CN202026526U - Flexible circuit board - Google Patents
Flexible circuit board Download PDFInfo
- Publication number
- CN202026526U CN202026526U CN2011201267632U CN201120126763U CN202026526U CN 202026526 U CN202026526 U CN 202026526U CN 2011201267632 U CN2011201267632 U CN 2011201267632U CN 201120126763 U CN201120126763 U CN 201120126763U CN 202026526 U CN202026526 U CN 202026526U
- Authority
- CN
- China
- Prior art keywords
- dielectric layer
- flexible
- substrate
- base material
- circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Abstract
Disclosed is a flexible circuit board, comprising a substrate. The flexible circuit board is characterized in that: the substrate is made of flexible base material provided with a surface circuit thereon; both the upper side and the lower side of the substrate are stitched with dielectric layer A which consists of pure glue A and flexible copper-coated base material A from the surface of the substrate to the outside, with the dielectric layer A being provided with a through hole A connected to the surface circuit and a galvanized coating A coated upon the inner wall of the hole; and the flexible copper-coated base material forms the external layer circuit. Pulse plating blind hole-filling technology, laser punching technology, and some other technologies are combined in FPC lamination technology application, which enables thus produced circuit board able to meet high flexibility with low cost required by small sized information machines, thereby realizing miniaturization, low power consumption, high performance, and low cost of a information machine, which is an advance in FPC.
Description
Technical field
The utility model relates to a kind of flexible electric circuit board.
Background technology
Along with the arriving of digital Age, make human dependence grow with each passing day, and people are more and more higher to high-speed, the high-effect and compact requirement of electronic product now, have quite important that flexible circuit board becomes to electronic product.
PCB (rigid circuit board) has developed the technology of HDI (high density interconnect) now, and can accomplish twice laminating even technology repeatedly, in many laminating techniques of PCB, extensive use the material and the core material pressing of RCC (resin coated copper foil Resin Coated Copper), but, can only be applied on the PCB because this material shortage is flexible accordingly.
Summary of the invention
The technical problems to be solved in the utility model provides a kind of suitable pliability that has, safe and reliable flexible electric circuit board.
In order to solve the problems of the technologies described above, the technical scheme that its technical problem that solves the utility model adopts is: a kind of flexible electric circuit board, comprise substrate, it is characterized in that, described substrate is a flexible parent metal, described flexible parent metal surface is provided with the top layer circuit, described substrate each pressing of both sides up and down has dielectric layer A, described dielectric layer A is followed successively by pure glue A, flexible copper-clad base material A outward from substrate surface, described dielectric layer A is provided with through hole A that links to each other with the top layer circuit and the electrodeposited coating A that covers on the inwall of hole, and described flexible copper-clad base material is formed outer circuit.
In order to solve the problems of the technologies described above, another technical scheme that its technical problem that solves the utility model adopts is: described substrate is a flexible parent metal, described flexible parent metal surface is provided with the top layer circuit, described substrate each pressing of both sides up and down has dielectric layer A, described dielectric layer A is followed successively by pure glue A outward from substrate surface, flexible copper-clad base material A, described dielectric layer A is provided with through hole A that links to each other with the top layer circuit and the electrodeposited coating A that covers on the inwall of hole, described flexible copper-clad base material is formed time outer circuit, described dielectric layer A surface pressing has dielectric layer B, described dielectric layer B is followed successively by pure glue B outward from substrate surface, flexible copper-clad base material B, described dielectric layer B is provided with in through hole B that links to each other with A outer circuit of dielectric layer and the electrodeposited coating B that covers on the inwall of hole, and described dielectric layer B flexible copper-clad base material is formed outer circuit.
The beneficial effects of the utility model are: in FPC (flexible electric circuit board) laminating technique is used, integrated use pulse plating fill out the blind hole technology, laser drilling etc., the circuit board of making can satisfy that the small information machine requires has suitable pliability, flexible cheaply, realizing miniaturization, low-power consumption, high-performance and the low cost of information machine, is the progress of FPC.
Description of drawings
Accompanying drawing 1 is described to be lamination schematic diagram of flexible electric circuit board.
Accompanying drawing 2 is described to be flexible electric circuit board twice laminating schematic diagram.
Label declaration: 1-substrate; The pure glue A of 2-; 2 '-pure glue B; 3-flexible copper-clad base material A; 3 '-flexible copper-clad base material B; 4-through hole A; 4 '-through hole B; 5-electrodeposited coating A; 5 '-electrodeposited coating B;
Embodiment
By describing technology contents of the present utility model, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1, accompanying drawing provides a kind of flexible electric circuit board for the utility model, comprise substrate 1, described substrate 1 is a flexible parent metal, described flexible parent metal surface is provided with the top layer circuit, and described substrate each pressing of both sides up and down has dielectric layer A, and described dielectric layer A is followed successively by pure glue A2, flexible copper-clad base material A3 outward from substrate surface, described dielectric layer A is provided with through hole A4 that links to each other with the top layer circuit and the electrodeposited coating A5 that covers on the inwall of hole, and described flexible copper-clad base material is formed outer circuit.
