CN201686766U - Silicon wafer cleaning and texturing slot - Google Patents

Silicon wafer cleaning and texturing slot Download PDF

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Publication number
CN201686766U
CN201686766U CN2010202081710U CN201020208171U CN201686766U CN 201686766 U CN201686766 U CN 201686766U CN 2010202081710 U CN2010202081710 U CN 2010202081710U CN 201020208171 U CN201020208171 U CN 201020208171U CN 201686766 U CN201686766 U CN 201686766U
Authority
CN
China
Prior art keywords
slot
heating pipe
heating tube
texturing
cleaning
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN2010202081710U
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Chinese (zh)
Inventor
王瑞勋
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Changzhou EGing Photovoltaic Technology Co Ltd
Original Assignee
Changzhou EGing Photovoltaic Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Changzhou EGing Photovoltaic Technology Co Ltd filed Critical Changzhou EGing Photovoltaic Technology Co Ltd
Priority to CN2010202081710U priority Critical patent/CN201686766U/en
Application granted granted Critical
Publication of CN201686766U publication Critical patent/CN201686766U/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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  • Photovoltaic Devices (AREA)

Abstract

The utility model relates to a silicon wafer cleaning and texturing slot, which comprises a slot body and a heating pipe, wherein the slot bottom of the slot body is provided with a supporting frame of the heating pipe; and the distance between a limiting slot of the heating pipe to the slot bottom of the slot body is 1/5-1/4 of the height of the liquid level. As the silicon wafer cleaning and texturing slot is internally and additionally provided with the supporting frame of the heating pipe, the heating pipe is limited by the limiting slot of the heating pipe on the supporting frame of the heating pipe, and the supporting frame of the heating pipe is used for separating the heating pipe, the slot wall and the slot bottom of the cleaning and texturing slot, thereby avoiding the direction contact of the heating pipe, the slot wall and the slot bottom of the cleaning and texturing slot and ensuring the cleaning and texturing slot not to be damaged by fire at high temperature. When in heating, the temperature on the heating pipe can be dispersed all around the solution in the slot uniformly, thereby ensuring the uniformity of the temperature of the solution in the slot and also ensuring the production safety.

