The assembly technology of far-infrared electric-heating air-conditioning heating module
Technical field
The present invention relates to a kind of assembly technology, especially relate to a kind of assembly technology utilizing far infrared to carry out the electrothermal conditioner heated, belong to air-conditioning technical field.
Background technology
At present, people generally need using air-condition to heat to heating in room in winter, especially at northern area, every household needs to pass into heating installation with resisting cold, and the expense of annual each household flower in heating is just up to thousands of unit, and heating installation uses coal heating produces steam in addition, use fossil fuel not only contaminated environment, be unfavorable for energy-conserving and environment-protective, and in the transmitting procedure of heating installation, easily produce more loss.And for the air-conditioning of routine, its heating mainly contains two kinds of modes:
The first heats the heating principle of principle just as some electric heater.It is exactly the heating by electrothermal tube, direct is heat energy by electric energy conversion, by heat trnasfer, neighbouring air themperature is improved after electrothermal tube heating, this mode of heating efficiency is higher, but be generally used on the larger monomer air-conditioning of cabinet-type air conditioner constant power, the air conditioner of this mode of heating is commonly referred to as electric auxiliary pattern of fever air conditioner;
It is the same with refrigeration principle that the second heats principle, and its principle heated simply can be interpreted as from external world's absorption heat and then transfer to indoor by air conditioner, and we make this air conditioner be hot Pump air conditioner.But also therefore, when the temperature of outdoor is too low, absorb heat just very limited, so that indoor heating effect is poor.After zubzero temperature, the effect that hot Pump air conditioner plays is just poor.
Visible employing first kind of way, power consumption is comparatively large, and adopts its effect of the second way obvious not.And above-mentioned two kinds of mode of heatings, it all can cause indoor humidity to reduce in the course of the work, makes user feel very dry.
And from Germany scientist in 1800 breathe out inferior found infrared ray when studying solar spectrum since, infrared ray correlation technique has been widely used on industrial production, medical diagnosis, detection, treatment and prevention and health care; Medical infrared ray can be divided near infrared ray, middle infrared (Mid-IR) and far infrared according to Biological characteristics.Far infrared refers to the infrared ray of wavelength at 3-1000 micron, the infrared ray of this wave band of its medium wavelength 4-20 micron is important to the existence of the mankind and biological growing pullets, far infrared to human body effect primarily of line outside line far away three key properties determine (one be radiation, two be strong penetrations, three be absorb, resonance and sympathetic response).Human body surface accepts far infrared, and from outward appearance to inner essence conducts infiltration, by absorption produce thermogenetic effect, produce with in-vivo tissue cell resonate, sympathetic response, facilitate activity.And owing to producing thermogenetic effect, make human microvascular expand, self-disciplining is strengthened, and blood circulation is accelerated, and accelerates the mass exchange of cell and blood, thus facilitates the metabolism of body.Meanwhile, far infrared improves cytophagous phagocytic activity, is conducive to the absorption of chronic inflammation, dissipation, is applicable to treat various types of chronic inflammation, as some chronic inflammations of neuritis, myositis, arthritis and internal organ.Heat energy can reduce sensorineural excitability, and by relieve muscle spasms, detumescence, anti-inflammatory with improve blood circulation and treat various pain, as neuralgia and Crampy Pain, struvite and avascular pain etc.Therefore, far infrared is medically called " fertility light " by expert;
For this reason, the present inventor introduces FAR INFRARED HEATING mode in field of air conditioning, replaces traditional air-conditioning.
Summary of the invention
The object of the invention is to overcome above-mentioned deficiency, a kind of energy-conserving and environment-protective are provided and heat the assembly technology of the heating module of moist Far infrared electric heating air conditioner.
