CN204230280U - A kind of for regulating the system of Reducing thickness uniformity in silicon chip texture etching slot - Google Patents
A kind of for regulating the system of Reducing thickness uniformity in silicon chip texture etching slot Download PDFInfo
- Publication number
- CN204230280U CN204230280U CN201420790611.6U CN201420790611U CN204230280U CN 204230280 U CN204230280 U CN 204230280U CN 201420790611 U CN201420790611 U CN 201420790611U CN 204230280 U CN204230280 U CN 204230280U
- Authority
- CN
- China
- Prior art keywords
- slot
- silicon chip
- texturing slot
- reservoir
- liquid
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Abstract
A kind of for regulating the system of Reducing thickness uniformity in silicon chip texture etching slot, comprise texturing slot, be provided with at least three reaction channels in texturing slot, be provided with successively from top to bottom in reaction channel and be positioned at pinch roller below texturing slot inner liquid medicine liquid level and roller, silicon chip mobile and making herbs into wool between roller and pinch roller; Also comprise reservoir, liquid in reservoir is transported in texturing slot by woven hose by reservoir, the woven hose being positioned at texturing slot is provided with some spray orifices, liquid in texturing slot is transported in reservoir by overflow pipe and return duct by texturing slot, liquid in reservoir forms heat exchange by heat exchange capillary and an ice maker, and other the every bar reaction channels between the reaction channel at texturing slot two ends are provided with a spray equipment.Its beneficial effect: the temperature being conducive to reducing the reaction channel in the middle of in texturing slot, thus make the homogeneous temperature in texturing slot, make the wafer thinning amount of carrying out in texturing slot in making herbs into wool process even, distribution of color is even, and rate of finished products is high.
Description
Technical field
The utility model belongs to crystal silicon solar energy battery and manufactures field, especially a kind of for regulating the system of Reducing thickness uniformity in silicon chip texture etching slot.
Background technology
Along with the continuous lifting of manufacture of solar cells technology, new requirement is proposed for the quality of solar battery product and cost.Process for etching is an of paramount importance ring in the whole production line of solar cell, its objective is the surface damage layer in order to remove the rear silicon chip of cutting, carry out texturing process by the method for chemical corrosion at silicon chip surface simultaneously, form good sunken luminous effect, thus reduce silicon chip surface reflectivity, improve short circuit current, the final photoelectric conversion efficiency improving battery.At present, making herbs into wool for chain type polysilicon is all generally utilize the strong oxidizing property of nitric acid and the complexing of hydrofluoric acid, silicon chip is oxidized and complexing stripping, silicon chip surface generation isotropism heterogeneity is caused to be corroded, form cellular matte, thus increase the order of reflection of incident light, effectively enhance the utilance of incident sunlight, improve photogenerated current density.At present, the texturing slot that the etching device of chain type polysilicon mainly adopts multiple reaction channel to carry out simultaneously, its shortcoming is: due to nitric acid, amount of heat is released when hydrofluoric acid and silicon chip react, cause the reaction channel temperature at texturing slot center higher than other regions, and silicon chip with acid reaction rate and temperature proportional, the even meeting of temperature distributing disproportionation causes the uneven of each reaction channel Reducing thickness, uneven thinning meeting causes different specific areas, under PE holds identical deposition rate, different specific areas produces inconsistent thickness, finally cause distribution of color discrete, affect rate of finished products.
Summary of the invention
The purpose of this utility model is to provide a kind of for regulating the system of Reducing thickness uniformity in silicon chip texture etching slot, make silicon chip in normal making herbs into wool process, uniformity of temperature profile in each reaction channel, guarantees the uniformity of the wafer thinning amount in each reaction channel, improves silicon chip rate of finished products.
To achieve these goals, the utility model adopts following technical scheme: a kind of for regulating the system of Reducing thickness uniformity in silicon chip texture etching slot, comprise texturing slot, reaction channel is provided with in described texturing slot, be provided with successively from top to bottom in described reaction channel and be positioned at pinch roller below texturing slot inner liquid medicine liquid level and roller, silicon chip moves and carries out making herbs into wool between roller and pinch roller; Also comprise a reservoir, liquid in reservoir is transported in described texturing slot by a woven hose by described reservoir, the woven hose being positioned at described texturing slot is provided with some first spray orifices, liquid in described texturing slot is transported in reservoir by overflow pipe and return duct by described texturing slot, liquid in described reservoir forms heat exchange by heat exchange capillary and an ice maker, described reaction channel has three at least, and other the every bar reaction channels between the reaction channel at texturing slot two ends are provided with a spray equipment.
