 is embedded into described embedded heat sink in the embedded hole of enclosed chip, makes the upper and lower surface of its embedded heat sink concordant with the upper and lower surface of place enclosed chip;
Step 3 with led chip corresponding fixed-site of embedded heat sink on enclosed chip, is provided with between led chip and enclosed chip and is connected lead;
Step 4, the enclosed chip with after completing steps 3 operations is fixed on the package floor;
Step 5 is directed to aforesaid package floor supporting LED control circuit and heat-dissipating frame is set, and processes the LED lamp.
18. a kind of manufacturing approach according to claim 17 with LED lamp of nested cooling stand; It is characterized in that: corresponding step 1 or step 2 or step 3; On described enclosed chip; Position outside the embedded hole is provided with circuit unit; This circuit unit is in order to connecting described led chip through connecting lead, and the circuit on the package floor.
19. a kind of manufacturing approach according to claim 17 with LED lamp of nested cooling stand; It is characterized in that: described embedded heat sink, adopt to comprise the graphite composite material of one of which realization at least in graphite-carbon/carbon-copper composite material, graphite-aluminium composite material, graphite-silver composite material, graphite-alumina composite material, the graphite-aluminium nitride composite material;
Accordingly, described enclosed chip adopts both one of which at least of alumina ceramic plate or al nitride ceramic board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110135795A CN102306694A (en) | 2011-05-24 | 2011-05-24 | Nested radiation bracket for light-emitting diode (LED) packaging, LED lamp and manufacturing method |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110135795A CN102306694A (en) | 2011-05-24 | 2011-05-24 | Nested radiation bracket for light-emitting diode (LED) packaging, LED lamp and manufacturing method |
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| CN102306694A true CN102306694A (en) | 2012-01-04 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107658375A (en) * | 2017-08-21 | 2018-02-02 | 山东鼎拓电子科技有限公司 | A kind of basalt LED support production technology and structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN107658375A (en) * | 2017-08-21 | 2018-02-02 | 山东鼎拓电子科技有限公司 | A kind of basalt LED support production technology and structure |
| CN107658375B (en) * | 2017-08-21 | 2022-04-22 | 山东鼎拓电子科技有限公司 | Production process and structure of basalt LED bracket |
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