In the present embodiment, this laminated circuit board adopts flexible copper-clad base material (FCCL) 3, pure glue 2 and substrate 1 pressing, at first, substrate 1 is a flexible parent metal, the top layer circuit is made on the flexible parent metal surface, flexible copper-clad base material A3, pure glue A2 and flexible base, board laminated according to shown position lump together, its dielectric layer is carried out laser drill, the top layer circuit that exposes the flexible parent metal surface carries out the pulse plating blind hole again, top layer circuit and outer layer metal layer conducting, again outer layer metal layer is made outer circuit, finish a lamination flexible electric circuit board it.
See also Fig. 2, accompanying drawing provides a kind of flexible electric circuit board for the utility model, described substrate 1 is a flexible parent metal, described flexible parent metal surface is provided with the top layer circuit, described substrate about in the of 1 each pressing of both sides dielectric layer A is arranged, described dielectric layer A is followed successively by pure glue A2 outward from substrate surface, flexible copper-clad base material A3, described dielectric layer A is provided with through hole A4 that links to each other with the top layer circuit and the electrodeposited coating A5 that covers on the inwall of hole, described flexible copper-clad base material is formed time outer circuit, described dielectric layer A surface pressing has dielectric layer B, described dielectric layer B is followed successively by pure glue B2 ' outward from substrate surface, flexible copper-clad base material B3 ', described dielectric layer B is provided with in the through hole B4 ' that links to each other with A outer circuit of dielectric layer and covers electrodeposited coating B5 ' on the inwall of hole, and described dielectric layer B flexible copper-clad base material is formed outer circuit.
In the present embodiment, this laminated circuit board adopts flexible copper-clad base material (FCCL), pure glue and substrate 1 pressing, described substrate 1 is a flexible parent metal, the top layer circuit is made on the flexible parent metal surface, flexible copper-clad base material A3, pure glue A2 and flexible base, board laminate according to shown position and lump together, A carries out laser drill to its dielectric layer, the top layer circuit that exposes the flexible parent metal surface, carry out the pulse plating blind hole again,, inferior outer layer metal layer is made time outer circuit top layer circuit and time outer layer metal layer conducting, finish a lamination flexible electric circuit board to it, with flexible copper-clad base material B3 ', pure glue B2 ' and a lamination flexible electric circuit board laminate according to shown position and lump together again, and B carries out laser drill to its dielectric layer, expose time outer circuit, carry out the pulse plating blind hole again,, outer layer metal layer is made outer circuit time outer-layer circuit and outer layer metal layer conducting.Just finished twice laminating, in whole process, carried out secondary flexible copper-clad base material, pure glue and core material laminate the process of closing, and used secondary laser boring during the course, the technology that second pulse plating etc. are relevant, because the application of material is suitable, guaranteed certain flexible of circuit board.
Claims (2)
1. flexible electric circuit board, comprise substrate, it is characterized in that, described substrate is a flexible parent metal, described flexible parent metal surface is provided with the top layer circuit, and described substrate each pressing of both sides up and down has dielectric layer A, and described dielectric layer A is followed successively by pure glue A, flexible copper-clad base material A outward from substrate surface, described dielectric layer A is provided with through hole A that links to each other with the top layer circuit and the electrodeposited coating A that covers on the inwall of hole, and described flexible copper-clad base material is formed outer circuit.
