CN201689913U - 一种结构简单的led封装结构 - Google Patents
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Abstract
一种结构简单的LED封装结构,LED封装技术。包括基板及绝缘层,并在基板上设置多个安装区:基板上开制多个通孔,绝缘层是通过射出成型的方式避开基板上的多个所述安装区将塑胶覆盖于基板上及同时灌注于每个所述通孔中一次成型的,在注射成型绝缘层的同时,以基板上的每个所述安装区为槽底面形成沉坑形的具有安装功能和反光功能的安装槽;在所述安装区即所述安装槽的槽底面上设置安装座及电极点,安装座上安装LED发光芯片,所述安装槽的槽口设置具有卡接功能的卡扣,通过该卡扣将设置于所述安装槽上的透光体与所述安装槽卡接。有益效果在于:封装结构及封装工序简单,效果好,生产效率高,适宜规模化生产,产品品质非常可靠。
Description
技术领域
本实用新型涉及一种LED封装技术,尤其是一种结构简单的LED封装结构。
背景技术
近些年来,随着制造成本的下降和发光效率、光衰等技术瓶颈的突破,我国的LED照明产业进入了加速发展阶段,应用市场迅速增长,这导致了LED封装产品的巨大市场,使我国成为国际上LED封装的第一产量大国。
传统的LED封装有很多种,申请号为2006 1 0 1 4209 1.8的专利中提出了一种LED封装结构:包括:一双层式基板、至少一芯片、至少二连结导线,以及将上述至少一芯片及至少二连结导线包覆结合于双层式基板的胶体,其中该双层式基板主要于一绝缘基板上设置有导电图案,并于顶面涂布一层隔离胶,且涂布隔离胶时顶面预留有结合区及数个电极区,该芯片则结合于结合区中,同时该芯片通过二连结导线与导电图案连结导通,再通过胶体点封于结合区,以完成LED封装。然而,此种传统的LED封装方式,虽较之前支架式的LED封装结构,在体积上有所减小,但仍具有一定的体积,而在科技日新月异的现代,每一种电子产品均标谤轻、薄、短、小,因此这种传统的LED封装结构已不符现代产品的需求;再者此种在基板表面上封装LED芯片,会使LED芯片侧面发出的光不能得到有效的利用而浪费掉了。
申请号为200680018945.X的专利中又提出了一种LED用基板及LED封装:包括LED用基板,其特征在于,在散热部的平坦面上接合穿设有LED安装孔的绝缘层,在所述绝缘层上设置有构成布线图案的布线部。其特征在于,在所述LED用基板1的LED安装孔内,在散热部上封装LED芯片,LED芯片与布线部电连接。此种LED封装结构虽然提高了LED芯片的出光效率,而且所述的LED用基板也有效地解决了LED芯片发光时产生的热量迅速散热的问题,但是所述的LED用基板结构却比较复杂,生产工艺繁琐,不适用于批量生产,难以提高生产效率。
实用新型内容
本实用新型所要解决的技术问题是克服现有技术的上述不足,提供一种结构简单的LED封装结构,其适用于批量生产并能提高生产效率,生产工艺成熟并可靠。
本实用新型一种结构简单的LED封装结构,包括基板及绝缘层,并在基板上设置多个安装区:基板上开制多个通孔,绝缘层是通过射出成型的方式避开基板上的多个所述安装区将塑胶覆盖于基板上及同时灌注于每个所述通孔中一次成型的,在注射成型绝缘层的同时,以基板上的每个所述安装区为槽底面形成沉坑形的安装槽;在所述安装区即所述安装槽的槽底面上设置安装座及电极点,安装座上安装LED发光芯片,安装座与电极点电性连接,电极点与相应的电路电性连接;所述安装槽的侧壁形成反射LED发光芯片发出的光线的反光面,使LED发光芯片发出的光线充分有效利用;所述安装槽的槽口设置具有卡接功能的卡扣,通过该卡扣将设置于所述安装槽上的透光体与所述安装槽卡接。实际上,安装槽既具有安装功能,又具有反光功能。
对上述技术方案进行进一步阐述:
所述卡扣通过射出成型与绝缘层一体成型。
所述卡扣为所述安装槽的槽口向外侧伸的凸沿。
所述透光体呈片状,其朝向LED发光芯片的那一表面涂布有荧光粉层。
基板为印刷电路板,或为单层或为双层,或为金属基板或为非金属基板。
所述绝缘层的材质可为一般的塑胶类,如PMMA,PPA,PBI,ABS等。
