CN208584113U - Wafer side laser code apparatus - Google Patents
Wafer side laser code apparatus Download PDFInfo
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- CN208584113U CN208584113U CN201821122839.2U CN201821122839U CN208584113U CN 208584113 U CN208584113 U CN 208584113U CN 201821122839 U CN201821122839 U CN 201821122839U CN 208584113 U CN208584113 U CN 208584113U
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- laser
- mobile vehicle
- movement carrier
- wafer
- slidably connected
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Abstract
The utility model provides a kind of wafer side laser code apparatus, which includes vacuum absorbing platform, laser, laser head, first movement carrier, the second mobile vehicle, control device；The vacuum absorbing platform and the laser head are spaced a distance setting；The laser head is set on the first movement carrier and connect with the laser；The first movement carrier is slidably connected with the laser head, and the first movement carrier is slidably connected with second mobile vehicle, and second mobile vehicle is set on a placement platform and is slidably connected with the placement platform；The first movement carrier and the second mobile vehicle are connect with the control device, and the control device controls the first movement carrier and the sliding of the second mobile vehicle；The vacuum absorbing platform is for placing and fixing wafer.It can realize using the technical program to wafer preparation and the whole process follow-up of quality and monitoring of subsequent chip fabrication processes.
Description
Technical field
The utility model relates to Laser Jet field, in particular to a kind of wafer side laser code apparatus.
Background technique
The wafer of the materials such as monocrystalline silicon, monocrystalline silicon carbide, sapphire is because it is with good physics, chemistry and photo electric
Can and be widely used in the fields such as LED substrate, microelectronic component and semiconductor devices.In such applications, it first has to prepare
Then satisfactory wafer forms chip in the designed circuit of crystal column surface preparation.In order to carry out quantity to wafer
Statistics, identification and quality monitoring, it usually needs be identified in crystal column surface stamp.Presently mainly in polished wafer table
Face edge carries out stamp, for the tracking and monitoring in subsequent chip fabrication process to product quality.And it is prepared in wafer early period
In the process, crystal column surface needs to lead to not by the manufacturing procedures such as grinding and polishing in crystal column surface stamp.Therefore, at present
It cannot realize that the preparation process for cutting rear wafer to line carries out tracking and monitoring to it by stamp mode.However, to realize to crystalline substance
Circle processing and chip prepare full-range stamp tracking and monitoring, it is necessary to using a kind of new stamp mode.
Utility model content
The purpose of the utility model is to overcome above-mentioned deficiencies in the prior art, provide a kind of wafer side laser and beat
Code device is realized to wafer preparation and the whole process follow-up of quality and monitoring of subsequent chip fabrication processes.
In order to solve above-mentioned some technical problems, the utility model provides a kind of wafer side Laser Jet dress
It sets, including vacuum absorbing platform, laser, laser head, first movement carrier, the second mobile vehicle, control device；The vacuum
Absorption platform and the laser head are spaced a distance setting；The laser head is set on the first movement carrier and passes through
Connection line of optic fibre is connect with the laser；The first movement carrier is slidably connected in a first direction with the laser head,
The first movement carrier is slidably connected in a second direction with second mobile vehicle, and second mobile vehicle is set to
It is slidably connected on third direction on one placement platform and with the placement platform；The first movement carrier and the second mobile load
Body is connect with the control device, and the control device controls the first movement carrier and the sliding of the second mobile vehicle；Institute
Vacuum absorbing platform is stated for placing and fixing wafer.
In a preferred embodiment, the first guide rail is provided on the first movement carrier, the laser head is described
It is slidably connected on first guide rail with the first movement carrier；It is provided with the second guide rail on second mobile vehicle, described
One mobile vehicle is slidably connected on second guide rail with second mobile vehicle.
In a preferred embodiment, the first direction, second direction, third direction are orthogonal two-by-two.
Compared to the prior art, the technical solution of the utility model have it is following the utility model has the advantages that
The utility model provides a kind of wafer side laser code apparatus, beats instead of traditional crystal column surface laser
Code method, after under wafer is cut from crystal bar, if directly in crystal column surface stamp, in processing such as subsequent grinding, polishings
Crystal column surface stamp pattern can be damaged in process, cause pattern that can not be identified, the utility model completely can be to avoid
The problem is, it can be achieved that wafer preparation and the whole process follow-up of quality and monitoring of subsequent chip fabrication processes.
Detailed description of the invention
Fig. 1 is wafer side laser code apparatus structural schematic diagram in the preferred embodiment in the utility model；
Fig. 2 is the bar code designed in the preferred embodiment in the utility model according to the lateral dimension of wafer；
Fig. 3 is that the wafer schematic diagram after Laser Jet is completed in the preferred embodiment in the utility model.
Fig. 4 is that the microscope for the bar code that laser etches on the side of wafer in the preferred embodiment in the utility model shines
Piece.
Specific embodiment
The utility model is described further below in conjunction with the drawings and specific embodiments.