The object of the present invention is achieved like this: a kind of assembly technology of far-infrared electric-heating air-conditioning heating module, and the step of described assembly technology is:
Step 1, substrate cut;
Formation substrate is cut to glass-fiber-plate, and is processed to form location hole and conductive hole at the two ends of substrate respectively, and location hole is positioned at the outside of conductive hole;
Step 2, clean;
Surface cleaning is carried out to the substrate that step 1 is formed;
Step 3, ink printing;
Electrically conductive ink is printed on substrate and forms heater, and the two ends of heater are coated to the conductive hole place at substrate two ends respectively;
Step 4, solidification;
The substrate being printed with heater is put into baking oven or irradiation ultraviolet radiation, will the electrically conductive ink baking and curing of heater be formed;
Step 5, subsides conducting strip;
Two pieces of back sides are attached to the conducting strip of glue-line and are printed with on the substrate of heater, and conducting strip covers on conductive hole;
Step 6, add prepreg;
Prepreg processes the through hole matched with conducting strip shape size, and then covered by prepreg and be printed with on the substrate of heater, conducting strip is positioned at the through hole of prepreg;
Step 7, cover another substrate 1;
The semi-finished product another substrate being covered completing steps 6 form euthermic chip semi-finished product;
Step 8, pressing;
Carry out temperature-pressure process to the euthermic chip semi-finished product of completing steps 7, upper and lower two layers of substrate, heater and conducting strip are bonded together by the glue that melts that prepreg is produced;
Step 9, die-cut;
After completing steps 8, euthermic chip to be cut can be obtained after cooling, because prepreg melts glue and spills on the edge of euthermic chip to be cut heating and have part in pressure process, in order to the consistent and overall appearance of overall dimension, four limits of euthermic chip to be cut are cut away together with location hole, and utilize press to go out installing hole on euthermic chip to be cut, and while rushing installing hole, conducting strip goes out flanging bore by flange drift, the flange of this flanging bore is positioned at the conductive hole of substrate, thus obtains euthermic chip;
Prepared by step 10, fin;
The width of fin is consistent with the width of euthermic chip, the length of fin is less than the length of euthermic chip, fin is ladder wave structure or wavelike structure, the die-cut connecting hole having population size and installing hole to match on fin, and connecting hole has turnup structure;
Step 11, superposition;
By multiple euthermic chip and the spaced superposition of fin, the connecting hole flange of fin inserts in the installing hole of the substrate forming euthermic chip;
Step 12, poling;
Inserted by contact tube in the flanging bore of the conducting strip forming euthermic chip, tube connector inserts and forms in the installing hole of substrate of euthermic chip and the connecting hole of fin;
Step 13, tube;
Then utilize pipe expanding machine to carry out tube operation to contact tube and tube connector, contact tube is closely connected with conducting strip, and tube connector is closely connected with fin with substrate;
Add and install above-mentioned steps and namely obtain heating module.
The assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention, for strengthening bulk strength, can increase following step after step 13:
Step 14, fastening;
Backing plate is installed respectively in the upper and lower two ends of the heating module obtained after completing steps 13, this installation backing plate is provided with the through hole passed for contact tube and tube connector; C-type steel is installed respectively in this half-finished left and right sides subsequently or installs between backing plate at upper and lower two pieces and install intercell connector.
The assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention, cutting mould is adopted to complete the operation of this step in step 1, described cutting mould includes cutting mould counterdie and cutting mould patrix, described cutting mould counterdie includes cutting mould lower mould bottom plate, described cutting mould lower mould bottom plate is provided with cutting mould counterdie guide pillar and cutting mould counterdie template, the template face of described cutting mould counterdie template is the step surface be made up of cutting mould bottom punch tangent plane and cutting mould counterdie joint face, described cutting mould bottom punch tangent plane is lower than cutting mould counterdie joint face, the two ends, left and right of described cutting mould bottom punch tangent plane are respectively arranged with the punching of two cutting mould counterdies, described cutting mould lower mould bottom plate is provided with cutting mould counterdie guide vane end stop, described cutting mould counterdie guide vane end stop is positioned at by cutting mould bottom punch tangent plane, described cutting mould patrix includes baffle plate on cutting mould, described cutting mould baffle plate is provided with the cutting mould upper die guide sleeve corresponding with cutting mould counterdie guide pillar, baffle plate is provided with described cutting mould the cutting mould patrix template corresponding with cutting mould counterdie template, and cutting mould patrix template to be arranged on cutting mould on baffle plate by cutting mould patrix elastic supporting member for supporting optical member, the template face of described cutting mould patrix template is the step surface be made up of cutting mould upper punch tangent plane and cutting mould patrix joint face, described cutting mould upper punch tangent plane is higher than cutting mould patrix joint face, two ends and the cutting mould counterdie punching opposite position place of described cutting mould upper punch tangent plane are provided with cutting mould patrix drift.
The assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention, prepreg die cutting die is adopted to process through hole on prepreg in step 6, described prepreg die cutting die includes prepreg die cutting die patrix and prepreg die cutting die counterdie, described prepreg die cutting die patrix and prepreg die cutting die counterdie include baffle plate and prepreg die cutting die lower mould bottom plate on prepreg die cutting die respectively, baffle plate and prepreg die cutting die lower mould bottom plate are separately installed with prepreg die cutting die patrix template and prepreg die cutting die counterdie template to described prepreg die cutting die, described prepreg die cutting die patrix template to be arranged on prepreg die cutting die on baffle plate by prepreg die cutting die patrix elastic supporting member for supporting optical member, in described prepreg die cutting die patrix template and prepreg die cutting die counterdie template, correspondence is provided with prepreg die cutting die patrix drift and the punching of prepreg die cutting die counterdie respectively, on described prepreg die cutting die, in baffle plate and prepreg die cutting die lower mould bottom plate, correspondence is provided with prepreg die cutting die upper die guide sleeve and prepreg die cutting die counterdie guide pillar respectively.
The assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention, pressing mold is adopted to complete the operation of this step in step 8, described pressing mold includes pressing mold patrix and pressing mold counterdie, and on described pressing mold patrix and pressing mold counterdie, correspondence is provided with pressing mold patrix guide hole and pressing mold counterdie guide pillar respectively.
The assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention, die cutting die is adopted to complete the operation of this step in step 9, described die cutting die includes die cutting die patrix and die cutting die counterdie, described die cutting die patrix includes baffle plate on die cutting die, described die cutting die baffle plate is provided with die cutting die patrix template and die cutting die upper die guide sleeve, described die cutting die patrix template is provided with die cutting die patrix boss, described die cutting die patrix boss is provided with the punching of die cutting die patrix, described die cutting die counterdie includes die cutting die lower mould bottom plate, described die cutting die lower mould bottom plate is provided with die cutting die counterdie template, described die cutting die counterdie template is connected in die cutting die lower mould bottom plate by die cutting die counterdie elastic supporting member for supporting optical member, described die cutting die lower mould bottom plate is provided with the die cutting die counterdie guide pillar of coupling corresponding with die cutting die upper die guide sleeve, described die cutting die counterdie template is provided with the die cutting die counterdie concave surface corresponding with die cutting die patrix boss, described die cutting die counterdie concave surface is provided with the die cutting die counterdie drift matched with the punching of die cutting die patrix and die cutting die counterdie flange drift, die cutting die counterdie drift is used for die-cut installing hole, die cutting die counterdie flange drift is used for conducting strip to go out flange at conductive hole place.
Compared with prior art, the invention has the beneficial effects as follows:
The far infrared air-conditioning heating module that the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention is made, compared to traditional air-conditioning heating mode, heating efficiency is higher, has the benefit of energy-conserving and environment-protective; Meanwhile, owing to using far infrared to heat, compared to the Electric heating of traditional air conditioner, adopts the electrothermal conditioner that heating module of the present invention is made, can humidity in holding chamber, user's use is more comfortable; And far infrared has physical therapy function, while maintenance indoor temperature, good effect is had more to the healthy of user, effect that Fu Zhuzhiliao keeps healthy can be played.In the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention, apply a large amount of moulds, simplify manual operation, make production efficiency better, can production cost be effectively reduced.
Accompanying drawing explanation
Fig. 1 is the structural representation of substrate in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Fig. 2 be in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention at substrate in printing electrically conductive ink form the structural representation after heater.
Fig. 3 is the structural representation covering conducting strip in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention on the substrate being printed with heater.
Fig. 4 is the end view of Fig. 3 in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Fig. 5 is the structural representation of prepreg in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Fig. 6 is the structural representation (adding conducting strip) in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention after being printed with the substrate upper press cover prepreg of heater.
Fig. 7 is the end view of Fig. 6 in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Fig. 8 is the structural representation in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention on prepreg upper press cover after another substrate.
