CN103167646B - The assembly technology of Far infrared electric heating air conditioner euthermic chip - Google Patents
The assembly technology of Far infrared electric heating air conditioner euthermic chip Download PDFInfo
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- CN103167646B CN103167646B CN201110413838.XA CN201110413838A CN103167646B CN 103167646 B CN103167646 B CN 103167646B CN 201110413838 A CN201110413838 A CN 201110413838A CN 103167646 B CN103167646 B CN 103167646B
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Abstract
The present invention relates to a kind of assembly technology of Far infrared electric heating air conditioner euthermic chip, the step of described technique is: step 1, substrate cut; Step 2, clean; Step 3, ink printing; Step 4, solidification; Step 5, subsides conducting strip; Step 6, add prepreg; Step 7, cover another substrate (1); Step 8, pressing; Step 9, die-cut; Euthermic chip (101) is obtained after completing steps 9.The assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention, heats moist Far infrared electric heating air conditioner euthermic chip for processing energy-conserving and environment-protective.
Description
Technical field
The present invention relates to a kind of assembly technology, especially relate to a kind of assembly technology of Far infrared electric heating air conditioner euthermic chip, belong to air-conditioning processing technique field.
Background technology
At present, people generally need using air-condition to heat to heating in room in winter, especially at northern area, every household needs to pass into heating installation with resisting cold, and the expense of annual each household flower in heating is just up to thousands of unit, and heating installation uses coal heating produces steam in addition, use fossil fuel not only contaminated environment, be unfavorable for energy-conserving and environment-protective, and in the transmitting procedure of heating installation, easily produce more loss.And for the air-conditioning of routine, its heating mainly contains two kinds of modes:
The first heats the heating principle of principle just as some electric heater.It is exactly the heating by electrothermal tube, direct is heat energy by electric energy conversion, by heat trnasfer, neighbouring air themperature is improved after electrothermal tube heating, this mode of heating efficiency is higher, but be generally used on the larger monomer air-conditioning of cabinet-type air conditioner constant power, the air conditioner of this mode of heating is commonly referred to as electric auxiliary pattern of fever air conditioner;
It is the same with refrigeration principle that the second heats principle, and its principle heated simply can be interpreted as from external world's absorption heat and then transfer to indoor by air conditioner, and we make this air conditioner be hot Pump air conditioner.But also therefore, when the temperature of outdoor is too low, absorb heat just very limited, so that indoor heating effect is poor.After zubzero temperature, the effect that hot Pump air conditioner plays is just poor.
Visible employing first kind of way, power consumption is comparatively large, and adopts its effect of the second way obvious not.And above-mentioned two kinds of mode of heatings, it all can cause indoor humidity to reduce in the course of the work, makes user feel very dry.
And from Germany scientist in 1800 breathe out inferior found infrared ray when studying solar spectrum since, infrared ray correlation technique has been widely used on industrial production, medical diagnosis, detection, treatment and prevention and health care; Medical infrared ray can be divided near infrared ray, middle infrared (Mid-IR) and far infrared according to Biological characteristics.Far infrared refers to the infrared ray of wavelength at 3-1000 micron, the infrared ray of this wave band of its medium wavelength 4-20 micron is important to the existence of the mankind and biological growing pullets, far infrared to human body effect primarily of line outside line far away three key properties determine (one be radiation, two be strong penetrations, three be absorb, resonance and sympathetic response).Human body surface accepts far infrared, and from outward appearance to inner essence conducts infiltration, by absorption produce thermogenetic effect, produce with in-vivo tissue cell resonate, sympathetic response, facilitate activity.And owing to producing thermogenetic effect, make human microvascular expand, self-disciplining is strengthened, and blood circulation is accelerated, and accelerates the mass exchange of cell and blood, thus facilitates the metabolism of body.Meanwhile, far infrared improves cytophagous phagocytic activity, is conducive to the absorption of chronic inflammation, dissipation, is applicable to treat various types of chronic inflammation, as some chronic inflammations of neuritis, myositis, arthritis and internal organ.Heat energy can reduce sensorineural excitability, and by relieve muscle spasms, detumescence, anti-inflammatory with improve blood circulation and treat various pain, as neuralgia and Crampy Pain, struvite and avascular pain etc.Therefore, far infrared is medically called " fertility light " by expert;
For this reason, the present inventor introduces FAR INFRARED HEATING mode in field of air conditioning, replaces traditional air-conditioning.
Summary of the invention
The object of the invention is to overcome above-mentioned deficiency, a kind of energy-conserving and environment-protective are provided and heat the assembly technology of the euthermic chip of moist Far infrared electric heating air conditioner.
