CN201839514U - PCB with a plurality of isolated areas - Google Patents

PCB with a plurality of isolated areas Download PDF

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Publication number
CN201839514U
CN201839514U CN2010205655401U CN201020565540U CN201839514U CN 201839514 U CN201839514 U CN 201839514U CN 2010205655401 U CN2010205655401 U CN 2010205655401U CN 201020565540 U CN201020565540 U CN 201020565540U CN 201839514 U CN201839514 U CN 201839514U
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CN
China
Prior art keywords
line areas
isolated
multizone
printed substrate
areas
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010205655401U
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Chinese (zh)
Inventor
龚文德
王青云
黄亦仁
张丰富
鲁科
冯成庚
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
SHENZHEN LONGJIANG INDUSTRIAL Co Ltd
Original Assignee
SHENZHEN LONGJIANG INDUSTRIAL Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by SHENZHEN LONGJIANG INDUSTRIAL Co Ltd filed Critical SHENZHEN LONGJIANG INDUSTRIAL Co Ltd
Priority to CN2010205655401U priority Critical patent/CN201839514U/en
Application granted granted Critical
Publication of CN201839514U publication Critical patent/CN201839514U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Abstract

The utility model discloses a PCB (Printed Circuit Board) with a plurality of isolated areas, which comprises a first circuit area and a second circuit area, wherein the first circuit area and the second circuit area are mutually and physically isolated; and the first circuit area and the second circuit area are supplied power separately and adopts completely isolated reference grounds. The PCB with the plurality of isolated areas has the benefits that the areas which are isolated mutually and physically are adopted, and interference of easily-disturbed circuits is avoided by adopting separate power supply and completely isolated grounds for grounding, so that the stability of the PCB can be ensured.

Description

Multizone is isolated printed substrate
Technical field
The utility model relates to electronic applications, relates in particular to a kind of multizone and isolates printed substrate.
Background technology
Be distributed with the components and parts of multiple performance on the printed substrate, the mutual interference of meeting phase causes unstable properties between its parameter frequency or the power supply.Especially between analog circuit and the control circuit, be easy to generate interference signal between high-tension circuit and the low-voltage circuit, make that the operational environment of CPU is more abominable.In addition, have on the pcb board part caloric value big during, caloric value is bigger in the work, if temperature is too high, will influence some to temperature relatively responsive during operate as normal.
The utility model content
The technical problem that the utility model mainly solves provides a kind of antijamming capability that improves pcb board, and then the multizone of enhancing product performance is isolated printed substrate.
For solving the problems of the technologies described above, the technical scheme that the utility model adopts is: provide a kind of multizone to isolate printed substrate, described wiring board comprises mutually physically-isolated first line areas and second line areas, power supply and adopting reference isolated fully respectively between described first line areas and second line areas.
The beneficial effects of the utility model are: the printed substrate that does not adopt multizone to isolate that is different from prior art is easy to generate the defective of interference, the utility model adopts mutual physically-isolated zone, and adopt power supply respectively and fully isolator ground connection solved interference between the circuit of easy interference, guaranteed the stability of pcb board.
Further, by heating area of isolation and thermo-responsive area of isolation are set, and will generate heat area of isolation and thermo-responsive area of isolation be away from setting, guaranteed that the electronic devices and components in the thermo-responsive zone can operate as normal, and the thermal source that is unlikely to be subjected to heating region disturbs.
Description of drawings
Fig. 1 is the structural representation of the utility model first embodiment;
Fig. 2 is the structural representation of the utility model second embodiment;
Fig. 3 is the structural representation of the utility model the 3rd embodiment.
Embodiment
By describing technology contents of the present utility model, structural feature in detail, realized purpose and effect, give explanation below in conjunction with execution mode and conjunction with figs. are detailed.
See also Fig. 1, multizone of the present utility model is isolated first embodiment of printed substrate, comprise mutually physically-isolated first line areas 10 and second line areas 11, power supply and adopting reference isolated fully respectively between described first line areas 10 and second line areas 11.
First line areas 10 is provided with high-tension line part circuit, and described second line areas 11 is provided with low-voltage circuit part circuit.
The printed substrate that does not adopt multizone to isolate that is different from prior art is easy to generate the defective of interference, the utility model adopts mutual physically-isolated zone, and adopt power supply respectively and fully isolator ground connection solved interference between the circuit of easy interference, guaranteed the stability of pcb board.
Please in conjunction with Fig. 2, second embodiment of multizone isolation printed substrate of the present utility model comprises all technical characterictics of first embodiment, difference is that this multizone is isolated the printed substrate wiring board and also comprised tertiary circuit district 12, and described tertiary circuit district 12 is provided with CPU part circuit.
By the tertiary circuit district is set, CPU part circuit is isolated, can solve interference well to CPU, guarantee that the Control work of Controlled CPU is normally carried out.
Please in conjunction with Fig. 3, the 3rd embodiment of multizone isolation printed substrate of the present utility model comprises all technical characterictics of second embodiment, difference is that this multizone isolation printed substrate wiring board also comprises the 4th line areas 13 and the 5th line areas 14, described the 4th line areas 13 is provided with heater members, described the 5th line areas 14 is provided with heat-sensitive device, and described the 4th line areas 13 is away from the 5th line areas 14.
The interregional isolation strip 15 that sets up all insulation of above-mentioned mutual isolation, the width of this isolation strip 15 is between 7 millimeters~7.5 millimeters.
The above only is embodiment of the present utility model; be not so limit claim of the present utility model; every equivalent structure or equivalent flow process conversion that utilizes the utility model specification and accompanying drawing content to be done; or directly or indirectly be used in other relevant technical fields, all in like manner be included in the scope of patent protection of the present utility model.