Fig. 9 is the end view of Fig. 8 in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 10 is the structural representation of the euthermic chip to be cut formed after temperature-pressure operation in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 11 is the structural representation of euthermic chip in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 12 is the side sectional view of Figure 11 in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 13 is the structural representation of fin in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 14 is the A-A cutaway view of Figure 13 in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 15 is the structural representation in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention after an euthermic chip and the superposition of fin.
Figure 16 is Figure 15 in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention
partial enlarged drawing.
Figure 17 penetrates contact tube 8 and the rear structural representation of tube connector 9 after euthermic chip and fin superposition in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 18 is the structural representation of a kind of fastener in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 19 is Figure 18 in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention
partial enlarged drawing.
Figure 20 is the structural representation (inserting structural representation during two tube connectors) of another kind of fastener in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 21 is Figure 20 in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention
partial enlarged drawing.
Figure 22 is the structural representation (structural representation when utilizing intercell connector to connect) of the third fastener in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 23 is the structural representation of cutting mould counterdie in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 24 is the structural representation of cutting mould patrix in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 25 is that the A of Figure 24 in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention is to schematic diagram.
Figure 26 is the structural representation of die cutting die patrix in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 27 is die cutting die lower die structure schematic diagram in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 28 is that the B of Figure 27 in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention is to schematic diagram.
Figure 29 is the structural representation of prepreg die cutting die patrix in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 30 is the structural representation of prepreg die cutting die counterdie in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 31 is that the C of Figure 29 in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention is to schematic diagram.
Figure 32 is the structural representation of pressing mold patrix in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 33 is the structural representation of pressing mold counterdie in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 34 is the vertical view of Figure 33 in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention.
Figure 35 is Figure 12 in the assembly technology of far-infrared electric-heating air-conditioning heating module of the present invention
partial enlarged drawing.
Wherein:
Substrate 1, heater 2, conducting strip 3, prepreg 4, euthermic chip semi-finished product 5, euthermic chip to be cut 6, fin 7, contact tube 8, tube connector 9, fastener 10, cutting mould counterdie 11, cutting mould patrix 12, die cutting die patrix 13, die cutting die counterdie 14, prepreg die cutting die patrix 15, prepreg die cutting die counterdie 16, pressing mold patrix 17, pressing mold counterdie 18;
Euthermic chip 101, heating module 102;
Location hole 1.1, conductive hole 1.2, installing hole 1.3;
Through hole 4.1;
Connecting hole 7.1;
Backing plate 10.1, C-type steel 10.2, intercell connector 10.3;
Cutting mould lower mould bottom plate 11.1, cutting mould counterdie guide pillar 11.2, cutting mould counterdie template 11.3, cutting mould counterdie guide vane end stop 11.4, cutting mould counterdie punching 11.5;
Cutting mould bottom punch tangent plane 11.3.1, cutting mould counterdie joint face 11.3.2;
Baffle plate 12.1, cutting mould upper die guide sleeve 12.2, cutting mould patrix template 12.3, cutting mould patrix elastic supporting member for supporting optical member 12.4, cutting mould patrix drift 12.5 on cutting mould;
Cutting mould upper punch tangent plane 12.3.1, cutting mould patrix joint face 12.3.2;
Baffle plate 13.1, die cutting die patrix template 13.2, die cutting die patrix boss 13.3, die cutting die upper die guide sleeve 13.4, die cutting die patrix punching 13.5 on die cutting die;
Die cutting die lower mould bottom plate 14.1, die cutting die counterdie template 14.2, die cutting die counterdie concave surface 14.3, die cutting die counterdie guide pillar 14.4, die cutting die counterdie elastic supporting member for supporting optical member 14.5, die cutting die counterdie drift 14.6, die cutting die counterdie flange drift 14.7;
Baffle plate 15.1, prepreg die cutting die patrix template 15.2, prepreg die cutting die patrix drift 15.3, prepreg die cutting die upper die guide sleeve 15.4, prepreg die cutting die patrix elastic supporting member for supporting optical member 15.5 on prepreg die cutting die;
Prepreg die cutting die lower mould bottom plate 16.1, prepreg die cutting die counterdie template 16.2, prepreg die cutting die counterdie punching 16.3, prepreg die cutting die counterdie guide pillar 16.4;
Pressing mold patrix guide hole 17.1, pressing mold counterdie guide pillar 18.1.
