CN112394280A - Testing arrangement of power chip production usefulness - Google Patents
Testing arrangement of power chip production usefulness Download PDFInfo
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- CN112394280A CN112394280A CN202011283010.2A CN202011283010A CN112394280A CN 112394280 A CN112394280 A CN 112394280A CN 202011283010 A CN202011283010 A CN 202011283010A CN 112394280 A CN112394280 A CN 112394280A
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- 238000012360 testing method Methods 0.000 title claims abstract description 59
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 23
- 238000001514 detection method Methods 0.000 claims abstract description 52
- 238000003825 pressing Methods 0.000 claims abstract description 35
- 239000000523 sample Substances 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 16
- 230000000694 effects Effects 0.000 claims description 8
- 230000006835 compression Effects 0.000 claims description 3
- 238000007906 compression Methods 0.000 claims description 3
- 238000001125 extrusion Methods 0.000 claims description 2
- 238000007689 inspection Methods 0.000 claims 3
- 238000003780 insertion Methods 0.000 claims 1
- 230000037431 insertion Effects 0.000 claims 1
- 230000009471 action Effects 0.000 description 6
- 238000009434 installation Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 230000003139 buffering effect Effects 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000006872 improvement Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 235000012431 wafers Nutrition 0.000 description 1
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2856—Internal circuit aspects, e.g. built-in test features; Test chips; Measuring material aspects, e.g. electro migration [EM]
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2863—Contacting devices, e.g. sockets, burn-in boards or mounting fixtures
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/286—External aspects, e.g. related to chambers, contacting devices or handlers
- G01R31/2865—Holding devices, e.g. chucks; Handlers or transport devices
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2874—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature
- G01R31/2875—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to temperature related to heating
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/28—Testing of electronic circuits, e.g. by signal tracer
- G01R31/2851—Testing of integrated circuits [IC]
- G01R31/2855—Environmental, reliability or burn-in testing
- G01R31/2872—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation
- G01R31/2881—Environmental, reliability or burn-in testing related to electrical or environmental aspects, e.g. temperature, humidity, vibration, nuclear radiation related to environmental aspects other than temperature, e.g. humidity or vibrations
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01R—MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
- G01R31/00—Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
- G01R31/40—Testing power supplies
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- Engineering & Computer Science (AREA)
- Environmental & Geological Engineering (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- General Engineering & Computer Science (AREA)
- Health & Medical Sciences (AREA)
- Toxicology (AREA)
- Testing Of Individual Semiconductor Devices (AREA)
Abstract
The invention relates to a testing device for power supply chip production, which comprises a detection table for placing a power supply chip, wherein the detection table is provided with: the pressing device can longitudinally apply pressure for fixing; the temperature control device is arranged at any end of the pressing device and used for controlling the temperature of the power supply chip fixed on the pressing device; the plurality of detection holes of participating in, can self-holding power chip participate in, a plurality of detection hole bottoms of participating in are provided with the detection device who detects participating in. The testing device for power supply chip production, provided by the invention, provides different temperature environments and pressure environments for power supply chip testing.
Description
Technical Field
The invention relates to the field of power chip detection equipment, in particular to a testing device for power chip production.
Background
The power management chip is mainly responsible for identifying CPU power supply amplitude, generating corresponding short moment wave and pushing a rear-stage circuit to output power, the electronic chip is a miniature electronic device or component, adopts a certain process to interconnect elements such as transistors, resistors, capacitors, inductors and the like required in a circuit together with wiring, is manufactured on a small or a plurality of small semiconductor wafers or medium substrates and then is packaged in a tube shell to form a miniature structure with required circuit functions, the semiconductor chip detection device is mainly applied to the test of the semiconductor industry, the photoelectric industry, integrated circuits and packaging, is widely applied to the research and development of precise electrical measurement of complex and high-speed devices and aims to ensure the quality and reliability of the device, and reduces development time and cost of device fabrication processes.
However, the conventional power supply chip is tested at normal temperature, and external factors such as testing at different temperatures of the chip are not considered, and the chip is tested under a compression condition, so that the test data of the conventional testing device is inaccurate.
Disclosure of Invention
In order to overcome the problems, the invention provides a testing device for power supply chip production, which provides different temperature environments and pressure environments for testing the power supply chip.
The technical scheme adopted by the invention for solving the technical problems is as follows: the utility model provides a testing arrangement of power chip production usefulness, is including the detection platform that is used for placing power chip, it is provided with on the detection platform: the pressing device can longitudinally apply pressure for fixing; the temperature control device is arranged at any end of the pressing device and used for controlling the temperature of the power supply chip fixed on the pressing device; the plurality of detection holes of participating in, can self-holding power chip participate in, a plurality of detection hole bottoms of participating in are provided with the detection device who detects participating in.
