CN103167649A - Sealing craft of far infrared electric heating air conditioner heating chip - Google Patents
Sealing craft of far infrared electric heating air conditioner heating chip Download PDFInfo
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- CN103167649A CN103167649A CN2011104135555A CN201110413555A CN103167649A CN 103167649 A CN103167649 A CN 103167649A CN 2011104135555 A CN2011104135555 A CN 2011104135555A CN 201110413555 A CN201110413555 A CN 201110413555A CN 103167649 A CN103167649 A CN 103167649A
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- air conditioner
- far infrared
- infrared electric
- electric heating
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Abstract
The invention relates to a sealing craft of a far infrared electric heating air conditioner heating chip. The heating chip comprises two substrates (1) which serve as an upper surface layer and a lower surface layer. When sealing operations are conducted, prepreg is arranged between the two substrates (1) in a clamping mode, and then pressure and temperature are increased so that melted glue is generated by the prepreg, and an adhesion layer (4) is formed so that the two substrates (1) are bonded together. The sealing craft of the far infrared electric heating air conditioner heating chip has the advantage of being good in sealing effect.
Description
Technical field
The present invention relates to a kind of sealing technology, especially relate to a kind of sealing technology of Far infrared electric heating air conditioner euthermic chip, belong to the air-conditioning processing technique field.
Background technology
At present, people generally need to use air-conditioning to heat in carrying out the room in winter to heat, especially at northern area, the every household need to pass into heating installation with resisting cold, and the expense of annual each household flower in heating is just up to thousands of units, and heating installation is to use the coal heating to produce steam in addition, use not only contaminated environment of fossil fuel, be unfavorable for energy-conserving and environment-protective, and in the transmitting procedure of heating installation, easily produce more loss.People have developed miscellaneous heating mode for this reason, and wherein, the Far-infrared Heating mode not only has heating function because of it, and have physical therapy efficacy and be subject to people's extensive concern; But, conventional Far-infrared Heating structure consists of euthermic chip for electrically conductive ink simply is coated on substrate, and be applied to individual physiotherapy more and be not implanted to field of air conditioning, Far-infrared Heating structure many employing manual operations in manufacture process simultaneously, especially in the seal process for the euthermic chip that is coated with electrically conductive ink, after need to adding another substrate, the substrate that is coated with electrically conductive ink carries out seal operation, common people directly apply glue-line and seal between two substrates, thereby cause sealing effectiveness relatively poor.
Summary of the invention
The object of the invention is to overcome above-mentioned deficiency, a kind of sealing technology of Far infrared electric heating air conditioner euthermic chip of good sealing effect is provided.
The object of the present invention is achieved like this: a kind of sealing technology of Far infrared electric heating air conditioner euthermic chip, euthermic chip includes two substrates as upper epidermis and lower top layer, when carrying out seal operation, first prepreg is folded between two substrates, then Pressurized-heated, make the prepreg generation melt glue formation adhering layer two substrates be bonded together.
The sealing technology of Far infrared electric heating air conditioner euthermic chip of the present invention, before adding prepreg, two conducting strips that added the electrode effect between two substrates, coated with conductive ink lay on the upper surface of the substrate on lower top layer simultaneously, and above-mentioned conducting strip covers on conductive ink layer.
Compared with prior art, the invention has the beneficial effects as follows:
The present invention heats prepreg and forms adhering layer after pressurization and seal, and not only simplify and facilitated operation, and than the mode of gluing, whole adhering layer is more even, thereby not only is connected firmly, good sealing effect, and the surface of euthermic chip is more smooth, has improved the appearance property of product.
Description of drawings
Fig. 1 is the structural representation of Far infrared electric heating air conditioner euthermic chip of the present invention.
Fig. 2 is Far infrared electric heating air conditioner euthermic chip Fig. 1's of the present invention
Partial enlarged drawing.
Fig. 3 is the structural representation after the printing conductive inks layer (dash area in figure namely represents the shape of conductive ink layer) on substrate in Far infrared electric heating air conditioner euthermic chip of the present invention.
Wherein:
Conductive hole 1.1, installing hole 1.2.
Embodiment
referring to Fig. 1 ~ 3, the sealing technology of a kind of Far infrared electric heating air conditioner euthermic chip that the present invention relates to, wherein, euthermic chip includes two substrates 1 as upper epidermis and lower top layer, and be arranged at two conducting strips 3 that play the electrode effect between two substrates 1, be coated with conductive ink layer 2(as shown in Figure 3 on upper surface as the substrate 1 on lower top layer), described conductive ink layer 2 can be arranged to linear structure or planar structure according to demand, linear structure is applied under the small-power state, planar structure applications is under high-power state, above-mentioned conducting strip 3 covers on conductive ink layer 2, be provided with the conductive hole 1.1 that runs through conductive ink layer 2 and conducting strip 3 on described euthermic chip, and conducting strip 3 is provided with downward flange (as depicted in figs. 1 and 2) at conductive hole 1.1 places, also be provided with a plurality of installing holes 1.2 on described euthermic chip, when carrying out seal operation, first prepreg is folded between two substrates 1, Pressurized-heated then makes prepreg produce to melt glue to form adhering layer 4 two substrates 1 and conducting strip 3 and conductive ink layer 2 is bonded together.
Claims (2)
1. the sealing technology of a Far infrared electric heating air conditioner euthermic chip, it is characterized in that: euthermic chip includes two substrates (1) as upper epidermis and lower top layer, when carrying out seal operation, first prepreg is folded between two substrates (1), then Pressurized-heated, make the prepreg generation melt glue formation adhering layer (4) two substrates (1) be bonded together.
