CN103167643B - A kind of electrode lead-out structure of Far infrared electric heating air conditioner euthermic chip - Google Patents
A kind of electrode lead-out structure of Far infrared electric heating air conditioner euthermic chip Download PDFInfo
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- CN103167643B CN103167643B CN201110413251.9A CN201110413251A CN103167643B CN 103167643 B CN103167643 B CN 103167643B CN 201110413251 A CN201110413251 A CN 201110413251A CN 103167643 B CN103167643 B CN 103167643B
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- euthermic chip
- conducting strip
- substrates
- air conditioner
- electric heating
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Abstract
The electrode lead-out structure of a kind of Far infrared electric heating air conditioner euthermic chip of the present invention, include multiple euthermic chip and contact tube (5), euthermic chip includes two substrates (1) as upper epidermis and layer, and two conducting strips (3) be arranged between two substrates (1), and the adhering layer (4) be provided with between two substrates (1) for connecting two substrates (1) and conducting strip (3), the upper surface of substrate (1) is coated with conductive ink layer (2), conducting strip (3) covers on conductive ink layer (2), euthermic chip is provided with the conductive hole (1.1) running through conductive ink layer (2) and conducting strip (3), contact tube (5) is inserted in conductive hole (1.1), contact tube (5) is closely connected with conducting strip (3) after tube.The electrode lead-out structure of Far infrared electric heating air conditioner euthermic chip of the present invention, utilizes tube technology to be connected with conducting strip by contact tube, and compared to modes such as traditional riveted joints, manufacturing process is simple, good connecting effect.
Description
Technical field
The present invention relates to a kind of electrode lead-out structure of Far infrared electric heating air conditioner euthermic chip, belong to air-conditioning technical field.
Background technology
At present, people generally need using air-condition to carry out heating to heating in room in winter, especially at northern area, every household needs to pass into heating installation with resisting cold, and the expense of annual each household flower in heating is just up to thousands of unit, and heating installation uses coal heating produces steam in addition, use fossil fuel not only contaminated environment, be unfavorable for energy-conserving and environment-protective, and in the transmitting procedure of heating installation, easily produce more loss.Be developed miscellaneous heating mode, wherein, Far-infrared Heating mode not only has heating function because of it for this reason, and has physical therapy efficacy and receive the extensive concern of people; But, conventional Far-infrared Heating structure mostly is and is simply coated on substrate by electrically conductive ink, then electrode is pressed, cover one deck prepreg and substrate again, then pressurization forms euthermic chip, and this structure is applied to individual physiotherapy more and is not implanted to field of air conditioning, and electrode adopts the mode of riveted joint or welding lead to draw, complex procedures when not only manufacturing, and it is good not to connect effect.
Summary of the invention
The object of the invention is to overcome above-mentioned deficiency, provide a kind of structure simple and the electrode lead-out structure of the Far infrared electric heating air conditioner euthermic chip of good connecting effect.
The object of the present invention is achieved like this: a kind of electrode lead-out structure of Far infrared electric heating air conditioner euthermic chip, described structure includes multiple euthermic chip and contact tube, described euthermic chip includes two substrates as upper epidermis and layer, and two conducting strips playing electrode effect be arranged between two substrates, and the adhering layer be provided with between two substrates for connecting two substrates and conducting strip, upper surface as the substrate of layer is coated with conductive ink layer, above-mentioned conducting strip covers on conductive ink layer, described euthermic chip is provided with the conductive hole running through conductive ink layer and conducting strip, and conducting strip is provided with downward flange at conductive hole place, described contact tube is inserted in conductive hole, and contact tube is closely connected with conducting strip after tube, described euthermic chip is also provided with multiple installing hole.
Compared with prior art, the invention has the beneficial effects as follows:
The present invention utilizes tube technology to be connected with conducting strip by contact tube, and compared to traditional riveting method, structure is more simple, connects more convenient, and by arranging flange, considerably increases the firmness of connection.
Accompanying drawing explanation
Fig. 1 is the structural representation of the electrode lead-out structure of a kind of Far infrared electric heating air conditioner euthermic chip of the present invention.
Fig. 2 is electrode lead-out structure Fig. 1's of a kind of Far infrared electric heating air conditioner euthermic chip of the present invention
partial enlarged drawing.
Fig. 3 is the structural representation (namely the dash area in figure represents the shape of conductive ink layer) in the electrode lead-out structure of a kind of Far infrared electric heating air conditioner euthermic chip of the present invention on substrate after printing conductive inks layer.
Wherein:
Substrate 1, conductive ink layer 2, conducting strip 3, adhering layer 4, contact tube 5;
Conductive hole 1.1, installing hole 1.2.