Preferably, the temperature control device comprises a heating sheet.
Preferably, the pressing device comprises a pressing plate which can descend and apply downward pressing force to the power chip, and the heating sheet is arranged on the bottom surface of the pressing plate; the temperature control device further comprises a temperature sensor arranged in the pressing plate.
Preferably, the pressing device further includes a top plate which is located on the detection table and can be raised to apply an upward pressing force to the power chip.
Preferably, the automatic clamping device is arranged in the pin detection hole and comprises a clamping piece and a third spring, a movable groove is formed in the side portion of the pin detection hole, one end of the third spring is connected with the bottom surface of the movable groove, one end of the third spring is connected with the clamping piece, the clamping piece can transversely stretch and retract, the upper end and the lower end of the clamping piece are provided with a guide-in inclined plane, when the power supply chip is inserted into the pin detection hole, the guide-in inclined plane is extruded to enable the clamping piece to move laterally, the pressure spring is compressed, and. The automatic clamping device comprises two clamping pieces, a spring and a movable groove which are respectively and symmetrically arranged.
Preferably, the detection device comprises a probe and a slide rail, the slide rail corresponds to the bottom of each pin detection hole, and the probe is slidably arranged on the slide rail and can move to the bottom of each pin detection hole. The number of the slide rails is two.
Preferably, the detection device further comprises a sliding block, the bottom of the sliding block is movably clamped with the sliding rail, the upper portion of the sliding block is a cylindrical seat, and the probe is movably mounted in the cylindrical seat up and down through a third spring.
Preferably, the probe is installed through an installation plate, a movable column is arranged at the bottom of the installation plate and is inserted into the cylindrical seat, the spring is sleeved on the cylindrical seat and the movable column, and the upper end and the lower end of the third spring are respectively contacted with the installation plate and the bottom of the sliding block.
Preferably, the periphery of the detection table is provided with a plurality of sliding columns, the tops of the sliding columns are provided with supporting plates, the pressing plates are movably inserted into the sliding columns, the supporting plates are provided with first air cylinders, and the first air cylinders control the lifting of the pressing plates.
Preferably, the bottom of the detection table is provided with a second cylinder, and the second cylinder controls the top plate to lift.
The invention has the beneficial effects that: a testing device for power chip production provides different temperature environments for power chip testing, heating is achieved through a heating sheet, when the power chip works, the temperature of the power chip is monitored through a temperature sensor, when overtemperature or damage occurs, the testing is stopped, when the testing is complete, the power chip is taken out, whether deformation and other conditions occur or not is observed, the testing time is selected according to the selected temperature and the model of the power chip, the testing time is shorter when the temperature is higher than the testing time is lower than the testing time, rapid testing can be achieved, in addition, the pressing devices at the upper end and the lower end provide pressing force to provide a pressure environment for the power chip testing, the two clamping pieces are arranged on two sides of a jack in a relative mode through symmetrical arrangement of a movable groove relative to the center line of the jack, under the elastic force action of a third spring, the two clamping pieces are close to each other, after a pin of the power chip is inserted, the pin and the power chip body are fixed under the action of the third spring.
Drawings
The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention and not to limit the invention. In the drawings:
FIG. 1 is a schematic diagram showing the complete structure of a testing device for power chip production according to the present invention;
FIG. 2 is a front sectional view of a testing device for power chip production according to the present invention;
FIG. 3 is a side sectional view of the testing device for power chip production according to the present invention;
fig. 4 is an enlarged structural view of the invention at a in fig. 3.
In the figure: 1, a detection table; 2, supporting columns; 3, inserting holes; 4, a sliding column; 5, pressing a plate; 6 a first cylinder; 7, supporting plates; 8, limiting plates; 9 a first telescopic rod; 10 fixing the shell; 11, a receiving groove; 12 a second telescopic rod; 13 a second cylinder; 14 a top plate; 15 heating plates; 16 a temperature sensor; 17 a first spring; 18 a clip; 19 a movable cylinder; 20, a probe; 21, mounting a plate; 22 a movable post; 23 slide rails; 24 sliding blocks; 25 a second spring; 26 a movable groove; 27 third spring.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-4, the present invention provides the following technical solutions: the utility model provides a testing arrangement of power chip production usefulness, is including the detection platform that is used for placing power chip, it is provided with on the detection platform: the pressing device can longitudinally apply pressure for fixing; the temperature control device is arranged at any end of the pressing device and used for controlling the temperature of the power supply chip fixed on the pressing device; the plurality of detection holes of participating in, can self-holding power chip participate in, a plurality of detection hole bottoms of participating in are provided with the detection device who detects participating in.
