CN201708185U - Plane bracket - Google Patents
Plane bracket Download PDFInfo
- Publication number
- CN201708185U CN201708185U CN2010201831512U CN201020183151U CN201708185U CN 201708185 U CN201708185 U CN 201708185U CN 2010201831512 U CN2010201831512 U CN 2010201831512U CN 201020183151 U CN201020183151 U CN 201020183151U CN 201708185 U CN201708185 U CN 201708185U
- Authority
- CN
- China
- Prior art keywords
- welding
- pin
- area
- welding zone
- plane bracket
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
- H01L24/78—Apparatus for connecting with wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
- H01L2224/78—Apparatus for connecting with wire connectors
- H01L2224/787—Means for aligning
- H01L2224/78703—Mechanical holding means
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
- H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
- H01L2224/8512—Aligning
- H01L2224/85148—Aligning involving movement of a part of the bonding apparatus
- H01L2224/85169—Aligning involving movement of a part of the bonding apparatus being the upper part of the bonding apparatus, i.e. bonding head, e.g. capillary or wedge
- H01L2224/8518—Translational movements
- H01L2224/85181—Translational movements connecting first on the semiconductor or solid-state body, i.e. on-chip, regular stitch
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/10—Details of semiconductor or other solid state devices to be connected
- H01L2924/1015—Shape
- H01L2924/1016—Shape being a cuboid
- H01L2924/10162—Shape being a cuboid with a square active surface
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Connections Effected By Soldering, Adhesion, Or Permanent Deformation (AREA)
Abstract
The utility model discloses a plane bracket for encapsulating light emitting diodes. The plane bracket comprises two pins (1); one end of each pin is bent downward and extends forward; one of the pins extends forward to form a second welding area with smaller size, and the other pin extends forward to form a wafer fixing area (3) with larger size; and a compression area (5) compressed by a press claw of a welding machine extends from one side of the second welding area (2). By adopting the plane bracket provided by the utility model, the compression area of the second welding area (2) compressed by the press claw is changed, and poor welding wires resulted from bad contact between the second welding area of the plane bracket and a heating plate are reduced, so that the production yield is improved, the potential defects of products are reduced, and the market competitiveness of the products is improved.
Description
Technical field
The utility model relates to a kind of planar bracket of encapsulation LED.
Background technology
Light-emitting diode is a most very powerful and exceedingly arrogant current light source, and it has advantages such as energy-conserving and environment-protective, safe and reliable, long service life, is widely used in all trades and professions.Utilizing the planar bracket encapsulation LED is a kind of important method during present semiconductor components and devices is produced.This method mainly is that various types of wafers and IC are fixed on the planar bracket with the silver slurry, makes current lead-through through bonding wire craft again.
As shown in Figure 1, existing planar bracket comprises that two are in the pin 1 that same plane is separated from each other up and down, and the right-hand member of pin is bending downwards all, and extends to the right.Top pin extends to form second welding zone 2 than small size to the right, following pin extends to form a larger area crystal bonding area 3 (seeing also Fig. 2) to the right.
As shown in Figure 2, the general brilliant bonding wire craft admittedly that uses of the encapsulation of existing planar bracket, this technology is: Gu crystalline substance → bonding wire → press seal.Promptly elder generation as on the flat heating plate 8, is fixed in two pins 1 on the crystal bonding area 3 with wafer 4, is welded on the wafer 4 with the end of bonding wire porcelain mouth 9 with gold thread 6 again; Then, compress that top pin 1 (consulting Fig. 1), with bonding wire porcelain mouth 9 other end of gold thread 6 is welded in second welding zone 2 again with the paw 7 of welding machine.After bonding wire is finished, last press seal.
Yet, see also Fig. 2, in solid brilliant bonding wire process, because pin 1 plane height, second welding zone, 2 planes of planar bracket are low, promptly the pin and second welding zone connect into a stepped structure by an inclined plane not on same plane between two planes.When the paw 7 of welding machine pressed to the pin face, because the effect of lever principle, the just perk slightly of second welding zone 2 of front end can not normally contact with heating plate 8.Causing like this before the bonding wire can not normal heating, and when bonding wire porcelain mouth 9 pressed down bonding wire, second welding zone 2 can move downward along with pressing down of bonding wire porcelain mouth, bonding wire porcelain mouth bonding wire dynamics is shifted, cause broken string or rosin joint at last, thereby cause the bad or reliability variation of device, it is bad higher to hide property.
Summary of the invention
When the utility model carried out LED package in order to solve existing planar bracket, failure welding, the low technical problem of encapsulation yields proposed a kind of planar bracket with higher welding quality rate.