The object of the present invention is achieved like this: a kind of assembly technology of Far infrared electric heating air conditioner euthermic chip, and the step of described technique is:
Step 1, substrate cut;
Formation substrate is cut to glass-fiber-plate, and is processed to form location hole and conductive hole at the two ends of substrate respectively, and location hole is positioned at the outside of conductive hole;
Step 2, clean;
Surface cleaning is carried out to the substrate that step 1 is formed;
Step 3, ink printing;
Electrically conductive ink is printed on substrate and forms heater, and the two ends of heater are coated to the conductive hole place at substrate two ends respectively;
Step 4, solidification;
The substrate being printed with heater is put into baking oven or irradiation ultraviolet radiation, will the electrically conductive ink baking and curing of heater be formed;
Step 5, subsides conducting strip;
Two pieces of back sides are attached to the conducting strip of glue-line and are printed with on the substrate of heater, and conducting strip covers on conductive hole;
Step 6, add prepreg;
Prepreg processes the through hole matched with conducting strip shape size, and the shape size of prepreg and the shape size of substrate match, and then covered by prepreg and be printed with on the substrate of heater, conducting strip is positioned at the through hole of prepreg;
Step 7, cover another substrate;
The semi-finished product another substrate being covered completing steps 6 form euthermic chip semi-finished product;
Step 8, pressing;
Carry out temperature-pressure process to the euthermic chip semi-finished product of completing steps 7, upper and lower two layers of substrate, heater and conducting strip are bonded together by the glue that melts that prepreg is produced;
Step 9, die-cut;
After completing steps 8, euthermic chip to be cut can be obtained after cooling, because prepreg melts glue and spills on the edge of euthermic chip to be cut heating and have part in pressure process, in order to the consistent and overall appearance of overall dimension, four limits of euthermic chip to be cut are cut away together with location hole, and on euthermic chip to be cut, utilize press to go out four installing holes, and while rushing installing hole, conducting strip goes out flanging bore by flange drift, the flange of this flanging bore is positioned at conductive hole, thus obtains euthermic chip.
The assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention, cutting mould is adopted to complete the operation of this step in step 1, described cutting mould includes cutting mould counterdie and cutting mould patrix, described cutting mould counterdie includes cutting mould lower mould bottom plate, described cutting mould lower mould bottom plate is provided with cutting mould counterdie guide pillar and cutting mould counterdie template, the template face of described cutting mould counterdie template is the step surface be made up of cutting mould bottom punch tangent plane and cutting mould counterdie joint face, described cutting mould bottom punch tangent plane is lower than cutting mould counterdie joint face, the two ends, left and right of described cutting mould bottom punch tangent plane are respectively arranged with the punching of two cutting mould counterdies, described cutting mould lower mould bottom plate is provided with cutting mould counterdie guide vane end stop, described cutting mould counterdie guide vane end stop is positioned at by cutting mould bottom punch tangent plane, described cutting mould patrix includes baffle plate on cutting mould, described cutting mould baffle plate is provided with the cutting mould upper die guide sleeve corresponding with cutting mould counterdie guide pillar, baffle plate is provided with described cutting mould the cutting mould patrix template corresponding with cutting mould counterdie template, and cutting mould patrix template to be arranged on cutting mould on baffle plate by cutting mould patrix elastic supporting member for supporting optical member, the template face of described cutting mould patrix template is the step surface be made up of cutting mould upper punch tangent plane and cutting mould patrix joint face, described cutting mould upper punch tangent plane is higher than cutting mould patrix joint face, two ends and the cutting mould counterdie punching opposite position place of described cutting mould upper punch tangent plane are provided with cutting mould patrix drift.
The assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention, the prepreg in step 6 adopts prepreg die cutting die to complete punch forming; described prepreg die cutting die includes prepreg die cutting die patrix and prepreg die cutting die counterdie, described prepreg die cutting die patrix and prepreg die cutting die counterdie include baffle plate and prepreg die cutting die lower mould bottom plate on prepreg die cutting die respectively, baffle plate and prepreg die cutting die lower mould bottom plate are separately installed with prepreg die cutting die patrix template and prepreg die cutting die counterdie template to described prepreg die cutting die, described prepreg die cutting die patrix template to be arranged on prepreg die cutting die on baffle plate by prepreg die cutting die patrix elastic supporting member for supporting optical member, in described prepreg die cutting die patrix template and prepreg die cutting die counterdie template, correspondence is provided with prepreg die cutting die patrix drift and the punching of prepreg die cutting die counterdie respectively, on described prepreg die cutting die, in baffle plate and prepreg die cutting die lower mould bottom plate, correspondence is provided with prepreg die cutting die upper die guide sleeve and prepreg die cutting die counterdie guide pillar respectively.
The assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention, pressing mold was adopted to operate in step 8, described pressing mold includes pressing mold patrix and pressing mold counterdie, and described pressing mold patrix and pressing mold counterdie respectively correspondence are provided with pressing mold patrix guide hole and pressing mold counterdie guide pillar.
The assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention, die cutting die is adopted to operate in step 9, described die cutting die includes die cutting die patrix and die cutting die counterdie, described die cutting die patrix includes baffle plate on die cutting die, described die cutting die baffle plate is provided with die cutting die patrix template and die cutting die upper die guide sleeve, described die cutting die patrix template is provided with die cutting die patrix boss, described die cutting die patrix boss is provided with the punching of die cutting die patrix, described die cutting die counterdie includes die cutting die lower mould bottom plate, described die cutting die lower mould bottom plate is provided with die cutting die counterdie template, described die cutting die counterdie template is connected in die cutting die lower mould bottom plate by die cutting die counterdie elastic supporting member for supporting optical member, described die cutting die lower mould bottom plate is provided with the die cutting die counterdie guide pillar of coupling corresponding with die cutting die upper die guide sleeve, described die cutting die counterdie template is provided with the die cutting die counterdie concave surface corresponding with die cutting die patrix boss, described die cutting die counterdie concave surface is provided with the die cutting die counterdie drift matched with the punching of die cutting die patrix and die cutting die counterdie flange drift, die cutting die counterdie drift is used for die-cut installing hole, die cutting die counterdie flange drift is used for conducting strip to go out flange at conductive hole place.
Compared with prior art, the invention has the beneficial effects as follows:
Adopt the far infrared air-conditioning euthermic chip that the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention is made, compared to traditional air-conditioning heating mode, heating efficiency is higher, has the benefit of energy-conserving and environment-protective; Meanwhile, owing to using far infrared to heat, compared to the Electric heating of traditional air conditioner, adopt the electrothermal conditioner that euthermic chip of the present invention is made, can humidity in holding chamber, user is used more comfortable; And far infrared has physical therapy function, while maintenance indoor temperature, good effect is had more to the healthy of user, effect that Fu Zhuzhiliao keeps healthy can be played.The assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention, in whole assembly technology, applies a large amount of moulds, simplifies manual operation, makes production efficiency better, can effectively reduce production cost.
Accompanying drawing explanation
Fig. 1 is the structural representation of substrate in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Fig. 2 be in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention at substrate in printing electrically conductive ink form the structural representation after heater.
Fig. 3 is the structural representation substrate in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention after being printed with heater covering conducting strip.
Fig. 4 is the end view of Fig. 3 in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Fig. 5 is the structural representation of prepreg in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Fig. 6 is the structural representation (adding conducting strip) in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention after being printed with the substrate upper press cover prepreg of heater.
Fig. 7 is the end view of Fig. 6 in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Fig. 8 is the structural representation in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention on prepreg upper press cover after another substrate.
Fig. 9 is the end view of Fig. 8 in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Figure 10 is the structural representation of the euthermic chip to be cut formed after temperature-pressure operation in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Figure 11 is the structural representation of euthermic chip in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Figure 12 is the side sectional view of Figure 11 in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Figure 13 is Figure 12 in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention
partial enlarged drawing.
Figure 14 is the structural representation of cutting mould counterdie in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Figure 15 is the structural representation of cutting mould patrix in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Figure 16 is that the A of Figure 15 in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention is to schematic diagram.
Figure 17 is the structural representation of die cutting die patrix in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Figure 18 is die cutting die lower die structure schematic diagram in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Figure 19 is that the B of Figure 18 in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention is to schematic diagram.
Figure 20 is the structural representation of prepreg die cutting die patrix in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Figure 21 is the structural representation of prepreg die cutting die counterdie in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Figure 22 is that the C of Figure 20 in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention is to schematic diagram.
Figure 23 is the structural representation of pressing mold patrix in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Figure 24 is the structural representation of pressing mold counterdie in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Figure 25 is the vertical view of Figure 24 in the assembly technology of Far infrared electric heating air conditioner euthermic chip of the present invention.