Embodiment
See Fig. 1 ~ 35, the assembly technology of a kind of far-infrared electric-heating air-conditioning heating module that the present invention relates to, the step of described technique is:
Step 1, substrate cut;
Glass-fiber-plate is cut and forms substrate 1, described substrate 1 is rectangle structure, also different shapes can be made into according to actual conditions during actual manufacture, and be processed to form location hole 1.1 and conductive hole 1.2 at the two ends of substrate 1 respectively, and location hole 1.1 is positioned at the outside (as shown in Figure 1) of conductive hole 1.2, it is shaping that whole process utilizes cutting mould once to cut, see Figure 23 ~ 25, described cutting mould includes cutting mould counterdie 11 and cutting mould patrix 12, described cutting mould counterdie 11 includes cutting mould lower mould bottom plate 11.1, described cutting mould lower mould bottom plate 11.1 is provided with cutting mould counterdie guide pillar 11.2 and cutting mould counterdie template 11.3, the template face of described cutting mould counterdie template 11.3 is the step surface be made up of cutting mould bottom punch tangent plane 11.3.1 and cutting mould counterdie joint face 11.3.2, described cutting mould bottom punch tangent plane 11.3.1 is lower than cutting mould counterdie joint face 11.3.2, the two ends, left and right of described cutting mould bottom punch tangent plane 11.3.1 are respectively arranged with two cutting mould counterdies punching 11.5, described cutting mould lower mould bottom plate 11.1 is provided with cutting mould counterdie guide vane end stop 11.4, described cutting mould counterdie guide vane end stop 11.4 is positioned at by cutting mould bottom punch tangent plane 11.3.1, described cutting mould patrix 12 includes baffle plate 12.1 on cutting mould, described cutting mould baffle plate 12.1 is provided with the cutting mould upper die guide sleeve 12.2 corresponding with cutting mould counterdie guide pillar 11.2, baffle plate 12.1 is provided with described cutting mould the cutting mould patrix template 12.3 corresponding with cutting mould counterdie template 11.3, and cutting mould patrix template 12.3 to be arranged on cutting mould on baffle plate 12.1 by cutting mould patrix elastic supporting member for supporting optical member 12.4, the template face of described cutting mould patrix template 12.3 is the step surface be made up of cutting mould upper punch tangent plane 12.3.1 and cutting mould patrix joint face 12.3.2, described cutting mould upper punch tangent plane 12.3.1 is higher than cutting mould patrix joint face 12.3.2, two ends and the cutting mould counterdie punching 11.5 opposite position place of described cutting mould upper punch tangent plane 12.3.1 are provided with cutting mould patrix drift 12.5, when cutting, cutting mould counterdie 11 is contained on press after being located by connecting mutually with cutting mould upper die guide sleeve 12.2 by cutting mould counterdie guide pillar 11.2 with cutting mould patrix 12, glass-fiber-plate is entered cutting mould bottom punch tangent plane 11.3.1 via cutting mould counterdie joint face 11.3.2, start press subsequently, cutting mould patrix 12 presses down, step surface is utilized to be cut off by glass-fiber-plate, and go out location hole 1.1 and conductive hole 1.2 on the substrate 1 by cutting mould patrix drift 12.5 simultaneously, finally, cutting mould patrix 12 under the drive of press on move, now, cutting mould patrix template 12.3 unloads sweeping away the defective material come time die-cut under the elastic force effect of cutting mould patrix elastic supporting member for supporting optical member 12.4,
Step 2, clean;
Surface cleaning is carried out to the substrate 1 that step 1 is formed;
Step 3, ink printing;
Electrically conductive ink printing is formed heater 2 on the substrate 1, screen printing technique or other mode of printings can be utilized, this heater 2 is on the substrate 1 in wire or planar, linear structure can be used in low-power applications field, in high-power field, planar structure can be used, during actual manufacture, can carry out selectivity manufacture according to the requirement of user, and the two ends of heater 2 are coated to conductive hole 1.2 place (as shown in Figure 2) at substrate 1 two ends respectively;
Step 4, solidification;
The substrate 1 being printed with heater 2 is put into baking oven or irradiation ultraviolet radiation, will the electrically conductive ink baking and curing of heater 2 be formed;
Step 5, subsides conducting strip;
