CN202036695U - Far infrared electric heating physiotherapy chip - Google Patents
Far infrared electric heating physiotherapy chip Download PDFInfo
- Publication number
- CN202036695U CN202036695U CN2011200594618U CN201120059461U CN202036695U CN 202036695 U CN202036695 U CN 202036695U CN 2011200594618 U CN2011200594618 U CN 2011200594618U CN 201120059461 U CN201120059461 U CN 201120059461U CN 202036695 U CN202036695 U CN 202036695U
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- far
- physical therapy
- infrared
- far infrared
- infrared electric
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Abstract
The utility model discloses a far infrared electric heating physiotherapy chip, which is characterized by comprising a far infrared chip (1), a wire (2) and a battery pack. The far infrared chip comprises six layers of structures which are sequentially an upper surface layer (1.1), a first gluing layer (1.2), a polyethylene terephthalate (PET) protective film layer (1.3), a far infrared substrate (1.4), a second gluing layer (1.5) and a lower surface layer (1.6) from top to bottom. The far infrared substrate (1.4) comprises a PET substrate (1.4.1), a conductive silver paste coating layer (1.4.2), a conductive ink coating layer (1.4.3) and conductive bars (1.4.4). The conductive bars (1.4.4) are connected with the battery pack through the wire (2). The far infrared electric heating physiotherapy chip is small in volume, light in weight, convenient to carry and free of influences on daily use.
Description
Technical field
This utility model relates to a kind of human body physical therapy medical apparatus and instruments, relates in particular to a kind of with the far-infrared electric physical therapy chip.
Background technology
From Germany scientist in 1800 breathe out inferior found infrared ray during at the research solar spectrum since, the infrared ray correlation technique has been widely used in commercial production, on medical diagnosis, detection, treatment and the prevention and health care.
According to biology characteristics medical infrared ray can be divided near infrared ray, middle infrared (Mid-IR) and far infrared.Far infrared is meant the infrared ray of wavelength at the 3-1000 micron, the infrared ray of this wave band of its medium wavelength 4-20 micron is very important with biological growth to human existence, far infrared three key properties that effect mainly contains far infrared to human body determine (the one, radiation, the 2nd, intensive penetration, the 3rd, absorption, resonance and sympathetic response).Human body surface is accepted far infrared, and from outward appearance to inner essence conduction infiltration, is absorbed the generation thermogenetic effect, produces resonance, sympathetic response with the in-vivo tissue cell, has promoted activity.And owing to produce thermogenetic effect, make the human microvascular expansion, self-disciplining is strengthened, and blood circulation is accelerated, and has quickened the mass exchange of cell and blood, thereby has promoted the metabolism of body.Simultaneously, far infrared improves cytophagous phagocytic activity, helps absorption, the dissipation of chronic inflammatory disease, is applicable to the various types of chronic inflammatory diseases of treatment, as some chronic inflammatory diseases of neuritis, myositis, arthritis and internal organs.Heat energy can reduce sensorineural irritability, and by relieve muscle spasms, detumescence, antiinflammatory with improve blood circulation and treat various pain, as neuralgia and Crampy Pain, struvite and avascular pain etc.Therefore, medically be called " life light wave " by the expert.
The health-care physiotherapeutic product that infrared ray is relevant on the market is varied, Herba Apocyni veneti be the textile product of representative because of its no thermal source effect, the intensity and the persistence of the far infrared of its generation are under suspicion; Employed far infrared therapeutic apparatus in the medical treatment, because of its temperature height, the alternating current energy supply is unfavorable for convenient the use.And its volume is big, weight is heavier, needs, could use as hospital to specific place, has limited its scope of application.Have thermal source, far-infrared electric physical therapy chip portable, that nano material is made yet there are no report.
Summary of the invention
At the problems referred to above, the purpose of this utility model is to provide a kind of volume little, in light weight, can carry, and does not influence the far-infrared electric physical therapy chip of daily life.
In order to achieve the above object, the technical solution of the utility model is as follows: a kind of far-infrared electric physical therapy chip of using, and it is characterized in that: this physical therapy chip comprises far infrared chip, lead and battery component;
Described far infrared chip comprises six layers of structure, is followed successively by upper epidermis, first adhesive layer, PET protective film, far infrared substrate, second adhesive layer and following top layer from top to bottom;
Described far infrared substrate comprises the PET substrate, the close upper and lower both sides of described PET substrate surface edge is provided with two conductive silver paste coatings, described PET substrate middle part is coated with the electrically conductive ink coating, the edge, upper and lower both sides of described electrically conductive ink coating overlaps with two conductive silver paste coatings respectively, and described two conductive silver paste coatings are covered with bus outward; Described bus links to each other with battery component by lead.
