CN202085395U - Hollow FPC - Google Patents
Hollow FPC Download PDFInfo
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- CN202085395U CN202085395U CN2011201442364U CN201120144236U CN202085395U CN 202085395 U CN202085395 U CN 202085395U CN 2011201442364 U CN2011201442364 U CN 2011201442364U CN 201120144236 U CN201120144236 U CN 201120144236U CN 202085395 U CN202085395 U CN 202085395U
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- copper foil
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Abstract
The utility model discloses a hollow FPC (Flexible Printed Circuit). The FPC comprises a foundation copper foil layer with a hollow finger, as well as an upper overlapped layer and a lower overlapped layer which are respectively positioned on the upper side and the lower side of the foundation copper foil, the upper overlapped layer and the lower overlapped layer respectively at least comprise a covering film, and hollow areas corresponding to the hollow finger are formed on the upper overlapped layer and the lower overlapped layer. The hollow areas can be shaped by directly adopting a frequently-used punching molding process in the conventional technologies, so that the manufacturing cost of the FPC can be reduced greatly, and the effect of improving the product competitiveness is achieved.
Description
Technical field
The utility model relates to the flexible printed circuit field, relates to a kind of hollow out FPC in particular.
Background technology
Flexible printed circuit FPC can also obtain using widely on the electrical interconnection of medical apparatus and instruments around folding endurance based on it at present, and especially on multilayer hollow out finger (bottom of this finger does not have PI), it is that FPC uses a growth class faster in recent years.
At present, manufacturer generally all is to adopt carbon dioxide laser that the PI floor in finger district is carried out hollow out when making vacancy section.But it needs expensive equipment input for flexible PCB manufacturer, thereby increases the burden of enterprise greatly, and has reduced the market competitiveness of enterprise.
In view of this, the above-mentioned defective further investigation of the inventor during at existing flexible printed circuit vacancy section moulding has this case to produce then.
The utility model content
The purpose of this utility model is to provide a kind of hollow out FPC, to solve the problem a little less than prior art has the cost height and the market competitiveness when the moulding flexible PCB vacancy section.
In order to reach above-mentioned purpose, solution of the present utility model is:
A kind of hollow out FPC, wherein, comprise basic copper foil layer that has the hollow out finger and last overlapped layers and the following overlapped layers that lays respectively at basic copper foil layer upside and downside, should go up overlapped layers and comprise one deck coverlay at least, be formed with vacancy section on this on overlapped layers and the following overlapped layers respectively corresponding to the hollow out finger with following overlapped layers.
Further, overlapped layers is first coverlay that is attached to basic copper foil layer upper surface on this, and this time overlapped layers is second coverlay that is attached to basic copper foil layer lower surface.
Further, this basis copper foil layer is first copper foil layer, should go up overlapped layers is first coverlay that is attached to the first copper foil layer upper surface, and this time overlapped layers comprises adhesive-layer, PI layer, second copper foil layer and second coverlay of stacked setting in regular turn, and this adhesive-layer is bonded in the lower surface of first copper foil layer.
Further, this basis copper foil layer is second copper foil layer, and overlapped layers comprises PI layer, first copper foil layer and first coverlay of stacked setting in regular turn on this, and this PI laminating is attached to the upper surface of second copper foil layer; This time overlapped layers comprises adhesive-layer, PI layer, the 3rd copper foil layer and second coverlay of stacked setting in regular turn, and this adhesive-layer is bonded in the lower surface of second copper foil layer.
Further, this basis copper foil layer is second copper foil layer, and overlapped layers comprises PI layer, first copper foil layer and first coverlay that is cascading on this, and this PI laminating is attached to the upper surface of second copper foil layer; This time overlapped layers comprises adhesive-layer, PI layer, the 3rd copper foil layer, PI layer, the 4th copper foil layer and second coverlay of stacked setting in regular turn, and this adhesive-layer is bonded in the lower surface of second copper foil layer.
Further, this basis copper foil layer is second copper foil layer, and overlapped layers comprises adhesive-layer, PI layer, first copper foil layer and first coverlay that is cascading on this, and adhesive-layer of overlapped layers is bonded in the upper surface of second copper foil layer on this; This time overlapped layers comprises PI layer, adhesive-layer, the 3rd copper foil layer, PI layer, adhesive-layer, the 4th copper foil layer, PI layer, adhesive-layer, PI layer, the 5th copper foil layer and second coverlay that stacks gradually, and this PI laminating is attached to the lower surface of second copper foil layer.
