CN202036692U - Firmly connected far-infrared chip - Google Patents
Firmly connected far-infrared chip Download PDFInfo
- Publication number
- CN202036692U CN202036692U CN2011200594073U CN201120059407U CN202036692U CN 202036692 U CN202036692 U CN 202036692U CN 2011200594073 U CN2011200594073 U CN 2011200594073U CN 201120059407 U CN201120059407 U CN 201120059407U CN 202036692 U CN202036692 U CN 202036692U
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- far infrared
- substrate
- infrared chip
- chip
- layer
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Laminated Bodies (AREA)
Abstract
The utility model discloses a firmly connected far-infrared chip, which is characterized by comprising six layers, an upper surface layer (1), a first adhesive layer (2), a PET (polyethylene terephthalate) protective membrane layer (3), a far-infrared substrate (4), a second adhesive layer (5) and a lower surface layer (6) arranged sequentially from top to bottom, and the periphery of the far-infrared chip is provided with an adhesive edge (7); and the far-infrared substrate (4) comprises a PET substrate (4.1), a conductive silver paste coating (4.2), a conductive ink coating (4.3) and a conductive bar (4.4). The utility model has the advantages that the firmly connected far-infrared chip has a small size, a light weight and good sealing performance, is connected firmly and cannot be damaged easily.
Description
Technical field
This utility model relates to a kind of human body physical therapy medical apparatus and instruments, relates in particular to a kind of far infrared chip to be connected firmly.
Background technology
From Germany scientist in 1800 breathe out inferior found infrared ray during at the research solar spectrum since, the infrared ray correlation technique has been widely used in commercial production, on medical diagnosis, detection, treatment and the prevention and health care.
According to biology characteristics medical infrared ray can be divided near infrared ray, middle infrared (Mid-IR) and far infrared.Far infrared is meant the infrared ray of wavelength at the 3-1000 micron, the infrared ray of this wave band of its medium wavelength 4-20 micron is very important with biological growth to human existence, far infrared three key properties that effect mainly contains far infrared to human body determine (the one, radiation, the 2nd, intensive penetration, the 3rd, absorption, resonance and sympathetic response).Human body surface is accepted far infrared, and from outward appearance to inner essence conduction infiltration, is absorbed the generation thermogenetic effect, produces resonance, sympathetic response with the in-vivo tissue cell, has promoted activity.And owing to produce thermogenetic effect, make the human microvascular expansion, self-disciplining is strengthened, and blood circulation is accelerated, and has quickened the mass exchange of cell and blood, thereby has promoted the metabolism of body.Simultaneously, far infrared improves cytophagous phagocytic activity, helps absorption, the dissipation of chronic inflammatory disease, is applicable to the various types of chronic inflammatory diseases of treatment, as some chronic inflammatory diseases of neuritis, myositis, arthritis and internal organs.Heat energy can reduce sensorineural irritability, and by relieve muscle spasms, detumescence, antiinflammatory with improve blood circulation and treat various pain, as neuralgia and Crampy Pain, struvite and avascular pain etc.Therefore, medically be called " life light wave " by the expert.
Health-care physiotherapeutic product relevant with far infrared on the market is varied, Herba Apocyni veneti be the textile product of representative because of its no thermal source effect, the intensity and the persistence of the far infrared of its generation are under suspicion; Employed far infrared therapeutic apparatus in the medical treatment, because of its temperature height, the alternating current energy supply is unfavorable for convenient the use.And its volume is big, weight is heavier, needs, could use as hospital to specific place, has limited its scope of application.And the far infrared chip sealing of conventional far infrared instrument for physiotherapy is poor, and it is insecure, fragile to bond, and service life is short.
Summary of the invention
At the problems referred to above, the purpose of this utility model is to provide a kind of volume little, in light weight, can carry, and is connected firmly, good airproof performance, the non-damageable far infrared chip that is connected firmly.
