CN102114308B - Far infrared electric heating physical therapy chip and preparation method thereof - Google Patents

Far infrared electric heating physical therapy chip and preparation method thereof Download PDF

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Publication number
CN102114308B
CN102114308B CN2011100554738A CN201110055473A CN102114308B CN 102114308 B CN102114308 B CN 102114308B CN 2011100554738 A CN2011100554738 A CN 2011100554738A CN 201110055473 A CN201110055473 A CN 201110055473A CN 102114308 B CN102114308 B CN 102114308B
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far
physical therapy
far infrared
infrared
characterized
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CN2011100554738A
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Chinese (zh)
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CN102114308A (en
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陆文昌
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江阴市霖肯科技有限公司
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Priority to CN201010599454.7 priority
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Priority to CN2011100554738A priority patent/CN102114308B/en
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Abstract

The invention discloses a far infrared electric heating physical therapy chip and a preparation method thereof. The physical therapy chip is characterized by comprising a far infrared chip (1), a conducting wire (2) and a battery pack, wherein the far infrared chip (1) comprises a six-layer structure which sequentially comprises an upper surface layer (1.1), a first adhesive layer (1.2), a polyethylene terephthalate (PET) protective film (1.3), a far infrared substrate (1.4), a second adhesive layer (1.5) and a lower surface layer (1.6) from the top down; the far infrared substrate (1.4) comprises a PET substrate (1.4.1), a conductive silver paste coating (1.4.2), a conductive ink coating (1.4.3) and a conductive bar (1.4.4); and the conductive bar (1.4.4) is connected with the battery pack through the conducting wire (2). The far infrared electric heating physical therapy chip is small in volume, light in weight and portable, and does not affect daily life.

Description

Far-infrared electric physical therapy chip and preparation method thereof

Technical field

The present invention relates to a kind of human body physical therapy medical apparatus and instruments, relate in particular to a kind of with the far-infrared electric physical therapy chip.

Background technology

From Germany scientist in 1800 breathe out inferior found infrared ray during at the research solar spectrum since, the infrared ray correlation technique has been widely used in commercial production, on medical diagnosis, detection, treatment and the prevention and health care.

According to biology characteristics can medical infrared ray be divided near infrared ray, middle infrared (Mid-IR) and far infrared.Far infrared is meant the infrared ray of wavelength at the 3-1000 micron; The infrared ray of this wave band of its medium wavelength 4-20 micron is very important with biological growth to human existence; Far infrared three key properties that effect mainly contains far infrared to human body determine (the one, radiation, the 2nd, intensive penetration, the 3rd, absorption, resonance and sympathetic response).Human body surface is accepted far infrared, and from outward appearance to inner essence conduction infiltration, is absorbed the generation thermogenetic effect, produces resonance, sympathetic response with the in-vivo tissue cell, has promoted activity.And owing to produce thermogenetic effect, make the human microvascular expansion, self-disciplining is strengthened, and blood circulation is accelerated, and has quickened the mass exchange of cell and blood, thereby has promoted the metabolism of body.Simultaneously, far infrared improves cytophagous phagocytic activity, helps absorption, the dissipation of chronic inflammatory disease, is applicable to the various types of chronic inflammatory diseases of treatment, like some chronic inflammatory diseases of neuritis, myositis, arthritis and internal organs.Heat energy can reduce sensorineural irritability, and through relieve muscle spasms, detumescence, antiinflammatory with improve blood circulation and treat various pain, like neuralgia and Crampy Pain, struvite and avascular pain etc.Therefore, medically be called " life light wave " by the expert.

The health-care physiotherapeutic product that infrared ray is relevant on the market is varied, Herba Apocyni veneti be the textile product of representative because of its no thermal source effect, the intensity and the persistence of the far infrared of its generation are under suspicion; Employed far infrared therapeutic apparatus in the medical treatment, because of its temperature is high, the alternating current energy supply is unfavorable for convenient the use.And its volume is big, weight is heavier, needs, could use like hospital to specific place, has limited its scope of application.Have thermal source, far-infrared electric physical therapy chip portable, that nano material is made also do not appear in the newspapers.

Summary of the invention

To the problems referred to above, the object of the present invention is to provide a kind of volume little, in light weight, can carry, do not influence the far-infrared electric physical therapy chip of daily life.

