CN205595312U - A electric performance detection device for semiconductor chip - Google Patents
A electric performance detection device for semiconductor chip Download PDFInfo
- Publication number
- CN205595312U CN205595312U CN201521099128.4U CN201521099128U CN205595312U CN 205595312 U CN205595312 U CN 205595312U CN 201521099128 U CN201521099128 U CN 201521099128U CN 205595312 U CN205595312 U CN 205595312U
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- pin
- test
- test sheet
- semiconductor chip
- mounting seat
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Abstract
The utility model discloses an electric performance detection device for semiconductor chip, include: PCB base plate, at least a set of left side test group piece, at least a set of right side test group piece, left mount pad and right mount pad, left side test group piece, right side test group piece are constituteed by first test piece, the second test piece of parallel and vertical setting, and have the insulating layer between the first test piece, second test piece, and this is first tests piece, second test piece by central section, the first pin that is located central section both ends, second pin with be located the third pin constitution of central section lower extreme, first pin, second pin section tilt up central relatively. The utility model discloses electricity performance detection device has strengthened the pin of test group piece and semiconductor chip to be tested's contact pressure, is favorable to improving the pin of test group piece and the reliability of semiconductor chip to be tested electrical contact, has also improved life.
Description
Technical field
This utility model relates to a kind of electric property detection device, particularly relates to a kind of electric property detection device for semiconductor chip.
Background technology
In research and development, large-scale production and the Product checking of semiconductor chip, being required to test all kinds of performances of chip, chip test base is the critical component in test device.The function of test bench is that its function quality directly affects reliability and the accuracy of chip testing by electric signal and the transmission of electric current between chip positioning clamping and wiring board.Along with the speed of service of chip improves and the minimizing of electronic product size day by day, the requirement to electric property detection device performance improves the most day by day.Therefore, how to design a kind of more superior electric property detection device, become the direction that those skilled in the art make great efforts.
Summary of the invention
This utility model provides a kind of electric property detection device for semiconductor chip, this electric property detection device which increases the pin of test pack and the footprint pressure of semiconductor chip to be measured, be conducive to the pin improving test pack and the reliability of semiconductor chip to be measured electrical contact, also improve service life.
For reaching above-mentioned purpose, the technical solution adopted in the utility model is: a kind of electric property detection device for semiconductor chip, including: test on the left of PCB substrate, least one set and on the right side of pack, least one set, test pack, left mounting seat and right mounting seat, described left side test pack, right side test pack are flush-mounted in left mounting seat and right mounting seat respectively, and one for placing the object stage of chip to be measured between left mounting seat and right mounting seat；
Described left side test pack, test pack in right side is by the first test sheet that is parallel and that be vertically arranged, second test sheet composition, and first test sheet, between second test sheet, there is insulating barrier, this the first test sheet, second test sheet is by central authorities section, first pin at two ends, centrally located section, second pin and the 3rd pin composition of lower end, centrally located section, first pin, second pin opposite central section is inclined upwardly, described first test sheet, second test respective 3rd pin of sheet is for electrically connecting with PCB substrate, described first test sheet, second test respective first pin of sheet, second pin is for electrically connecting with chip to be measured.
Technique scheme is further improved technical scheme as follows:
1., in such scheme, also include that left cover and right cover plate, this left cover and right cover plate are respectively arranged in left mounting seat and right mounting seat.
2., in such scheme, described left cover and right cover plate all have venthole towards the end of object stage.
3. in such scheme, being respectively provided with back-to-back side between insulating barrier, or the first test sheet, the second test sheet and have insulating barrier between described first test sheet, the second test sheet, this insulating barrier is welding resistance green oil layer.
