CN201792429U - Wafer cutting device - Google Patents
Wafer cutting device Download PDFInfo
- Publication number
- CN201792429U CN201792429U CN2010205060580U CN201020506058U CN201792429U CN 201792429 U CN201792429 U CN 201792429U CN 2010205060580 U CN2010205060580 U CN 2010205060580U CN 201020506058 U CN201020506058 U CN 201020506058U CN 201792429 U CN201792429 U CN 201792429U
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- Prior art keywords
- wafer
- cutter sweep
- crane
- mounting table
- base
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Abstract
The utility model relates to a wafer cutting device which comprises a base, a wafer table, an erector and a cutting tool, wherein the wafer table is arranged on the top of the base; the erector is fixedly connected with the base; and the cutting tool is fixed on the erector, and is arranged above the wafer table. The wafer cutting device can cut an integrated circuit chip sample to be detected from a wafer without cutting off other parts of the wafer, omits the step of re-bonding the wafer, simplifies a process, improves the finished product manufacturing efficiency, simultaneously does not need to use any adhesive film, and reduces the cost.
Description
Technical field
The utility model relates to a kind of semiconductor manufacturing equipment, relates in particular to a kind of wafer cutter sweep.
Background technology
In the semiconductor technology manufacture process, after forming a plurality of IC chips on the wafer, carry out the step that physical characteristic is analyzed is carried out in described IC chip sampling, the step of described physical characteristic analysis can further guarantee the quality of IC chip, helps further to improve the qualification rate of dispatching from the factory.
In the prior art, carry out in the step that physical characteristic analyzes described, at first be will be from wafer peel sample, promptly cut one or several IC chip from wafer.Fig. 1 be in the prior art during from wafer draw samples step to the cutting schematic diagram of wafer, as shown in Figure 1, the method that prior art adopts is that whole wafer is cut, choose the IC chip 11 ' on the wafer 10 ', promptly wafer is cut along four tangent lines 12 ', described method has been cut into eight with wafer, and except that IC chip 11 ' to be detected, other parts of wafer 10 ' are divided into seven and spread out.The method of prior art makes troubles for follow-up making flow process: for example, need wafer is carried out probe test in the follow-up detection operation, described wafer probe testing procedure will be gone up each IC chip to wafer 10 ' and be numbered, and then part or all of wafer sort is carried out and is write down the result.This just need be bonded together once more at the wafer of aforementioned incision, and bonding again process not only process is complicated, and labor intensive lowers efficient, and purchases special adhesive film and also improved cost.
The utility model content
The technical problems to be solved in the utility model is, the device that provide a kind of when can cut an IC chip sample from wafer, does not cut off other parts of wafer.
For addressing the above problem, the utility model provides the wafer cutter sweep a kind of wafer cutter sweep, described wafer cutter sweep comprises base, wafer mounting table, crane and cutting tool, wherein said wafer mounting table is arranged at described base top, the fixedly connected described base of described crane, described cutting tool is fixedly arranged on described crane, and is positioned at the top of described wafer mounting table.
Further, described crane is inverted "L" shaped, and the fixedly connected described base of an end of described crane, the other end are positioned at described wafer mounting table top and parallel with described wafer mounting table.
Further, described wafer mounting table is connected by translating device with base, and described translating device can drive described wafer mounting table and move horizontally with respect to described base.
Optionally, described base is provided with the translating device control button.
Optionally, described crane is provided with the lifting control button.
Further, described cutting tool comprises motor and drill bit, the fixedly connected crane of described motor, and described drill bit is fixedly connected on the output shaft of described motor.
Preferably, the material of described drill bit is a diamond.
Further, described drill bit comprises drill bit fixed mount and grinding head.
Preferably, the material of described grinding head is a diamond dust.
When in sum, described wafer cutter sweep can cut IC chip sample to be detected from wafer, do not cut off other parts of wafer.Do not need to carry out wafer step for adhering again, simplified technological process, improve the make efficiency of finished product, do not need to use adhesive film to reduce cost simultaneously yet.
Description of drawings
Fig. 1 is to the cutting schematic diagram of wafer in the prior art.