In order to achieve the above object, technical scheme of the present invention is following: a kind of far-infrared electric physical therapy chip of using, and it is characterized in that: this physical therapy chip comprises far infrared chip, lead and battery component;

Said far infrared chip comprises six layers of structure, is followed successively by upper epidermis, first adhesive layer, PET protective film, far infrared substrate, second adhesive layer and following top layer from top to bottom;

Said far infrared substrate comprises the PET substrate; Said PET substrate surface is provided with two conductive silver paste coatings near upper and lower both sides edge; Said PET substrate middle part is coated with the electrically conductive ink coating; The edge, upper and lower both sides of said electrically conductive ink coating overlaps with two conductive silver paste coatings respectively, and said two conductive silver paste coatings are covered with bus outward; Said bus links to each other with battery component through lead.

Said upper epidermis and following top layer are for containing the flaxen fiber layer of cloth.

Said upper epidermis is Caulis et Folium Lini layer of cloth with following top layer.

Said PET substrate surface is vertically arranged with the clear area of some no electrically conductive ink coats, and said clear area is divided into polylith with said electrically conductive ink coating; Said PET protective film is provided with long slot bore, and the position of said long slot bore is corresponding with the position, clear area.

Offer through hole on the said far infrared substrate that is coated with the electrically conductive ink coating, also offer corresponding with it through hole on the relevant position of said PET protective film.

Said two conductive silver paste coatings of the covering fully of said PET protective film and electrically conductive ink coating.

Said bus is Copper Foil or aluminium foil.

Be in series with overheat protector between said bus and the battery component.

The periphery of said far infrared chip is provided with the glue limit.

Said overheat protector is outside equipped with fluid sealant, and said fluid sealant is connected in aggregates with the glue limit.

A kind of method for preparing of far-infrared electric physical therapy chip, said method for preparing comprises the steps:

Cutting of PET substrate;

3-6mm place, upper and lower two back gauge edge at the PET substrate upper surface that cuts coats two conductive silver paste coatings respectively,

After drying, the coated with conductive ink coating at PET substrate middle part, and make and toast the upper and lower two edges of electrically conductive ink coating and the overlapping edges of upper and lower two conductive silver paste coatings;

Lower surface at the PET substrate lumps together through adhesive layer and cloth presser then;

The bus that on two conductive silver paste coatings, pastes the wide 5-8mm of one deck again is as electrode;

Cover one deck PET protective film consistent at the far infrared substrate upper surface for preparing then with conductive silver paste coating Outside Dimensions, the upper surface rubber cover adhesion coating and the cloth of PET protective film then, the method through heat seal is combined with each other each layer;

Punching then, power line connects, and makes two lead-in wires of lead one end also be connected with said two bus respectively, the overheat protector of wherein connecting on lead-in wire.

The method for preparing of a kind of far-infrared electric physical therapy chip of the present invention is through injection molding way, with the periphery and the overheat protector sealing of far infrared chip.

All encapsulants are styrene-butadiene resin melten gel during above-mentioned sealing.

When the present invention was heated to 60 ℃ when the physical therapy chip temperature, overheat protector work was broken off power supply, avoids high temperature burning to human body skin.

Through microcomputerized control, heating chip is heated with adjustable power, and the electrically conductive ink coating is launched the far infrared of 4-20 μ m, and human body and surrounding tissue are carried out physical therapy, reaches blood circulation promoting, alleviates the effect of malaise symptoms.

The through hole on the PET protecting film and the setting of long slot bore make that connection is more firm between each layer.

Its volume is little, and is in light weight, can carry, and do not influence daily life.It also has following advantage:

1. toughness is high: the stretching resistance 20kg of Electric radiant Heating Film; 2. security of operation: hot face temperature is no more than 60 ℃ during Electric radiant Heating Film work; 3. healthy comfortable.Detect through national infrared product quality supervision and inspection center, this chip heat-radiating properties is good, and energy saving does not contain harmful ray.The far infrared that is produced is not only harmless, and good for health.

Description of drawings

Fig. 1 is a far-infrared electric physical therapy chip structural representation of the present invention.

Fig. 2 is the vertical view of Fig. 1.

Fig. 3 is the vertical view of Fig. 1 mid and far infrared substrate.

Fig. 4 is the vertical view of PET protective film among Fig. 1.

Wherein:

Far infrared chip 1, lead 2;

Upper epidermis 1.1, first adhesive layer 1.2, PET protective film 1.3, far infrared substrate 1.4, second adhesive layer 1.5, top layer 1.6 down; Long slot bore 1.3.1; PET substrate 1.4.1, conductive silver paste coating 1.4.2, electrically conductive ink coating 1.4.3, bus 1.4.4, clear area 1.4.5.

