CN103167649B - The sealing technology of Far infrared electric heating air conditioner euthermic chip - Google Patents
The sealing technology of Far infrared electric heating air conditioner euthermic chip Download PDFInfo
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- CN103167649B CN103167649B CN201110413555.5A CN201110413555A CN103167649B CN 103167649 B CN103167649 B CN 103167649B CN 201110413555 A CN201110413555 A CN 201110413555A CN 103167649 B CN103167649 B CN 103167649B
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- euthermic chip
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- air conditioner
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- electric heating
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Abstract
The present invention relates to a kind of sealing technology of Far infrared electric heating air conditioner euthermic chip, euthermic chip includes two substrates (1) as upper epidermis and layer, when carrying out seal operation, first prepreg is folded between two substrates (1), then Pressurized-heated, makes prepreg generation melt glue formation adhering layer (4) and two substrates (1) is bonded together.The sealing technology of Far infrared electric heating air conditioner euthermic chip of the present invention, has the advantage of good sealing effect.
Description
Technical field
The present invention relates to a kind of sealing technology, especially relate to a kind of sealing technology of Far infrared electric heating air conditioner euthermic chip, belong to air-conditioning processing technique field.
Background technology
At present, people generally need using air-condition to carry out heating to heating in room in winter, especially at northern area, every household needs to pass into heating installation with resisting cold, and the expense of annual each household flower in heating is just up to thousands of unit, and heating installation uses coal heating produces steam in addition, use fossil fuel not only contaminated environment, be unfavorable for energy-conserving and environment-protective, and in the transmitting procedure of heating installation, easily produce more loss.Be developed miscellaneous heating mode, wherein, Far-infrared Heating mode not only has heating function because of it for this reason, and has physical therapy efficacy and receive the extensive concern of people; But, conventional Far-infrared Heating structure forms euthermic chip for being simply coated on substrate by electrically conductive ink, and be applied to individual physiotherapy more and be not implanted to field of air conditioning, Far-infrared Heating structure in the fabrication process more simultaneously adopts manual operation, especially for being coated with in the seal process of euthermic chip of electrically conductive ink, the substrate being coated with electrically conductive ink carries out seal operation after needing to add another substrate, usual people directly apply glue-line and seal between two substrates, thus cause sealing effectiveness poor.
Summary of the invention
The object of the invention is to overcome above-mentioned deficiency, a kind of sealing technology of Far infrared electric heating air conditioner euthermic chip of good sealing effect is provided.
The object of the present invention is achieved like this: a kind of sealing technology of Far infrared electric heating air conditioner euthermic chip, euthermic chip includes two substrates as upper epidermis and layer, when carrying out seal operation, first prepreg is folded between two substrates, then Pressurized-heated, makes prepreg generation melt glue formation adhering layer and is bonded together by two substrates.
The sealing technology of Far infrared electric heating air conditioner euthermic chip of the present invention, before adding prepreg, added two conducting strips of electrode effect between two substrates, simultaneously coated with conductive ink layer on the upper surface of the substrate of layer, and above-mentioned conducting strip covers on conductive ink layer.
Compared with prior art, the invention has the beneficial effects as follows:
The present invention seals forming adhering layer after prepreg temperature-pressure, not only simplifies and facilitates operation, and compared to the mode of gluing, whole adhering layer is more even, is thus not only connected firmly, good sealing effect, and the surface of euthermic chip is more smooth, improve the appearance property of product.
Accompanying drawing explanation
Fig. 1 is the structural representation of Far infrared electric heating air conditioner euthermic chip of the present invention.
Fig. 2 is Far infrared electric heating air conditioner euthermic chip Fig. 1's of the present invention
partial enlarged drawing.
Fig. 3 is the structural representation (namely the dash area in figure represents the shape of conductive ink layer) in Far infrared electric heating air conditioner euthermic chip of the present invention on substrate after printing conductive inks layer.
Wherein:
Substrate 1, conductive ink layer 2, conducting strip 3, adhering layer 4;
Conductive hole 1.1, installing hole 1.2.
Embodiment
See Fig. 1 ~ 3, the sealing technology of a kind of Far infrared electric heating air conditioner euthermic chip that the present invention relates to, wherein, euthermic chip includes two substrates 1 as upper epidermis and layer, and two conducting strips 3 playing electrode effect be arranged between two substrates 1, upper surface as the substrate 1 of layer is coated with conductive ink layer 2(as shown in Figure 3), described conductive ink layer 2 can be arranged to linear structure or planar structure according to demand, under linear structure is applied to small-power state, under planar structure is applied to high-power state, above-mentioned conducting strip 3 covers on conductive ink layer 2, described euthermic chip is provided with the conductive hole 1.1 running through conductive ink layer 2 and conducting strip 3, and conducting strip 3 is provided with downward flange (as depicted in figs. 1 and 2) at conductive hole 1.1 place, described euthermic chip is also provided with multiple installing hole 1.2, when carrying out seal operation, first prepreg is folded between two substrates 1, then Pressurized-heated, prepreg is produced melt glue to form adhering layer 4 and two substrates 1 and conducting strip 3 and conductive ink layer 2 are bonded together.