Two pieces of back sides are attached to the conducting strip 3 of glue-line and are printed with on the substrate 1 of heater 2, and conducting strip 3 covers (as shown in Figure 3 and Figure 4) on conductive hole 1.2;
Step 6, add prepreg;
Prepreg 4 processes the through hole 4.1(that matches with conducting strip 3 shape size as shown in Figure 5), the shape size of prepreg 4 and the shape size of substrate 1 match, then being covered by prepreg 4 is printed with on the substrate 1 of heater 2, and conducting strip 3 is positioned at the through hole 4.1 (as shown in Figure 6 and Figure 7) of prepreg 4;
In this step, prepreg die cutting die is used to carry out punch forming;
Described prepreg die cutting die includes prepreg die cutting die patrix 15 and prepreg die cutting die counterdie 16, described prepreg die cutting die patrix 15 and prepreg die cutting die counterdie 16 include baffle plate 15.1 and prepreg die cutting die lower mould bottom plate 16.1 on prepreg die cutting die respectively, baffle plate 15.1 and prepreg die cutting die lower mould bottom plate 16.1 are separately installed with prepreg die cutting die patrix template 15.2 and prepreg die cutting die counterdie template 16.2 to described prepreg die cutting die, described prepreg die cutting die patrix template 15.2 to be arranged on prepreg die cutting die on baffle plate 15.1 by prepreg die cutting die patrix elastic supporting member for supporting optical member 15.5, in described prepreg die cutting die patrix template 15.2 and prepreg die cutting die counterdie template 16.2, correspondence is provided with prepreg die cutting die patrix drift 15.3 and prepreg die cutting die counterdie punching 16.3 respectively, on described prepreg die cutting die, in baffle plate 15.1 and prepreg die cutting die lower mould bottom plate 16.1, correspondence is provided with prepreg die cutting die upper die guide sleeve 15.4 and prepreg die cutting die counterdie guide pillar 16.4 respectively,
Time die-cut, die cutting die patrix 15 and prepreg die cutting die counterdie 16 are sleeved on press, prepreg 4 is placed in prepreg die cutting die counterdie template 16.2, start press, prepreg die cutting die patrix drift 15.3 punches out at prepreg 4 through hole 4.1 matched with conducting strip 3;
Step 7, cover another substrate 1;
The semi-finished product another substrate 1 being covered completing steps 6 form euthermic chip semi-finished product 5(as shown in Figure 8 and Figure 9);
Step 8, pressing;
Carry out temperature-pressure process to the euthermic chip semi-finished product 5 of completing steps 7, upper and lower two layers of substrate 1, heater 2 and conducting strip 3 are bonded together by the glue that melts that prepreg 4 is produced;
In this step, operate by pressing mold, see Figure 32 ~ 34, described pressing mold includes pressing mold patrix 17 and pressing mold counterdie 18, and described pressing mold patrix 17 and pressing mold counterdie 18 respectively correspondence are provided with pressing mold patrix guide hole 17.1 and pressing mold counterdie guide pillar 18.1;
During use, euthermic chip semi-finished product 5 utilize location hole 1.1 to be enclosed within pressing mold counterdie 18, so also on euthermic chip semi-finished product 5, pad a release liners, at covering euthermic chip semi-finished product 5, the euthermic chip semi-finished product 5 of suitable quantity can be selected according to the situation of reality, all be encased inside release liners between adjacent euthermic chip semi-finished product 5, finally again pressing mold patrix 17 loaded onto, this mould is sent into hot press and carries out temperature-pressure process;
Step 9, die-cut;
After completing steps 8, euthermic chip 6(to be cut can be obtained after cooling as shown in Figure 10, in figure, dash area represents the part that will cut away), because prepreg 4 melts glue and spills on the edge of euthermic chip 6 to be cut heating and have part in pressure process, in order to the consistent and overall appearance of overall dimension, being cut away together with location hole 1.1 on four limits of euthermic chip 6 to be cut (cuts in process in step 1, the size of substrate 1 is greater than final euthermic chip to be cut 6, location hole 1.1 only plays the role of positioning in a manufacturing process, location hole 1.1 is not had) in finished product, and on euthermic chip 6 to be cut, utilize press to go out four installing holes 1.3, during actual manufacture, the installing hole 1.3 of suitable quantity can be gone out according to the actual requirements, and while rushing installing hole 1.3, conducting strip 3 goes out flanging bore by flange drift, the flange of this flanging bore is positioned at conductive hole 1.2, thus obtain euthermic chip 101(as is illustrated by figs. 11 and 12),
