CN202036694U - Sealed far infrared physiotherapy chip capable of being fixed easily during injection molding - Google Patents
Sealed far infrared physiotherapy chip capable of being fixed easily during injection molding Download PDFInfo
- Publication number
- CN202036694U CN202036694U CN2011200594285U CN201120059428U CN202036694U CN 202036694 U CN202036694 U CN 202036694U CN 2011200594285 U CN2011200594285 U CN 2011200594285U CN 201120059428 U CN201120059428 U CN 201120059428U CN 202036694 U CN202036694 U CN 202036694U
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Abstract
The utility model discloses a sealed far infrared physiotherapy chip capable of being fixed easily during injection molding, which is characterized in that the physiotherapy chip comprises a far infrared chip and a conducting wire (7), the far infrared chip comprises a six-layer structure which sequentially consists of an upper surface layer (1), a first adhesive layer (2), a polyethylene terephthalate (PET) protective film layer (3), a far infrared substrate (4), a second adhesive layer (5) and a lower surface layer (6) from the top to the bottom, and a rubber edge (8) is arranged around the far infrared chip; and positioning holes (10) are arranged on the rubber edge (8) on one side on which the far infrared chip is connected with the conducting wire. The sealed far infrared physiotherapy chip has the advantages that the chip can be fixed easily during injection molding, the position of the chip is defined, the situations of displacement and curling can be avoided, the rate of injection-molded finished products reaches more than 98 percent and material cost and production cost are greatly reduced.
Description
Technical field
This utility model relates to a kind of human body physical therapy medical apparatus and instruments, relates in particular to a kind of easy fixed sealing far-infrared physiotherapy chip during with injection moulding.
Background technology
From Germany scientist in 1800 breathe out inferior found infrared ray during at the research solar spectrum since, the infrared ray correlation technique has been widely used in commercial production, on medical diagnosis, detection, treatment and the prevention and health care.
According to biology characteristics medical infrared ray can be divided near infrared ray, middle infrared (Mid-IR) and far infrared.Far infrared is meant the infrared ray of wavelength at the 3-1000 micron, the infrared ray of this wave band of its medium wavelength 4-20 micron is very important with biological growth to human existence, far infrared three key properties that effect mainly contains far infrared to human body determine (the one, radiation, the 2nd, intensive penetration, the 3rd, absorption, resonance and sympathetic response).Human body surface is accepted far infrared, and from outward appearance to inner essence conduction infiltration, is absorbed the generation thermogenetic effect, produces resonance, sympathetic response with the in-vivo tissue cell, has promoted activity.And owing to produce thermogenetic effect, make the human microvascular expansion, self-disciplining is strengthened, and blood circulation is accelerated, and has quickened the mass exchange of cell and blood, thereby has promoted the metabolism of body.Simultaneously, far infrared improves cytophagous phagocytic activity, helps absorption, the dissipation of chronic inflammatory disease, is applicable to the various types of chronic inflammatory diseases of treatment, as some chronic inflammatory diseases of neuritis, myositis, arthritis and internal organs.Heat energy can reduce sensorineural irritability, and by relieve muscle spasms, detumescence, antiinflammatory with improve blood circulation and treat various pain, as neuralgia and Crampy Pain, struvite and avascular pain etc.Therefore, medically be called " life light wave " by the expert.
The health-care physiotherapeutic product that infrared ray is relevant on the market is varied, Herba Apocyni veneti be the textile product of representative because of its no thermal source effect, the intensity and the persistence of the far infrared of its generation are under suspicion; Employed far infrared therapeutic apparatus in the medical treatment, because of its temperature height, the alternating current energy supply is unfavorable for convenient the use.And its volume is big, weight is heavier, needs, could use as hospital to specific place, has limited its scope of application.And the far infrared chip sealing of conventional far infrared instrument for physiotherapy is poor, it is insecure to bond, fragile, the chip periphery sealed mould processing and can address this problem, but envelope is moulded in the process, and the far infrared chip easily is shifted, curls, and injection moulding is that yield rate is low, be about 30% only, cause material and production cost high.
Summary of the invention
At the problems referred to above, the purpose of this utility model is to provide a kind of volume little, in light weight, can carry, and chip is difficult for displacement, curls during injection moulding, injection-molded finished rate height, material and production cost low, be easy to fixed sealing far-infrared physiotherapy chip.