所述透光体的材质可以是玻璃,或是透光的塑胶类,如PMMA,PC,PS等。
本实用新型同现有技术相比,有益效果在于:
其一,本实用新型利用射出成型的方式将塑胶覆盖于基板上及绝缘通孔中,使绝缘层、安装槽、安装槽的具有反射作用的侧壁及安装槽的槽口上的卡扣一体成型,大大简化了LED封装结构,适用于大批量生产,更有利于提高生产效率。
其二,通过基板上的通孔中与绝缘层同时灌注,使将绝缘层与基板牢牢固定住,不但结构工序简单,而且效果好。
其三,射出成型工艺目前已经非常成熟,从而使产品品质非常可靠。
其四,利用本实用新型取代传统LED封装,不但在传统LED封装的基础上更有效且大幅度缩减LED的体积,由于LED芯片是直接封装在基板上,若是高散热型基板,还可以有效地提高其散热的效率。
其五,本实用新型的所述透光体采用了玻璃或可透光的塑胶加荧光粉涂布的结构,代替传统的树脂加荧光粉填充结构,不但制作工艺简单,成本低,还有效地加速了LED芯片发光时热量的散发,降低了荧光粉因直接高温老化的速度。
附图说明
图1是本实用新型LED用基板的剖视图。
图2是本实用新型LED用基板及LED封装的剖视图。
图3是本实用新型多个LED发光芯片封装剖视图。
图4是本实用新型的透光体为弧形面的剖视图。
图中:1、基板;2、绝缘层;3、安装区:4、通孔,5、安装槽;6、安装座;7、电极点;8、LED发光芯片;9、卡扣;10、透光体;11、荧光粉层。
具体实施方式
如图1、图2、图3和图4所示,本实用新型一种结构简单的LED封装结构,包括基板1及绝缘层2,并在基板1上设置多个安装区3:基板1上开制多个通孔4,绝缘层2是通过射出成型的方式避开基板1上的每个所述安装区3将塑胶覆盖于基板1上及同时灌注于多个所述通孔4中一次成型的,在注射成型绝缘层2的同时,以基板1上的每个所述安装区3为槽底面形成沉坑形的安装槽5;在所述安装区3即所述安装槽5的槽底面上设置安装座6及电极点7,安装座6上安装LED发光芯片8,安装座6与电极点7电性连接,电极点7与相应的电路电性连接;所述安装槽5的侧壁形成反射LED发光芯片8发出的光线的反光面;所述安装槽5的槽口设置具有卡接功能的卡扣9,通过该卡扣9将设置于所述安装槽5上的透光体10与所述安装槽5卡接。实际上,安装槽5既具有安装功能,又具有反光功能。
所述卡扣9通过射出成型与绝缘层2一体成型。
所述卡扣9为所述安装槽5的槽口向外侧伸的凸沿。
所述透光体10呈片状,其朝向LED发光芯片8的那一表面涂布有荧光粉层11。片状的所述透光体10可制作成平面状的(如图2所示),或弧形面状的(如图4所示)。
基板1为印刷电路板,或为单层或为双层,或为金属基板或为非金属基板。
所述绝缘层2的材质可为一般的塑胶类,如PMMA,PPA,PBI,ABS等。
所述透光体10的材质可以是玻璃,或是透光的塑胶类,如PMMA,PC,PS等。
本实用新型制作与封装时,先制作基板1,其上开制通孔4,设置好安装区3,再通过射出成型的方式在基板1制作绝缘层2,并将通孔4灌注,同时一次成型好具有反光功能和安装功能的安装槽5及其上的卡扣9,接着安装LED发光芯片8,卡接盖合透光体10即可,在一个安装区3上,可安装一个LED发光芯片8(如图2所示),也可安装两个或更多个LED发光芯片8(如图3所示),封装结构及封装工序都很简单。
上面详细描述了本实用新型的具体实施例。但应当理解,本实用新型的实施方式并不仅限于这些实施例,这些实施例的描述仅用于帮助理解本实用新型的精神。在本实用新型所揭示的精神下,对本实用新型所作的各种变化例,都应包含在本实用新型的范围内。本实用新型的专利保护范围应当由所附的权利要求书来限定。
Claims (4)
