CN201781690U - 电路板 - Google Patents

电路板 Download PDF

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Publication number
CN201781690U
CN201781690U CN2010202656493U CN201020265649U CN201781690U CN 201781690 U CN201781690 U CN 201781690U CN 2010202656493 U CN2010202656493 U CN 2010202656493U CN 201020265649 U CN201020265649 U CN 201020265649U CN 201781690 U CN201781690 U CN 201781690U
Authority
CN
China
Prior art keywords
circuit board
electronic component
slotted eye
side edges
electronic parts
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010202656493U
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English (en)
Inventor
廖昌德
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ambit Microsystems Shanghai Ltd
Hon Hai Precision Industry Co Ltd
Original Assignee
Ambit Microsystems Shanghai Ltd
Hon Hai Precision Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ambit Microsystems Shanghai Ltd, Hon Hai Precision Industry Co Ltd filed Critical Ambit Microsystems Shanghai Ltd
Priority to CN2010202656493U priority Critical patent/CN201781690U/zh
Priority to US12/862,764 priority patent/US20120018209A1/en
Application granted granted Critical
Publication of CN201781690U publication Critical patent/CN201781690U/zh
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/182—Printed circuits structurally associated with non-printed electric components associated with components mounted in the printed circuit board, e.g. insert mounted components [IMC]
    • H05K1/183—Components mounted in and supported by recessed areas of the printed circuit board
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
    • H05K2201/09854—Hole or via having special cross-section, e.g. elliptical

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Structure Of Printed Boards (AREA)
  • Mounting Of Printed Circuit Boards And The Like (AREA)

Abstract

本实用新型的电路板边缘处设有用于安装电子零件的槽孔。所述槽孔包括多个侧边，每相邻侧边交界处设有贯孔。当电子零件安装于所述槽孔内时，所述电子零件与所述槽孔之侧边贴合，以实现可靠的定位。使用所述电路板，在安装电子零件时，可以有效避免电子零件与电路板之间的定位松动或定位干涉的问题，从而提高了产品的良率。

Description

电路板
技术领域
本实用新型涉及一种电路板，特别涉及一种具有用于安装电子零件的槽孔的电路板结构。
背景技术
由于消费性电子产品的设计日趋多样化，相对的做为承载电子零件的电路板(PCB)外形依照电子产品外形的多变有了不同形状的设计。请参阅图1及图2，电路板10之边缘常常需要设计用于安装电子零件的槽孔12，习知技术中，所述槽孔12每相邻侧边交界处均包括圆角，当装配电子零件20于所述槽孔12处时，则存在电子零件定位松动(如图1所示)或电子零件干涉(如图2所示)的问题，易造成产品的不良的可靠度。
实用新型内容
有鉴于此，需提供一种电路板，以解决电子零件定位松动或零件干涉的问题。
本实用新型的电路板边缘处设有用于安装电子零件的槽孔。所述槽孔包括多个侧边，每相邻侧边交界处设有贯孔。当所述电子零件安装于所述槽孔内时，所述电子零件与所述槽孔之侧边贴合，以实现可靠的定位。
作为本实用新型的进一步改进，所述侧边相互垂直。
使用本实用新型之电路板，在安装电子零件时，可以有效避免电子零件与电路板之间的定位松动或定位干涉的问题，从而提高了产品的良率。
附图说明
图1是习知技术中电路板与电子零件装配关系示意图。
图2是习知技术中电路板与电子零件装配关系的另一示意图。
图3是本实用新型之电路板与电子零件之间的装配关系分解示意图。
图4是图3所示的电子零件与电路板的组装示意图。
主要元件符号说明
电路板            10，30
槽孔              12，32
零件              20，40
贯孔              34
侧边              324
具体实施方式
请参阅图3及图4，电路板30边缘处设有槽孔32，所述槽孔32用于安装电子零件40。所述槽孔32包括多个侧边324。每相邻两个侧边324的交界处设有贯孔34。本实施方式中，所述侧边324相互垂直，也就是说所述槽孔32为方形槽孔，相应地，所述电子零件40与所述槽孔32配合的部份也呈方形。
贯孔34的设置使得所述槽孔32的侧边324之交界处具有直角过度的路径，避免了电子零件40安装于所述槽孔32内时与所述交界处的干涉，加强了所述电子零件40与所述槽孔32之侧边324贴合，以实现可靠的定位。
使用本实用新型之电路板，在安装电子零件时，可以有效避免电子零件与电路板之间的定位松动或定位干涉的问题，从而提高了产品的良率。

Claims (2)

1.一种电路板，所述电路板边缘处设有用于安装电子零件的槽孔，所述槽孔包括多个侧边，其特征在于，每相邻侧边交界处设有贯孔，当所述电子零件安装于所述槽孔内时，所述电子零件与所述槽孔之侧边贴合，以实现可靠的定位。
2.如权利要求1所述的电路板，其特征在于，所述侧边相互垂直。
CN2010202656493U 2010-07-21 2010-07-21 电路板 Expired - Fee Related CN201781690U (zh)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN2010202656493U CN201781690U (zh) 2010-07-21 2010-07-21 电路板
US12/862,764 US20120018209A1 (en) 2010-07-21 2010-08-25 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010202656493U CN201781690U (zh) 2010-07-21 2010-07-21 电路板

Publications (1)

Publication Number Publication Date
CN201781690U true CN201781690U (zh) 2011-03-30

Family

ID=43794888

Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010202656493U Expired - Fee Related CN201781690U (zh) 2010-07-21 2010-07-21 电路板

Country Status (2)

Country Link
US (1) US20120018209A1 (zh)
CN (1) CN201781690U (zh)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110686084A (zh) * 2018-07-06 2020-01-14 株式会社鹭宫制作所 电动阀以及冷冻循环系统

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR102046988B1 (ko) 2012-05-25 2019-11-20 삼성전자 주식회사 낮은 삽입력을 갖는 인쇄회로기판(ｐｃｂ), 그 제조방법, 및 그 ｐｃｂ를 포함하는 시스템
JP6527065B2 (ja) * 2015-10-02 2019-06-05 東芝メモリ株式会社 メモリカードスロット装置及び電子機器

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
SG48955A1 (en) * 1992-07-27 1998-05-18 Murata Manufacturing Co Multilayer electronic component method of manufacturing the same and method of measuring characteristics thereof
US6396136B2 (en) * 1998-12-31 2002-05-28 Texas Instruments Incorporated Ball grid package with multiple power/ground planes
TW465146B (en) * 1999-02-02 2001-11-21 Hon Hai Prec Ind Co Ltd Thermal expansion adjustment method of plate-shaped electronic devices and the structure thereof
US20070190747A1 (en) * 2006-01-23 2007-08-16 Tessera Technologies Hungary Kft. Wafer level packaging to lidded chips
CN101336042B (zh) * 2007-06-29 2012-05-16 鸿富锦精密工业（深圳）有限公司 焊盘、具有该焊盘的电路板和电子装置
KR20100075126A (ko) * 2008-12-24 2010-07-02 삼성전자주식회사 표시 장치

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110686084A (zh) * 2018-07-06 2020-01-14 株式会社鹭宫制作所 电动阀以及冷冻循环系统

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Publication number Publication date
US20120018209A1 (en) 2012-01-26

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C14 Grant of patent or utility model
GR01 Patent grant
C17 Cessation of patent right
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20110330

Termination date: 20110721