Claims (1)
1. the sealing technology of a Far infrared electric heating air conditioner euthermic chip, it is characterized in that: euthermic chip includes two substrates (1) as upper epidermis and layer, when carrying out seal operation, first prepreg is folded between two substrates (1), then Pressurized-heated, makes prepreg generation melt glue formation adhering layer (4) and two substrates (1) is bonded together;
Before adding prepreg, between two substrates (1), added two conducting strips (3) of electrode effect, simultaneously coated with conductive ink layer (2) on the upper surface of the substrate (1) of layer, and above-mentioned conducting strip (3) covers on conductive ink layer (2); Described euthermic chip is provided with the conductive hole (1.1) running through conductive ink layer (2) and conducting strip (3), and conducting strip (3) is provided with downward flange at conductive hole (1.1) place, described euthermic chip is also provided with multiple installing hole (1.2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110413555.5A CN103167649B (en) | 2011-12-10 | 2011-12-10 | The sealing technology of Far infrared electric heating air conditioner euthermic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110413555.5A CN103167649B (en) | 2011-12-10 | 2011-12-10 | The sealing technology of Far infrared electric heating air conditioner euthermic chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103167649A CN103167649A (en) | 2013-06-19 |
| CN103167649B true CN103167649B (en) | 2015-10-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110413555.5A Active CN103167649B (en) | 2011-12-10 | 2011-12-10 | The sealing technology of Far infrared electric heating air conditioner euthermic chip |
Country Status (1)
| Country | Link |
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| CN (1) | CN103167649B (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104611894A (en) * | 2015-01-28 | 2015-05-13 | 陆文昌 | Intelligent clothes care machine and control method thereof |
| CN110769527B (en) * | 2019-09-12 | 2022-01-25 | 宁波科诺佳新材料有限公司 | Organic high-temperature electric heating composite film and preparation method thereof |
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| CN2134033Y (en) * | 1992-06-16 | 1993-05-19 | 南开大学 | High heat elimination printed circuit board |
| JPH05291318A (en) * | 1992-04-07 | 1993-11-05 | Toshiba Corp | Resin sealing-type semiconductor device |
| CN1132931A (en) * | 1994-12-30 | 1996-10-09 | 卡西欧计算机公司 | Method of connecting terminals of one electronic part to terminals of another electronic part |
| CN1386045A (en) * | 2001-05-01 | 2002-12-18 | 日东电工株式会社 | Wiring board and making method thereof |
| CN101202252A (en) * | 2006-12-12 | 2008-06-18 | 华泰电子股份有限公司 | Glue film and chip encapsulation manufacture process using the glue film |
| CN101418205A (en) * | 2008-12-10 | 2009-04-29 | 华烁科技股份有限公司 | Halogen-free flameproof adhesive and application thereof in prepreg and multiple layer printed plate aspect |
| CN102039701A (en) * | 2009-10-19 | 2011-05-04 | 台光电子材料股份有限公司 | Prepreg and metal foil substrate |
| CN201997002U (en) * | 2010-12-22 | 2011-10-05 | 江阴市霖肯科技有限公司 | Far infrared physiotherapy chip convenient for injection molding |
| CN201996994U (en) * | 2010-12-22 | 2011-10-05 | 江阴市霖肯科技有限公司 | Far infrared chip assembly of electro-thermal physiotherapy instrument |
-
2011
- 2011-12-10 CN CN201110413555.5A patent/CN103167649B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05291318A (en) * | 1992-04-07 | 1993-11-05 | Toshiba Corp | Resin sealing-type semiconductor device |
| CN2134033Y (en) * | 1992-06-16 | 1993-05-19 | 南开大学 | High heat elimination printed circuit board |
| CN1132931A (en) * | 1994-12-30 | 1996-10-09 | 卡西欧计算机公司 | Method of connecting terminals of one electronic part to terminals of another electronic part |
| CN1386045A (en) * | 2001-05-01 | 2002-12-18 | 日东电工株式会社 | Wiring board and making method thereof |
| CN101202252A (en) * | 2006-12-12 | 2008-06-18 | 华泰电子股份有限公司 | Glue film and chip encapsulation manufacture process using the glue film |
| CN101418205A (en) * | 2008-12-10 | 2009-04-29 | 华烁科技股份有限公司 | Halogen-free flameproof adhesive and application thereof in prepreg and multiple layer printed plate aspect |
| CN102039701A (en) * | 2009-10-19 | 2011-05-04 | 台光电子材料股份有限公司 | Prepreg and metal foil substrate |
| CN201997002U (en) * | 2010-12-22 | 2011-10-05 | 江阴市霖肯科技有限公司 | Far infrared physiotherapy chip convenient for injection molding |
| CN201996994U (en) * | 2010-12-22 | 2011-10-05 | 江阴市霖肯科技有限公司 | Far infrared chip assembly of electro-thermal physiotherapy instrument |
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|---|---|
| CN103167649A (en) | 2013-06-19 |
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Effective date of registration: 20160531 Address after: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Jiangyin Province Patentee after: Jiangyin Wenchang Intelligent Electromechanical Research Institution Co.,Ltd. Address before: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Wuxi province Jiangyin City Patentee before: Jiangyin Linken Technology Co.,Ltd. |
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Effective date of registration: 20230628 Address after: No. 997, Huicheng Avenue, Huishan District, Wuxi City, Jiangsu Province, 214181 Patentee after: Yilufa Intelligent Technology (Jiangsu) Co.,Ltd. Address before: No. 98, Zhuhuang Road, Zhutang Town, Jiangyin City, Jiangsu Province, 214415 Patentee before: Jiangyin Wenchang Intelligent Electromechanical Research Institution Co.,Ltd. |