The specific composition structure comprises a detection table 1, a support column 2 is arranged at the bottom of the detection table 1, a fixing device is arranged at the top of the detection table 1, a receiving groove 11 is arranged inside the detection table 1, a second air cylinder 13 is arranged at the bottom of the receiving groove 11, a second air rod 12 is arranged at the top of the second air cylinder 13, a top plate 14 is arranged at the top of the second air rod 12, a slide rail 23 is arranged at one side of the second air cylinder 13, a slide block 24 is arranged at the top of the slide rail 23, a movable cylinder 19 is arranged at the top of the slide block 24, a movable column 22 is arranged at the top of the movable cylinder 19, a mounting plate 21 is arranged at the top of the movable column 22, a second spring 25 is arranged at the bottom of the mounting plate 21, a probe 20 is arranged at the top of the mounting plate 21, a slide column 4 is arranged at the top of the detection table 1, a support plate 7 is arranged at the, the bottom of first telescopic link 9 is provided with limiting plate 8, and the bottom of limiting plate 8 is provided with first spring 17, and the outside of limiting plate 8 is provided with set casing 10, and the bottom of set casing 10 is provided with clamp plate 5, and the inside of clamp plate 5 is provided with heating plate 15, and the bottom of clamp plate 5 is provided with temperature sensor 16.
In this embodiment, the heating is realized by the heating sheet 15, the heating temperature is 20-65 ℃, when the power chip works, the temperature of the power chip is monitored by the temperature sensor 16, when the power chip is over-temperature or damaged, the test is stopped, when the test is complete, the power chip is taken out, whether deformation occurs or not is observed, the test time is selected according to the selected temperature and the model of the power chip, the test time is shorter when the temperature is high than when the temperature is low, the test time can be quickly tested, the two clamping sheets 18 are oppositely arranged at the two sides of the jack 3 through the symmetrical arrangement of the movable groove 26 relative to the central line of the jack 3, under the elastic force of the third spring 27, the two clamping sheets 18 are close to each other, after the pin of the power chip is inserted into the jack 3, the pin and the body of the power chip are fixed under the action of the third spring 27, the probe 20 is fixed by the mounting plate 21, meanwhile, one gauge head of the multimeter is fixed inside the probe 20 and slides on the top of the slide rail 23 through the slide block 24, when the probe 20 passes through the bottom of the jack 3, the gauge head inside the probe 20 can be contacted with the pins of the power chip, so that the probe 20 can be fixed and always contacted with the pins of the power chip, the slide block 24 is controlled to move through the slide rail 23 which is arranged oppositely, so that the other gauge head of the multimeter is sequentially contacted with the pins of the power chip, the voltage and the current of the power chip are tested, the quality of the power chip is judged, the press plate 5 slides along the up-down direction through the arrangement of the slide column 4, the press plate 5 is gradually close to the top of the power chip to extrude the power chip, the firmness and the service life of the power chip are detected, the gauge plate 8 slides inside the fixed shell 10, and when the first cylinder 6 drives the first, first telescopic link 9 promotes clamp plate 5 and is close to power chip gradually, through the buffering of the first spring 17 reduction dynamics, prevents that pressure from too big to carry out the protection of certain degree to power chip.
Specifically, fixing device includes activity groove 26, the inside in activity groove 26 is provided with third spring 27, the one end of third spring 27 is provided with clamping piece 18, one side of clamping piece 18 is provided with jack 3, through the symmetrical setting of activity groove 26 central line about jack 3, set up two clamping pieces 18 relatively in jack 3 both sides, under the spring action of third spring 27, two clamping pieces 18 are close to each other, insert jack 3 back when power supply chip pins, fix to inserting pin and power supply chip body under the effect of third spring 27.
Specifically, mounting panel 21 welded mounting is at the top of activity post 22, probe 20 fixed mounting is at mounting panel 21 top, fix probe 20 through mounting panel 21, fix the inside at probe 20 with a gauge outfit of universal meter simultaneously, slide at slide rail 23 top through slider 24, when probe 20 is through jack 3 bottom, the inside gauge outfit of probe 20 can participate in with power supply chip and contact, make probe 20 carry out fixed gauge outfit and participate in with power supply chip all the time and contact, slide rail 23 control slider 24 through relative setting moves, make another gauge outfit of universal meter contact with each participating in of power supply chip in proper order, test power supply chip voltage electric current, judge power supply chip's quality.