Die cutting die one-step punching is adopted to complete in above-mentioned steps,
See Figure 26 ~ 28, described die cutting die includes die cutting die patrix 13 and die cutting die counterdie 14, described die cutting die patrix 13 includes baffle plate 13.1 on die cutting die, described die cutting die baffle plate 13.1 is provided with die cutting die patrix template 13.2 and die cutting die upper die guide sleeve 13.4, described die cutting die patrix template 13.2 is provided with die cutting die patrix boss 13.3, described die cutting die patrix boss 13.3 is provided with die cutting die patrix punching 13.5, described die cutting die counterdie 14 includes die cutting die lower mould bottom plate 14.1, described die cutting die lower mould bottom plate 14.1 is provided with die cutting die counterdie template 14.2, described die cutting die counterdie template 14.2 is connected in die cutting die lower mould bottom plate 14.1 by die cutting die counterdie elastic supporting member for supporting optical member 14.5, described die cutting die lower mould bottom plate 14.1 is provided with the die cutting die counterdie guide pillar 14.4 of coupling corresponding with die cutting die upper die guide sleeve 13.4, described die cutting die counterdie template 14.2 is provided with the die cutting die counterdie concave surface 14.3 corresponding with die cutting die patrix boss 13.3, described die cutting die counterdie concave surface 14.3 is provided with the die cutting die counterdie drift 14.6 matched with die cutting die patrix punching 13.5 and die cutting die counterdie flange drift 14.7, die cutting die counterdie drift 14.6 is for die-cut installing hole 1.3, die cutting die counterdie flange drift 14.7 is for going out flange (as shown in figure 35) by conducting strip 3 at conductive hole 1.2 place,
During use, die cutting die patrix 13 and die cutting die counterdie 14 are installed on corresponding press, then euthermic chip 6 to be cut is positioned on the die cutting die counterdie concave surface 14.3 of die cutting die counterdie template 14.2, start press, the die-cut place of cooperation of die cutting die patrix boss 13.3 and die cutting die counterdie concave surface 14.3 is utilized to need the euthermic chip of size, meanwhile, common drift goes out installing hole 1.3 on euthermic chip 6 to be cut, and flange drift goes out flange on conducting strip 3;
Prepared by step 10, fin;
The width of fin 7 is consistent with the width of euthermic chip 101, the length of fin 7 is less than the length of euthermic chip 101, fin 7 is in ladder wave structure or wavelike structure, the die-cut connecting hole 7.1 having population size and installing hole 1.3 to match on fin 7, and connecting hole 7.1 has turnup structure (as Figure 13 and Figure 14);
Step 11, superposition;
By multiple euthermic chip 101 and the spaced superposition of fin 7, connecting hole 7.1 flange of fin 7 inserts in the installing hole 1.3 of the substrate 1 forming euthermic chip 101, (as Figure 15 and Figure 16);
Step 12, poling;
Inserted by contact tube 8 in the flanging bore of the conducting strip 3 forming euthermic chip 101, tube connector 9 inserts in the installing hole 1.3 of the substrate 1 forming euthermic chip 101 and the connecting hole 7.1 of fin 7 (as shown in figure 17); Tube connector 9 in this step can be arranged side by side many (as shown in Figure 20 and Figure 21), is connected tightness with reinforced company's adapter 9 with substrate 1 and fin 7;
Step 13: tube;
Utilize pipe expanding machine to carry out tube operation to contact tube 8 and tube connector 9, contact tube 8 is closely connected with conducting strip 3, and tube connector 9 is closely connected with fin 7 with substrate 1; Namely the heating module 102 obtained after completing this step;
Step 14, fastening;
For strengthening bulk strength, at the two ends up and down of heating module 102, backing plate 10.1 can be installed respectively after completing steps 13, this installation backing plate 10.1 be provided with the through hole passed for contact tube 8 and tube connector 9; C-type steel 10.2(is installed respectively see Figure 18 and Figure 19 in this half-finished left and right sides subsequently) or intercell connector 10.3(is welded as shown in figure 22 between upper and lower two pieces of installation backing plates 10.1).