CN103158320B - The pressing mold of Far infrared electric heating air conditioner euthermic chip and compression method thereof - Google Patents
The pressing mold of Far infrared electric heating air conditioner euthermic chip and compression method thereof Download PDFInfo
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- CN103158320B CN103158320B CN201110413554.0A CN201110413554A CN103158320B CN 103158320 B CN103158320 B CN 103158320B CN 201110413554 A CN201110413554 A CN 201110413554A CN 103158320 B CN103158320 B CN 103158320B
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- euthermic chip
- counterdie
- patrix
- pressing mold
- air conditioner
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Abstract
The present invention relates to a kind of pressing mold of Far infrared electric heating air conditioner euthermic chip, described mould includes patrix (1) and counterdie (2), and described patrix (1) and counterdie (2) respectively correspondence are provided with patrix guide hole (2) and counterdie guide pillar (2); The compression method of described pressing mold is: in pressing process, euthermic chip is enclosed within counterdie (2), then on euthermic chip, a release liners is padded, cover an euthermic chip again, euthermic chip can load multi-disc, and be all encased inside release liners between adjacent euthermic chip, finally again patrix (1) is put, then this mould feeding hot press is carried out temperature-pressure process.The pressing mold of Far infrared electric heating air conditioner euthermic chip of the present invention, efficiency is high and pressing sealing effectiveness is better.
Description
Technical field
The present invention relates to a kind of pressing mold, especially relate to a kind of pressing mold be applied on Far infrared electric heating air conditioner euthermic chip, belong to air-conditioning processing technique field.
Background technology
At present, people generally need using air-condition to carry out heating to heating in room in winter, especially at northern area, every household needs to pass into heating installation with resisting cold, and the expense of annual each household flower in heating is just up to thousands of unit, and heating installation uses coal heating produces steam in addition, use fossil fuel not only contaminated environment, be unfavorable for energy-conserving and environment-protective, and in the transmitting procedure of heating installation, easily produce more loss.Be developed miscellaneous heating mode, wherein, Far-infrared Heating mode not only has heating function because of it for this reason, and has physical therapy efficacy and receive the extensive concern of people; But, conventional Far-infrared Heating structure forms euthermic chip for being simply coated on substrate by electrically conductive ink, and be applied to individual physiotherapy more and be not implanted to field of air conditioning, Far-infrared Heating structure in the fabrication process more simultaneously adopts manual operation, especially for being coated with in the seal process of euthermic chip of electrically conductive ink, the substrate being coated with electrically conductive ink carries out seal operation after needing to add another substrate, substrate is directly put into hot press and is carried out seal operation by usual people, and efficiency is low and effect is poor.
Summary of the invention
The object of the invention is to overcome above-mentioned deficiency, provide a kind of efficiency high and the pressing mold of the good Far infrared electric heating air conditioner euthermic chip of pressing sealing effectiveness.
The object of the present invention is achieved like this: a kind of pressing mold of Far infrared electric heating air conditioner euthermic chip, and described mould includes upper die and lower die, and described upper die and lower die respectively correspondence are provided with patrix guide hole and counterdie guide pillar.
The compression method of a kind of pressing mold as claimed in claim 1, in pressing process, euthermic chip is enclosed within counterdie, then on euthermic chip, a release liners is padded, cover an euthermic chip again, euthermic chip can load multi-disc, and is all encased inside release liners between adjacent euthermic chip, last again by Upper Die-sleeve, then this mould feeding hot press is carried out temperature-pressure process.
Compared with prior art, the invention has the beneficial effects as follows:
The present invention adopts mould to operate, and compared to traditional manual mode of operation, processes more quick, and owing to adopting Mould Machining, compared to traditional Artificial Control, control more accurate, thus the yields of product is higher, and uniformity is better; Multi-disc euthermic chip can be suppressed successively simultaneously, substantially increase working (machining) efficiency.
Accompanying drawing explanation
Fig. 1 is the upper die structure schematic diagram of the pressing mold of Far infrared electric heating air conditioner euthermic chip of the present invention.
Fig. 2 is the lower die structure schematic diagram of the pressing mold of Far infrared electric heating air conditioner euthermic chip of the present invention.
