CN202036693U - Heat insulation nano far infrared electric heating physiotherapy chip - Google Patents

Heat insulation nano far infrared electric heating physiotherapy chip Download PDF

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Publication number
CN202036693U
CN202036693U CN2011200594105U CN201120059410U CN202036693U CN 202036693 U CN202036693 U CN 202036693U CN 2011200594105 U CN2011200594105 U CN 2011200594105U CN 201120059410 U CN201120059410 U CN 201120059410U CN 202036693 U CN202036693 U CN 202036693U
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China
Prior art keywords
far infrared
chip
infrared
layer
far
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Expired - Fee Related
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CN2011200594105U
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Chinese (zh)
Inventor
陆文昌
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JIANGYIN LINKEN TECHNOLOGY CO LTD
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JIANGYIN LINKEN TECHNOLOGY CO LTD
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  • Electrotherapy Devices (AREA)
  • Laminated Bodies (AREA)
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  • Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)

Abstract

The utility model discloses a heat insulation nano far infrared electric heating physiotherapy chip, which is characterized by comprising a far infrared chip and a wire. The far infrared chip comprises six layers of structures which are sequentially an upper surface layer (1), a first gluing layer (2), a polyethylene terephthalate (PET) protective film layer (3), a far infrared substrate (4), a second gluing layer (5) and a lower surface layer (6) from top to bottom. The far infrared substrate (4) comprises a PET substrate (4.1), a conductive silver paste coating layer (4.2), a conductive ink coating layer (4.3) and conductive bars (4.4). The two conductive bars (4.4) are connected with two leading wires of the wire respectively, and an overheat protector (7) is in series connection between one of the conductive bars (4.4) and the leading wire connected with the conductive bar (4.4). The heat insulation nano far infrared electric heating physiotherapy chip is small in volume, light in weight, convenient in inject molding and seal and attractive.

