CN201839514U - PCB with a plurality of isolated areas - Google Patents
PCB with a plurality of isolated areas Download PDFInfo
- Publication number
- CN201839514U CN201839514U CN2010205655401U CN201020565540U CN201839514U CN 201839514 U CN201839514 U CN 201839514U CN 2010205655401 U CN2010205655401 U CN 2010205655401U CN 201020565540 U CN201020565540 U CN 201020565540U CN 201839514 U CN201839514 U CN 201839514U
- Authority
- CN
- China
- Prior art keywords
- line areas
- isolated
- multizone
- printed substrate
- areas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Images
Landscapes
- Structure Of Printed Boards (AREA)
Abstract
The utility model discloses a PCB (Printed Circuit Board) with a plurality of isolated areas, which comprises a first circuit area and a second circuit area, wherein the first circuit area and the second circuit area are mutually and physically isolated; and the first circuit area and the second circuit area are supplied power separately and adopts completely isolated reference grounds. The PCB with the plurality of isolated areas has the benefits that the areas which are isolated mutually and physically are adopted, and interference of easily-disturbed circuits is avoided by adopting separate power supply and completely isolated grounds for grounding, so that the stability of the PCB can be ensured.
Description
Technical field
The utility model relates to electronic applications, relates in particular to a kind of multizone and isolates printed substrate.
Background technology
Be distributed with the components and parts of multiple performance on the printed substrate, the mutual interference of meeting phase causes unstable properties between its parameter frequency or the power supply.Especially between analog circuit and the control circuit, be easy to generate interference signal between high-tension circuit and the low-voltage circuit, make that the operational environment of CPU is more abominable.In addition, have on the pcb board part caloric value big during, caloric value is bigger in the work, if temperature is too high, will influence some to temperature relatively responsive during operate as normal.
The utility model content
The technical problem that the utility model mainly solves provides a kind of antijamming capability that improves pcb board, and then the multizone of enhancing product performance is isolated printed substrate.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: provide a kind of multizone to isolate printed substrate, described wiring board comprises mutually physically-isolated first line areas and second line areas, power supply and adopting reference isolated fully respectively between described first line areas and second line areas.
The beneficial effects of the utility model are: the printed substrate that does not adopt multizone to isolate that is different from prior art is easy to generate the defective of interference, the utility model adopts mutual physically-isolated zone, and adopt power supply respectively and fully isolator ground connection solved interference between the circuit of easy interference, guaranteed the stability of pcb board.
Further, by heating area of isolation and thermo-responsive area of isolation are set, and will generate heat area of isolation and thermo-responsive area of isolation be away from setting, guaranteed that the electronic devices and components in the thermo-responsive zone can operate as normal, and the thermal source that is unlikely to be subjected to heating region disturbs.
Description of drawings
Fig. 1 is the structural representation of the utility model first embodiment;
Fig. 2 is the structural representation of the utility model second embodiment;
Fig. 3 is the structural representation of the utility model the 3rd embodiment.
Embodiment
By describing technology contents of the present utility model, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1, multizone of the present utility model is isolated first embodiment of printed substrate, comprise mutually physically-isolated first line areas 10 and second line areas 11, power supply and adopting reference isolated fully respectively between described first line areas 10 and second line areas 11.
The printed substrate that does not adopt multizone to isolate that is different from prior art is easy to generate the defective of interference, the utility model adopts mutual physically-isolated zone, and adopt power supply respectively and fully isolator ground connection solved interference between the circuit of easy interference, guaranteed the stability of pcb board.
Please in conjunction with Fig. 2, second embodiment of multizone isolation printed substrate of the present utility model comprises all technical characterictics of first embodiment, difference is that this multizone is isolated the printed substrate wiring board and also comprised tertiary circuit district 12, and described tertiary circuit district 12 is provided with CPU part circuit.
By the tertiary circuit district is set, CPU part circuit is isolated, can solve interference well to CPU, guarantee that the Control work of Controlled CPU is normally carried out.
Please in conjunction with Fig. 3, the 3rd embodiment of multizone isolation printed substrate of the present utility model comprises all technical characterictics of second embodiment, difference is that this multizone isolation printed substrate wiring board also comprises the 4th line areas 13 and the 5th line areas 14, described the 4th line areas 13 is provided with heater members, described the 5th line areas 14 is provided with heat-sensitive device, and described the 4th line areas 13 is away from the 5th line areas 14.
The interregional isolation strip 15 that sets up all insulation of above-mentioned mutual isolation, the width of this isolation strip 15 is between 7 millimeters～7.5 millimeters.