Owing to technique scheme is used, this utility model compared with prior art has the advantage that
1. this utility model is for the electric property detection device of semiconductor chip, which increase the pin of test pack and the footprint pressure of semiconductor chip to be measured, be conducive to the pin improving test pack and the reliability of semiconductor chip to be measured electrical contact, also improve service life；Secondly, its left cover and right cover plate all have venthole towards the end of object stage, effectively eliminate pin and the dust of semiconductor chip to be measured of test pack, improve electrical contact environment so that the pin of test pack is more preferable with what semiconductor chip to be measured contacted.
2. this utility model is for the electric property detection device of semiconductor chip, the inspection card device that it is provided utilizes lever principle and spring-return performance can release card smoothly, efficiently solve manual inspection card device and damage the unstable factor of card present in the inspection card process, can be with the detection card of efficient quick.
Accompanying drawing explanation
Accompanying drawing 1 is used for the electric property detection device structural representation of semiconductor chip for this utility model；
Accompanying drawing 2 is this utility model electric property detection device partial structurtes schematic diagram；
Accompanying drawing 3 is the partial structurtes schematic diagram of accompanying drawing 2；
Accompanying drawing 4 tests pack structural representation for this utility model；
Accompanying drawing 5 is the partial structurtes schematic diagram of accompanying drawing 4.
In the figures above: 1, PCB substrate；2, left side test pack；3, right side test pack；4, left mounting seat；5, right mounting seat；6, object stage；7, the first test sheet；8, the second test sheet；9, insulating barrier；101, central authorities section；102, the first pin；103, the second pin；104, the 3rd pin；11, left cover；12, right cover plate；13, venthole.
Detailed description of the invention
Below in conjunction with the accompanying drawings and this utility model is further described by embodiment:
Embodiment 1: a kind of electric property detection device for semiconductor chip, including: test on the left of PCB substrate 1, least one set and on the right side of pack 2, least one set, test pack 3, left mounting seat 4 and right mounting seat 5, described left side test pack 2, right side test pack 3 are flush-mounted in left mounting seat 4 and right mounting seat 5 respectively, and one for placing the object stage 6 of chip to be measured between left mounting seat 4 and right mounting seat 5；
Described left side test pack 2, test pack 3 in right side is by the first test sheet 7 that is parallel and that be vertically arranged, second test sheet 8 forms, and first test sheet 7, between second test sheet 8, there is insulating barrier 9, this the first test sheet 7, second test sheet 8 is by central authorities section 101, first pin 102 at two ends, centrally located section 101, 3rd pin 104 of the second pin 103 and lower end, centrally located section 101 forms, first pin 102, second pin 103 opposite central section 101 is inclined upwardly, described first test sheet 7, second respective 3rd pin 104 of test sheet 8 is for electrically connecting with PCB substrate 1, described first test sheet 7, second test respective first pin 102 of sheet 8, second pin 103 is for electrically connecting with chip to be measured.
Embodiment 2: a kind of electric property detection device for semiconductor chip, including: test on the left of PCB substrate 1, least one set and on the right side of pack 2, least one set, test pack 3, left mounting seat 4 and right mounting seat 5, described left side test pack 2, right side test pack 3 are flush-mounted in left mounting seat 4 and right mounting seat 5 respectively, and one for placing the object stage 6 of chip to be measured between left mounting seat 4 and right mounting seat 5；
Described left side test pack 2, test pack 3 in right side is by the first test sheet 7 that is parallel and that be vertically arranged, second test sheet 8 forms, and first test sheet 7, between second test sheet 8, there is insulating barrier 9, this the first test sheet 7, second test sheet 8 is by central authorities section 101, first pin 102 at two ends, centrally located section 101, 3rd pin 104 of the second pin 103 and lower end, centrally located section 101 forms, first pin 102, second pin 103 opposite central section 101 is inclined upwardly, described first test sheet 7, second respective 3rd pin 104 of test sheet 8 is for electrically connecting with PCB substrate 1, described first test sheet 7, second test respective first pin 102 of sheet 8, second pin 103 is for electrically connecting with chip to be measured.