Further, the end of this copper foil layer, last overlapped layers and following overlapped layers all is formed with the ladder finger.
After adopting said structure, a kind of hollow out FPC and method for making thereof that the utility model relates to, it is to the vacancy section independent moulding respectively earlier of last overlapped layers and following overlapped layers, be attached to again on the basic copper foil layer, thereby make the moulding of vacancy section can directly adopt punching molding commonly used in the conventional art, thereby significantly reduce the processing and manufacturing cost of flexible printed circuit production firm, have the effect that promotes product competitiveness.
Description of drawings
The structural representation of Fig. 1 a kind of hollow out FPC first embodiment for the utility model relates to;
The structural representation of Fig. 2 a kind of hollow out FPC second embodiment for the utility model relates to;
The structural representation of Fig. 3 a kind of hollow out FPC the 3rd embodiment for the utility model relates to;
The structural representation of Fig. 4 a kind of hollow out FPC the 4th embodiment for the utility model relates to;
The structural representation of Fig. 5 a kind of hollow out FPC the 5th embodiment for the utility model relates to.
Among the figure:
Hollow out FPC 100
First coverlay, 1 second coverlay 2
First copper foil layer, 3 adhesive-layers 4
PI layer 5 second copper foil layer 6
The 3rd copper foil layer 7 the 4th copper foil layer 8
The 5th copper foil layer 9
Ladder is pointed 20 hollow outs finger 30
Embodiment
In order further to explain the technical solution of the utility model, the utility model is elaborated below by specific embodiment.
A kind of hollow out FPC100 that the utility model relates to comprises basic copper foil layer, goes up overlapped layers and following overlapped layers, and overlapped layers is positioned at the upside of basic copper foil layer on this, and this time overlapped layers is positioned at the downside of basic copper foil layer.
Be formed with hollow out finger 30 on this basis copper foil layer, overlapped layers and following overlapped layers all comprise one deck coverlay at least on this, are formed with the vacancy section 40 corresponding to hollow out finger 30 on this on overlapped layers and the following overlapped layers respectively.Concrete, the end of this copper foil layer, last overlapped layers and following overlapped layers all also is formed with ladder finger 20, and to shown in Figure 5, above-mentioned end all refers to right part as Fig. 1.
As shown in Figure 1, it relates to first embodiment of a kind of hollow out FPC100 for the utility model, and it is an individual layer hollow out FPC100 structure.In the present embodiment, this basis copper foil layer is first copper foil layer 3, and overlapped layers is first coverlay 1 on this, and this first coverlay 1 is attached to the upper surface of basic copper foil layer; This time overlapped layers is second coverlay 2, and this second coverlay 2 is attached to the lower surface of basic copper foil layer.
As shown in Figure 2, it relates to second embodiment of a kind of hollow out FPC100 for the utility model, and it is two-layer hollow out FPC100 structure.In the present embodiment, this basis copper foil layer is first copper foil layer 3, should go up overlapped layers is first coverlay 1, this first coverlay 1 is attached to the upper surface of first copper foil layer 3, this time overlapped layers then comprises adhesive-layer 4, PI layer 5, second copper foil layer 6 and second coverlay 2 of stacked setting in regular turn, and this adhesive-layer 4 is bonded in the lower surface of first copper foil layer 3.Present embodiment is when actual production, and following overlapped layers can be selected single face FCCL for use, and is attached to the lower surface of first copper foil layer 3 behind gum.Need to prove that for present embodiment this basis copper foil layer can also be chosen as second copper foil layer 6, specifically then set forth no longer one by one.
As shown in Figure 3, it relates to the 3rd embodiment of a kind of hollow out FPC100 for the utility model, and it is three layers of hollow out FPC100 structure.In the present embodiment, this basis copper foil layer is second copper foil layer 6, and overlapped layers comprises PI layer 5, first copper foil layer 3 and first coverlay 1 of stacked setting in regular turn on this, and this PI layer 5 is attached to the upper surface of second copper foil layer 6; This time overlapped layers then comprises adhesive-layer 4, PI layer 5, the 3rd copper foil layer 7 and second coverlay 2 of stacked setting in regular turn, and this adhesive-layer 4 is bonded in the lower surface of second copper foil layer 6.Present embodiment is when actual production, and overlapped layers and following overlapped layers all can select for use single face FCCL to process on this.Need to prove that for present embodiment this basis copper foil layer can also be adjusted according to current needs, specifically then do not set forth one by one.