A kind of set-up mode of spray equipment, described spray equipment comprises the spray piping be connected with described reservoir, and the spray piping be positioned at above reaction channel is provided with some second spray orifices, and described second spray orifice is positioned at above the liquid liquid level of described texturing slot.
Further, control the flow of low temperature liquid in spray equipment, described spray piping is also provided with the first adjuster valve.
Further, described spray piping is connected with described reservoir by the first pumping, and the first pumping provides the low temperature liquid in described reservoir to provide power for spray piping.
Further, described woven hose is provided with the second pumping, and described second pumping provides the low temperature liquid in described reservoir to provide power for woven hose.
Further, some first spray orifices on described woven hose are positioned at below described roller.
Further, described heat exchange capillary is positioned at below the liquid liquid level of described reservoir, and heat exchanger effectiveness is high.
Further, described woven hose is provided with the second adjuster valve, for regulating the medical liquid spraying flow sprayed by woven hose.
Liquid in reservoir forms heat exchange by heat exchange capillary and ice maker, reduce the fluid temperature in reservoir thus form low temperature liquid, silicon chip and acid are in course of reaction, discharge amount of heat, improve the temperature of texturing slot liquid thus form high temperature liquid, in order to make the homogeneous temperature of each reaction channel of texturing slot, by woven hose and spray piping by the low temperature medical liquid spraying in reservoir in reaction channel, because woven hose is positioned at below roller, spray piping is positioned at above the liquid liquid level of texturing slot, the temperature of middle every bar reaction channel can be effectively reduced, make the more uniform temperature of texturing slot.
The utility model compared with prior art, there is following beneficial effect: 1, by the injection low temperature liquid of spray piping and woven hose, be conducive to reducing the temperature of the reaction channel in the middle of in texturing slot, thus make the homogeneous temperature in texturing slot, make the wafer thinning amount of carrying out in texturing slot in making herbs into wool process even, distribution of color is even, and rate of finished products is high; 2, whole system is simple, and easy to operate, cost is low; 3, in system, be provided with the first adjuster valve and the second adjuster valve, the control of flow is more reliable, and rate of finished products is better.
Accompanying drawing explanation
Fig. 1 is the structure side view of system in embodiment 1.
Fig. 2 is the vertical view of system in embodiment 1.
Fig. 3 is the vertical view of system in embodiment 2.
Fig. 4 is the vertical view of system in embodiment 3.
Embodiment
Below in conjunction with drawings and Examples, the utility model is further illustrated.
Embodiment 1:
As shown in Figure 1, 2, the utility model is a kind of for regulating the system of Reducing thickness uniformity in silicon chip texture etching slot, comprise texturing slot 1, five reaction channels are provided with in described texturing slot 1, be provided with successively from top to bottom in described reaction channel and be positioned at pinch roller below texturing slot 1 inner liquid medicine liquid level 2 and roller 3, silicon chip 4 moves and carries out making herbs into wool between roller 3 and pinch roller 2, also comprise a reservoir 5, liquid in reservoir 5 is transported in described texturing slot 1 by a woven hose 6 by described reservoir 5, the woven hose 6 being positioned at described texturing slot 1 is provided with some first spray orifices 7, described first spray orifice 7 is positioned at below described roller 3, described woven hose 6 is provided with the second pumping 14, for woven hose provides the low temperature liquid in described reservoir 5 to provide power, described woven hose 6 is provided with the second adjuster valve 15, for regulating by the medicinal liquid flow in woven hose 6, thus control the medical liquid spraying amount of the first spray orifice 7, liquid in described texturing slot 1 is transported in reservoir 5 by overflow pipe 8 and return duct 9 by described texturing slot 1, liquid in described reservoir 5 forms heat exchange by heat exchange capillary 10 and an ice maker, described heat exchange capillary 10 is positioned at below the liquid liquid level of described reservoir 5, be positioned at below liquid and can improve heat exchanger effectiveness, other three reaction channels between the reaction channel at texturing slot 1 two ends are respectively provided with a spray equipment.