Description

Anti-scald nano-far-infrared Electvic heating physiogherapy chip
Technical field
This utility model relates to a kind of human body physical therapy medical apparatus and instruments, relates in particular to a kind of with anti-scald nano-far-infrared Electvic heating physiogherapy chip.
Background technology
From Germany scientist in 1800 breathe out inferior found infrared ray during at the research solar spectrum since, the infrared ray correlation technique has been widely used in commercial production, on medical diagnosis, detection, treatment and the prevention and health care.
According to biology characteristics medical infrared ray can be divided near infrared ray, middle infrared (Mid-IR) and far infrared.Far infrared is meant the infrared ray of wavelength at the 3-1000 micron, the infrared ray of this wave band of its medium wavelength 4-20 micron is very important with biological growth to human existence, far infrared three key properties that effect mainly contains far infrared to human body determine (the one, radiation, the 2nd, intensive penetration, the 3rd, absorption, resonance and sympathetic response).Human body surface is accepted far infrared, and from outward appearance to inner essence conduction infiltration, is absorbed the generation thermogenetic effect, produces resonance, sympathetic response with the in-vivo tissue cell, has promoted activity.And owing to produce thermogenetic effect, make the human microvascular expansion, self-disciplining is strengthened, and blood circulation is accelerated, and has quickened the mass exchange of cell and blood, thereby has promoted the metabolism of body.Simultaneously, far infrared improves cytophagous phagocytic activity, helps absorption, the dissipation of chronic inflammatory disease, is applicable to the various types of chronic inflammatory diseases of treatment, as some chronic inflammatory diseases of neuritis, myositis, arthritis and internal organs.Heat energy can reduce sensorineural irritability, and by relieve muscle spasms, detumescence, antiinflammatory with improve blood circulation and treat various pain, as neuralgia and Crampy Pain, struvite and avascular pain etc.Therefore, medically be called " life light wave " by the expert.
Health-care physiotherapeutic product relevant with far infrared on the market is varied, Herba Apocyni veneti be the textile product of representative because of its no thermal source effect, the intensity and the persistence of the far infrared of its generation are under suspicion; Employed far infrared therapeutic apparatus in the medical treatment, because of its temperature height, the alternating current energy supply is unfavorable for convenient the use.And its volume is big, weight is heavier, needs, could use as hospital to specific place, has limited its scope of application.In the continued power process, the temperature of far infrared chip can constantly raise, and scalds human body easily.
Summary of the invention
At the problems referred to above, the purpose of this utility model is to provide a kind of volume little, in light weight, can carry, and uses comfortable anti-scald nano-far-infrared Electvic heating physiogherapy chip.
In order to achieve the above object, the technical solution of the utility model is as follows: the anti-scald nano-far-infrared Electvic heating physiogherapy of a kind of usefulness chip, it is characterized in that: this physical therapy chip comprises far infrared chip and lead, described far infrared chip comprises six layers of structure, is followed successively by upper epidermis, first adhesive layer, PET protective film, far infrared substrate, second adhesive layer and following top layer from top to bottom;
Described far infrared substrate comprises the PET substrate, the close upper and lower both sides of described PET substrate surface edge is provided with two conductive silver paste coatings, described PET substrate middle part is coated with the electrically conductive ink coating, the edge, upper and lower both sides of described electrically conductive ink coating overlaps with two conductive silver paste coatings respectively, and described two conductive silver paste coatings are covered with bus outward; Described two bus link to each other with two lead-in wires of lead respectively; Wherein be in series with overheat protector between a bus and the lead-in wire that is attached thereto.
Described upper epidermis and following top layer are for containing the flaxen fiber layer of cloth.
Described upper epidermis and following top layer are Caulis et Folium Lini layer of cloth.
Its volume of this utility model is little, and is in light weight, can carry, and do not influence daily life.The existence of overheat protector, but temperature is when too high, the power supply of can in time cutting off the electricity supply, security of operation, hot face temperature is no more than 50 ℃ during chip operation, can not produce scald, uses safer and more comfortable.
Description of drawings
Fig. 1 is the anti-scald nano-far-infrared Electvic heating physiogherapy of a this utility model chip stereo sketch map;
Fig. 2 is the anti-scald nano-far-infrared Electvic heating physiogherapy of a this utility model chip structure sketch map;
Fig. 3 is a far infrared substrate structure sketch map.
Wherein:
Upper epidermis 1, first adhesive layer 2, PET protective film 3, far infrared substrate 4, second adhesive layer 5, following top layer 6, overheat protector 7; PET substrate 4.1, conductive silver paste coating 4.2, electrically conductive ink coating 4.3, bus 4.4, clear area 4.5.
The specific embodiment:
1 pair of anti-scald nano-far-infrared Electvic heating physiogherapy chip is further described in conjunction with the accompanying drawings:
The anti-scald nano-far-infrared Electvic heating physiogherapy of this utility model chip, this physical therapy chip comprises far infrared chip and lead, described far infrared chip comprises six layers of structure, is followed successively by upper epidermis 1, first adhesive layer 2, PET protective film 3, far infrared substrate 4, second adhesive layer 5 and following top layer 6 from top to bottom;
Described far infrared substrate 4 comprises PET substrate 4.1, described PET substrate 4.1 surfaces close upper and lower both sides edge is provided with two conductive silver paste coatings 4.2, described PET substrate 4.1 middle parts are coated with electrically conductive ink coating 4.3, the edge, upper and lower both sides of described electrically conductive ink coating 4.3 overlaps with two conductive silver paste coatings 4.2 respectively, is covered with bus 4.4 described two bus outside described two conductive silver paste coatings 4.2 and links to each other with two lead-in wires of lead respectively; Wherein be in series with overheat protector 7 between a bus 4.4 and the lead-in wire that is attached thereto.
Described upper epidermis 1 and following top layer 6 are preferably linen for containing the flaxen fiber layer of cloth.