Wherein:
Substrate 1, heater 2, conducting strip 3, prepreg 4, euthermic chip semi-finished product 5, euthermic chip to be cut 6;
Euthermic chip 101;
Location hole 1.1, conductive hole 1.2, installing hole 1.3;
Through hole 4.1;
Cutting mould counterdie 1011, cutting mould patrix 1012, die cutting die patrix 1013, die cutting die counterdie 1014, prepreg die cutting die patrix 1015, prepreg die cutting die counterdie 1016, pressing mold patrix 1017, pressing mold counterdie 1018;
Cutting mould lower mould bottom plate 1011.1, cutting mould counterdie guide pillar 1011.2, cutting mould counterdie template 1011.3, cutting mould counterdie guide vane end stop 1011.4, cutting mould counterdie punching 1011.5;
Cutting mould bottom punch tangent plane 1011.3.1, cutting mould counterdie joint face 1011.3.2;
Baffle plate 1012.1, cutting mould upper die guide sleeve 1012.2, cutting mould patrix template 1012.3, cutting mould patrix elastic supporting member for supporting optical member 1012.4, cutting mould patrix drift 1012.5 on cutting mould;
Cutting mould upper punch tangent plane 1012.3.1, cutting mould patrix joint face 1012.3.2;
Baffle plate 1013.1, die cutting die patrix template 1013.2, die cutting die patrix boss 1013.3, die cutting die upper die guide sleeve 1013.4, die cutting die patrix punching 1013.5 on die cutting die;
Die cutting die lower mould bottom plate 1014.1, die cutting die counterdie template 1014.2, die cutting die counterdie concave surface 1014.3, die cutting die counterdie guide pillar 1014.4, die cutting die counterdie elastic supporting member for supporting optical member 1014.5, die cutting die counterdie drift 1014.6, die cutting die counterdie flange drift 1014.7;
Baffle plate 1015.1, prepreg die cutting die patrix template 1015.2, prepreg die cutting die patrix drift 1015.3, prepreg die cutting die upper die guide sleeve 1015.4, prepreg die cutting die patrix elastic supporting member for supporting optical member 1015.5 on prepreg die cutting die;
Prepreg die cutting die lower mould bottom plate 1016.1, prepreg die cutting die counterdie template 1016.2, prepreg die cutting die counterdie punching 1016.3, prepreg die cutting die counterdie guide pillar 1016.4;
Pressing mold patrix guide hole 1017.1, pressing mold counterdie guide pillar 1018.1.
Embodiment
See Fig. 1 ~ 25, the assembly technology of a kind of Far infrared electric heating air conditioner euthermic chip that the present invention relates to, the step of described technique is:
Step 1, substrate cut;
Glass-fiber-plate is cut and forms substrate 1, described substrate 1 is rectangle structure, also different shapes can be made into according to actual conditions during actual manufacture, and be processed to form location hole 1.1 and conductive hole 1.2 at the two ends of substrate 1 respectively, and location hole 1.1 is positioned at the outside (as shown in Figure 1) of conductive hole 1.2;
It is shaping that whole process utilizes cutting mould once to cut, see Figure 14 ~ 16, described cutting mould includes cutting mould counterdie 1011 and cutting mould patrix 1012, described cutting mould counterdie 1011 includes cutting mould lower mould bottom plate 1011.1, described cutting mould lower mould bottom plate 1011.1 is provided with cutting mould counterdie guide pillar 1011.2 and cutting mould counterdie template 1011.3, the template face of described cutting mould counterdie template 1011.3 is the step surface be made up of cutting mould bottom punch tangent plane 1011.3.1 and cutting mould counterdie joint face 1011.3.2, described cutting mould bottom punch tangent plane 1011.3.1 is lower than cutting mould counterdie joint face 1011.3.2, the two ends, left and right of described cutting mould bottom punch tangent plane 1011.3.1 are respectively arranged with two cutting mould counterdies punching 1011.5, described cutting mould lower mould bottom plate 1011.1 is provided with cutting mould counterdie guide vane end stop 1011.4, described cutting mould counterdie guide vane end stop 1011.4 is positioned at by cutting mould bottom punch tangent plane 1011.3.1, described cutting mould patrix 1012 includes baffle plate 1012.1 on cutting mould, described cutting mould baffle plate 1012.1 is provided with the cutting mould upper die guide sleeve 1012.2 corresponding with cutting mould counterdie guide pillar 1011.2, baffle plate 1012.1 is provided with described cutting mould the cutting mould patrix template 1012.3 corresponding with cutting mould counterdie template 1011.3, and cutting mould patrix template 1012.3 to be arranged on cutting mould on baffle plate 1012.1 by cutting mould patrix elastic supporting member for supporting optical member 1012.4, the template face of described cutting mould patrix template 1012.3 is the step surface be made up of