For solving the problems of the technologies described above, the planar bracket that the utility model proposes, comprise all bendings downwards of an end of two pins that are separated from each other, pin, and extend forward, wherein pin extends to form second welding zone than small size forward, the another pin extends to form a larger area crystal bonding area forward.One side of described second welding zone is extended one and is distinguished for pressing of compressing of welding machine paw.
Preferably, the described district that pressing is extended to the side near the another pin by second welding zone.
Compared with prior art, the utility model extends one at second welding zone of planar bracket and can distinguish for pressing of compressing of welding machine paw, so that paw is directly being pressed on second welding zone, make second welding zone and the following heating plate can comprehensive engagement, bonding wire can normal heating, overcome bad phenomenon such as broken string or rosin joint, thereby the hiding property that greatly reduces product is bad, has promoted product quality.According to the nearly check of test manufacture over the past half year, the welding yields is 99.7% by 99% original lifting, greatly reduces production cost, has improved the competitiveness of product in market.
Description of drawings
Fig. 1 is the floor map of existing planar bracket;
Fig. 2 be Figure 1A-A to the parting face, be the schematic diagram of existing planar bracket encapsulation;
Fig. 3 is the structural representation of the utility model planar bracket;
Fig. 4 be Figure 1B-B to the parting face, be the schematic diagram of the utility model planar bracket encapsulation.
Embodiment
Fig. 3 shows the planar structure of the utility model planar bracket embodiment, and described planar bracket comprises two pins that are separated from each other 1 up and down, and the right-hand member of (in conjunction with Fig. 4) pin is bending downwards all, and extends to the right.Wherein a pin (top pin) extends to form one to the right than second welding zone 2 of small size and another pin (following pin) extends to form a larger area crystal bonding area 3 to the right.Extend one in a side of second welding zone 2 and distinguish 5 for pressing of compressing of welding machine paw 7.In the present embodiment, pressing and distinguishing 5 side extensions by second welding zone 2 pin 1 below close.Pressing as required and distinguishing 5 and also can extend, for example, extending to a side away from following pin 1 to other directions.
As shown in Figure 3 and Figure 4, the method for packing of the utility model planar bracket, step is as follows:
In the above-mentioned technology, the pressure limit that paw 7 compresses second welding zone 2 and crystal bonding area 3 is 100～300 grams, and according to different pin material and sizes, but preferred pressure is 150 grams, 200 grams, 250 grams.Can guarantee that under this pressure second welding zone and crystal bonding area can perks.The temperature range of the heating crystal bonding area 3 and second welding zone 2 is 160～300 degrees centigrade, and preferably temperature value is 180,200,230,280 degrees centigrade as required.Under this temperature, gold thread is fully combined with support coating, guarantee the bonding wire quality.
The experiment proved that, the novel encapsulated method that the utility model proposes, having changed pressing of paw distinguishes, minimizing is bad owing to planar bracket second welding zone contacts the bad bonding wire that produces with heating plate, thereby improved the production yields, it is bad to have reduced the hiding property of product, has increased the competitiveness of product in market.
Claims (2)
1. planar bracket, comprise two pins (1), one end of pin is bending downwards all, and extend forward, pin extends to form second welding zone (2) forward, the another pin extends to form crystal bonding area (3) forward, it is characterized in that a side of described second welding zone (2) is extended one and pressed district (5) for what welding machine paw (7) compressed.
2. planar bracket as claimed in claim 1 is characterized in that: the described district (5) that pressing is extended to the side near another pin (1) by second welding zone (2).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201831512U CN201708185U (en) | 2010-04-30 | 2010-04-30 | Plane bracket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2010201831512U CN201708185U (en) | 2010-04-30 | 2010-04-30 | Plane bracket |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201708185U true CN201708185U (en) | 2011-01-12 |
Family
ID=43445339
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2010201831512U Expired - Lifetime CN201708185U (en) | 2010-04-30 | 2010-04-30 | Plane bracket |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201708185U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101834267A (en) * | 2010-04-30 | 2010-09-15 | 深圳市奥伦德元器件有限公司 | Planar bracket and encapsulating method |
-
2010
- 2010-04-30 CN CN2010201831512U patent/CN201708185U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101834267A (en) * | 2010-04-30 | 2010-09-15 | 深圳市奥伦德元器件有限公司 | Planar bracket and encapsulating method |
| CN101834267B (en) * | 2010-04-30 | 2013-07-10 | 深圳市奥伦德元器件有限公司 | Planar bracket and encapsulating method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| AV01 | Patent right actively abandoned |
Granted publication date: 20110112 Effective date of abandoning: 20130710 |
|
| AV01 | Patent right actively abandoned |
Granted publication date: 20110112 Effective date of abandoning: 20130710 |
|
| RGAV | Abandon patent right to avoid regrant |