Claims (3)

1. anti-scald nano-far-infrared Electvic heating physiogherapy chip, it is characterized in that: this physical therapy chip comprises far infrared chip and lead, described far infrared chip comprises six layers of structure, is followed successively by upper epidermis (1), first adhesive layer (2), PET protective film (3), far infrared substrate (4), second adhesive layer (5) and following top layer (6) from top to bottom;
Described far infrared substrate (4) comprises PET substrate (4.1), described PET substrate (4.1) surface close upper and lower both sides edge is provided with two conductive silver paste coatings (4.2), described PET substrate (4.1) middle part is coated with electrically conductive ink coating (4.3), the edge, upper and lower both sides of described electrically conductive ink coating (4.3) overlaps with two conductive silver paste coatings (4.2) respectively, the outer bus (4.4) that is covered with of described two conductive silver paste coatings (4.2); Described two bus (4.4) link to each other with two lead-in wires of lead respectively; Wherein be in series with overheat protector (7) between a bus (4.4) and the lead-in wire that is attached thereto.
2. a kind of anti-scald nano-far-infrared Electvic heating physiogherapy chip according to claim 1, it is characterized in that: described upper epidermis (1) and following top layer (6) are and contain the flaxen fiber layer of cloth.
3. a kind of anti-scald nano-far-infrared Electvic heating physiogherapy chip according to claim 1, it is characterized in that: described upper epidermis (1) and following top layer (6) are Caulis et Folium Lini layer of cloth.
CN2011200594105U 2010-12-22 2011-03-09 Heat insulation nano far infrared electric heating physiotherapy chip Expired - Fee Related CN202036693U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2011200594105U CN202036693U (en) 2010-12-22 2011-03-09 Heat insulation nano far infrared electric heating physiotherapy chip

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
CN2010105994547A CN102000395A (en) 2010-12-22 2010-12-22 Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof
CN201010599454.7 2010-12-22
CN2011200594105U CN202036693U (en) 2010-12-22 2011-03-09 Heat insulation nano far infrared electric heating physiotherapy chip

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CN202036693U true CN202036693U (en) 2011-11-16

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Family Applications (10)

Application Number Title Priority Date Filing Date
CN2010105994547A Pending CN102000395A (en) 2010-12-22 2010-12-22 Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof
CN2011200594270U Expired - Fee Related CN201996993U (en) 2010-12-22 2011-03-09 Water-proof far infrared chip
CN2011200594586U Expired - Fee Related CN201996995U (en) 2010-12-22 2011-03-09 Far infrared substrate of electric heating physiotherapy instrument
CN2011100554738A Expired - Fee Related CN102114308B (en) 2010-12-22 2011-03-09 Far infrared electric heating physical therapy chip and preparation method thereof
CN2011200594105U Expired - Fee Related CN202036693U (en) 2010-12-22 2011-03-09 Heat insulation nano far infrared electric heating physiotherapy chip
CN2011200593583U Expired - Fee Related CN201996992U (en) 2010-12-22 2011-03-09 Portable far infrared electro-thermal physical therapy chip component
CN2011200594285U Expired - Fee Related CN202036694U (en) 2010-12-22 2011-03-09 Sealed far infrared physiotherapy chip capable of being fixed easily during injection molding
CN2011200594073U Expired - Fee Related CN202036692U (en) 2010-12-22 2011-03-09 Firmly connected far-infrared chip
CN2011200594618U Expired - Lifetime CN202036695U (en) 2010-12-22 2011-03-09 Far infrared electric heating physiotherapy chip
CN2011200594567U Expired - Fee Related CN201996994U (en) 2010-12-22 2011-03-09 Far infrared chip assembly of electro-thermal physiotherapy instrument

Family Applications Before (4)