Specifically, roof 14 thickness size equals with income groove 11 height size, and roof 14 fixed mounting flushes roof 14 and detection platform 1 top through receiving 11 height sizes in groove and roof 14 thickness size is the same convenient, puts power chip and fixes at detection platform 1 top, pushes roof 14 and hugs closely bottom power chip through second cylinder 13 and second telescopic link 12 on 12 tops of second telescopic link.
Specifically, the quantity of traveller 4 is four, and four symmetrical settings of traveller 4 are examining 1 tops of test table, set up through traveller 4 and make clamp plate 5 slide along upper and lower direction, make clamp plate 5 be close to the power chip top gradually and extrude power chip, detect power chip fastness and life, and traveller 4 fixes backup pad 7 simultaneously, guarantees that first cylinder 6 can work firm, realizes the extrusion detection to power chip.
Specifically, limiting plate 8 slides inside set casing 10, and first spring 17 sets up between limiting plate 8 and clamp plate 5, slides inside set casing 10 through limiting plate 8, when first cylinder 6 drives first telescopic link 9 and removes, and first telescopic link 9 promotes clamp plate 5 and is close to the power chip gradually, reduces the buffering of dynamics through first spring 17, prevents that pressure from excessively carrying out the protection of certain degree to the power chip.
Specifically, the temperature sensor 16 is a patch type temperature sensor, the temperature sensor 16 is tightly attached to the bottom of the pressing plate 5, heating is achieved through the heating sheet 15, the heating temperature is 20-65 ℃, when the power supply chip works, the temperature of the power supply chip is monitored through the temperature sensor 16, when overtemperature or damage occurs, the test is stopped, when the test is complete, the power supply chip is taken out, whether deformation and the like occur or not is observed, the test time is selected according to the selected temperature and the model of the power supply chip, the high-temperature test time is shorter than the low-temperature test time, rapid test can be achieved, and the model of the temperature sensor 16 is JKWP/P-201S.
Specifically, the quantity of slide rail 23 is two, and slide rail 23 sets up with jack 3 is corresponding, and slide rail 23 control slide block 24 through relative setting removes, makes another gauge outfit of universal meter in proper order with each participating in of power chip and contacts, tests power chip voltage electric current, judges power chip's quality, and fixed relative universal meter gauge outfit simultaneously participates in the contact with power chip, detects the voltage electric current condition of participating in of this one side of power chip, judges quality.
The working principle and the using process of the invention are as follows: after the detection device is installed, when the detection device is used, the top plate 14 is moved into the receiving groove 11 to be flush with the top of the detection platform 1 through the second air cylinder 13 and the second telescopic rod 12, the two clamping pieces 18 are oppositely arranged on two sides of the jack 3 through the movable groove 26 which is symmetrically arranged relative to the central line of the jack 3, the two clamping pieces 18 are mutually close to each other under the elastic force action of the third spring 27, after the power chip pins are inserted into the jack 3, the power chip pins are inserted into the jack 3 in a matching way, the pins and the power chip body are fixed under the action of the third spring 27, the top plate 14 is pushed to be tightly attached to the bottom of the power chip through the second air cylinder 13 and the second telescopic rod 12, the top plate 14 slides in the fixed shell 10 through the limiting plate 8, when the first telescopic rod 9 is driven by the first air cylinder 6 to move, the first telescopic rod 9 pushes the pressing plate 5 to gradually close to the top of, the power supply chip is prevented from being protected to a certain extent by overlarge pressure, the power supply chip is slowly compressed, heating is realized by the heating sheet 15, when the power supply chip works, the temperature of the power supply chip is monitored by the temperature sensor 16, when overtemperature or damage occurs, the test is stopped, when the test is complete, the power supply chip is taken out, whether deformation occurs or not is observed, the test time is selected according to the selected temperature and the model of the power supply chip, the test time is shorter when the temperature is higher than the test time when the temperature is lower than the test time, the probe 20 is fixed by the mounting plate 21, one gauge head of the multimeter is fixed inside the probe 20, the gauge head slides on the top of the slide rail 23 through the slide block 24, when the probe 20 passes through the bottom of the jack 3, the gauge head inside the probe 20 can be contacted with the pin of the power supply chip, so that the probe 20 is always contacted with, slide rail 23 through relative setting controls slider 24 and removes, makes another gauge outfit of universal meter contact with each participating in of power chip in proper order, tests power chip voltage electric current, judges power chip's good or bad, then takes out the power chip that will detect from examining test table top.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that changes may be made in the embodiments and/or equivalents thereof without departing from the spirit and scope of the invention. Any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. The utility model provides a testing arrangement of power chip production usefulness, is including the detection platform that is used for placing power chip, its characterized in that, it is provided with on the detection platform: the pressing device can longitudinally apply pressure for fixing;
the temperature control device is arranged at any end of the pressing device and used for controlling the temperature of the power supply chip fixed on the pressing device;
the plurality of detection holes of participating in, can self-holding power chip participate in, a plurality of detection hole bottoms of participating in are provided with the detection device who detects participating in.