Fig. 2 is a wafer cutter sweep schematic diagram described in the utility model one embodiment.
Fig. 3 is to the cutting schematic diagram of wafer among the utility model one embodiment.
Fig. 4 is the structural representation of cutting tool among the embodiment in the utility model.
The specific embodiment
For making content of the present utility model clear more understandable,, content of the present utility model is described further below in conjunction with Figure of description.Certainly the utility model is not limited to this specific embodiment, and the known general replacement of those skilled in the art also is encompassed in the protection domain of the present utility model.
Secondly, the utility model utilizes schematic diagram to carry out detailed statement, and when the utility model example was described in detail in detail, for convenience of explanation, schematic diagram did not amplify according to general ratio is local, should be with this as to qualification of the present utility model.
Fig. 2 is a wafer cutter sweep schematic diagram described in the utility model one embodiment, as shown in Figure 2, and in conjunction with above-mentioned core concept, the utility model provides a kind of wafer cutter sweep, described wafer cutter sweep comprises base 101, wafer mounting table 103, crane 107 and cutting tool 105, wherein said wafer mounting table 103 is arranged on the described base 101, described crane 107 fixedly connected described bases 101, described cutting tool 105 is fixedly arranged on described crane 107, and is positioned at the top of described wafer mounting table 103.
On the described base 101 wafer mounting table 103 is set, described wafer mounting table 103 is used for fixing the placement wafer, further, described wafer mounting table 103 and base 101 are connected by translating device (among the figure for expressing), and described translating device can drive described wafer mounting table 103 and move horizontally with respect to described base 101; Optionally, on described base 101, the translating device control button is set, described translating device control button can be two, set an orthogonal basic coordinates X-axis and Y-axis in the horizontal direction, for example wherein, the motion of a translating device control button 101a control X-direction, the motion of another translating device control button 101b control Y direction, can control the horizontal movement of described wafer mounting table 103 so exactly, control to described translating device can also be additive method in addition, as, described translating device and external control system (as computer etc.) are by the external control system controlled motion.
Described crane 107 is fixed on the described base 101, further, described crane 107 is inverted "L" shaped, the fixedly connected described base 101 of one end of described crane 107, the other end is positioned at described wafer mounting table 103 tops and parallel with described wafer mounting table 103, wherein said cutting tool 105 is fixed on the afterbody of the other end of described crane 107, towards wafer mounting table 103, when described like this crane 107 descends, described cutting tool 105 just can be near the wafer that is positioned on the described wafer mounting table 103, and wafer cut, in addition, described crane 107 can also be other shapes, as is " U " type: as described in two ends are fixed on the crane 107, described cutting tool 105 is positioned at the middle part of described crane 107, towards wafer mounting table 103.The structure of described crane 107 not exclusively restriction is described with said structure, and other can be fixed in cutting tool 105 directly over the described wafer mounting table 103, and the shape that highly can regulate, structure can thought range as crane 107 structures in.
Optionally, described crane 107 is provided with lifting control button 107a, described lifting control button 107a can control the vertical motion of described crane 107 exactly, control to described crane 107 can also be additive method in addition, as, described crane 107 and external control system (as computer etc.), by the external control system controlled motion.
Fig. 4 is the structural representation of cutting tool among the embodiment in the utility model, please refer to Fig. 4, described cutting tool 105 comprises motor 105a and drill bit 105b, the fixedly connected crane 107 of described motor 105a, described drill bit 105b is fixedly connected on the output shaft of described motor 105a, when motor 105a worked, the output shaft of described motor 105a drove drill bit 105b motion, can finish the cutting to wafer.Preferably, the material of described drill bit 105b is a diamond, because the material of wafer is a silicon, adopts diamond can reach good cutting effect.Further, described drill bit 105b comprises drill bit fixed mount and grinding head, and described drill bit fixed mount is fixedlyed connected with described motor output shaft, described grinding head is fixed on the described drill bit fixed mount, the grinding head indentation adopts zigzag grinding head cutting crystal wafer more tartly, raises the efficiency; Preferably, the material of described grinding head is a diamond dust.