In the present embodiment, described spray equipment comprises the spray piping 11 be connected with described reservoir 5, the spray piping 11 be positioned at above reaction channel is provided with some second spray orifices 12, described second spray orifice 12 is positioned at above the liquid liquid level of described texturing slot 1, described spray piping 11 is also provided with the first adjuster valve 13 for regulating by the medicinal liquid flow in spray piping 11, thus controls the medical liquid spraying amount of the second spray orifice 12.
Described spray piping 11 is connected with described reservoir 5 by the first pumping 13, and the first pumping 13 provides the low temperature liquid in described reservoir 5 to provide power for spray piping 11.
In the present embodiment, the temperature of the first silicon chip and the reaction channel corresponding to the 5th silicon chip is compared with second, three, reaction channel corresponding to four silicon chips low without difficulty, a large amount of heat that silicon chip 4 and acid reaction discharge easily is accumulated in second, three, in reaction channel corresponding to four silicon chips, especially in the reaction channel region corresponding to the 3rd silicon chip, therefore the reaction channel middle upper part corresponding to the 3rd silicon chip is provided with spray equipment, at the second silicon chip, the side middle away from texturing slot 1 in reaction channel corresponding to 4th silicon chip is provided with spray equipment, can second be effectively reduced, 3rd, 4th silicon chip answer temperature in reaction channel, thus make the temperature in texturing slot 1 more even, the rate of finished products of silicon chip 4 is higher.
The principle of the present embodiment is as follows: the liquid in reservoir 5 forms heat exchange by heat exchange capillary 10 and ice maker, reduce the fluid temperature in reservoir 5 thus form low temperature liquid, silicon chip 4 and acid are in course of reaction, discharge amount of heat, improve the temperature of texturing slot 1 liquid thus form high temperature liquid, in order to make the homogeneous temperature of each reaction channel of texturing slot 1, by woven hose 6 and spray piping 11 by the low temperature medical liquid spraying in reservoir in reaction channel, because woven hose 6 is positioned at below roller 3, spray piping 11 is positioned at above the liquid liquid level of texturing slot 1, the temperature of middle every bar reaction channel can be effectively reduced, make the more uniform temperature of texturing slot 1, the rate of finished products of silicon chip 4 is better.
Embodiment 2:
As shown in Figure 3, in the present embodiment, be provided with three reaction channels in described texturing slot 1, be provided with spray equipment in the middle of the reaction channel corresponding to the second silicon chip, other are with embodiment 1.
Embodiment 3:
As shown in Figure 4, in the present embodiment, ten reaction channels are provided with in described texturing slot 1, the centre of the reaction channel corresponding to the 5th silicon chip and the 6th silicon chip and second and third, four, seven, eight, reaction channel corresponding to nine silicon chips is provided with spray equipment away from the side in the middle of texturing slot, other are with embodiment 1.
Claims (8)
1. one kind for regulating the system of Reducing thickness uniformity in silicon chip texture etching slot, comprise texturing slot, reaction channel is provided with in described texturing slot, be provided with successively from top to bottom in described reaction channel and be positioned at pinch roller below texturing slot inner liquid medicine liquid level and roller, silicon chip moves and carries out making herbs into wool between roller and pinch roller; Also comprise a reservoir, liquid in reservoir is transported in described texturing slot by a woven hose by described reservoir, the woven hose being positioned at described texturing slot is provided with some first spray orifices, liquid in described texturing slot is transported in reservoir by overflow pipe and return duct by described texturing slot, liquid in described reservoir forms heat exchange by heat exchange capillary and an ice maker, it is characterized in that: described reaction channel has three at least, other the every bar reaction channels between the reaction channel at texturing slot two ends are provided with a spray equipment.
2. according to claim 1 for regulating the system of Reducing thickness uniformity in silicon chip texture etching slot, it is characterized in that: described spray equipment comprises the spray piping be connected with described reservoir, the spray piping be positioned at above reaction channel is provided with some second spray orifices, and described second spray orifice is positioned at above the liquid liquid level of described texturing slot.
3. according to claim 2 for regulating the system of Reducing thickness uniformity in silicon chip texture etching slot, it is characterized in that: described spray piping is also provided with the first adjuster valve.
4. according to claim 2 for regulating the system of Reducing thickness uniformity in silicon chip texture etching slot, it is characterized in that: described spray piping is connected with described reservoir by the first pumping.
5., according to the arbitrary described system for regulating Reducing thickness uniformity in silicon chip texture etching slot of claim 1-4, it is characterized in that: described woven hose is provided with the second pumping.