Described upper epidermis and following top layer are for containing the flaxen fiber layer of cloth.
Described upper epidermis and following top layer are Caulis et Folium Lini layer of cloth.
Described PET substrate surface is vertically arranged with the clear area of some no electrically conductive ink coats, and described clear area is divided into polylith with described electrically conductive ink coating; Described PET protective film is provided with long slot bore, and the position of described long slot bore is corresponding with the position, clear area.
Offer through hole on the described far infrared substrate that is coated with the electrically conductive ink coating, also offer corresponding with it through hole on the relevant position of described PET protective film.
Described two conductive silver paste coatings of the covering fully of described PET protective film and electrically conductive ink coating.
Described bus is Copper Foil or aluminium foil.
Be in series with overheat protector between described bus and the battery component.
The periphery of described far infrared chip is provided with the glue limit.
Described overheat protector is outside equipped with fluid sealant, and described fluid sealant is connected in aggregates with the glue limit.
A kind of preparation method of far-infrared electric physical therapy chip, described preparation method comprises the steps:
Cutting of PET substrate;
3-6mm place, upper and lower two back gauge edge at the PET substrate upper surface that cuts coats two conductive silver paste coatings respectively,
After drying, at PET substrate middle part coated with conductive ink coating, and make and toast the upper and lower two edges of electrically conductive ink coating and the overlapping edges of upper and lower two conductive silver paste coatings;
Lower surface at the PET substrate lumps together by adhesive layer and cloth presser then;
On two conductive silver paste coatings, paste the bus of the wide 5-8mm of one deck again as electrode;
Cover one deck PET protective film consistent at the far infrared substrate upper surface for preparing then with conductive silver paste coating Outside Dimensions, the upper surface rubber cover adhesion coating and the cloth of PET protective film then, the method by heat seal is combined with each other each layer;
Punching then, power line connects, and makes two lead-in wires of lead one end also be connected with described two bus respectively, the overheat protector of wherein connecting on lead-in wire.
The preparation method of a kind of far-infrared electric physical therapy chip of this utility model is by injection molding way, with the periphery and the overheat protector sealing of far infrared chip.
All encapsulants are styrene-butadiene resin melten gel during above-mentioned sealing.
When this utility model was heated to 60 ℃ when the physical therapy chip temperature, overheat protector work disconnected power supply, avoids high temperature burning to human body skin.
By microcomputerized control, heating chip is heated with adjustable power, and the electrically conductive ink coating is launched the far infrared of 4-20 μ m, and human body and surrounding tissue are carried out physical therapy, reaches blood circulation promoting, alleviates the effect of malaise symptoms.
The through hole on the PET protecting film and the setting of long slot bore make that connection is more firm between each layer.
Its volume is little, and is in light weight, can carry, and do not influence daily life.It also has following advantage:
1. toughness height: the stretching resistance 20kg of Electric radiant Heating Film; 2. security of operation: hot face temperature is no more than 60 ℃ during Electric radiant Heating Film work; 3. healthy comfortable.Detect through country infrared product quality supervision and inspection center, this chip heat-radiating properties is good, and energy saving does not contain harmful ray.The far infrared that is produced is not only harmless, and good for health.
Description of drawings
Fig. 1 is this utility model far-infrared electric physical therapy chip structural representation.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the vertical view of Fig. 1 mid and far infrared substrate.
Fig. 4 is the vertical view of PET protective film among Fig. 1.
Wherein:
Far infrared chip 1, lead 2;
Upper epidermis 1.1, first adhesive layer 1.2, PET protective film 1.3, far infrared substrate 1.4, second adhesive layer 1.5, following top layer 1.6; Long slot bore 1.3.1; PET substrate 1.4.1, conductive silver paste coating 1.4.2, electrically conductive ink coating 1.4.3, bus 1.4.4, clear area 1.4.5.
The specific embodiment:
In conjunction with the accompanying drawings the far-infrared electric physical therapy chip is further described:
This utility model physical therapy chip comprises far infrared chip 1, and lead 2 and battery component constitute, and an end of lead 2 is connected with far infrared chip 1, and the other end is connected with battery component.