2. one kind around the property circuit board, comprise substrate, it is characterized in that, described substrate is a flexible parent metal, described flexible parent metal surface is provided with the top layer circuit, described substrate each pressing of both sides up and down has dielectric layer A, described dielectric layer A is followed successively by pure glue A outward from substrate surface, flexible copper-clad base material A, described dielectric layer A is provided with through hole A that links to each other with the top layer circuit and the electrodeposited coating A that covers on the inwall of hole, described flexible copper-clad base material is formed time outer circuit, described dielectric layer A surface pressing has dielectric layer B, described dielectric layer B is followed successively by pure glue B outward from substrate surface, flexible copper-clad base material B, described dielectric layer B is provided with in through hole B that links to each other with A outer circuit of dielectric layer and the electrodeposited coating B that covers on the inwall of hole, and described dielectric layer B flexible copper-clad base material is formed outer circuit.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201267632U CN202026526U (en) | 2011-04-26 | 2011-04-26 | Flexible circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201267632U CN202026526U (en) | 2011-04-26 | 2011-04-26 | Flexible circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN202026526U true CN202026526U (en) | 2011-11-02 |
Family
ID=44851457
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2011201267632U Expired - Fee Related CN202026526U (en) | 2011-04-26 | 2011-04-26 | Flexible circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN202026526U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103957660A (en) * | 2014-04-30 | 2014-07-30 | 惠州市力道电子材料有限公司 | High-thermal-conductivity ceramic substrate containing filling copper columns and manufacturing process thereof |
| CN105007685A (en) * | 2015-07-17 | 2015-10-28 | 宁波华远电子科技有限公司 | Rigid-flexible printed circuit board and manufacturing method thereof |
| CN107846776A (en) * | 2016-09-19 | 2018-03-27 | 苏州纳格光电科技有限公司 | Multi-layer flexible circuit board |
| CN111970622A (en) * | 2020-06-09 | 2020-11-20 | 深圳前海振百易科技有限公司 | Loudspeaker capable of generating power and implementation method thereof |
-
2011
- 2011-04-26 CN CN2011201267632U patent/CN202026526U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103957660A (en) * | 2014-04-30 | 2014-07-30 | 惠州市力道电子材料有限公司 | High-thermal-conductivity ceramic substrate containing filling copper columns and manufacturing process thereof |
| CN105007685A (en) * | 2015-07-17 | 2015-10-28 | 宁波华远电子科技有限公司 | Rigid-flexible printed circuit board and manufacturing method thereof |
| CN105007685B (en) * | 2015-07-17 | 2018-01-02 | 宁波华远电子科技有限公司 | Rigid-flexible circuit board and its manufacture method |
| CN107846776A (en) * | 2016-09-19 | 2018-03-27 | 苏州纳格光电科技有限公司 | Multi-layer flexible circuit board |
| CN111970622A (en) * | 2020-06-09 | 2020-11-20 | 深圳前海振百易科技有限公司 | Loudspeaker capable of generating power and implementation method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI640236B (en) | Multilayer flexible printed circuit board and method for making the same | |
| CN102548186A (en) | Hexamethylene diisocyanate (HDI) plate with symmetrically pressed structure and manufacturing method thereof | |
| CN202026526U (en) | Flexible circuit board | |
| WO2013086911A1 (en) | Method for manufacturing multi-step high density interconnect board | |
| CN103124472A (en) | Flex-rigid printed circuit board manufacturing method and flex-rigid printed circuit board | |
| CN104349609A (en) | Printed circuit board and manufacturing method thereof | |
| CN109429441A (en) | Rigid Flex and preparation method thereof | |
| CN105764269A (en) | Processing method of PCB, and PCB | |
| CN104661450B (en) | A kind of method based on laser drill DIRECT HOLE METALLIZATION TECHNIQUE IN | |
| CN107801309A (en) | The preparation method of six sandwich circuit boards and six sandwich circuit boards | |
| CN101711098A (en) | Twice laminating technique of flexible printed circuits | |
| CN103874346A (en) | Method for manufacturing circuit board | |
| CN103813652A (en) | Processing method of blind hole | |
| CN101640978A (en) | Method and device for manufacturing single-side nickel-plated sheet | |
| CN204157152U (en) | A kind of multilayer circuit board | |
| CN106658959A (en) | Flexible circuit board and manufacturing method thereof | |
| CN104023484A (en) | Manufacturing method of printed circuit board overlaid through hole structure | |
| CN204362415U (en) | Automobile audio half flex circuit application | |
| CN202050587U (en) | Thick copper PCB board | |
| CN204180377U (en) | The pressing structure of cavity circuit plate | |
| CN106211641A (en) | A kind of high reliability laminated plates | |
| CN202587597U (en) | Golden finger circuit board | |
| CN109379840A (en) | A kind of processing method and circuit board of hanging golden finger | |
| CN105307387B (en) | A kind of high multilayered rigidity and flexibility combined impedance plate of large scale and preparation method thereof | |
| CN204090296U (en) | Blind buried via hole printed circuit board (PCB) |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee |
Owner name: SHENZHEN JINGCHENGDA ELECTRIC CIRCUIT CO., LTD. Free format text: FORMER NAME: SHENZHEN JINGCHENGDA CIRCUIT CO., LTD. |
|
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 Guangdong city of Shenzhen province Baoan District Shajing Town Xin Yangcun West Industrial Zone B building Patentee after: Shenzhen Jingchengda Circuit Technology Co., Ltd. Address before: 518000 Guangdong city of Shenzhen province Baoan District Shajing Town Xin Yangcun West Industrial Zone B building Patentee before: Shenzhen Jingchengda Electric Circuit Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20111102 Termination date: 20160426 |