CN201689875U - 晶圆位置校准件 - Google Patents
晶圆位置校准件 Download PDFInfo
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- CN201689875U CN201689875U CN2010202161363U CN201020216136U CN201689875U CN 201689875 U CN201689875 U CN 201689875U CN 2010202161363 U CN2010202161363 U CN 2010202161363U CN 201020216136 U CN201020216136 U CN 201020216136U CN 201689875 U CN201689875 U CN 201689875U
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CN2010202161363U CN201689875U (zh) | 2010-06-04 | 2010-06-04 | 晶圆位置校准件 |
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CN2010202161363U CN201689875U (zh) | 2010-06-04 | 2010-06-04 | 晶圆位置校准件 |
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CN201689875U true CN201689875U (zh) | 2010-12-29 |
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CN2010202161363U Expired - Fee Related CN201689875U (zh) | 2010-06-04 | 2010-06-04 | 晶圆位置校准件 |
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Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103367194A (zh) * | 2012-03-26 | 2013-10-23 | 上海宏力半导体制造有限公司 | 一种用于晶圆传送位置校正的装置及方法 |
CN111640694A (zh) * | 2020-06-01 | 2020-09-08 | 上海精测半导体技术有限公司 | 一种晶圆上片系统的校准和监控方法及晶圆上片系统 |
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2010
- 2010-06-04 CN CN2010202161363U patent/CN201689875U/zh not_active Expired - Fee Related
Cited By (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN103367194A (zh) * | 2012-03-26 | 2013-10-23 | 上海宏力半导体制造有限公司 | 一种用于晶圆传送位置校正的装置及方法 |
CN103367194B (zh) * | 2012-03-26 | 2016-08-24 | 上海华虹宏力半导体制造有限公司 | 一种用于晶圆传送位置校正的装置及方法 |
CN111640694A (zh) * | 2020-06-01 | 2020-09-08 | 上海精测半导体技术有限公司 | 一种晶圆上片系统的校准和监控方法及晶圆上片系统 |
CN111640694B (zh) * | 2020-06-01 | 2021-09-28 | 上海精测半导体技术有限公司 | 一种晶圆上片系统的校准和监控方法及晶圆上片系统 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
ASS | Succession or assignment of patent right |
Owner name: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (BEIJING Free format text: FORMER OWNER: SEMICONDUCTOR MANUFACTURING INTERNATIONAL (SHANGHAI) CORPORATION Effective date: 20130221 |
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C41 | Transfer of patent application or patent right or utility model | ||
COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 201203 PUDONG NEW AREA, SHANGHAI TO: 100176 DAXING, BEIJING |
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TR01 | Transfer of patent right |
Effective date of registration: 20130221 Address after: 100176 No. 18 Wenchang Avenue, Beijing economic and Technological Development Zone Patentee after: Semiconductor Manufacturing International (Beijing) Corporation Address before: 201203 Shanghai City, Pudong New Area Zhangjiang Road No. 18 Patentee before: Semiconductor Manufacturing International (Shanghai) Corporation |
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CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101229 Termination date: 20180604 |
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CF01 | Termination of patent right due to non-payment of annual fee |