In order to achieve the above object, the technical solution of the utility model is as follows: a kind of when the injection moulding easy fixed sealing far-infrared physiotherapy chip, this physical therapy chip comprises far infrared chip and lead, described far infrared chip comprises six layers of structure, be followed successively by upper epidermis, first adhesive layer, PET protective film, far infrared substrate, second adhesive layer and following top layer from top to bottom, the periphery of described far infrared chip is provided with the glue limit; The glue limit of the side that described far infrared chip is connected with lead is provided with locating hole.
Described far infrared substrate comprises the PET substrate, the close upper and lower both sides of described PET substrate surface edge is provided with two conductive silver paste coatings, described PET substrate middle part is coated with the electrically conductive ink coating, the edge, upper and lower both sides of described electrically conductive ink coating overlaps with two conductive silver paste coatings respectively, and described two conductive silver paste coatings are covered with bus outward; Described two bus link to each other with two lead-in wires of lead respectively.
Described far infrared chip edge and lead junction are protruded and are provided with gum cover, and described gum cover is coated on outside the lead, and described gum cover is provided with locating hole.
Locating hole on the described glue limit is four.
Locating hole on the described gum cover is two.
Its volume of this utility model is little, and is in light weight, can carry, and do not influence daily life.During injection moulding, be easy to fix, chip position is determined, can not produce displacement and curling phenomenon, and injection-molded finished rate greatly reduces material and production cost up to more than 98%.
Description of drawings
Fig. 1 is this utility model front view;
Fig. 2 is a structural representation of the present utility model;
Fig. 3 is a far infrared substrate structure sketch map.
Wherein:
Upper epidermis 1, first adhesive layer 2, PET protective film 3, far infrared substrate 4, second adhesive layer 5, following top layer 6, lead 7, glue limit 8, gum cover 9, locating hole 10;
PET substrate 4.1, conductive silver paste coating 4.2, electrically conductive ink coating 4.3, bus 4.4, clear area 4.5.
The specific embodiment:
Easy fixed sealing far-infrared physiotherapy chip is further described during in conjunction with the accompanying drawings to injection moulding:
Easy fixed sealing far-infrared physiotherapy chip during this utility model injection moulding, this physical therapy chip comprises far infrared chip and lead 7, described far infrared chip comprises six layers of structure, be followed successively by upper epidermis 1, first adhesive layer 2, PET protective film 3, far infrared substrate 4, second adhesive layer 5 and following top layer 6 from top to bottom, the periphery of described far infrared chip is provided with glue limit 8;
Described far infrared substrate 4 comprises PET substrate 4.1, described PET substrate 4.1 surfaces close upper and lower both sides edge is provided with two conductive silver paste coatings 4.2, described PET substrate 4.1 middle parts are coated with electrically conductive ink coating 4.3, the edge, upper and lower both sides of described electrically conductive ink coating 4.3 overlaps with two conductive silver paste coatings 4.2 respectively, be covered with bus 4.4 outside described two conductive silver paste coatings 4.2, described two bus 4.4 link to each other with two lead-in wires of lead respectively; Described far infrared chip is connected a side with lead glue limit 8 is provided with locating hole 10.
Described far infrared chip edge and lead 7 junctions are protruded and are provided with gum cover 9, and described gum cover 9 is coated on outside the lead 7, and described gum cover 9 is provided with locating hole 10.
Locating hole on the described glue limit 8 is four.
Locating hole on the described gum cover 9 is two.
Described upper epidermis 1 and following top layer 6 are preferably linen for containing the flaxen fiber layer of cloth.
Claims (5)
1. easy fixed sealing far-infrared physiotherapy chip during an injection moulding, it is characterized in that: this physical therapy chip comprises far infrared chip and lead (7), described far infrared chip comprises six layers of structure, be followed successively by upper epidermis (1), first adhesive layer (2), PET protective film (3), far infrared substrate (4), second adhesive layer (5) and following top layer (6) from top to bottom, the periphery of described far infrared chip is provided with glue limit (8); The glue limit (8) of the side that described far infrared chip is connected with lead is provided with locating hole (10).