The specific embodiment:

In conjunction with accompanying drawing the far-infrared electric physical therapy chip is further described:

Physical therapy chip of the present invention comprises far infrared chip 1, and lead 2 constitutes with battery component, and an end of lead 2 is connected with far infrared chip 1, and the other end is connected with battery component.

Said far infrared chip 1 comprises six layers of structure, is followed successively by upper epidermis 1.1, first adhesive layer 1.2, PET protective film 1.3, far infrared substrate 1.4, second adhesive layer 1.5 and following top layer 1.6 from top to bottom;

Said far infrared substrate 1.4 comprises PET substrate 1.4.1; Said PET substrate 1.4.1 surface is provided with two conductive silver paste coating 1.4.2 near upper and lower both sides edge; Said PET substrate 1.4.1 middle part is coated with electrically conductive ink coating 1.4.3; The edge, upper and lower both sides of said electrically conductive ink coating 1.4.3 overlaps with two conductive silver paste coating 1.4.2 respectively, and said two conductive silver paste coating 1.4.2 are covered with bus 1.4.4 outward; Said bus 1.4.4 links to each other with battery component through lead 2.

Said upper epidermis and following top layer are preferably linen for containing the flaxen fiber layer of cloth.

Said PET substrate surface is vertically arranged with the clear area of some no electrically conductive ink coats, and said clear area is divided into polylith with said electrically conductive ink coating; Said PET protective film is provided with long slot bore, and the position of said long slot bore is corresponding with the position, clear area.

Offer through hole on the said far infrared substrate that is coated with the electrically conductive ink coating, also offer corresponding with it through hole on the relevant position of said PET protective film.

Said two conductive silver paste coatings of the covering fully of said PET protective film and electrically conductive ink coating.

Said bus is Copper Foil or aluminium foil.

Further set forth the preparation process of far-infrared electric physical therapy chip below in conjunction with accompanying drawing:

The preparation of far-infrared electric chip:

Cutting of PET substrate;

3-6mm place, upper and lower two back gauge edge at the PET substrate upper surface that cuts coats two conductive silver paste coatings respectively, and the width of said conductive silver paste coating is 5-8mm, and thickness is 2-10 μ m; Dry in 120 ℃ of continuous tunnel furnaces, then, the coated with conductive printing ink at PET substrate middle part; And make the upper and lower two edges of electrically conductive ink coating and the overlapping edges of upper and lower two conductive silver paste coatings; Baking, baking temperature 170-190 ℃, time 60-90min;

Lower surface at the PET substrate presses together through adhesive layer and linen goods then;

The Copper Foil that on two conductive silver paste coatings, pastes the wide 5-8mm of one deck again is as electrode;

Cover one deck PET protective film consistent at the far infrared substrate upper surface for preparing then with conductive silver paste coating Outside Dimensions, the upper surface rubber cover adhesion coating and the linen goods of PET protective film then, the method through heat seal is combined with each other each layer;

Punching then; Put copper washer with copper rivet and penetrate in the circular hole of accomplishing fluently, copper rivet directly is connected with the on-chip Copper Foil of far infrared, connects lead and overheat protector; At last with overheat protector and compound after chip edge with ejaculation formula injection machine plastic packaging, process the far-infrared electric chip.

Circular hole and long slot bore on the above-mentioned PET protecting film, but when hot press moulding deaeration, thereby strengthen bonding force.

Claims (13)

