CN221199857U

CN221199857U - Novel integrated circuit testing device

Info

Publication number: CN221199857U
Application number: CN202322765261.XU
Authority: CN
Inventors: 林峰; 姜龙
Original assignee: Riyuexin Semiconductor Kunshan Co ltd
Current assignee: Riyuexin Semiconductor Kunshan Co ltd
Priority date: 2023-10-16
Filing date: 2023-10-16
Publication date: 2024-06-21
Anticipated expiration: 2033-10-16

Abstract

The utility model relates to the technical field of conduction testing, in particular to a novel integrated circuit testing device, wherein a LoadBoard board is arranged at the lower end of a Socket test seat, the Socket test seat and a LoadBoard board are fixedly connected through a switching PCB, meanwhile, the Socket test seat is arranged at the upper end of the switching PCB, and a LoadBoard board is arranged at the lower end of the switching PCB. According to the utility model, each PIN on the IC board can contact with the PIN needle on the Socket test seat, so that the test mode that the Pogo PIN needle point contacts with the IC PIN is adopted to replace the test mode that the integrated Socket contacts with the IC PIN in a surface manner, the product quality can be effectively improved, the maintenance efficiency is improved, and the cost is saved.

Description

Novel integrated circuit testing device

Technical Field

The utility model relates to the technical field of conduction testing, in particular to a novel integrated circuit testing device.

Background

Socket is mainly used for checking on-line single IC components and on-line short circuit conditions of all circuit networks, commonly called on-test, and analog device function and digital device logic function test. Is a standard test equipment for testing the electrical performance and electrical connection of on-line components to check production defects and bad components.

The Socket test seat is mainly divided into a manual flip-type structure, an automatic pressing structure and a double-buckle type pressing structure. Currently, a manual flip-type push-down Socket is generally in surface contact with an IC pin, which is easy to cause dirt residue, thereby causing quality problems.

Disclosure of utility model

The present utility model is directed to a novel integrated circuit testing device, which solves the problems set forth in the background art.

The technical scheme of the utility model is as follows: the utility model provides a novel integrated circuit test device, including Socket test seat and LoadBoard boards, loadBoard board sets up the lower extreme at Socket test seat, just carry out fixed connection through switching PCB between Socket test seat and the LoadBoard board, simultaneously Socket test seat sets up the upper end at switching PCB, loadBoard boards set up the lower extreme at switching PCB.

Still further, socket test seat is including the frame, be provided with the upper cover plate in the middle of the inside of frame, the lower extreme of upper cover plate is provided with the lower cover plate, connect through first perforation between upper cover plate and the lower cover plate, first perforation is seted up in the inside of upper cover plate.

Furthermore, the inner side edge of the frame is provided with a connecting hole, and the frame is connected with the lower cover plate through the connecting hole.

Further, a plurality of holes are formed in the lower cover plate.

Still further, the switching PCB is including the PCB bottom plate, offer the second perforation on the PCB bottom plate, carry out fixed connection through the second perforation between switching PCB and the Socket test seat.

Furthermore, one side of the second perforation is provided with a Pad part, and the transfer PCB is connected with Pin needles in the PCB bottom plate through the Pad part.

Furthermore, a plurality of Pad parts are arranged, and meanwhile, the Pad parts are in one-to-one correspondence with Pin needles in the Socket test seat.

Still further, the lower extreme of PCB bottom plate is provided with the bottom connecting needle, connect through the bottom connecting needle between switching PCB and LoadBoard boards.

The utility model provides a novel integrated circuit testing device through improvement, which has the following improvements and advantages compared with the prior art:

According to the utility model, the IC board is placed on the Pogo PIN needle of the Socket test seat, so that each PIN on the IC board can contact the PIN needle on the Socket test seat, and therefore, a test mode that the Pogo PIN needle point contacts the IC PIN is adopted to replace a test mode that the integrated Socket contacts the IC PIN in a surface manner, further, the product quality can be effectively improved, the maintenance efficiency is improved, and the cost is saved.

Drawings

The utility model is further explained below with reference to the drawings and examples:

FIG. 1 is a schematic diagram of a novel integrated circuit test apparatus of the present utility model;

Fig. 2 is a schematic structural view of the transfer PCB of the present utility model;

Reference numerals illustrate:

1. A frame; 2. switching the PCB; 201. a PCB base plate; 202. a second perforation; 203. pad part; 3. an upper cover plate; 4. a first perforation; 5. a connection hole; 6. LoadBoard plates.

Detailed Description

The following description of the embodiments of the present invention will be made clearly and completely with reference to the accompanying drawings, in which it is apparent that the embodiments described are only some embodiments of the present invention, but not all embodiments. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.

It should be noted that, in the description of the present invention, the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, only for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the apparatus or elements to be referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.

Furthermore, it should be understood that the dimensions of the various elements shown in the figures are not drawn to actual scale, e.g., the thickness or width of some layers may be exaggerated relative to other layers for ease of description.

It should be noted that like reference numerals and letters refer to like items in the following figures, and thus once an item is defined or illustrated in one figure, no further detailed discussion or description thereof will be necessary in the following description of the figures.