2. easy fixed sealing far-infrared physiotherapy chip during a kind of injection moulding according to claim 1, it is characterized in that: described far infrared substrate (4) comprises PET substrate (4.1), described PET substrate (4.1) surface close upper and lower both sides edge is provided with two conductive silver paste coatings (4.2), described PET substrate (4.1) middle part is coated with electrically conductive ink coating (4.3), the edge, upper and lower both sides of described electrically conductive ink coating (4.3) overlaps with two conductive silver paste coatings (4.2) respectively, the outer bus (4.4) that is covered with of described two conductive silver paste coatings (4.2); Described two bus (4.4) link to each other with two lead-in wires of lead respectively.
3. easy fixed sealing far-infrared physiotherapy chip during a kind of injection moulding according to claim 2, it is characterized in that: described far infrared chip edge and lead (7) junction are protruded and are provided with gum cover (9), described gum cover (9) is coated on outside the lead (7), and described gum cover (9) is provided with locating hole.
4. easy fixed sealing far-infrared physiotherapy chip during a kind of injection moulding according to claim 2, it is characterized in that: the locating hole on the described glue limit (8) is four.
5. easy fixed sealing far-infrared physiotherapy chip during a kind of injection moulding according to claim 3, it is characterized in that: the locating hole on the described gum cover (9) is two.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011200594285U CN202036694U (en) | 2010-12-22 | 2011-03-09 | Sealed far infrared physiotherapy chip capable of being fixed easily during injection molding |
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201010599454.7 | 2010-12-22 | ||
CN2010105994547A CN102000395A (en) | 2010-12-22 | 2010-12-22 | Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof |
CN2011200594285U CN202036694U (en) | 2010-12-22 | 2011-03-09 | Sealed far infrared physiotherapy chip capable of being fixed easily during injection molding |
Publications (1)
Publication Number | Publication Date |
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CN202036694U true CN202036694U (en) | 2011-11-16 |
Family
ID=43808256
Family Applications (10)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010105994547A Pending CN102000395A (en) | 2010-12-22 | 2010-12-22 | Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof |
CN2011200594586U Expired - Fee Related CN201996995U (en) | 2010-12-22 | 2011-03-09 | Far infrared substrate of electric heating physiotherapy instrument |
CN2011200594618U Expired - Lifetime CN202036695U (en) | 2010-12-22 | 2011-03-09 | Far infrared electric heating physiotherapy chip |
CN2011200594105U Expired - Fee Related CN202036693U (en) | 2010-12-22 | 2011-03-09 | Heat insulation nano far infrared electric heating physiotherapy chip |
CN2011200594285U Expired - Fee Related CN202036694U (en) | 2010-12-22 | 2011-03-09 | Sealed far infrared physiotherapy chip capable of being fixed easily during injection molding |
CN2011200594073U Expired - Fee Related CN202036692U (en) | 2010-12-22 | 2011-03-09 | Firmly connected far-infrared chip |
CN2011200593583U Expired - Fee Related CN201996992U (en) | 2010-12-22 | 2011-03-09 | Portable far infrared electro-thermal physical therapy chip component |
CN2011100554738A Expired - Fee Related CN102114308B (en) | 2010-12-22 | 2011-03-09 | Far infrared electric heating physical therapy chip and preparation method thereof |
CN2011200594270U Expired - Fee Related CN201996993U (en) | 2010-12-22 | 2011-03-09 | Water-proof far infrared chip |
CN2011200594567U Expired - Fee Related CN201996994U (en) | 2010-12-22 | 2011-03-09 | Far infrared chip assembly of electro-thermal physiotherapy instrument |
Family Applications Before (4)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010105994547A Pending CN102000395A (en) | 2010-12-22 | 2010-12-22 | Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof |
CN2011200594586U Expired - Fee Related CN201996995U (en) | 2010-12-22 | 2011-03-09 | Far infrared substrate of electric heating physiotherapy instrument |
CN2011200594618U Expired - Lifetime CN202036695U (en) | 2010-12-22 | 2011-03-09 | Far infrared electric heating physiotherapy chip |