Described far infrared chip 1 comprises six layers of structure, is followed successively by upper epidermis 1.1, first adhesive layer 1.2, PET protective film 1.3, far infrared substrate 1.4, second adhesive layer 1.5 and following top layer 1.6 from top to bottom;
Described far infrared substrate 1.4 comprises PET substrate 1.4.1, described PET substrate 1.4.1 surface close upper and lower both sides edge is provided with two conductive silver paste coating 1.4.2, described PET substrate 1.4.1 middle part is coated with electrically conductive ink coating 1.4.3, the edge, upper and lower both sides of described electrically conductive ink coating 1.4.3 overlaps with two conductive silver paste coating 1.4.2 respectively, and described two conductive silver paste coating 1.4.2 are covered with bus 1.4.4 outward; Described bus 1.4.4 links to each other with battery component by lead 2.
Described upper epidermis and following top layer are preferably linen for containing the flaxen fiber layer of cloth.
Described PET substrate surface is vertically arranged with the clear area of some no electrically conductive ink coats, and described clear area is divided into polylith with described electrically conductive ink coating; Described PET protective film is provided with long slot bore, and the position of described long slot bore is corresponding with the position, clear area.
Offer through hole on the described far infrared substrate that is coated with the electrically conductive ink coating, also offer corresponding with it through hole on the relevant position of described PET protective film.
Described two conductive silver paste coatings of the covering fully of described PET protective film and electrically conductive ink coating.
Described bus is Copper Foil or aluminium foil.
Further set forth the preparation process of far-infrared electric physical therapy chip below in conjunction with accompanying drawing:
The preparation of far-infrared electric chip:
Cutting of PET substrate;
3-6mm place, upper and lower two back gauge edge at the PET substrate upper surface that cuts coats two conductive silver paste coatings respectively, the width of described conductive silver paste coating is 5-8mm, thickness is 2-10 μ m, dry in 120 ℃ of continuous tunnel furnaces, then, at PET substrate middle part coated with conductive printing ink, and make the upper and lower two edges of electrically conductive ink coating and the overlapping edges of upper and lower two conductive silver paste coatings, baking, baking temperature 170-190 ℃, time 60-90min;
Lower surface at the PET substrate presses together by adhesive layer and linen goods then;
On two conductive silver paste coatings, paste the Copper Foil of the wide 5-8mm of one deck again as electrode;
Cover one deck PET protective film consistent at the far infrared substrate upper surface for preparing then with conductive silver paste coating Outside Dimensions, the upper surface rubber cover adhesion coating and the linen goods of PET protective film then, the method by heat seal is combined with each other each layer;
Punching then; put copper washer with copper rivet and penetrate in the circular hole of accomplishing fluently, copper rivet directly is connected with the on-chip Copper Foil of far infrared, connects lead and overheat protector; at last with overheat protector and compound after chip edge with ejaculation formula injection machine plastic packaging, make the far-infrared electric chip.
Circular hole and long slot bore on the above-mentioned PET protecting film, but when hot press moulding deaeration, thereby strengthen bonding force.
Claims (10)
1. far-infrared electric physical therapy chip, it is characterized in that: this physical therapy chip comprises far infrared chip (1), lead (2) and battery component;
Described far infrared chip (1) comprises six layers of structure, is followed successively by upper epidermis (1.1), first adhesive layer (1.2), PET protective film (1.3), far infrared substrate (1.4), second adhesive layer (1.5) and following top layer (1.6) from top to bottom;
Described far infrared substrate (1.4) comprises PET substrate (1.4.1), described PET substrate (1.4.1) surface close upper and lower both sides edge is provided with two conductive silver paste coatings (1.4.2), described PET substrate (1.4.1) middle part is coated with electrically conductive ink coating (1.4.3), the edge, upper and lower both sides of described electrically conductive ink coating (1.4.3) overlaps with two conductive silver paste coatings (1.4.2) respectively, the outer bus (1.4.4) that is covered with of described two conductive silver paste coatings (1.4.2); Described bus (1.4.4) links to each other with battery component by lead (2).
2. a kind of far-infrared electric physical therapy chip according to claim 1 is characterized in that: described upper epidermis (1.1) and following top layer (1.6) are for containing the flaxen fiber layer of cloth.
3. a kind of far-infrared electric physical therapy chip according to claim 1 is characterized in that: described upper epidermis (1.1) and following top layer (1.6) are Caulis et Folium Lini layer of cloth.