cutting mould upper punch tangent plane 1012.3.1 and cutting mould patrix joint face 1012.3.2, described cutting mould upper punch tangent plane 1012.3.1 is higher than cutting mould patrix joint face 1012.3.2, two ends and the cutting mould counterdie punching 1011.5 opposite position place of described cutting mould upper punch tangent plane 1012.3.1 are provided with cutting mould patrix drift 1012.5, when cutting, cutting mould counterdie 1011 is contained on press after being located by connecting mutually with cutting mould upper die guide sleeve 1012.2 by cutting mould counterdie guide pillar 1011.2 with cutting mould patrix 1012, glass-fiber-plate is entered cutting mould bottom punch tangent plane 1011.3.1 via cutting mould counterdie joint face 1011.3.2, start press subsequently, cutting mould patrix 1012 presses down, step surface is utilized to be cut off by glass-fiber-plate, and go out location hole 1.1 and conductive hole 1.2 on the substrate 1 by cutting mould patrix drift 1012.5 simultaneously, finally, cutting mould patrix 1012 under the drive of press on move, now, cutting mould patrix template 1012.3 unloads sweeping away the defective material come time die-cut under the elastic force effect of cutting mould patrix elastic supporting member for supporting optical member 1012.4,
Step 2, clean;
Surface cleaning is carried out to the substrate 1 that step 1 is formed;
Step 3, ink printing;
Electrically conductive ink printing is formed heater 2 on the substrate 1, screen printing technique or other mode of printings can be utilized, this heater 2 is on the substrate 1 in wire or planar, linear structure can be used in low-power applications field, in high-power field, planar structure can be used, during actual manufacture, can carry out selectivity manufacture according to the requirement of user, and the two ends of heater 2 are coated to conductive hole 1.2 place (as shown in Figure 2) at substrate 1 two ends respectively;
Step 4, solidification;
The substrate 1 being printed with heater 2 is put into baking oven or irradiation ultraviolet radiation, will the electrically conductive ink baking and curing of heater 2 be formed;
Step 5, subsides conducting strip;
Two pieces of back sides are attached to the conducting strip 3 of glue-line and are printed with on the substrate 1 of heater 2, and conducting strip 3 covers (as shown in Figure 3 and Figure 4) on conductive hole 1.2;
Step 6, add prepreg;
Prepreg 4 processes the through hole 4.1(that matches with conducting strip 3 shape size as shown in Figure 5), the shape size of prepreg 4 and the shape size of substrate 1 match, then being covered by prepreg 4 is printed with on the substrate 1 of heater 2, and conducting strip 3 is positioned at the through hole 4.1 (as shown in Figure 6 and Figure 7) of prepreg 4;
In this step, prepreg die cutting die is used to carry out punch forming;
See Figure 20 ~ 22, described prepreg die cutting die includes prepreg die cutting die patrix 1015 and prepreg die cutting die counterdie 1016, described prepreg die cutting die patrix 1015 and prepreg die cutting die counterdie 1016 include baffle plate 1015.1 and prepreg die cutting die lower mould bottom plate 1016.1 on prepreg die cutting die respectively, baffle plate 1015.1 and prepreg die cutting die lower mould bottom plate 1016.1 are separately installed with prepreg die cutting die patrix template 1015.2 and prepreg die cutting die counterdie template 1016.2 to described prepreg die cutting die, described prepreg die cutting die patrix template 1015.2 to be arranged on prepreg die cutting die on baffle plate 1015.1 by prepreg die cutting die patrix elastic supporting member for supporting optical member 1015.5, in described prepreg die cutting die patrix template 1015.2 and prepreg die cutting die counterdie template 1016.2, correspondence is provided with prepreg die cutting die patrix drift 1015.3 and prepreg die cutting die counterdie punching 1016.3 respectively, on described prepreg die cutting die, in baffle plate 1015.1 and prepreg die cutting die lower mould bottom plate 1016.1, correspondence is provided with prepreg die cutting die upper die guide sleeve 1015.4 and prepreg die cutting die counterdie guide pillar 1016.4 respectively,
Time die-cut, die cutting die patrix 1015 and prepreg die cutting die counterdie 1016 are sleeved on press, prepreg 4 is placed in prepreg die cutting die counterdie template 1016.2, start press, prepreg die cutting die patrix drift 1015.3 punches out at prepreg 4 through hole 4.1 matched with conducting strip 3;
Step 7, cover another substrate 1;
The semi-finished product another substrate 1 being covered completing steps 6 form euthermic chip semi-finished product 5(as shown in Figure 8 and Figure 9);
Step 8, pressing;