As shown in Figure 4, it relates to the 4th embodiment of a kind of hollow out FPC100 for the utility model, and it is four layers of hollow out FPC100 structure.In the present embodiment, this basis copper foil layer is second copper foil layer 6, and overlapped layers comprises PI layer 5, first copper foil layer 3 and first coverlay 1 that is cascading on this, and this PI layer 5 is attached to the upper surface of second copper foil layer 6; This time overlapped layers comprises adhesive-layer 4, PI layer 5, the 3rd copper foil layer 7, PI layer 5, the 4th copper foil layer 8 and second coverlay 2 of stacked setting in regular turn, and this adhesive-layer 4 is bonded in the lower surface of second copper foil layer 6.Present embodiment is when actual production, and overlapped layers and following overlapped layers all can adopt single face FCCL to process on this, adopts viscose glue bonding between the adjacent FCCL, and this viscose glue does not then show in the accompanying drawings.For present embodiment, need to prove that this basis copper foil layer can also be adjusted into other copper foil layer according to current needs, specifically then differ one for example.
As shown in Figure 5, it relates to the 5th embodiment of a kind of hollow out FPC100 for the utility model, and it is five layers of hollow out FPC100 structure.In the present embodiment, this basis copper foil layer is second copper foil layer 6, and overlapped layers comprises adhesive-layer 4, PI layer 5, first copper foil layer 3 and first coverlay 1 that is cascading on this, and adhesive-layer 4 of overlapped layers is bonded in the upper surface of second copper foil layer 6 on this; This time overlapped layers comprises PI layer 5, adhesive-layer 4, the 3rd copper foil layer 7, PI layer 5, adhesive-layer 4, the 4th copper foil layer 8, PI layer 5, adhesive-layer 4, PI layer 5, the 5th copper foil layer 9 and second coverlay 2 that stacks gradually, and this PI layer 5 is attached to the lower surface of second copper foil layer 6.Present embodiment is when actual production, and overlapped layers and following overlapped layers all can adopt single face FCCL to process on this, adopts adhesive-layer 4 to carry out bonding between the adjacent FCCL; For present embodiment, need to prove that this basis copper foil layer can also be adjusted into other copper foil layer according to current needs, specifically then differ one for example.
For processed the creating of a kind of hollow out FPC100 energy that allows the utility model relate to, the utility model also discloses the method for making of a kind of hollow out FPC100, and it comprises the steps:
1., preliminary treatment: comprise the preliminary treatment of basic copper foil layer, the preliminary treatment of going up overlapped layers and the preliminary treatment of following overlapped layers, the preliminary treatment of this basis copper foil layer comprises basic copper foil layer circuit etching, the preliminary treatment that should go up overlapped layers comprises the vacancy section 40 of overlapped layers in the moulding at least, and the preliminary treatment of this time overlapped layers comprises the vacancy section 40 of overlapped layers under the moulding at least; Concrete, the moulding of vacancy section 40 is to adopt mechanical press's punching molding.
2., combination lamination: will be through the basic copper foil layer of preliminary treatment, last overlapped layers and the alignment of following overlapped layers and combination lamination;
3., subsequent treatment: will make up basic copper foil layer behind the lamination, go up overlapped layers and following overlapped layers is holed successively, heavy copper, paste dry film, figure transfer, selection electro-coppering, chemical cleaning, pressing coverlay, electronickelling gold or tin and cut profile.
Method for making with the 5th example structure is elaborated below:
For all the other embodiment of the present utility model, its forming method is analogous to the 5th embodiment, does not just elaborate one by one at this, need to prove, the utility model is applicable to preferably and is less than or equal to 5 layers of hollow out FPC100 that it has ladder finger 20.
Core of the present utility model is: it is to the vacancy section 40 independent moulding respectively earlier of last overlapped layers and following overlapped layers, be attached to again on the basic copper foil layer, the mode that promptly fundamentally is different from available technology adopting laser hollow out, thereby make the moulding of vacancy section 40 can directly adopt punching molding commonly used in the conventional art, thereby significantly reduce the processing and manufacturing cost of flexible printed circuit production firm, have the effect that promotes product competitiveness.
The foregoing description and graphic and non-limiting product form of the present utility model and style, any person of an ordinary skill in the technical field all should be considered as not breaking away from patent category of the present utility model to its suitable variation or modification of doing.