4. a kind of far-infrared electric physical therapy chip according to claim 1, it is characterized in that: described PET substrate (1.4.1) surface longitudinal is provided with the clear area (1.4.5) of some no electrically conductive ink coats, and described clear area is divided into polylith with described electrically conductive ink coating (1.4.3); Described PET protective film (1.3) is provided with long slot bore (1.3.1), and the position of described long slot bore (1.3.1) is corresponding with position, clear area (1.4.5).
5. a kind of far-infrared electric physical therapy chip according to claim 1; it is characterized in that: offer through hole on the described far infrared substrate (1.4) that is coated with electrically conductive ink coating (1.4.3), also offer corresponding with it through hole on the relevant position of described PET protective film (1.3).
6. a kind of far-infrared electric physical therapy chip according to claim 1 is characterized in that: described two conductive silver paste coatings (1.4.2) of the covering fully of described PET protective film (1.3) and electrically conductive ink coating (1.4.3).
7. a kind of far-infrared electric physical therapy chip according to claim 1 is characterized in that: described bus (1.4.4) is Copper Foil or aluminium foil.
8. a kind of far-infrared electric physical therapy chip according to claim 1 is characterized in that: be in series with overheat protector between described bus (1.4.4) and the battery component.
9. a kind of far-infrared electric physical therapy chip according to claim 8 is characterized in that: the periphery of described far infrared chip (1) is provided with the glue limit.
, a kind of far-infrared electric physical therapy chip according to claim 9, it is characterized in that: described overheat protector is outside equipped with fluid sealant, described fluid sealant is connected in aggregates with the glue limit.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011200594618U CN202036695U (en) | 2010-12-22 | 2011-03-09 | Far infrared electric heating physiotherapy chip |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010105994547A CN102000395A (en) | 2010-12-22 | 2010-12-22 | Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof |
CN201010599454.7 | 2010-12-22 | ||
CN2011200594618U CN202036695U (en) | 2010-12-22 | 2011-03-09 | Far infrared electric heating physiotherapy chip |
Publications (1)
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CN202036695U true CN202036695U (en) | 2011-11-16 |
Family
ID=43808256
Family Applications (10)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010105994547A Pending CN102000395A (en) | 2010-12-22 | 2010-12-22 | Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof |
CN2011200594285U Expired - Fee Related CN202036694U (en) | 2010-12-22 | 2011-03-09 | Sealed far infrared physiotherapy chip capable of being fixed easily during injection molding |
CN2011200594105U Expired - Fee Related CN202036693U (en) | 2010-12-22 | 2011-03-09 | Heat insulation nano far infrared electric heating physiotherapy chip |
CN2011200594073U Expired - Fee Related CN202036692U (en) | 2010-12-22 | 2011-03-09 | Firmly connected far-infrared chip |
CN2011100554738A Expired - Fee Related CN102114308B (en) | 2010-12-22 | 2011-03-09 | Far infrared electric heating physical therapy chip and preparation method thereof |
CN2011200594270U Expired - Fee Related CN201996993U (en) | 2010-12-22 | 2011-03-09 | Water-proof far infrared chip |
CN2011200594618U Expired - Lifetime CN202036695U (en) | 2010-12-22 | 2011-03-09 | Far infrared electric heating physiotherapy chip |
CN2011200593583U Expired - Fee Related CN201996992U (en) | 2010-12-22 | 2011-03-09 | Portable far infrared electro-thermal physical therapy chip component |
CN2011200594586U Expired - Fee Related CN201996995U (en) | 2010-12-22 | 2011-03-09 | Far infrared substrate of electric heating physiotherapy instrument |
CN2011200594567U Expired - Fee Related CN201996994U (en) | 2010-12-22 | 2011-03-09 | Far infrared chip assembly of electro-thermal physiotherapy instrument |
Family Applications Before (6)
Application Number | Title | Priority Date | Filing Date |
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CN2010105994547A Pending CN102000395A (en) | 2010-12-22 | 2010-12-22 | Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof |
CN2011200594285U Expired - Fee Related CN202036694U (en) | 2010-12-22 | 2011-03-09 | Sealed far infrared physiotherapy chip capable of being fixed easily during injection molding |
