CN201852899U - Automatic conduction testing device for semiconductor substrates - Google Patents
Automatic conduction testing device for semiconductor substrates Download PDFInfo
- Publication number
- CN201852899U CN201852899U CN2010205746398U CN201020574639U CN201852899U CN 201852899 U CN201852899 U CN 201852899U CN 2010205746398 U CN2010205746398 U CN 2010205746398U CN 201020574639 U CN201020574639 U CN 201020574639U CN 201852899 U CN201852899 U CN 201852899U
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- China
- Prior art keywords
- test platform
- testing device
- semiconductor substrates
- contact jaw
- conduction
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
The utility model relates to the technical field of manufacturing of semiconductors, in particular to an automatic conduction testing device for semiconductor substrates. The automatic conduction testing device is characterized by comprising a testing platform, wherein a plurality of contact ends are arranged on two sides of the testing platform and connected with a resistance testing computer, the contact ends on the same side are connected to the same flat plate, springs are arranged among the contact ends and the flat plate, each flat plate is connected with a motor through a crank shaft, and the motor is connected with a control switch. Furthermore, a photoelectric tube is arranged on one side of the testing platform and connected with the control switch, and a conveying belt is arranged in the front of the testing platform. The automatic conduction testing device has the advantages of capability of detecting conduction of multiple groups of circuits of semiconductor substrates quickly and automatically, and convenience in use.
Description
Technical field
The utility model relates to technical field of manufacturing semiconductors, relates to a kind of tool equipment, specifically relates to a kind of semiconductor chip conduction automatic testing equipment.
Background technology
Semiconductor chip has many row's multiple row crystal blocks, crystal block is welded on the substrate, if one of them crystal block failure welding on substrate will influence the performance of semiconductor chip, detecting the whether firm of crystal block welding is the conduction situation that can detect crystal block, and conduction is good, its welding just firmly, otherwise just have the dry joint phenomenon, in the prior art, what detect use is multimeter, because the circuit of crystal block is many, has the shortcoming of the trouble used; In addition, it also has the demand that is not suitable for the big production of batch, and more advanced multimeter has many set of joints, also is the resistance test computer, once can measure the conduction situation of a plurality of circuit, and it also has awkward phenomenon.
Summary of the invention
The purpose of this utility model is exactly at above-mentioned shortcoming, provides a kind of detection semiconductor chip that can be fast automatic to organize the instrument of the conduction situation of circuit more---semiconductor chip conduction automatic testing equipment.
The novel technical scheme of taking of this use is, semiconductor chip conduction automatic testing equipment, it is characterized in that: it comprises test platform, the test platform both sides have a plurality of contact jaws, contact jaw connects the resistance test computer, and the contact jaw of described every side is connected on the flat board, also has spring between contact jaw and the flat board, dull and stereotyped through bent axle connection motor, motor downlink connection gauge tap.
Say that further the sidepiece of described test platform has photoelectric tube, photoelectric tube connects gauge tap, and described test platform front portion also has travelling belt.
The beneficial effects of the utility model are: such proving installation have can be fast automatic the detection semiconductor chip organize the advantage of the conduction situation of circuit more, easy to use.
Description of drawings
Fig. 1 is the structural representation of the utility model semiconductor chip conduction automatic testing equipment.
Wherein: 1, test platform 2, contact jaw 3, flat board 4, spring 5, photoelectric tube 6, travelling belt
Specific embodiments:
Below in conjunction with accompanying drawing the utility model is further described.
As shown in Figure 1, semiconductor chip conduction automatic testing equipment, it is characterized in that: it comprises test platform 1, test platform 1 both sides have a plurality of contact jaws 2, contact jaw 2 connects the resistance test computer, and the contact jaw 2 of described every side is connected on the flat board 3, also has spring 4 between the contact jaw 2 and dull and stereotyped 3, dull and stereotyped 3 through bent axle connection motor, motor downlink connection gauge tap.
Semiconductor chip can be tested on test platform 1, once tests multi-group data; Also have spring 4 between the contact jaw 2 and dull and stereotyped 3, be for contact jaw contact with crystal grain better.
Say that further the sidepiece of described test platform 1 has photoelectric tube 5, photoelectric tube 5 connects gauge tap, and described test platform 1 front portion also has travelling belt 6.
Described semiconductor chip can send signal through photoelectric tube 5, the crystal block that motor motion, contact jaw 2 contacts are surveyed.Travelling belt is set, can realizes the automatic charging of semiconductor chip.
Claims (2)
1. semiconductor chip conduction automatic testing equipment, it is characterized in that: it comprises test platform, the test platform both sides have a plurality of contact jaws, contact jaw connects the resistance test computer, the contact jaw of described every side is connected on the flat board, also have spring between contact jaw and the flat board, dull and stereotyped through bent axle connection motor, motor downlink connection gauge tap.
2. device according to claim 1 is characterized in that: the sidepiece of described test platform has photoelectric tube, and photoelectric tube connects gauge tap, and described test platform front portion also has travelling belt.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205746398U CN201852899U (en) | 2010-10-25 | 2010-10-25 | Automatic conduction testing device for semiconductor substrates |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205746398U CN201852899U (en) | 2010-10-25 | 2010-10-25 | Automatic conduction testing device for semiconductor substrates |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201852899U true CN201852899U (en) | 2011-06-01 |
Family
ID=44095287
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205746398U Expired - Fee Related CN201852899U (en) | 2010-10-25 | 2010-10-25 | Automatic conduction testing device for semiconductor substrates |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201852899U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102393498A (en) * | 2011-12-13 | 2012-03-28 | 重庆平伟实业股份有限公司 | Testing apparatus for preventing reverse phenomenon of diode |
-
2010
- 2010-10-25 CN CN2010205746398U patent/CN201852899U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102393498A (en) * | 2011-12-13 | 2012-03-28 | 重庆平伟实业股份有限公司 | Testing apparatus for preventing reverse phenomenon of diode |
| CN102393498B (en) * | 2011-12-13 | 2013-10-23 | 重庆平伟实业股份有限公司 | Testing apparatus for preventing reverse phenomenon of diode |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110601 Termination date: 20111025 |