2. a kind of sealing technology of Far infrared electric heating air conditioner euthermic chip as claimed in claim 1, it is characterized in that: before adding prepreg, two conducting strips (3) that added the electrode effect between two substrates (1), while is coated with conductive ink lay (2) on the upper surface of the substrate (1) on lower top layer, and above-mentioned conducting strip (3) covers on conductive ink layer (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110413555.5A CN103167649B (en) | 2011-12-10 | 2011-12-10 | The sealing technology of Far infrared electric heating air conditioner euthermic chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201110413555.5A CN103167649B (en) | 2011-12-10 | 2011-12-10 | The sealing technology of Far infrared electric heating air conditioner euthermic chip |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN103167649A true CN103167649A (en) | 2013-06-19 |
| CN103167649B CN103167649B (en) | 2015-10-28 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201110413555.5A Active CN103167649B (en) | 2011-12-10 | 2011-12-10 | The sealing technology of Far infrared electric heating air conditioner euthermic chip |
Country Status (1)
| Country | Link |
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| CN (1) | CN103167649B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105561480A (en) * | 2015-01-28 | 2016-05-11 | 陆文昌 | Multifunctional far infrared health nursing machine and nursing method thereof |
| CN110769527A (en) * | 2019-09-12 | 2020-02-07 | 宁波科诺佳新材料有限公司 | Organic high-temperature electric heating composite film and preparation method thereof |
Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN2134033Y (en) * | 1992-06-16 | 1993-05-19 | 南开大学 | High heat elimination printed circuit board |
| JPH05291318A (en) * | 1992-04-07 | 1993-11-05 | Toshiba Corp | Resin sealing-type semiconductor device |
| CN1132931A (en) * | 1994-12-30 | 1996-10-09 | 卡西欧计算机公司 | Method of connecting terminals of one electronic part to terminals of another electronic part |
| CN1386045A (en) * | 2001-05-01 | 2002-12-18 | 日东电工株式会社 | Wiring board and making method thereof |
| CN101202252A (en) * | 2006-12-12 | 2008-06-18 | 华泰电子股份有限公司 | Glue film and chip encapsulation manufacture process using the glue film |
| CN101418205A (en) * | 2008-12-10 | 2009-04-29 | 华烁科技股份有限公司 | Halogen-free flameproof adhesive and application thereof in prepreg and multiple layer printed plate aspect |
| CN102039701A (en) * | 2009-10-19 | 2011-05-04 | 台光电子材料股份有限公司 | Prepreg and metal foil substrate |
| CN201997002U (en) * | 2010-12-22 | 2011-10-05 | 江阴市霖肯科技有限公司 | Far infrared physiotherapy chip convenient for injection molding |
| CN201996994U (en) * | 2010-12-22 | 2011-10-05 | 江阴市霖肯科技有限公司 | Far infrared chip assembly of electro-thermal physiotherapy instrument |
-
2011
- 2011-12-10 CN CN201110413555.5A patent/CN103167649B/en active Active
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH05291318A (en) * | 1992-04-07 | 1993-11-05 | Toshiba Corp | Resin sealing-type semiconductor device |
| CN2134033Y (en) * | 1992-06-16 | 1993-05-19 | 南开大学 | High heat elimination printed circuit board |
| CN1132931A (en) * | 1994-12-30 | 1996-10-09 | 卡西欧计算机公司 | Method of connecting terminals of one electronic part to terminals of another electronic part |
| CN1386045A (en) * | 2001-05-01 | 2002-12-18 | 日东电工株式会社 | Wiring board and making method thereof |
| CN101202252A (en) * | 2006-12-12 | 2008-06-18 | 华泰电子股份有限公司 | Glue film and chip encapsulation manufacture process using the glue film |
| CN101418205A (en) * | 2008-12-10 | 2009-04-29 | 华烁科技股份有限公司 | Halogen-free flameproof adhesive and application thereof in prepreg and multiple layer printed plate aspect |
| CN102039701A (en) * | 2009-10-19 | 2011-05-04 | 台光电子材料股份有限公司 | Prepreg and metal foil substrate |
| CN201997002U (en) * | 2010-12-22 | 2011-10-05 | 江阴市霖肯科技有限公司 | Far infrared physiotherapy chip convenient for injection molding |
| CN201996994U (en) * | 2010-12-22 | 2011-10-05 | 江阴市霖肯科技有限公司 | Far infrared chip assembly of electro-thermal physiotherapy instrument |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105561480A (en) * | 2015-01-28 | 2016-05-11 | 陆文昌 | Multifunctional far infrared health nursing machine and nursing method thereof |
| CN110769527A (en) * | 2019-09-12 | 2020-02-07 | 宁波科诺佳新材料有限公司 | Organic high-temperature electric heating composite film and preparation method thereof |
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| Publication number | Publication date |
|---|---|
| CN103167649B (en) | 2015-10-28 |
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Effective date of registration: 20160531 Address after: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Jiangyin Province Patentee after: Jiangyin Wenchang Intelligent Electromechanical Research Institution Co.,Ltd. Address before: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Wuxi province Jiangyin City Patentee before: Jiangyin Linken Technology Co.,Ltd. |
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Effective date of registration: 20230628 Address after: No. 997, Huicheng Avenue, Huishan District, Wuxi City, Jiangsu Province, 214181 Patentee after: Yilufa Intelligent Technology (Jiangsu) Co.,Ltd. Address before: No. 98, Zhuhuang Road, Zhutang Town, Jiangyin City, Jiangsu Province, 214415 Patentee before: Jiangyin Wenchang Intelligent Electromechanical Research Institution Co.,Ltd. |
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