Carry out temperature-pressure process to the euthermic chip semi-finished product 5 of completing steps 7, upper and lower two layers of substrate 1, heater 2 and conducting strip 3 are bonded together by the glue that melts that prepreg 4 is produced;
In this step, operate by pressing mold, see Figure 23 ~ 25, described pressing mold includes pressing mold patrix 1017 and pressing mold counterdie 1018, and described pressing mold patrix 1017 and pressing mold counterdie 1018 respectively correspondence are provided with pressing mold patrix guide hole 1017.1 and pressing mold counterdie guide pillar 1018.1;
During use, euthermic chip semi-finished product 5 utilize location hole 1.1 to be enclosed within pressing mold counterdie 1018, so also carry on euthermic chip semi-finished product 5 and pad a release liners, at covering euthermic chip semi-finished product 5, the euthermic chip semi-finished product 5 of suitable quantity can be selected according to the situation of reality, all be encased inside release liners between adjacent euthermic chip semi-finished product 5, finally again pressing mold patrix 1017 loaded onto, this mould is sent into hot press and carries out temperature-pressure process;
Step 9, die-cut;
After completing steps 8, euthermic chip 6(to be cut can be obtained after cooling as shown in Figure 10, in figure, dash area represents the part that will cut away), because prepreg melts glue and spills on the edge of euthermic chip to be cut heating and have part in pressure process, in order to the consistent and overall appearance of overall dimension, being cut away together with location hole 1.1 on four limits of euthermic chip 6 to be cut (cuts in process in step 1, the size of substrate 1 is greater than final euthermic chip to be cut 6, location hole 1.1 only plays the role of positioning in a manufacturing process, location hole 1.1 is not had) in finished product, and on euthermic chip 6 to be cut, utilize press to go out four installing holes 1.3, during actual manufacture, the installing hole 1.3 of suitable quantity can be gone out according to the actual requirements, and while rushing installing hole 1.3, conducting strip 3 goes out flanging bore by flange drift, the flange of this flanging bore is positioned at conductive hole 1.2, thus obtain euthermic chip 101(as is illustrated by figs. 11 and 12),
Die cutting die one-step punching is adopted to complete in above-mentioned steps,
See Figure 17 ~ 19, described die cutting die includes die cutting die patrix 1013 and die cutting die counterdie 1014, described die cutting die patrix 1013 includes baffle plate 1013.1 on die cutting die, described die cutting die baffle plate 1013.1 is provided with die cutting die patrix template 1013.2 and die cutting die upper die guide sleeve 1013.4, described die cutting die patrix template 1013.2 is provided with die cutting die patrix boss 1013.3, described die cutting die patrix boss 1013.3 is provided with die cutting die patrix punching 1013.5, described die cutting die counterdie 1014 includes die cutting die lower mould bottom plate 1014.1, described die cutting die lower mould bottom plate 1014.1 is provided with die cutting die counterdie template 1014.2, described die cutting die counterdie template 1014.2 is connected in die cutting die lower mould bottom plate 1014.1 by die cutting die counterdie elastic supporting member for supporting optical member 1014.5, described die cutting die lower mould bottom plate 1014.1 is provided with the die cutting die counterdie guide pillar 1014.4 of coupling corresponding with die cutting die upper die guide sleeve 1013.4, described die cutting die counterdie template 1014.2 is provided with the die cutting die counterdie concave surface 1014.3 corresponding with die cutting die patrix boss 1013.3, described die cutting die counterdie concave surface 1014.3 is provided with the die cutting die counterdie drift 1014.6 matched with die cutting die patrix punching 1013.5 and die cutting die counterdie flange drift 1014.7, die cutting die counterdie drift 1014.6 is for die-cut installing hole 1.3, die cutting die counterdie flange drift 1014.7 is for going out flange (as shown in figure 13) by conducting strip 3 at conductive hole 1.2 place,
During use, die cutting die patrix 1013 and die cutting die counterdie 1014 are installed on corresponding press, then euthermic chip 6 to be cut is positioned on the die cutting die counterdie concave surface 1014.3 of die cutting die counterdie template 1014.2, start press, the die-cut place of cooperation of die cutting die patrix boss 1013.3 and die cutting die counterdie concave surface 1014.3 is utilized to need the euthermic chip of size, meanwhile, common drift goes out installing hole 1.3 on euthermic chip 6 to be cut, and flange drift goes out flange on conducting strip 3.