Embodiment
See Fig. 1 ~ 3, the electrode lead-out structure of a kind of Far infrared electric heating air conditioner euthermic chip that the present invention relates to, described structure includes multiple euthermic chip and contact tube 5, described euthermic chip includes two substrates 1 as upper epidermis and layer, and two conducting strips 3 playing electrode effect be arranged between two substrates 1, and the adhering layer 4 be provided with between two substrates 1 for connecting two substrates 1 and conducting strip 3, upper surface as the substrate 1 of layer is coated with conductive ink layer 2(as shown in Figure 3), described conductive ink layer 2 can be arranged to linear structure or planar structure according to demand, under linear structure is applied to small-power state, under planar structure is applied to high-power state, above-mentioned conducting strip 3 covers on conductive ink layer 2, described euthermic chip is provided with the conductive hole 1.1 running through conductive ink layer 2 and conducting strip 3, and conducting strip 3 is provided with downward flange (as depicted in figs. 1 and 2) at conductive hole 1.1 place, described contact tube 5 is inserted in conductive hole 1.1, and contact tube 5 is closely connected with conducting strip 3 after tube, (object that conducting strip 3 arranges flange is enlarge active surface, improve the firmness connected), described euthermic chip is also provided with multiple installing hole 1.2, installing hole 1.2 connects for follow-up installation.
During use, the euthermic chip of suitable quantity can be selected according to the situation of reality, also can be encased inside fin to increase heating effect between euthermic chip.
Claims (2)
1. the electrode lead-out structure of a Far infrared electric heating air conditioner euthermic chip, it is characterized in that: described structure includes multiple euthermic chip and contact tube (5), described euthermic chip includes two substrates (1) as upper epidermis and layer, and two conducting strips (3) of playing electrode effect be arranged between two substrates (1), and the adhering layer (4) be provided with between two substrates (1) for connecting two substrates (1) and conducting strip (3), upper surface as the substrate (1) of layer is coated with conductive ink layer (2), above-mentioned conducting strip (3) covers on conductive ink layer (2), described euthermic chip is provided with the conductive hole (1.1) running through conductive ink layer (2) and conducting strip (3), and conducting strip (3) is provided with downward flange at conductive hole (1.1) place, described contact tube (5) is inserted in conductive hole (1.1), and contact tube (5) is closely connected with conducting strip (3) after tube.
2. the electrode lead-out structure of a kind of Far infrared electric heating air conditioner euthermic chip as claimed in claim 1, is characterized in that: described euthermic chip is also provided with multiple installing hole (1.2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110413251.9A CN103167643B (en) | 2011-12-10 | 2011-12-10 | A kind of electrode lead-out structure of Far infrared electric heating air conditioner euthermic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110413251.9A CN103167643B (en) | 2011-12-10 | 2011-12-10 | A kind of electrode lead-out structure of Far infrared electric heating air conditioner euthermic chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103167643A CN103167643A (en) | 2013-06-19 |
| CN103167643B true CN103167643B (en) | 2015-09-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201110413251.9A Active CN103167643B (en) | 2011-12-10 | 2011-12-10 | A kind of electrode lead-out structure of Far infrared electric heating air conditioner euthermic chip |
Country Status (1)
| Country | Link |
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| CN (1) | CN103167643B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3813468A (en) * | 1972-06-14 | 1974-05-28 | Pickford Holland Co Ltd | Electrodes for glass furnaces |
| CN101277556A (en) * | 2007-03-28 | 2008-10-01 | 株式会社湘南合成树脂制作所 | Electric heating apparatus and pipe lining method using same |
| CN102251651A (en) * | 2011-05-07 | 2011-11-23 | 葛跃进 | Self-heating floor system and self-heating floor thereof |
| CN202435627U (en) * | 2011-12-10 | 2012-09-12 | 江阴市霖肯科技有限公司 | Electrode lead-out structure of heating chip of far infrared electric heating air-conditioner |
-
2011
- 2011-12-10 CN CN201110413251.9A patent/CN103167643B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3813468A (en) * | 1972-06-14 | 1974-05-28 | Pickford Holland Co Ltd | Electrodes for glass furnaces |
| CN101277556A (en) * | 2007-03-28 | 2008-10-01 | 株式会社湘南合成树脂制作所 | Electric heating apparatus and pipe lining method using same |
| CN102251651A (en) * | 2011-05-07 | 2011-11-23 | 葛跃进 | Self-heating floor system and self-heating floor thereof |
| CN202435627U (en) * | 2011-12-10 | 2012-09-12 | 江阴市霖肯科技有限公司 | Electrode lead-out structure of heating chip of far infrared electric heating air-conditioner |
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| Publication number | Publication date |
|---|---|
| CN103167643A (en) | 2013-06-19 |
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Effective date of registration: 20160530 Address after: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Jiangyin Province Patentee after: Jiangyin Wenchang Intelligent Electromechanical Research Institution Co.,Ltd. Address before: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Wuxi province Jiangyin City Patentee before: Jiangyin Linken Technology Co.,Ltd. |
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Effective date of registration: 20230626 Address after: No. 997, Huicheng Avenue, Huishan District, Wuxi City, Jiangsu Province, 214181 Patentee after: Yilufa Intelligent Technology (Jiangsu) Co.,Ltd. Address before: No. 98, Zhuhuang Road, Zhutang Town, Jiangyin City, Jiangsu Province, 214415 Patentee before: Jiangyin Wenchang Intelligent Electromechanical Research Institution Co.,Ltd. |
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