Claims (5)

1. a multizone is isolated printed substrate, it is characterized in that: described wiring board comprises physically-isolated first line areas and second line areas mutually, power supply and adopting reference isolated fully respectively between described first line areas and second line areas.
2. multizone according to claim 1 is isolated printed substrate, and it is characterized in that: described first line areas is provided with high-tension line part circuit, and described second line areas is provided with low-voltage circuit part circuit.
3. multizone according to claim 2 is isolated printed substrate, and it is characterized in that: described wiring board comprises the tertiary circuit district, and described tertiary circuit district is provided with CPU part circuit.
4. multizone according to claim 3 is isolated printed substrate, it is characterized in that: described wiring board comprises the 4th line areas and the 5th line areas, described the 4th line areas is provided with heater members, and described the 5th line areas is provided with heat-sensitive device, and described the 4th line areas is away from the 5th line areas.
5. isolate printed substrate according to each described multizone of claim 1~4, it is characterized in that: the interregional isolation strip that sets up all insulation of described mutual isolation, the width of described isolation strip is between 7 millimeters~7.5 millimeters.
CN2010205655401U 2010-10-18 2010-10-18 PCB with a plurality of isolated areas Expired - Fee Related CN201839514U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010205655401U CN201839514U (en) 2010-10-18 2010-10-18 PCB with a plurality of isolated areas

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010205655401U CN201839514U (en) 2010-10-18 2010-10-18 PCB with a plurality of isolated areas

Publications (1)

Publication Number Publication Date
CN201839514U true CN201839514U (en) 2011-05-18

Family

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010205655401U Expired - Fee Related CN201839514U (en) 2010-10-18 2010-10-18 PCB with a plurality of isolated areas

Country Status (1)

Country Link
CN (1) CN201839514U (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103179479A (en) * 2011-12-23 2013-06-26 歌尔声学股份有限公司 Bluetooth headset radio frequency sensitivity improvement method and bluetooth headset using same
CN112153812A (en) * 2019-06-28 2020-12-29 深圳迈瑞生物医疗电子股份有限公司 Circuit board and AED equipment

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103179479A (en) * 2011-12-23 2013-06-26 歌尔声学股份有限公司 Bluetooth headset radio frequency sensitivity improvement method and bluetooth headset using same
CN103179479B (en) * 2011-12-23 2016-01-20 歌尔声学股份有限公司 The bluetooth earphone of radio-frequency sensitivity of Bluetooth headset raising method and application the method
CN112153812A (en) * 2019-06-28 2020-12-29 深圳迈瑞生物医疗电子股份有限公司 Circuit board and AED equipment

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110518

Termination date: 20141018

EXPY Termination of patent right or utility model