Description

Silicon chip cleaning and texturing slot
[technical field]
The utility model relates to a kind of battery sheet production device, relates in particular to the silicon chip of solar cell cleaning and texturing slot.
[background technology]
Sun power is a kind of radiating capacity, compares with other energy, and that sun power can not produce is poisonous, obnoxious flavour and waste residue, and it is a kind of green energy resource, thereby does not pollute the environment.Sunlight is available anywhere simultaneously, and is easy to use, safe, with low cost, can regenerate.But it must just can be converted to electric energy by means of energy converter, this energy converter that transform light energy is become electric energy, be exactly solar cell,, proposed new requirement for the quality and the cost of solar product along with the continuous lifting of photovoltaic industrial technology.And the raw material of making solar cell is the silicon material, the silicon material is drawn into silicon rod, silicon chip is prepared from by the multi-line cutting machine cutting by silicon rod, the silicon chip that cuts, impurity and surface irregularities such as surface attachment mortar, therefore before making battery, the surface treatment of silicon chip be to carry out earlier, the matting of silicon chip and the surface corrosion of silicon chip comprised.Matting is in order to remove the various impurity on the silicon chip, and the purpose of surface corrosion is the cutting damage of removing silicon chip surface, obtains to be fit to the silicon face that the system knot requires.The performance and the state of silicon chip surface before the system knot directly influence the characteristic of knot, thereby influence the performance of finished product battery.Silicon chip promptly begins making herbs into wool through after the surface treatment, leather producing process is an of paramount importance ring in the whole production line, its objective is that carrying out texturing by the method for chemical corrosion at silicon chip surface handles, form good sunken photoeffect, reduce the silicon chip surface emittance.General production technique is to adopt slot type making herbs into wool at present, in higher temperature environment, carry out anisotropic etch with KOH or NaOH solution, erode away the pyramid that is similar to pyramid structure at silicon chip surface, realize the multiple reflection of incident light, reduce surface albedo.And the homogeneity in the homogeneity of groove internal corrosion liquid and temperature field has just determined the stability of mass industrialized production, so the stability in the temperature field in the technological process is an of paramount importance factor of influence.The type of heating of rinse bath and texturing slot is by stainless steel tubular type well heater or the heating of Teflon tubular heater at present, stainless steel tubular type well heater or Teflon tubular heater are placed directly in the bottom of rinse bath and texturing slot, layer overlay stainless steel plate on well heater, again silicon slice placed on stainless steel plate, because the material of rinse bath and texturing slot is the PP plastics, its heatproof is no more than 275 ℃, heating tube and bottom land directly contacted to cause bottom land to burn out, thereby it is accidents caused, simultaneously, heating tube directly is placed on bottom land, can causes the temperature diffusion slowly with inhomogeneous.
[utility model content]
In order to overcome the deficiency that existing cleaning and texturing slot exists, the utility model provides a kind of solar silicon wafers cleaning and texturing slot.Adopt this cleaning and texturing slot, it can either prevent effectively that heating tube from burning out bottom land, can guarantee the homogeneity of fluid temperature in the groove again.
The technical solution adopted in the utility model is:
Silicon chip cleaning and texturing slot described in the utility model, it comprises cell body and heating tube, it is characterized in that: be provided with the heating tube bracing frame on the bottom land of cell body.
Further, described heating tube bracing frame is made up of the Teflon unit of plastic of two symmetrical distributions, offers the heating tube stopper slot on every Teflon unit of plastic, and the heating tube stopper slot is 1/5~1/4 of the interior solution height of groove to the height of bottom land.
Owing in silicon chip cleaning and texturing slot, set up the heating tube bracing frame, heating tube is spacing by the heating tube stopper slot on the heating tube bracing frame, the heating tube bracing frame separates the cell wall and the bottom land of heating tube and cleaning and texturing slot, avoided heating tube directly to contact with bottom land, guaranteed that cleaning and texturing slot is not by the high temperature scaling loss with the cell wall of cleaning and texturing slot.During heating, the temperature on the heating tube can be equably in groove solution around diffusion, guaranteed the homogeneity of solution temperature in the groove also to have guaranteed the safety of producing simultaneously.
[description of drawings]
Fig. 1 is the prior art constructions synoptic diagram, and promptly heating tube directly is placed in the silicon chip cleaning and texturing slot;
Fig. 2, Fig. 3 are synoptic diagram of the present utility model,
Be that heating tube is placed on the bracing frame of cleaning and texturing slot internal heating pipe;
Fig. 3 is the right view of Fig. 2;
Among the figure: the 1-cell body; The 2-heating tube; The 3-bottom land; 4-heating tube bracing frame;
5-heating tube stopper slot; The 6-cell wall.
[embodiment]
Described silicon chip cleaning and texturing slot, as Fig. 2, shown in Figure 3, it is made up of cell body 1, heating tube 2 and heating tube bracing frame 4, described heating tube bracing frame 4 is made up of the Teflon unit of plastic of two symmetrical distributions, on every Teflon unit of plastic, offer heating tube stopper slot 5, heating tube bracing frame 4 is placed on the bottom of cell body 1, and heating tube bracing frame 4 separates cell wall 6 and the bottom land 3 of heating tube 2 with cleaning and texturing slot, and heating tube stopper slot 5 is 1/4 of the interior solution height of groove to the height of bottom land 3.

Claims (2)

1. silicon chip cleaning and texturing slot, it comprises cell body (1) and heating tube (2), it is characterized in that: be provided with heating tube bracing frame (4) on the bottom land (3) of cell body (1).
2. according to the described silicon chip cleaning and texturing slot of claim 1, it is characterized in that: described heating tube bracing frame (4) is made up of the Teflon unit of plastic of two symmetrical distributions, offer heating tube stopper slot (5) on every Teflon unit of plastic, heating tube stopper slot (5) is 1/5~1/4 of the interior solution height of groove to the height of bottom land (3).
CN2010202081710U 2010-05-31 2010-05-31 Silicon wafer cleaning and texturing slot Expired - Fee Related CN201686766U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN2010202081710U CN201686766U (en) 2010-05-31 2010-05-31 Silicon wafer cleaning and texturing slot

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN2010202081710U CN201686766U (en) 2010-05-31 2010-05-31 Silicon wafer cleaning and texturing slot

Publications (1)

Publication Number Publication Date
CN201686766U true CN201686766U (en) 2010-12-29

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN2010202081710U Expired - Fee Related CN201686766U (en) 2010-05-31 2010-05-31 Silicon wafer cleaning and texturing slot

Country Status (1)

Country Link
CN (1) CN201686766U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101831713A (en) * 2010-05-31 2010-09-15 常州亿晶光电科技有限公司 Silicon chip cleaning and texturing slot

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101831713A (en) * 2010-05-31 2010-09-15 常州亿晶光电科技有限公司 Silicon chip cleaning and texturing slot

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Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20101229

Termination date: 20150531

EXPY Termination of patent right or utility model