CN2011200594105U Expired - Fee Related CN202036693U (en) | 2010-12-22 | 2011-03-09 | Heat insulation nano far infrared electric heating physiotherapy chip |
Family Applications After (5)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2011200594073U Expired - Fee Related CN202036692U (en) | 2010-12-22 | 2011-03-09 | Firmly connected far-infrared chip |
CN2011200593583U Expired - Fee Related CN201996992U (en) | 2010-12-22 | 2011-03-09 | Portable far infrared electro-thermal physical therapy chip component |
CN2011100554738A Expired - Fee Related CN102114308B (en) | 2010-12-22 | 2011-03-09 | Far infrared electric heating physical therapy chip and preparation method thereof |
CN2011200594270U Expired - Fee Related CN201996993U (en) | 2010-12-22 | 2011-03-09 | Water-proof far infrared chip |
CN2011200594567U Expired - Fee Related CN201996994U (en) | 2010-12-22 | 2011-03-09 | Far infrared chip assembly of electro-thermal physiotherapy instrument |
Country Status (1)
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CN (10) | CN102000395A (en) |
Families Citing this family (7)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102000395A (en) * | 2010-12-22 | 2011-04-06 | 江苏省江阴市霖肯科技有限公司 | Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof |
CN103162396A (en) * | 2011-12-10 | 2013-06-19 | 江阴市霖肯科技有限公司 | Connecting and fixing craft of far infrared electric heating air conditioner heating module |
CN103167649B (en) * | 2011-12-10 | 2015-10-28 | 江阴市霖肯科技有限公司 | The sealing technology of Far infrared electric heating air conditioner euthermic chip |
CN103167647B (en) * | 2011-12-10 | 2015-12-16 | 江阴市霖肯科技有限公司 | Far infrared electric heating air conditioner euthermic chip |
CN105806159A (en) * | 2016-05-06 | 2016-07-27 | 黑龙江中惠地热股份有限公司 | Thin film for far infrared shooting and installing method |
CN107718778A (en) * | 2017-10-31 | 2018-02-23 | 无锡蓝晶电子科技有限公司 | A kind of shoulder shield |
CN111514465B (en) * | 2020-04-23 | 2022-06-24 | 无锡优波生命科技有限公司 | Far infrared light wave generation assembly based on ceramic membrane |
Family Cites Families (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN201076678Y (en) * | 2007-05-18 | 2008-06-25 | 秦仁和 | Biological energy chip |
CN201139280Y (en) * | 2007-12-28 | 2008-10-29 | 南京中脉科技发展有限公司 | Solar type infrared magnetic jade electric heating health bed mat |
CN102000395A (en) * | 2010-12-22 | 2011-04-06 | 江苏省江阴市霖肯科技有限公司 | Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof |
-
2010
- 2010-12-22 CN CN2010105994547A patent/CN102000395A/en active Pending
-
2011
- 2011-03-09 CN CN2011200594586U patent/CN201996995U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594618U patent/CN202036695U/en not_active Expired - Lifetime
- 2011-03-09 CN CN2011200594105U patent/CN202036693U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594285U patent/CN202036694U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594073U patent/CN202036692U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200593583U patent/CN201996992U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011100554738A patent/CN102114308B/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594270U patent/CN201996993U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594567U patent/CN201996994U/en not_active Expired - Fee Related
Also Published As
Publication number | Publication date |
---|---|
CN102000395A (en) | 2011-04-06 |
CN201996994U (en) | 2011-10-05 |
CN102114308A (en) | 2011-07-06 |
CN202036693U (en) | 2011-11-16 |
CN202036695U (en) | 2011-11-16 |
CN202036692U (en) | 2011-11-16 |
CN201996993U (en) | 2011-10-05 |
CN201996995U (en) | 2011-10-05 |
CN102114308B (en) | 2012-11-21 |
CN201996992U (en) | 2011-10-05 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
C41 | Transfer of patent application or patent right or utility model | ||
TR01 | Transfer of patent right |
Effective date of registration: 20160613 Address after: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Jiangyin Province Patentee after: Jiangyin Wenchang Intelligent Electromechanical Research Institution Co., Ltd Address before: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Wuxi province Jiangyin City Patentee before: Jiangyin Linken Technology Co.,Ltd. |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111116 Termination date: 20180309 |
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CF01 | Termination of patent right due to non-payment of annual fee |