2. The test device for power chip production according to claim 1, wherein: the temperature control device comprises a heating sheet.
3. The test device for power chip production according to claim 2, wherein: the pressing device comprises a pressing plate which can descend downwards and apply downward pressing force to the power chip, and the heating sheet is arranged on the bottom surface of the pressing plate; the temperature control device further comprises a temperature sensor arranged in the pressing plate.
4. The test device for power chip production according to claim 3, wherein: the pressing device further comprises a top plate, the top plate is located on the detection table and can ascend to apply upward pressing force to the power chip.
5. The test device for power chip production according to claim 1, wherein: participate in the inspection hole in be provided with automatic clamping device, automatic clamping device includes clamping piece and third spring, participates in the inspection hole lateral part and has the movable groove, the movable groove bottom surface is connected to third spring one end, the clamping piece is connected to one end, makes the clamping piece can horizontal concertina movement, the lower extreme is provided with leading-in inclined plane on the clamping piece, when power chip participates in the insertion participates in the inspection hole, the leading-in inclined plane of extrusion makes the clamping piece lateral shifting, the compression spring compression, the tight power chip of clamp participates in.
6. The test device for power chip production according to claim 5, wherein: the detection device comprises a probe and a slide rail, wherein the slide rail corresponds to the bottom of each pin detection hole, and the probe is arranged on the slide rail in a sliding manner and can move to the bottom of each pin detection hole.
7. The test device for power chip production according to claim 6, wherein: the detection device further comprises a sliding block, the bottom of the sliding block is movably clamped with the sliding rail, the upper portion of the sliding block is a cylindrical seat, and the probe is movably installed in the cylindrical seat up and down through a third spring.
8. The test device for power chip production according to claim 7, wherein: the probe is installed through the mounting panel, the mounting panel bottom is provided with the activity post, and the activity post alternates in the drum seat, the spring housing is on drum seat and activity post, and the third spring upper and lower end contacts bottom mounting panel and slider respectively.
9. The test device for power chip production according to claim 4, wherein: the detection table is characterized in that a plurality of sliding columns are arranged on the periphery of the detection table, a supporting plate is arranged at the tops of the sliding columns, a pressing plate is movably inserted into the sliding columns, a first air cylinder is arranged on the supporting plate, and the first air cylinder controls the pressing plate to lift.
10. The test device for power chip production according to claim 9, wherein: the bottom of the detection table is provided with a second cylinder which controls the top plate to lift.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011283010.2A CN112394280B (en) | 2020-11-17 | 2020-11-17 | Testing device for power chip production |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011283010.2A CN112394280B (en) | 2020-11-17 | 2020-11-17 | Testing device for power chip production |
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| CN112394280A true CN112394280A (en) | 2021-02-23 |
| CN112394280B CN112394280B (en) | 2024-05-28 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114812857A (en) * | 2022-03-25 | 2022-07-29 | 江苏柏林大通电子科技有限公司 | Temperature detection device for electronic capacitor machining |
| CN115575801A (en) * | 2022-12-07 | 2023-01-06 | 无锡昌鼎电子有限公司 | Chip detection device based on temperature change |
| CN115792582A (en) * | 2023-02-03 | 2023-03-14 | 珠海市杰理科技股份有限公司 | Chip testing method, device and equipment |
| CN116819287A (en) * | 2023-08-28 | 2023-09-29 | 成都电科星拓科技有限公司 | Power IC self-detection method |
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| CN115792582A (en) * | 2023-02-03 | 2023-03-14 | 珠海市杰理科技股份有限公司 | Chip testing method, device and equipment |
| CN116819287A (en) * | 2023-08-28 | 2023-09-29 | 成都电科星拓科技有限公司 | Power IC self-detection method |
| CN116819287B (en) * | 2023-08-28 | 2023-11-17 | 成都电科星拓科技有限公司 | Power IC self-detection method |
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