Fig. 3 be in the utility model during from wafer draw samples step to the cutting schematic diagram of wafer, with reference to figure 3 and in conjunction with Fig. 2, the use of wafer cutter sweep described in the utility model one embodiment: with wafer 10 fixed placement in described wafer mounting table 103, start cutting tool 105 work, control lifting control button 107a, regulate the distance between cutting tool 105 and the wafer 10, controlling the translating device control button simultaneously makes IC chip to be detected 11 aim at cutting tool, cutting tool 105 is cut according to 12 pairs of wafers 10 of cut channel, IC chip to be detected 11 is cut.
When in sum, described wafer cutter sweep can cut IC chip to be detected 11 from wafer 10, do not cut off other parts of wafer.Do not need to carry out wafer 10 step for adhering again, simplified technological process, improve the make efficiency of finished product, do not need to use adhesive film to reduce cost simultaneously yet.
Though the utility model discloses as above with preferred embodiment; right its is not in order to limit the utility model; have in the technical field under any and know the knowledgeable usually; in not breaking away from spirit and scope of the present utility model; when doing a little change and retouching, therefore protection domain of the present utility model is as the criterion when looking claims person of defining.
Claims (9)
1. wafer cutter sweep, it is characterized in that, described wafer cutter sweep comprises base, wafer mounting table, crane and cutting tool, wherein said wafer mounting table is arranged on the described base, the fixedly connected described base of described crane, described cutting tool is fixedly arranged on described crane, and is positioned at the top of described wafer mounting table.
2. wafer cutter sweep as claimed in claim 1 is characterized in that described crane is inverted "L" shaped, and the fixedly connected described base of an end of described crane, the other end are positioned at described wafer mounting table top and parallel with described wafer mounting table.
3. wafer cutter sweep as claimed in claim 1 is characterized in that, described wafer mounting table is connected by translating device with base, and described translating device can drive described wafer mounting table and move horizontally with respect to described base.
4. wafer cutter sweep as claimed in claim 3 is characterized in that described base is provided with the translating device control button.
5. wafer cutter sweep as claimed in claim 1 is characterized in that described crane is provided with the lifting control button.
6. wafer cutter sweep as claimed in claim 1 is characterized in that described cutting tool comprises motor and drill bit, the fixedly connected crane of described motor, and described drill bit is fixedly connected on the output shaft of described motor.
7. wafer cutter sweep as claimed in claim 1 is characterized in that, the material of described drill bit is a diamond.
8. wafer cutter sweep as claimed in claim 1 is characterized in that described drill bit comprises drill bit fixed mount and grinding head.
9. wafer cutter sweep as claimed in claim 1 is characterized in that, the material of described grinding head is a diamond dust.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205060580U CN201792429U (en) | 2010-08-26 | 2010-08-26 | Wafer cutting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010205060580U CN201792429U (en) | 2010-08-26 | 2010-08-26 | Wafer cutting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201792429U true CN201792429U (en) | 2011-04-13 |
Family
ID=43847350
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010205060580U Expired - Fee Related CN201792429U (en) | 2010-08-26 | 2010-08-26 | Wafer cutting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201792429U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103831710A (en) * | 2012-11-27 | 2014-06-04 | 盛美半导体设备（上海）有限公司 | Grinding head with wafer detection device |
| CN112078036A (en) * | 2020-07-08 | 2020-12-15 | 大同新成新材料股份有限公司 | Cutting equipment for processing semiconductor graphite round crystal and cutting method thereof |
-
2010
- 2010-08-26 CN CN2010205060580U patent/CN201792429U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103831710A (en) * | 2012-11-27 | 2014-06-04 | 盛美半导体设备（上海）有限公司 | Grinding head with wafer detection device |
| CN103831710B (en) * | 2012-11-27 | 2017-07-25 | 盛美半导体设备（上海）有限公司 | Grinding head with wafer detecting apparatus |
| CN112078036A (en) * | 2020-07-08 | 2020-12-15 | 大同新成新材料股份有限公司 | Cutting equipment for processing semiconductor graphite round crystal and cutting method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20110413 Termination date: 20160826 |