Claims (5)
1. an assembly technology for Far infrared electric heating air conditioner euthermic chip, is characterized in that: the step of described technique is:
Step 1, substrate cut;
Glass-fiber-plate is cut and forms substrate (1), and be processed to form location hole (1.1) and conductive hole (1.2) at the two ends of substrate (1) respectively, and location hole (1.1) is positioned at the outside of conductive hole (1.2);
Step 2, clean;
Surface cleaning is carried out to the substrate (1) that step 1 is formed;
Step 3, ink printing;
Electrically conductive ink is printed on substrate (1) and forms heater (2), and the two ends of heater (2) are coated to conductive hole (1.2) place at substrate (1) two ends respectively;
Step 4, solidification;
The substrate (1) being printed with heater (2) is put into baking oven or irradiation ultraviolet radiation, the electrically conductive ink baking and curing of heater (2) will be formed;
Step 5, subsides conducting strip;
Two pieces of back sides are attached to the conducting strip (3) of glue-line on the substrate (1) being printed with heater (2), and conducting strip (3) covers on conductive hole (1.2);
Step 6, add prepreg;
Prepreg (4) processes the through hole (4.1) matched with conducting strip (3) shape size, the shape size of prepreg (4) and the shape size of substrate (1) match, then covered by prepreg (4) on the substrate (1) being printed with heater (2), conducting strip (3) is positioned at the through hole (4.1) of prepreg (4);
Step 7, cover another substrate (1);
The semi-finished product another substrate (1) being covered completing steps 6 form euthermic chip semi-finished product (5);
Step 8, pressing;
Carry out temperature-pressure process to the euthermic chip semi-finished product (5) of completing steps 7, upper and lower two layers of substrate (1), heater (2) and conducting strip (3) are bonded together by the glue that melts that prepreg (4) is produced;
Step 9, die-cut;
After completing steps 8, euthermic chip to be cut (6) can be obtained after cooling, because prepreg melts glue and spills on the edge of euthermic chip to be cut heating and have part in pressure process, in order to the consistent and overall appearance of overall dimension, four limits of euthermic chip to be cut (6) are cut away together with location hole (1.1), and on euthermic chip to be cut (6), utilize press to go out four installing holes (1.3), and while rushing installing hole (1.3), conducting strip (3) goes out flanging bore by flange drift, the flange of this flanging bore is positioned at conductive hole (1.2), thus obtain euthermic chip (101).
2. the assembly technology of a kind of Far infrared electric heating air conditioner euthermic chip as claimed in claim 1, it is characterized in that: adopt cutting mould to complete the operation of this step in step 1, described cutting mould includes cutting mould counterdie (1011) and cutting mould patrix (1012), described cutting mould counterdie (1011) includes cutting mould lower mould bottom plate (1011.1), described cutting mould lower mould bottom plate (1011.1) is provided with cutting mould counterdie guide pillar (1011.2) and cutting mould counterdie template (1011.3), the template face of described cutting mould counterdie template (1011.3) is the step surface be made up of cutting mould bottom punch tangent plane (1011.3.1) and cutting mould counterdie joint face (1011.3.2), described cutting mould bottom punch tangent plane (1011.3.1) is lower than cutting mould counterdie joint face (1011.3.2), the two ends, left and right of described cutting mould bottom punch tangent plane (1011.3.1) are respectively arranged with two cutting mould counterdies punching (1011.5), described cutting mould lower mould bottom plate (1011.1) is provided with cutting mould counterdie guide vane end stop (1011.4), it is other that described cutting mould counterdie guide vane end stop (1011.4) is positioned at cutting mould bottom punch tangent plane (1011.3.1), described cutting mould patrix (1012) includes baffle plate on cutting mould (1012.1), described cutting mould baffle plate (1012.1) is provided with the cutting mould upper die guide sleeve (1012.2) corresponding with cutting mould counterdie guide pillar (1011.2), described cutting mould baffle plate (1012.1) is provided with the cutting mould patrix template (1012.3) corresponding with cutting mould counterdie template (1011.3), and cutting mould patrix template (1012.3) is arranged on baffle plate on cutting mould (1012.1) by cutting mould patrix elastic supporting member for supporting optical member (1012.4), the template face of described cutting mould patrix template (1012.3) is the step surface be made up of cutting mould upper punch tangent plane (1012.3.1) and cutting mould patrix joint face (1012.3.2), described cutting mould upper punch tangent plane (1012.3.1) is higher than cutting mould patrix joint face (1012.3.2), two ends and cutting mould counterdie punching (1011.5) the opposite position place of described cutting mould upper punch tangent plane (1012.3.1) are provided with cutting mould patrix drift (1012.5).