1. far-infrared electric physical therapy chip, it is characterized in that: this physical therapy chip comprises far infrared chip (1), lead (2) and battery component;
Said far infrared chip (1) comprises six layers of structure, is followed successively by upper epidermis (1.1), first adhesive layer (1.2), PET protective film (1.3), far infrared substrate (1.4), second adhesive layer (1.5) and following top layer (1.6) from top to bottom;
Said far infrared substrate (1.4) comprises PET substrate (1.4.1); Said PET substrate (1.4.1) surface is provided with two conductive silver paste coatings (1.4.2) near upper and lower both sides edge; Said PET substrate (1.4.1) middle part is coated with electrically conductive ink coating (1.4.3); The edge, upper and lower both sides of said electrically conductive ink coating (1.4.3) overlaps with two conductive silver paste coatings (1.4.2) respectively, the outer bus (1.4.4) that is covered with of said two conductive silver paste coatings (1.4.2); Said bus (1.4.4) links to each other with battery component through lead (2).
2. a kind of far-infrared electric physical therapy chip according to claim 1 is characterized in that: said upper epidermis (1.1) and following top layer (1.6) are for containing the flaxen fiber layer of cloth.
3. a kind of far-infrared electric physical therapy chip according to claim 1 is characterized in that: said upper epidermis (1.1) and following top layer (1.6) are Caulis et Folium Lini layer of cloth.
4. a kind of far-infrared electric physical therapy chip according to claim 1; It is characterized in that: said PET substrate (1.4.1) surface longitudinal is provided with the clear area (1.4.5) of some no electrically conductive ink coats, and said clear area is divided into polylith with said electrically conductive ink coating (1.4.3); Said PET protective film (1.3) is provided with long slot bore (1.3.1), and the position of said long slot bore (1.3.1) is corresponding with position, clear area (1.4.5).
5. a kind of far-infrared electric physical therapy chip according to claim 1; It is characterized in that: offer through hole on the said far infrared substrate (1.4) that is coated with electrically conductive ink coating (1.4.3), also offer corresponding with it through hole on the relevant position of said PET protective film (1.3).
6. a kind of far-infrared electric physical therapy chip according to claim 1 is characterized in that: said PET protective film (1.3) covers said conductive silver paste coating (1.4.2) and electrically conductive ink coating (1.4.3) fully.
7. a kind of far-infrared electric physical therapy chip according to claim 1 is characterized in that: said bus (1.4.4) is Copper Foil or aluminium foil.
8. a kind of far-infrared electric physical therapy chip according to claim 1 is characterized in that: be in series with overheat protector between said bus (1.4.4) and the battery component.
9. a kind of far-infrared electric physical therapy chip according to claim 8 is characterized in that: the periphery of said far infrared chip (1) is provided with the glue limit.
10. a kind of far-infrared electric physical therapy chip according to claim 9, it is characterized in that: said overheat protector is outside equipped with fluid sealant, and said fluid sealant is connected in aggregates with the glue limit.
11. the method for preparing of a far-infrared electric physical therapy chip is characterized in that: said method for preparing comprises the steps:
Cutting of PET substrate;
3-6mm place, upper and lower two back gauge edge at PET substrate (1.4.1) upper surface that cuts coats two conductive silver paste coatings (1.4.2) respectively,
After drying, the coated with conductive ink coating (1.4.3) at PET substrate (1.4.1) middle part, and make the upper and lower two edges of electrically conductive ink coating (1.4.3) and the overlapping edges of upper and lower two conductive silver paste coatings (1.4.2); After electrically conductive ink coating (1.4.3) coats, toast;
Lower surface at PET substrate (1.4.1) lumps together through adhesive layer and cloth presser then;
On two conductive silver paste coatings (1.4.2), paste one deck bus (1.4.4) again, process the far infrared substrate as electrode;
Cover one deck PET protective film (1.3) at the far infrared substrate upper surface for preparing then, the upper surface rubber cover adhesion coating and the cloth of PET protective film (1.3) then, the method through heat seal is combined with each other each layer;
Lead (2) is installed in punching then, makes two lead-in wires of lead (2) one ends also be connected with said bus (1.4.4) respectively, the overheat protector of wherein connecting on lead-in wire.
12. the method for preparing of a kind of far-infrared electric physical therapy chip according to claim 11 is characterized in that: through injection molding way, with the periphery and the overheat protector sealing of far infrared chip (1).
13. the method for preparing of a kind of far-infrared electric physical therapy chip according to claim 12 is characterized in that: the encapsulant that the periphery and the overheat protector sealing of far infrared chip (1) are adopted is the styrene-butadiene resin.
CN2011100554738A 2010-12-22 2011-03-09 Far infrared electric heating physical therapy chip and preparation method thereof CN102114308B (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
CN2010105994547A CN102000395A (en) 2010-12-22 2010-12-22 Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof
CN201010599454.7 2010-12-22
CN2011100554738A CN102114308B (en) 2010-12-22 2011-03-09 Far infrared electric heating physical therapy chip and preparation method thereof

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2011100554738A CN102114308B (en) 2010-12-22 2011-03-09 Far infrared electric heating physical therapy chip and preparation method thereof

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Publication Number Publication Date
CN102114308A CN102114308A (en) 2011-07-06
CN102114308B true CN102114308B (en) 2012-11-21

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Family Applications (10)