1.一种结构简单的LED封装结构,包括基板(1)及绝缘层(2),并在基板(1)上设置多个安装区(3):其特征在于:基板(1)上开制多个通孔(4),绝缘层(2)是通过射出成型的方式避开基板(1)上的每个所述安装区(3)将塑胶覆盖于基板(1)上及同时灌注于多个所述通孔(4)中一次成型的,在注射成型绝缘层(2)的同时,以基板(1)上的每个所述安装区(3)为槽底面形成沉坑形的具有安装功能及反光功能的安装槽(5);在所述安装区(3)即所述安装槽(5)的槽底面上设置安装座(6)及电极点(7),安装座(6)上安装LED发光芯片(8),安装座(6)与电极点(7)电性连接,电极点(7)与相应的电路电性连接;所述安装槽(5)的侧壁形成反射LED发光芯片(8)发出的光线的反光面;所述安装槽(5)的槽口设置具有卡接功能的卡扣(9),通过该卡扣(9)将设置于所述安装槽(5)上的透光体(10)与所述安装槽(5)卡接。
2.根据权利要求1所述的一种结构简单的LED封装结构,其特征在于:所述卡扣(9)通过射出成型与绝缘层(2)一体成型。
3.根据权利要求1所述的一种结构简单的LED封装结构,其特征在于:所述卡扣(9)为所述安装槽(5)的槽口向外侧伸的凸沿。
4.根据权利要求1所述的一种结构简单的LED封装结构,其特征在于:所述透光体(10)呈片状,其朝向LED发光芯片(8)的那一表面涂布有荧光粉层(11)。
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WO2011140940A1 (zh) * | 2010-05-13 | 2011-11-17 | Shen Lihao | 一种结构简单的led封装结构 |
CN104269115A (zh) * | 2014-10-22 | 2015-01-07 | 宜兴市远光电子有限公司 | 一种插件式led数码管套件支架或符号套件支架 |
CN112151657A (zh) * | 2020-10-16 | 2020-12-29 | 佛山市馨园照明科技有限公司 | 用于母猪养殖的led灯的封装结构及其使用方法 |
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JP2007311445A (ja) * | 2006-05-17 | 2007-11-29 | Stanley Electric Co Ltd | 半導体発光装置及びその製造方法 |
TWI313943B (en) * | 2006-10-24 | 2009-08-21 | Chipmos Technologies Inc | Light emitting chip package and manufacturing thereof |
CN201430163Y (zh) * | 2009-06-25 | 2010-03-24 | 福建中科万邦光电股份有限公司 | 一种新型led单个底座的封装结构 |
CN201689913U (zh) * | 2010-05-13 | 2010-12-29 | 沈李豪 | 一种结构简单的led封装结构 |
-
2010
- 2010-05-13 CN CN2010202012443U patent/CN201689913U/zh not_active Expired - Fee Related
-
2011
- 2011-05-03 WO PCT/CN2011/073597 patent/WO2011140940A1/zh active Application Filing
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
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WO2011140940A1 (zh) * | 2010-05-13 | 2011-11-17 | Shen Lihao | 一种结构简单的led封装结构 |
CN104269115A (zh) * | 2014-10-22 | 2015-01-07 | 宜兴市远光电子有限公司 | 一种插件式led数码管套件支架或符号套件支架 |
CN112151657A (zh) * | 2020-10-16 | 2020-12-29 | 佛山市馨园照明科技有限公司 | 用于母猪养殖的led灯的封装结构及其使用方法 |
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