The above only is embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.
Claims (5)
1. a multizone is isolated printed substrate, it is characterized in that: described wiring board comprises physically-isolated first line areas and second line areas mutually, power supply and adopting reference isolated fully respectively between described first line areas and second line areas.
2. multizone according to claim 1 is isolated printed substrate, and it is characterized in that: described first line areas is provided with high-tension line part circuit, and described second line areas is provided with low-voltage circuit part circuit.
3. multizone according to claim 2 is isolated printed substrate, and it is characterized in that: described wiring board comprises the tertiary circuit district, and described tertiary circuit district is provided with CPU part circuit.
4. multizone according to claim 3 is isolated printed substrate, it is characterized in that: described wiring board comprises the 4th line areas and the 5th line areas, described the 4th line areas is provided with heater members, and described the 5th line areas is provided with heat-sensitive device, and described the 4th line areas is away from the 5th line areas.
5. isolate printed substrate according to each described multizone of claim 1～4, it is characterized in that: the interregional isolation strip that sets up all insulation of described mutual isolation, the width of described isolation strip is between 7 millimeters～7.5 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205655401U CN201839514U (en) | 2010-10-18 | 2010-10-18 | PCB with a plurality of isolated areas |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205655401U CN201839514U (en) | 2010-10-18 | 2010-10-18 | PCB with a plurality of isolated areas |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201839514U true CN201839514U (en) | 2011-05-18 |
Family
ID=44009615
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205655401U Expired - Fee Related CN201839514U (en) | 2010-10-18 | 2010-10-18 | PCB with a plurality of isolated areas |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201839514U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103179479A (en) * | 2011-12-23 | 2013-06-26 | 歌尔声学股份有限公司 | Bluetooth headset radio frequency sensitivity improvement method and bluetooth headset using same |
| CN112153812A (en) * | 2019-06-28 | 2020-12-29 | 深圳迈瑞生物医疗电子股份有限公司 | Circuit board and AED equipment |
-
2010
- 2010-10-18 CN CN2010205655401U patent/CN201839514U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103179479A (en) * | 2011-12-23 | 2013-06-26 | 歌尔声学股份有限公司 | Bluetooth headset radio frequency sensitivity improvement method and bluetooth headset using same |
| CN103179479B (en) * | 2011-12-23 | 2016-01-20 | 歌尔声学股份有限公司 | The bluetooth earphone of radio-frequency sensitivity of Bluetooth headset raising method and application the method |
| CN112153812A (en) * | 2019-06-28 | 2020-12-29 | 深圳迈瑞生物医疗电子股份有限公司 | Circuit board and AED equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN201839514U (en) | PCB with a plurality of isolated areas | |
| CN204634159U (en) | A kind of pcb board and use its liquid crystal indicator | |
| CN201797644U (en) | Printed circuit board (PCB) with impedance module | |
| CN203673427U (en) | Cooling fan intelligent control system applied to PC-BASED automation equipment | |
| CN201797652U (en) | Structure for splicing multiple different types of PCB boards | |
| WO2012010216A3 (en) | Configuring a field device in a system for distributing electrical energy | |
| CN201087975Y (en) | Printing circuit boards | |
| CN205726669U (en) | Zero-ohm resistor and wire structures | |
| CN204046923U (en) | Heat radiation pcb board | |
| CN203896582U (en) | High-efficiency heat radiation type PCB | |
| CN203659302U (en) | Direct-connection combination experimental board | |
| CN202837449U (en) | Intelligent socket test table | |
| CN202514222U (en) | Circuit board mounting device | |
| CN110309095B (en) | Multifunctional industrial controller mainboard | |
| CN204290681U (en) | A kind of frequency converter control panel of optimization | |
| CN205124210U (en) | Fire -retardant two -sided control panel of high -efficient heat dissipation | |
| CN202907334U (en) | High-efficiency heat-dissipation type PCB | |
| CN205178039U (en) | Wiring board | |
| CN204657696U (en) | Multi-functional environment-protection Iron Stand | |
| CN207718219U (en) | A kind of multiplex communication equipment for intelligent controller | |
| CN104349605B (en) | Printed circuit board and manufacturing methods | |
| CN202103039U (en) | Self-heat radiation circuit board | |
| CN203465308U (en) | Wiring structure of electric energy meter | |
| CN202052086U (en) | Heating module of electronic incense furnace | |
| CN202652181U (en) | I2C intelligent output circuit |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110518 Termination date: 20141018 |
|
| EXPY | Termination of patent right or utility model |