Application Number Title Priority Date Filing Date
CN2010105994547A CN102000395A (en) 2010-12-22 2010-12-22 Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof
CN2011200594270U CN201996993U (en) 2010-12-22 2011-03-09 Water-proof far infrared chip
CN2011200594285U CN202036694U (en) 2010-12-22 2011-03-09 Sealed far infrared physiotherapy chip capable of being fixed easily during injection molding
CN2011200594618U CN202036695U (en) 2010-12-22 2011-03-09 Far infrared electric heating physiotherapy chip
CN2011200593583U CN201996992U (en) 2010-12-22 2011-03-09 Portable far infrared electro-thermal physical therapy chip component
CN2011200594567U CN201996994U (en) 2010-12-22 2011-03-09 Far infrared chip assembly of electro-thermal physiotherapy instrument
CN2011100554738A CN102114308B (en) 2010-12-22 2011-03-09 Far infrared electric heating physical therapy chip and preparation method thereof
CN2011200594105U CN202036693U (en) 2010-12-22 2011-03-09 Heat insulation nano far infrared electric heating physiotherapy chip
CN2011200594586U CN201996995U (en) 2010-12-22 2011-03-09 Far infrared substrate of electric heating physiotherapy instrument
CN2011200594073U CN202036692U (en) 2010-12-22 2011-03-09 Firmly connected far-infrared chip

Family Applications Before (6)

Application Number Title Priority Date Filing Date
CN2010105994547A CN102000395A (en) 2010-12-22 2010-12-22 Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof
CN2011200594270U CN201996993U (en) 2010-12-22 2011-03-09 Water-proof far infrared chip
CN2011200594285U CN202036694U (en) 2010-12-22 2011-03-09 Sealed far infrared physiotherapy chip capable of being fixed easily during injection molding
CN2011200594618U CN202036695U (en) 2010-12-22 2011-03-09 Far infrared electric heating physiotherapy chip
CN2011200593583U CN201996992U (en) 2010-12-22 2011-03-09 Portable far infrared electro-thermal physical therapy chip component
CN2011200594567U CN201996994U (en) 2010-12-22 2011-03-09 Far infrared chip assembly of electro-thermal physiotherapy instrument

Family Applications After (3)

Application Number Title Priority Date Filing Date
CN2011200594105U CN202036693U (en) 2010-12-22 2011-03-09 Heat insulation nano far infrared electric heating physiotherapy chip
CN2011200594586U CN201996995U (en) 2010-12-22 2011-03-09 Far infrared substrate of electric heating physiotherapy instrument
CN2011200594073U CN202036692U (en) 2010-12-22 2011-03-09 Firmly connected far-infrared chip

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Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102000395A (en) * 2010-12-22 2011-04-06 江苏省江阴市霖肯科技有限公司 Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof
CN103167649B (en) * 2011-12-10 2015-10-28 江阴市霖肯科技有限公司 The sealing technology of Far infrared electric heating air conditioner euthermic chip
CN103167647B (en) * 2011-12-10 2015-12-16 江阴市霖肯科技有限公司 Far infrared electric heating air conditioner euthermic chip
CN103162396A (en) * 2011-12-10 2013-06-19 江阴市霖肯科技有限公司 Connecting and fixing craft of far infrared electric heating air conditioner heating module
CN105806159A (en) * 2016-05-06 2016-07-27 黑龙江中惠地热股份有限公司 Thin film for far infrared shooting and installing method
CN107718778A (en) * 2017-10-31 2018-02-23 无锡蓝晶电子科技有限公司 A kind of shoulder shield

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CN201076678Y (en) * 2007-05-18 2008-06-25 秦仁和 Biological energy chip
CN201139280Y (en) * 2007-12-28 2008-10-29 南京中脉科技发展有限公司 Solar type infrared magnetic jade electric heating health bed mat
CN202036695U (en) * 2010-12-22 2011-11-16 江阴市霖肯科技有限公司 Far infrared electric heating physiotherapy chip

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201076678Y (en) * 2007-05-18 2008-06-25 秦仁和 Biological energy chip
CN201139280Y (en) * 2007-12-28 2008-10-29 南京中脉科技发展有限公司 Solar type infrared magnetic jade electric heating health bed mat
CN202036695U (en) * 2010-12-22 2011-11-16 江阴市霖肯科技有限公司 Far infrared electric heating physiotherapy chip

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Publication number Publication date
CN102000395A (en) 2011-04-06
CN201996992U (en) 2011-10-05
CN202036692U (en) 2011-11-16
CN201996993U (en) 2011-10-05
CN201996994U (en) 2011-10-05
CN102114308A (en) 2011-07-06
CN202036695U (en) 2011-11-16
CN201996995U (en) 2011-10-05
CN202036694U (en) 2011-11-16
CN202036693U (en) 2011-11-16

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