Also including left cover 11 and right cover plate 12, this left cover 11 and right cover plate 12 are respectively arranged in left mounting seat 4 and right mounting seat 5.
Above-mentioned left cover 11 and right cover plate 12 all have venthole 13 towards the end of object stage 6.
Described first test sheet 7, second is tested and is respectively provided with insulating barrier 9 between sheet 8, or the first test sheet 7, second is tested the back-to-back side of sheet 8 and had insulating barrier 9, and this insulating barrier 9 is welding resistance green oil layer.
Use above-mentioned when the electric property detection device of semiconductor chip, which increase the pin of test pack and the footprint pressure of semiconductor chip to be measured, be conducive to the pin improving test pack and the reliability of semiconductor chip to be measured electrical contact, also improve service life；Secondly, its left cover and right cover plate all have venthole towards the end of object stage, effectively eliminate pin and the dust of semiconductor chip to be measured of test pack, improve electrical contact environment so that the pin of test pack is more preferable with what semiconductor chip to be measured contacted.
Above-described embodiment only for technology of the present utility model design and feature are described, its object is to allow person skilled in the art will appreciate that content of the present utility model and to implement according to this, can not limit protection domain of the present utility model with this.All equivalence changes made according to this utility model spirit or modification, all should contain within protection domain of the present utility model.
Claims (4)
1. the electric property detection device for semiconductor chip, it is characterized in that: including: test on the left of PCB substrate (1), least one set and on the right side of pack (2), least one set, test pack (3), left mounting seat (4) and right mounting seat (5), described left side test pack (2), right side test pack (3) are flush-mounted in left mounting seat (4) and right mounting seat (5) respectively, and one is positioned between left mounting seat (4) and right mounting seat (5) for placing the object stage (6) of chip to be measured；
nullDescribed left side test pack (2)、Right side test pack (3) is by the first test sheet (7) that is parallel and that be vertically arranged、Second test sheet (8) composition，And first test sheet (7)、Between second test sheet (8), there is insulating barrier (9)，This first test sheet (7)、Second test sheet (8) is by central authorities section (101)、First pin (102) at centrally located section (101) two ends、Second pin (103) and the 3rd pin (104) composition of centrally located section (101) lower end，First pin (102)、Second pin (103) opposite central section (101) is inclined upwardly，Described first test sheet (7)、Second test sheet (8) respective 3rd pin (104) is for electrically connecting with PCB substrate (1)，Described first test sheet (7)、Second test sheet (8) respective first pin (102)、Second pin (103) is for electrically connecting with chip to be measured.
Electric property detection device for semiconductor chip the most according to claim 1, it is characterized in that: also include that left cover (11) and right cover plate (12), this left cover (11) and right cover plate (12) are respectively arranged in left mounting seat (4) and right mounting seat (5).
Electric property detection device for semiconductor chip the most according to claim 2, it is characterised in that: described left cover (11) and right cover plate (12) all have venthole (13) towards the end of object stage (6).
Electric property detection device for semiconductor chip the most according to claim 1, it is characterized in that: between described first test sheet (7), the second test sheet (8), be respectively provided with insulating barrier (9), or the first test sheet (7), the second test sheet (8) back-to-back side have insulating barrier (9), and this insulating barrier (9) is welding resistance green oil layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521099128.4U CN205595312U (en) | 2015-12-25 | 2015-12-25 | A electric performance detection device for semiconductor chip |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201521099128.4U CN205595312U (en) | 2015-12-25 | 2015-12-25 | A electric performance detection device for semiconductor chip |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205595312U true CN205595312U (en) | 2016-09-21 |
Family
ID=56926540
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201521099128.4U Active CN205595312U (en) | 2015-12-25 | 2015-12-25 | A electric performance detection device for semiconductor chip |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205595312U (en) |
-
2015
- 2015-12-25 CN CN201521099128.4U patent/CN205595312U/en active Active
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