In order to achieve the above object, the technical solution of the utility model is as follows: the far infrared chip that a kind of usefulness is connected firmly, it is characterized in that: described far infrared chip comprises six layers of structure, is followed successively by upper epidermis, first adhesive layer, PET protective film, far infrared substrate, second adhesive layer and following top layer from top to bottom; The periphery of described far infrared chip is provided with the glue limit;
Described far infrared substrate comprises the PET substrate, the close upper and lower both sides of described PET substrate surface edge is provided with two conductive silver paste coatings, described PET substrate middle part is coated with the electrically conductive ink coating, the edge, upper and lower both sides of described electrically conductive ink coating overlaps with two conductive silver paste coatings respectively, and described two conductive silver paste coatings are covered with bus outward.
Described upper epidermis and following top layer are for containing the flaxen fiber layer of cloth.
Described upper epidermis and following top layer are Caulis et Folium Lini layer of cloth.
Its volume of this utility model is little, and is in light weight, can carry, and do not influence daily life.The chip periphery is provided with that the glue limit is connected firmly, good airproof performance, not fragile.
Description of drawings
The far infrared chip structure sketch map that Fig. 1 is connected firmly for this utility model.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 is the vertical view of Fig. 1 mid and far infrared substrate.
Wherein:
The specific embodiment:
In conjunction with the accompanying drawings the far infrared chip that is connected firmly is further described:
The far infrared chip that this utility model is connected firmly comprises six layers of structure, is followed successively by upper epidermis 1, first adhesive layer 2, PET protective film 3, far infrared substrate 4, second adhesive layer 5 and following top layer 6 from top to bottom; The periphery of described far infrared chip is provided with glue limit 7.
Described far infrared substrate 4 comprises PET substrate 4.1, described PET substrate 4.1 surfaces close upper and lower both sides edge is provided with two conductive silver paste coatings 4.2, described PET substrate 4.1 middle parts are coated with electrically conductive ink coating 4.3, the edge, upper and lower both sides of described electrically conductive ink coating 4.3 overlaps with two conductive silver paste coatings 4.2 respectively, described two conductive silver paste coatings, the 4.2 outer bus 4.4 that are covered with.
Described upper epidermis and following top layer are preferably linen for containing the flaxen fiber layer of cloth.
Described PET substrate surface is vertically arranged with the clear area of some no electrically conductive ink coats, and described clear area is divided into polylith with described electrically conductive ink coating; Described PET protective film is provided with long slot bore, and the position of described long slot bore is corresponding with the position, clear area.
Offer through hole on the described far infrared substrate that is coated with the electrically conductive ink coating, also offer corresponding with it through hole on the relevant position of described PET protective film.
The size of described PET protective film is consistent with described two conductive silver paste coating Outside Dimensions.
Described bus is a copper-foil conducting electricity.
Further set forth the preparation process of the far infrared chip that is connected firmly below in conjunction with accompanying drawing:
Cutting of PET substrate;
3-6mm place, upper and lower two back gauge edge at the PET substrate upper surface that cuts coats two conductive silver paste coatings respectively, the width of described conductive silver paste coating is 5-8mm, thickness is 2-10 μ m, dry in 120 ℃ of continuous tunnel furnaces, then, at PET substrate middle part coated with conductive printing ink, and make the upper and lower two edges of electrically conductive ink coating and the overlapping edges of upper and lower two conductive silver paste coatings, baking, baking temperature 170-190 ℃, time 60-90min;
Underrun adhesive layer and linen goods at the PET substrate presses together then;
On two conductive silver paste coatings, paste the Copper Foil of the wide 5-8mm of one deck or aluminium foil again as electrode;
Cover one deck PET protective film consistent at the far infrared substrate upper surface for preparing then with conductive silver paste coating Outside Dimensions, the upper surface rubber cover adhesion coating and the linen goods of PET protective film then, the method by heat seal is combined with each other each layer;
Punching puts copper washer with copper rivet and penetrates in the circular hole of accomplishing fluently then, and copper rivet directly is connected with on-chip Copper Foil of far infrared or aluminium foil, at last the chip edge after compound is used ejaculation formula injection machine plastic packaging, makes the far-infrared electric chip.
Circular hole and long slot bore on the above-mentioned PET protecting film, but when hot press moulding deaeration, thereby strengthen bonding force.