A kind of wafer side laser code apparatus, with reference to Fig. 1, including vacuum absorbing platform 1, laser 5, laser head 3,
First movement carrier 41, the second mobile vehicle 42, control device 6；The vacuum absorbing platform 1 and the laser head 3 interval one
Section distance setting；The laser head 3 is set on the first movement carrier 41 and by connection line of optic fibre and the laser 5
Connection；The first movement carrier 41 is slidably connected in a first direction with the laser head 3, the first movement carrier 41 with
Second mobile vehicle 42 is slidably connected in a second direction, and second mobile vehicle 42 is set on a placement platform simultaneously
It is slidably connected on third direction with the placement platform；The first direction, second direction, third direction hang down mutually two-by-two
Directly；The first movement carrier 41 and the second mobile vehicle 42 are connect with the control device 6, and the control device 6 controls
The first movement carrier 41 and the sliding of the second mobile vehicle 42；The vacuum absorbing platform 1 is for placing and fixing wafer
2。
Specifically, the first guide rail 411 is provided on the first movement carrier 41, the laser head 3 is described first
It is slidably connected on guide rail 411 with the first movement carrier 41；The second guide rail 421 is provided on second mobile vehicle 42,
The first movement carrier 41 is slidably connected on second guide rail 421 with second mobile vehicle 42.
The application method using above-mentioned wafer side laser code apparatus, in the present embodiment, the crystalline substance is described below
Disk 2 using four inches sapphire wafers, specifically includes the following steps:
Step 1: adsorbing the wafer 2 on vacuum absorbing platform 1, the 2 place plane of wafer and the vacuum are inhaled
Attached platform 1 is parallel.
Step 2: control device 6 controls mobile first movement carrier 41 or the movement of the second mobile vehicle 42 or first movement
Carrier 41 moves simultaneously with the second mobile vehicle 42, and the laser head 3 is made to face the wafer on the vacuum absorbing platform 1
2, guarantee laser vertical irradiation derived from the laser head 3 on the vacuum absorbing platform 1.
Step 3: according to the constituent material of wafer 2 and the ruler for the specific code pattern for being engraved on 2 side of wafer
It is very little, laser processing parameter is set；Including optical maser wavelength, repetition rate, laser power, pulse width, laser scanning speed；At this
In embodiment, optical maser wavelength 355nm, repetition rate 20kHz, laser power 3W, pulse width 15ns, laser scanning speed are set
30mm/s；Other parameters can also be used, protection scope of this utility model cannot be limited by this.
Step 4: control device 6 generates the specific code pattern for marking the wafer 2, with reference to Fig. 2；The code pattern
Area be less than the wafer 2 lateralarea, with reference to Fig. 3；The side length of the wafer 2 and height are respectively
30.7mm and 648.5 μm, therefore the size of the code pattern is set as 26mm × 0.65mm.
Step 5: laser 5 launches laser via connection line of optic fibre from vertical irradiation after the laser head 3 export to crystalline substance
The side of disk 2, the focus of laser are placed exactly in the side of wafer 2；The side of the wafer 2, which generates, marks the wafer
The specific code pattern of piece 2, as shown in Figure 3.
Specifically, the material of wafer can be other wafer materials such as monocrystalline silicon, monocrystalline silicon carbide, sapphire, cannot
The protection scope of the utility model is limited with this.
The utility model provides a kind of wafer side laser code apparatus, beats instead of traditional crystal column surface laser
Code method, after under wafer is cut from crystal bar, if directly in crystal column surface stamp, in processing such as subsequent grinding, polishings
Crystal column surface stamp pattern can be damaged in process, cause pattern that can not be identified, the utility model completely can be to avoid
The problem is, it can be achieved that wafer preparation and the whole process follow-up of quality and monitoring of subsequent chip fabrication processes.
The preferable specific embodiment of the above, only the utility model, but the design concept of the utility model is not
It is confined to this, anyone skilled in the art within the technical scope disclosed by the utility model, utilizes this design
The change that unsubstantiality is carried out to the utility model belongs to the behavior for invading scope of protection of the utility model.
Claims (3)
1. a kind of wafer side laser code apparatus, it is characterised in that including vacuum absorbing platform, laser, laser head,
One mobile vehicle, the second mobile vehicle, control device；The vacuum absorbing platform is spaced a distance with the laser head and sets
It sets；The laser head is set on the first movement carrier and is connect by connection line of optic fibre with the laser；Described
One mobile vehicle is slidably connected in a first direction with the laser head, the first movement carrier and second mobile vehicle
It is slidably connected in a second direction, second mobile vehicle is set on a placement platform and with the placement platform in third
It is slidably connected on direction；The first movement carrier and the second mobile vehicle are connect with the control device, the control dress
Set the control first movement carrier and the sliding of the second mobile vehicle；The vacuum absorbing platform is for placing and fixing wafer
Piece.
2. wafer side according to claim 1 laser code apparatus, which is characterized in that on the first movement carrier
It is provided with the first guide rail, the laser head is slidably connected on first guide rail with the first movement carrier；Described second
The second guide rail is provided on mobile vehicle, the first movement carrier is sliding with second mobile vehicle on second guide rail
Dynamic connection.
3. wafer side according to claim 1 laser code apparatus, which is characterized in that the first direction, second
Direction, third direction are orthogonal two-by-two.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821122839.2U CN208584113U (en) | 2018-07-16 | 2018-07-16 | Wafer side laser code apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821122839.2U CN208584113U (en) | 2018-07-16 | 2018-07-16 | Wafer side laser code apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208584113U true CN208584113U (en) | 2019-03-08 |
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ID=65541031
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821122839.2U Active CN208584113U (en) | 2018-07-16 | 2018-07-16 | Wafer side laser code apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208584113U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108581250A (en) * | 2018-07-16 | 2018-09-28 | 华侨大学 | Wafer side laser code apparatus and its application method |
-
2018
- 2018-07-16 CN CN201821122839.2U patent/CN208584113U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108581250A (en) * | 2018-07-16 | 2018-09-28 | 华侨大学 | Wafer side laser code apparatus and its application method |
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