3. the assembly technology of a kind of Far infrared electric heating air conditioner euthermic chip as claimed in claim 1, is characterized in that: the prepreg in step 6 adopts prepreg die cutting die to complete punch forming;
Described prepreg die cutting die includes prepreg die cutting die patrix (1015) and prepreg die cutting die counterdie (1016), described prepreg die cutting die patrix (1015) and prepreg die cutting die counterdie (1016) include baffle plate (1015.1) and prepreg die cutting die lower mould bottom plate (1016.1) on prepreg die cutting die respectively, baffle plate (1015.1) and prepreg die cutting die lower mould bottom plate (1016.1) are separately installed with prepreg die cutting die patrix template (1015.2) and prepreg die cutting die counterdie template (1016.2) to described prepreg die cutting die, described prepreg die cutting die patrix template (1015.2) to be arranged on prepreg die cutting die on baffle plate (1015.1) by prepreg die cutting die patrix elastic supporting member for supporting optical member (1015.5), on described prepreg die cutting die patrix template (1015.2) and prepreg die cutting die counterdie template (1016.2), correspondence is provided with prepreg die cutting die patrix drift (1015.3) and prepreg die cutting die counterdie punching (1016.3) respectively, on described prepreg die cutting die, in baffle plate (1015.1) and prepreg die cutting die lower mould bottom plate (1016.1), correspondence is provided with prepreg die cutting die upper die guide sleeve (1015.4) and prepreg die cutting die counterdie guide pillar (1016.4) respectively.
4. the assembly technology of a kind of Far infrared electric heating air conditioner euthermic chip as claimed in claim 1, it is characterized in that: adopted pressing mold to operate in step 8, described pressing mold includes pressing mold patrix (1017) and pressing mold counterdie (1018), and described pressing mold patrix (1017) and pressing mold counterdie (1018) respectively correspondence are provided with pressing mold patrix guide hole (1017.1) and pressing mold counterdie guide pillar (1018.1).
5. the assembly technology of a kind of Far infrared electric heating air conditioner euthermic chip as claimed in claim 1, it is characterized in that: adopt die cutting die to operate in step 9, described die cutting die includes die cutting die patrix (1013) and die cutting die counterdie (1014), described die cutting die patrix (1013) includes baffle plate on die cutting die (1013.1), described die cutting die baffle plate (1013.1) is provided with die cutting die patrix template (1013.2) and die cutting die upper die guide sleeve (1013.4), described die cutting die patrix template (1013.2) is provided with die cutting die patrix boss (1013.3), described die cutting die patrix boss (1013.3) is provided with die cutting die patrix punching (1013.5), described die cutting die counterdie (1014) includes die cutting die lower mould bottom plate (1014.1), described die cutting die lower mould bottom plate (1014.1) is provided with die cutting die counterdie template (1014.2), described die cutting die counterdie template (1014.2) is connected in die cutting die lower mould bottom plate (1014.1) by die cutting die counterdie elastic supporting member for supporting optical member (1014.5), described die cutting die lower mould bottom plate (1014.1) is provided with the die cutting die counterdie guide pillar (1014.4) with die cutting die upper die guide sleeve (1013.4) corresponding coupling, described die cutting die counterdie template (1014.2) is provided with the die cutting die counterdie concave surface (1014.3) corresponding with die cutting die patrix boss (1013.3), described die cutting die counterdie concave surface (1014.3) is provided with the die cutting die counterdie drift (1014.6) matched with die cutting die patrix punching (1013.5) and die cutting die counterdie flange drift (1014.7), die cutting die counterdie drift (1014.6) is for die-cut installing hole (1.3), die cutting die counterdie flange drift (1014.7) is for going out flange by conducting strip (3) at conductive hole (1.2) place.
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| CN2120294U (en) * | 1991-09-03 | 1992-10-28 | 方禄明 | Far-infrared multi-function water-cooled air conditioner |
| CN200956666Y (en) * | 2006-09-22 | 2007-10-03 | 谭美田 | Combined polycrystalline electric-heating plate |
| CN101435612A (en) * | 2008-12-16 | 2009-05-20 | 常州尧棋纺织品有限公司 | Environment protection energy-saving vertical cabinet type health care cold and warm air conditioner |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JPH06100347B2 (en) * | 1986-07-04 | 1994-12-12 | 日本ピ−マツク株式会社 | Air conditioning method using far infrared rays |
| JP2726867B2 (en) * | 1987-09-07 | 1998-03-11 | 株式会社アムテックス | Far-infrared ray generator |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2120294U (en) * | 1991-09-03 | 1992-10-28 | 方禄明 | Far-infrared multi-function water-cooled air conditioner |
| CN200956666Y (en) * | 2006-09-22 | 2007-10-03 | 谭美田 | Combined polycrystalline electric-heating plate |
| CN101435612A (en) * | 2008-12-16 | 2009-05-20 | 常州尧棋纺织品有限公司 | Environment protection energy-saving vertical cabinet type health care cold and warm air conditioner |
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