Application Number Title Priority Date Filing Date
CN2010105994547A Pending CN102000395A (en) 2010-12-22 2010-12-22 Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof
CN2011200594270U Expired - Fee Related CN201996993U (en) 2010-12-22 2011-03-09 Water-proof far infrared chip
CN2011200594586U Expired - Fee Related CN201996995U (en) 2010-12-22 2011-03-09 Far infrared substrate of electric heating physiotherapy instrument
CN2011100554738A Expired - Fee Related CN102114308B (en) 2010-12-22 2011-03-09 Far infrared electric heating physical therapy chip and preparation method thereof

Family Applications After (5)

Application Number Title Priority Date Filing Date
CN2011200593583U Expired - Fee Related CN201996992U (en) 2010-12-22 2011-03-09 Portable far infrared electro-thermal physical therapy chip component
CN2011200594285U Expired - Fee Related CN202036694U (en) 2010-12-22 2011-03-09 Sealed far infrared physiotherapy chip capable of being fixed easily during injection molding
CN2011200594073U Expired - Fee Related CN202036692U (en) 2010-12-22 2011-03-09 Firmly connected far-infrared chip
CN2011200594618U Expired - Lifetime CN202036695U (en) 2010-12-22 2011-03-09 Far infrared electric heating physiotherapy chip
CN2011200594567U Expired - Fee Related CN201996994U (en) 2010-12-22 2011-03-09 Far infrared chip assembly of electro-thermal physiotherapy instrument

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Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103167647A (en) * 2011-12-10 2013-06-19 江阴市霖肯科技有限公司 Far infrared electric heating air conditioner heating chip
CN107718778A (en) * 2017-10-31 2018-02-23 无锡蓝晶电子科技有限公司 A kind of shoulder shield

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN102000395A (en) * 2010-12-22 2011-04-06 江苏省江阴市霖肯科技有限公司 Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof
CN103162396A (en) * 2011-12-10 2013-06-19 江阴市霖肯科技有限公司 Connecting and fixing craft of far infrared electric heating air conditioner heating module
CN103167649B (en) * 2011-12-10 2015-10-28 江阴市霖肯科技有限公司 The sealing technology of Far infrared electric heating air conditioner euthermic chip
CN105806159A (en) * 2016-05-06 2016-07-27 黑龙江中惠地热股份有限公司 Thin film for far infrared shooting and installing method
CN111514465B (en) * 2020-04-23 2022-06-24 无锡优波生命科技有限公司 Far infrared light wave generation assembly based on ceramic membrane

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN201076678Y (en) * 2007-05-18 2008-06-25 秦仁和 Biological energy chip
CN201139280Y (en) * 2007-12-28 2008-10-29 南京中脉科技发展有限公司 Solar type infrared magnetic jade electric heating health bed mat
CN102000395A (en) * 2010-12-22 2011-04-06 江苏省江阴市霖肯科技有限公司 Nanometer far infrared electric heating physical therapy chip controlled by microcomputer and application thereof

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103167647A (en) * 2011-12-10 2013-06-19 江阴市霖肯科技有限公司 Far infrared electric heating air conditioner heating chip
CN103167647B (en) * 2011-12-10 2015-12-16 江阴市霖肯科技有限公司 Far infrared electric heating air conditioner euthermic chip
CN107718778A (en) * 2017-10-31 2018-02-23 无锡蓝晶电子科技有限公司 A kind of shoulder shield

Also Published As

Publication number Publication date
CN201996993U (en) 2011-10-05
CN102114308B (en) 2012-11-21
CN202036694U (en) 2011-11-16
CN202036692U (en) 2011-11-16
CN102114308A (en) 2011-07-06
CN202036695U (en) 2011-11-16
CN102000395A (en) 2011-04-06
CN201996992U (en) 2011-10-05
CN201996994U (en) 2011-10-05
CN201996995U (en) 2011-10-05

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C17 Cessation of patent right
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Granted publication date: 20111116

Termination date: 20130309