Claims (3)
1. far infrared chip that is connected firmly, it is characterized in that: described far infrared chip comprises six layers of structure, is followed successively by upper epidermis (1), first adhesive layer (2), PET protective film (3), far infrared substrate (4), second adhesive layer (5) and following top layer (6) from top to bottom; The periphery of described far infrared chip is provided with glue limit (7);
Described far infrared substrate (4) comprises PET substrate (4.1), described PET substrate (4.1) surface close upper and lower both sides edge is provided with two conductive silver paste coatings (4.2), described PET substrate (4.1) middle part is coated with electrically conductive ink coating (4.3), the edge, upper and lower both sides of described electrically conductive ink coating (4.3) overlaps with two conductive silver paste coatings (4.2) respectively, the outer bus (4.4) that is covered with of described two conductive silver paste coatings (4.2).
2. a kind of far infrared chip that is connected firmly according to claim 1 is characterized in that: described upper epidermis (1) and following top layer (6) are and contain the flaxen fiber layer of cloth.
3. a kind of far infrared chip that is connected firmly according to claim 1 is characterized in that: described upper epidermis (1) and following top layer (6) are Caulis et Folium Lini layer of cloth.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011200594073U CN202036692U (en) | 2010-12-22 | 2011-03-09 | Firmly connected far-infrared chip |
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010105994547A CN102000395A (en) | 2010-12-22 | 2010-12-22 | Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof |
| CN201010599454.7 | 2010-12-22 | ||
| CN2011200594073U CN202036692U (en) | 2010-12-22 | 2011-03-09 | Firmly connected far-infrared chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202036692U true CN202036692U (en) | 2011-11-16 |
Family
ID=43808256
Family Applications (10)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105994547A Pending CN102000395A (en) | 2010-12-22 | 2010-12-22 | Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof |
| CN2011100554738A Expired - Fee Related CN102114308B (en) | 2010-12-22 | 2011-03-09 | Far infrared electric heating physical therapy chip and preparation method thereof |
| CN2011200594586U Expired - Fee Related CN201996995U (en) | 2010-12-22 | 2011-03-09 | Far infrared substrate of electric heating physiotherapy instrument |
| CN2011200594105U Expired - Fee Related CN202036693U (en) | 2010-12-22 | 2011-03-09 | Heat insulation nano far infrared electric heating physiotherapy chip |
| CN2011200594270U Expired - Fee Related CN201996993U (en) | 2010-12-22 | 2011-03-09 | Water-proof far infrared chip |
| CN2011200594618U Expired - Lifetime CN202036695U (en) | 2010-12-22 | 2011-03-09 | Far infrared electric heating physiotherapy chip |
| CN2011200594567U Expired - Fee Related CN201996994U (en) | 2010-12-22 | 2011-03-09 | Far infrared chip assembly of electro-thermal physiotherapy instrument |
| CN2011200593583U Expired - Fee Related CN201996992U (en) | 2010-12-22 | 2011-03-09 | Portable far infrared electro-thermal physical therapy chip component |
| CN2011200594285U Expired - Fee Related CN202036694U (en) | 2010-12-22 | 2011-03-09 | Sealed far infrared physiotherapy chip capable of being fixed easily during injection molding |
| CN2011200594073U Expired - Fee Related CN202036692U (en) | 2010-12-22 | 2011-03-09 | Firmly connected far-infrared chip |
Family Applications Before (9)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010105994547A Pending CN102000395A (en) | 2010-12-22 | 2010-12-22 | Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof |
| CN2011100554738A Expired - Fee Related CN102114308B (en) | 2010-12-22 | 2011-03-09 | Far infrared electric heating physical therapy chip and preparation method thereof |
| CN2011200594586U Expired - Fee Related CN201996995U (en) | 2010-12-22 | 2011-03-09 | Far infrared substrate of electric heating physiotherapy instrument |