Claims (7)
1. hollow out FPC, it is characterized in that, comprise basic copper foil layer that has the hollow out finger and last overlapped layers and the following overlapped layers that lays respectively at basic copper foil layer upside and downside, should go up overlapped layers and comprise one deck coverlay at least, be formed with vacancy section on this on overlapped layers and the following overlapped layers respectively corresponding to the hollow out finger with following overlapped layers.
2. a kind of hollow out FPC as claimed in claim 1 is characterized in that, overlapped layers is first coverlay that is attached to basic copper foil layer upper surface on this, and this time overlapped layers is second coverlay that is attached to basic copper foil layer lower surface.
3. a kind of hollow out FPC as claimed in claim 1, it is characterized in that, this basis copper foil layer is first copper foil layer, should go up overlapped layers is first coverlay that is attached to the first copper foil layer upper surface, this time overlapped layers comprises adhesive-layer, PI layer, second copper foil layer and second coverlay of stacked setting in regular turn, and this adhesive-layer is bonded in the lower surface of first copper foil layer.
4. a kind of hollow out FPC as claimed in claim 1 is characterized in that, this basis copper foil layer is second copper foil layer, and overlapped layers comprises PI layer, first copper foil layer and first coverlay of stacked setting in regular turn on this, and this PI laminating is attached to the upper surface of second copper foil layer; This time overlapped layers comprises adhesive-layer, PI layer, the 3rd copper foil layer and second coverlay of stacked setting in regular turn, and this adhesive-layer is bonded in the lower surface of second copper foil layer.
5. a kind of hollow out FPC as claimed in claim 1 is characterized in that, this basis copper foil layer is second copper foil layer, and overlapped layers comprises PI layer, first copper foil layer and first coverlay that is cascading on this, and this PI laminating is attached to the upper surface of second copper foil layer; This time overlapped layers comprises adhesive-layer, PI layer, the 3rd copper foil layer, PI layer, the 4th copper foil layer and second coverlay of stacked setting in regular turn, and this adhesive-layer is bonded in the lower surface of second copper foil layer.
6. a kind of hollow out FPC as claimed in claim 1, it is characterized in that, this basis copper foil layer is second copper foil layer, and overlapped layers comprises adhesive-layer, PI layer, first copper foil layer and first coverlay that is cascading on this, and adhesive-layer of overlapped layers is bonded in the upper surface of second copper foil layer on this; This time overlapped layers comprises PI layer, adhesive-layer, the 3rd copper foil layer, PI layer, adhesive-layer, the 4th copper foil layer, PI layer, adhesive-layer, PI layer, the 5th copper foil layer and second coverlay that stacks gradually, and this PI laminating is attached to the lower surface of second copper foil layer.
7. as each described a kind of hollow out FPC of claim 1 to 6, it is characterized in that the end of this copper foil layer, last overlapped layers and following overlapped layers all is formed with the ladder finger.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201442364U CN202085395U (en) | 2011-05-09 | 2011-05-09 | Hollow FPC |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201442364U CN202085395U (en) | 2011-05-09 | 2011-05-09 | Hollow FPC |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202085395U true CN202085395U (en) | 2011-12-21 |
Family
ID=45346007
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201442364U Expired - Fee Related CN202085395U (en) | 2011-05-09 | 2011-05-09 | Hollow FPC |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202085395U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244974A (en) * | 2011-05-09 | 2011-11-16 | 厦门市英诺尔电子科技有限公司 | Hollowed-out FPCB (flexible printed circuit board) and manufacturing method thereof |
-
2011
- 2011-05-09 CN CN2011201442364U patent/CN202085395U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102244974A (en) * | 2011-05-09 | 2011-11-16 | 厦门市英诺尔电子科技有限公司 | Hollowed-out FPCB (flexible printed circuit board) and manufacturing method thereof |
| CN102244974B (en) * | 2011-05-09 | 2013-05-15 | 厦门英诺尔电子科技股份有限公司 | Hollowed-out FPC and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: XIAMEN INNOV ELECTRONIC TECHNOLOGY CO., LTD. Free format text: FORMER NAME: XIAMEN CITY INNOV ELECTRONICS TECHNOLOGY CO., LTD. |
|
| CP03 | Change of name, title or address |
Address after: 361000, No. 101, No. 1 Xiang Xiang Road, torch hi tech Zone (Xiangan), Fujian, Xiamen Province Patentee after: Xiamen Innov Electronic Technology Co., Ltd. Address before: 361000 No. 1 Xiang Xiang Road, Torch Industrial Zone, Xiamen, Fujian, Xiangan Patentee before: Xiamen City Innov Electronics Technology Co., Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111221 Termination date: 20170509 |