Referring to fig. 1-2, the present embodiment provides a novel integrated circuit testing device, which includes a Socket test Socket and LoadBoard boards 6. Wherein LoadBoard board 6 sets up the lower extreme at Socket test seat, and carries out fixed connection through switching PCB2 between Socket test seat and the LoadBoard board 6, and Socket test seat sets up the upper end at switching PCB2 simultaneously, and LoadBoard board 6 sets up the lower extreme at switching PCB 2.

In this embodiment, the Socket test Socket includes a frame 1, an upper cover plate 3, a base and a lower cover plate, wherein the lower cover plate is disposed at the lower end of the upper cover plate 3, the frame 1 is disposed at the upper end of the upper cover plate 3, and the base is disposed at the lower end of the lower cover plate. That is, the frame 1, the upper cover plate 3, the lower cover plate and the base are sequentially arranged from top to bottom. Specifically, in the process of assembling the Socket test seat, the upper cover plate 3 and the lower cover plate are connected through the first through hole 4, the frame 1 and the lower cover plate are connected through the connecting hole 5, and then the base is connected with the lower cover plate. It should be noted that, the first through hole 4 is formed inside the upper cover 3, and the connecting hole 5 is formed on an inner side of the frame 1.

In this embodiment, the lower cover plate is provided with a plurality of holes, and the Pogo PIN can be connected with the lower cover plate through the holes. Notably, the Pogo PIN needle has a telescopic structure, so that during the pressing down process, the Pogo PIN needle can achieve a telescopic effect.

Referring to fig. 2, fig. 2 is a schematic diagram of the structure of the transfer PCB2 in the present embodiment. As can be seen from fig. 2: the adapter PCB2 includes a PCB backplane 201. The PCB chassis 201 is provided with a second through hole 202, and specifically, the adapting PCB2 and the Socket test Socket are fixedly connected through the second through hole 202. In this embodiment, one side of the second perforation 202 is provided with a Pad part 203, and the lower end of the pcb substrate 201 is provided with a bottom connection pin. The patch PCB2 is connected with the Pin needles in the PCB chassis 201 through the Pad portion 203, and meanwhile, the Pad portion 203 is provided with a plurality of pads, and the Pad portions 203 are in one-to-one correspondence with the Pin needles in the Socket test seat. And meanwhile, the transfer PCB2 and the LoadBoard board 6 are connected through a bottom connecting pin.

Specifically, after the Socket test Socket is installed, the needle-shaped bottom of the Socket test Socket can be directly inserted into the jack in the LoadBoard board 6. Meanwhile, the IC board can be placed on the Pogo PIN needle of the Socket test seat, so that each PIN on the IC board can contact with the PIN needle on the Socket test seat. And then the hand tester is buckled on two sides of the Socket test seat, and the IC board is extruded downwards, so that the IC board is fully contacted with the PIN needle on the Socket test seat. Therefore, the test mode that the Pogo PIN needle points contact with the IC PINs is adopted to replace the test mode that the integrated Socket contacts with the IC PINs with the surface, the product quality can be effectively improved, the maintenance efficiency is improved, and the cost is saved.

Although embodiments of the present invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made therein without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a novel integrated circuit test device, its characterized in that, including Socket test seat and LoadBoard board (6), loadBoard board (6) set up the lower extreme at Socket test seat, just carry out fixed connection through switching PCB (2) between Socket test seat and LoadBoard board (6), simultaneously Socket test seat sets up the upper end at switching PCB (2), loadBoard board (6) set up the lower extreme at switching PCB (2).

2. The novel integrated circuit testing device according to claim 1, wherein the Socket testing seat comprises a frame (1), an upper cover plate (3) is arranged in the middle of the interior of the frame (1), a lower cover plate is arranged at the lower end of the upper cover plate (3), the upper cover plate (3) and the lower cover plate are connected through a first perforation (4), and the first perforation (4) is formed in the upper cover plate (3).

3. The novel integrated circuit testing device according to claim 2, wherein the inner side edge of the frame (1) is provided with a connecting hole (5), and the frame (1) is connected with the lower cover plate through the connecting hole (5).

4. A novel integrated circuit testing device according to claim 2 or 3, wherein a plurality of holes are formed in the lower cover plate.

5. The novel integrated circuit testing device according to claim 1, wherein the transfer PCB (2) comprises a PCB bottom plate (201), a second through hole (202) is formed in the PCB bottom plate (201), and the transfer PCB (2) and the Socket test seat are fixedly connected through the second through hole (202).

6. The novel integrated circuit testing device according to claim 5, wherein one side of the second through hole (202) is provided with a Pad part (203), and the transfer PCB (2) is connected with Pin pins in the PCB chassis (201) through the Pad part (203).

7. The novel integrated circuit testing device according to claim 6, wherein a plurality of Pad portions (203) are provided, and a plurality of Pad portions (203) are in one-to-one correspondence with Pin needles in a Socket test Socket.

8. The novel integrated circuit testing device according to claim 5, wherein a bottom connecting pin is arranged at the lower end of the PCB bottom plate (201), and the transfer PCB (2) and the LoadBoard board (6) are connected through the bottom connecting pin.