| CN2011200594105U Expired - Fee Related CN202036693U (en) | 2010-12-22 | 2011-03-09 | Heat insulation nano far infrared electric heating physiotherapy chip |
| CN2011200594270U Expired - Fee Related CN201996993U (en) | 2010-12-22 | 2011-03-09 | Water-proof far infrared chip |
| CN2011200594618U Expired - Lifetime CN202036695U (en) | 2010-12-22 | 2011-03-09 | Far infrared electric heating physiotherapy chip |
| CN2011200594567U Expired - Fee Related CN201996994U (en) | 2010-12-22 | 2011-03-09 | Far infrared chip assembly of electro-thermal physiotherapy instrument |
| CN2011200593583U Expired - Fee Related CN201996992U (en) | 2010-12-22 | 2011-03-09 | Portable far infrared electro-thermal physical therapy chip component |
| CN2011200594285U Expired - Fee Related CN202036694U (en) | 2010-12-22 | 2011-03-09 | Sealed far infrared physiotherapy chip capable of being fixed easily during injection molding |
Country Status (1)
| Country | Link |
|---|---|
| CN (10) | CN102000395A (en) |
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102000395A (en) * | 2010-12-22 | 2011-04-06 | 江苏省江阴市霖肯科技有限公司 | Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof |
| CN103167647B (en) * | 2011-12-10 | 2015-12-16 | 江阴市霖肯科技有限公司 | Far infrared electric heating air conditioner euthermic chip |
| CN103167649B (en) * | 2011-12-10 | 2015-10-28 | 江阴市霖肯科技有限公司 | The sealing technology of Far infrared electric heating air conditioner euthermic chip |
| CN103162396A (en) * | 2011-12-10 | 2013-06-19 | 江阴市霖肯科技有限公司 | Connecting and fixing craft of far infrared electric heating air conditioner heating module |
| CN105806159A (en) * | 2016-05-06 | 2016-07-27 | 黑龙江中惠地热股份有限公司 | Thin film for far infrared shooting and installing method |
| CN107718778A (en) * | 2017-10-31 | 2018-02-23 | 无锡蓝晶电子科技有限公司 | A kind of shoulder shield |
| CN111514465B (en) * | 2020-04-23 | 2022-06-24 | 无锡优波生命科技有限公司 | Far infrared light wave generation assembly based on ceramic membrane |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201076678Y (en) * | 2007-05-18 | 2008-06-25 | 秦仁和 | Biological energy chip |
| CN201139280Y (en) * | 2007-12-28 | 2008-10-29 | 南京中脉科技发展有限公司 | Solar type infrared magnetic jade electric heating health bed mat |
| CN102000395A (en) * | 2010-12-22 | 2011-04-06 | 江苏省江阴市霖肯科技有限公司 | Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof |
-
2010
- 2010-12-22 CN CN2010105994547A patent/CN102000395A/en active Pending
-
2011
- 2011-03-09 CN CN2011100554738A patent/CN102114308B/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594586U patent/CN201996995U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594105U patent/CN202036693U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594270U patent/CN201996993U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594618U patent/CN202036695U/en not_active Expired - Lifetime
- 2011-03-09 CN CN2011200594567U patent/CN201996994U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200593583U patent/CN201996992U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594285U patent/CN202036694U/en not_active Expired - Fee Related
- 2011-03-09 CN CN2011200594073U patent/CN202036692U/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| CN202036693U (en) | 2011-11-16 |
| CN202036694U (en) | 2011-11-16 |
| CN201996994U (en) | 2011-10-05 |
| CN201996995U (en) | 2011-10-05 |
| CN102114308B (en) | 2012-11-21 |
| CN201996993U (en) | 2011-10-05 |
| CN201996992U (en) | 2011-10-05 |
| CN102114308A (en) | 2011-07-06 |
| CN202036695U (en) | 2011-11-16 |
| CN102000395A (en) | 2011-04-06 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160607 Address after: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Jiangyin Province Patentee after: Jiangyin Wenchang Intelligent Electromechanical Research Institution Co., Ltd Address before: Zhu Tang Zhen Zhu Huang Lu 98 No. 214415 Jiangsu city of Wuxi province Jiangyin City Patentee before: Jiangyin Linken Technology Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111116 Termination date: 20180309 |