Fig. 3 is the top view of pressing mold Fig. 2 of Far infrared electric heating air conditioner euthermic chip of the present invention.
Wherein:
Patrix 1, counterdie 2;
Patrix guide hole 1.1, counterdie guide pillar 2.1.
Detailed description of the invention
See Fig. 1 ~ 3, the pressing mold of a kind of Far infrared electric heating air conditioner euthermic chip that the present invention relates to, described mould includes patrix 1 and counterdie 2, and described patrix 1 and counterdie 2 respectively correspondence are provided with patrix guide hole 2 and counterdie guide pillar 2;
During use, euthermic chip is enclosed within counterdie 2, then on euthermic chip, a release liners is padded, at covering euthermic chip, the euthermic chip of suitable quantity can be selected according to the situation of reality, all be encased inside release liners between adjacent euthermic chip, finally again patrix 1 loaded onto, this mould is sent into hot press and carries out temperature-pressure process.
Claims (1)
1. the compression method of the pressing mold of a Far infrared electric heating air conditioner euthermic chip, it is characterized in that: described mould includes patrix (1) and counterdie (2), described patrix (1) and counterdie (2) respectively correspondence are provided with patrix guide hole (2) and counterdie guide pillar (2);
In pressing process, euthermic chip is enclosed within counterdie (2), then on euthermic chip, a release liners is padded, cover an euthermic chip again, euthermic chip can load multi-disc, and be all encased inside release liners between adjacent euthermic chip, finally again patrix (1) is put, then this mould feeding hot press is carried out temperature-pressure process.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110413554.0A CN103158320B (en) | 2011-12-10 | 2011-12-10 | The pressing mold of Far infrared electric heating air conditioner euthermic chip and compression method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110413554.0A CN103158320B (en) | 2011-12-10 | 2011-12-10 | The pressing mold of Far infrared electric heating air conditioner euthermic chip and compression method thereof |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103158320A CN103158320A (en) | 2013-06-19 |
| CN103158320B true CN103158320B (en) | 2015-12-16 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110413554.0A Active CN103158320B (en) | 2011-12-10 | 2011-12-10 | The pressing mold of Far infrared electric heating air conditioner euthermic chip and compression method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN103158320B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110405886B (en) * | 2019-07-29 | 2021-09-07 | 江西美兴门业有限公司 | Mold pressing door manufacturing equipment based on photoelectric effect principle |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2151849Y (en) * | 1992-12-18 | 1994-01-05 | 中外合资连云港景强新材料有限公司 | Multi-layer U-shaped profile pressing die |
| CN201399848Y (en) * | 2009-04-28 | 2010-02-10 | 深圳市东方亮彩精密技术有限公司 | Hot-melt decoration jig structure |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05343847A (en) * | 1992-06-05 | 1993-12-24 | Hitachi Ltd | Manufacture of multilayer printed wiring board |
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2011
- 2011-12-10 CN CN201110413554.0A patent/CN103158320B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2151849Y (en) * | 1992-12-18 | 1994-01-05 | 中外合资连云港景强新材料有限公司 | Multi-layer U-shaped profile pressing die |
| CN201399848Y (en) * | 2009-04-28 | 2010-02-10 | 深圳市东方亮彩精密技术有限公司 | Hot-melt decoration jig structure |
Also Published As
| Publication number | Publication date |
|---|---|
| CN103158320A (en) | 2013-06-19 |
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Effective date of registration: 20160530 Address after: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Jiangyin Province Patentee after: Jiangyin Wenchang Intelligent Electromechanical Research Institution Co.,Ltd. Address before: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Wuxi province Jiangyin City Patentee before: Jiangyin Linken Technology Co.,Ltd. |
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Effective date of registration: 20230630 Address after: No. 997, Huicheng Avenue, Huishan District, Wuxi City, Jiangsu Province, 214181 Patentee after: Yilufa Intelligent Technology (Jiangsu) Co.,Ltd. Address before: No. 98, Zhuhuang Road, Zhutang Town, Jiangyin City, Jiangsu Province, 214415 Patentee before: Jiangyin Wenchang Intelligent Electromechanical Research Institution Co.,Ltd. |