CN2011200594105U Expired - Fee Related CN202036693U (en) | 2010-12-22 | 2011-03-09 | Heat insulation nano far infrared electric heating physiotherapy chip |
CN2011200594073U Expired - Fee Related CN202036692U (en) | 2010-12-22 | 2011-03-09 | Firmly connected far-infrared chip |
CN2011100554738A Expired - Fee Related CN102114308B (en) | 2010-12-22 | 2011-03-09 | Far infrared electric heating physical therapy chip and preparation method thereof |
CN2011200594270U Expired - Fee Related CN201996993U (en) | 2010-12-22 | 2011-03-09 | Water-proof far infrared chip |
Family Applications After (3)
Application Number | Title | Priority Date | Filing Date |
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CN2011200593583U Expired - Fee Related CN201996992U (en) | 2010-12-22 | 2011-03-09 | Portable far infrared electro-thermal physical therapy chip component |
CN2011200594586U Expired - Fee Related CN201996995U (en) | 2010-12-22 | 2011-03-09 | Far infrared substrate of electric heating physiotherapy instrument |
CN2011200594567U Expired - Fee Related CN201996994U (en) | 2010-12-22 | 2011-03-09 | Far infrared chip assembly of electro-thermal physiotherapy instrument |
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CN (10) | CN102000395A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102114308A (en) * | 2010-12-22 | 2011-07-06 | 江阴市霖肯科技有限公司 | Far infrared electric heating physical therapy chip and preparation method thereof |
Families Citing this family (6)
Publication number | Priority date | Publication date | Assignee | Title |
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CN103162396A (en) * | 2011-12-10 | 2013-06-19 | 江阴市霖肯科技有限公司 | Connecting and fixing craft of far infrared electric heating air conditioner heating module |
CN103167649B (en) * | 2011-12-10 | 2015-10-28 | 江阴市霖肯科技有限公司 | The sealing technology of Far infrared electric heating air conditioner euthermic chip |
CN103167647B (en) * | 2011-12-10 | 2015-12-16 | 江阴市霖肯科技有限公司 | Far infrared electric heating air conditioner euthermic chip |
CN105806159A (en) * | 2016-05-06 | 2016-07-27 | 黑龙江中惠地热股份有限公司 | Thin film for far infrared shooting and installing method |
CN107718778A (en) * | 2017-10-31 | 2018-02-23 | 无锡蓝晶电子科技有限公司 | A kind of shoulder shield |
CN111514465B (en) * | 2020-04-23 | 2022-06-24 | 无锡优波生命科技有限公司 | Far infrared light wave generation assembly based on ceramic membrane |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201076678Y (en) * | 2007-05-18 | 2008-06-25 | 秦仁和 | Biological energy chip |
CN201139280Y (en) * | 2007-12-28 | 2008-10-29 | 南京中脉科技发展有限公司 | Solar type infrared magnetic jade electric heating health bed mat |
CN102000395A (en) * | 2010-12-22 | 2011-04-06 | 江苏省江阴市霖肯科技有限公司 | Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof |
-
2010
- 2010-12-22 CN CN2010105994547A patent/CN102000395A/en active Pending
-
2011
- 2011-03-09 CN CN2011200594285U patent/CN202036694U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594105U patent/CN202036693U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594073U patent/CN202036692U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011100554738A patent/CN102114308B/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594270U patent/CN201996993U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594618U patent/CN202036695U/en not_active Expired - Lifetime
- 2011-03-09 CN CN2011200593583U patent/CN201996992U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594586U patent/CN201996995U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594567U patent/CN201996994U/en not_active Expired - Fee Related
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102114308A (en) * | 2010-12-22 | 2011-07-06 | 江阴市霖肯科技有限公司 | Far infrared electric heating physical therapy chip and preparation method thereof |
CN102114308B (en) * | 2010-12-22 | 2012-11-21 | 江阴市霖肯科技有限公司 | Far infrared electric heating physical therapy chip and preparation method thereof |
Also Published As
Publication number | Publication date |
---|---|
CN102000395A (en) | 2011-04-06 |
CN201996992U (en) | 2011-10-05 |
CN102114308B (en) | 2012-11-21 |
CN201996994U (en) | 2011-10-05 |
CN201996993U (en) | 2011-10-05 |
CN202036694U (en) | 2011-11-16 |
CN202036692U (en) | 2011-11-16 |
CN202036693U (en) | 2011-11-16 |
CN201996995U (en) | 2011-10-05 |
CN102114308A (en) | 2011-07-06 |
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C14 | Grant of patent or utility model | ||
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AV01 | Patent right actively abandoned |
Granted publication date: 20111116 Effective date of abandoning: 20130227 |
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RGAV | Abandon patent right to avoid regrant |