6., according to the arbitrary described system for regulating Reducing thickness uniformity in silicon chip texture etching slot of claim 1-4, it is characterized in that: some first spray orifices on described woven hose are positioned at below described roller.
7., according to the arbitrary described system for regulating Reducing thickness uniformity in silicon chip texture etching slot of claim 1-4, it is characterized in that: described heat exchange capillary is positioned at below the liquid liquid level of described reservoir.
8., according to the arbitrary described system for regulating Reducing thickness uniformity in silicon chip texture etching slot of claim 1-4, it is characterized in that: described woven hose is provided with the second adjuster valve further.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420790611.6U CN204230280U (en) | 2014-12-11 | 2014-12-11 | A kind of for regulating the system of Reducing thickness uniformity in silicon chip texture etching slot |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420790611.6U CN204230280U (en) | 2014-12-11 | 2014-12-11 | A kind of for regulating the system of Reducing thickness uniformity in silicon chip texture etching slot |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204230280U true CN204230280U (en) | 2015-03-25 |
Family
ID=52928340
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420790611.6U Expired - Fee Related CN204230280U (en) | 2014-12-11 | 2014-12-11 | A kind of for regulating the system of Reducing thickness uniformity in silicon chip texture etching slot |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204230280U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465878A (en) * | 2014-12-11 | 2015-03-25 | 东方日升新能源股份有限公司 | System for adjusting thickness reduction uniformity in silicon slice texturing groove |
| CN107564842A (en) * | 2017-09-21 | 2018-01-09 | 常州捷佳创精密机械有限公司 | A kind of silicon chip processing device and its dipper, the discharge method of dipper |
| CN109473374A (en) * | 2017-09-08 | 2019-03-15 | 天津环鑫科技发展有限公司 | A kind of digging groove groove body with medical fluid circulator |
| CN109473375A (en) * | 2017-09-08 | 2019-03-15 | 天津环鑫科技发展有限公司 | A kind of digging groove groove body conducive to homogeneous corrosion |
-
2014
- 2014-12-11 CN CN201420790611.6U patent/CN204230280U/en not_active Expired - Fee Related
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104465878A (en) * | 2014-12-11 | 2015-03-25 | 东方日升新能源股份有限公司 | System for adjusting thickness reduction uniformity in silicon slice texturing groove |
| CN109473374A (en) * | 2017-09-08 | 2019-03-15 | 天津环鑫科技发展有限公司 | A kind of digging groove groove body with medical fluid circulator |
| CN109473375A (en) * | 2017-09-08 | 2019-03-15 | 天津环鑫科技发展有限公司 | A kind of digging groove groove body conducive to homogeneous corrosion |
| CN107564842A (en) * | 2017-09-21 | 2018-01-09 | 常州捷佳创精密机械有限公司 | A kind of silicon chip processing device and its dipper, the discharge method of dipper |
| WO2019056632A1 (en) * | 2017-09-21 | 2019-03-28 | 常州捷佳创精密机械有限公司 | Wafer processing device, solution tank thereof, and discharge method for solution tank |
| CN107564842B (en) * | 2017-09-21 | 2019-06-14 | 常州捷佳创精密机械有限公司 | A kind of discharge method of silicon chip processing device and its dipper, dipper |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204230280U (en) | A kind of for regulating the system of Reducing thickness uniformity in silicon chip texture etching slot | |
| CN103618020A (en) | Wet etching method in silicon solar cell production | |
| CN101982889B (en) | Manufacturing method of solar cell | |
| CN104465878A (en) | System for adjusting thickness reduction uniformity in silicon slice texturing groove | |
| CN203790598U (en) | Falling film evaporator | |
| CN107919307A (en) | A kind of feeding device of wet etching | |
| CN201695106U (en) | Double-groove polysilicon wet-method wool preparation equipment | |
| CN205104507U (en) | Polycrystalline silicon solar cell making herbs into wool concentration flow circulation meter device | |
| CN201695088U (en) | Tank type polycrystalline silicon wet-process texturing equipment | |
| CN203704702U (en) | Scattered multilayer filler cooling tower | |
| CN203312350U (en) | Alkali groove structure for back polishing of crystal silicon solar cell | |
| CN204424294U (en) | A kind of fluff making device of solar battery sheet | |
| CN207542206U (en) | A kind of feeding device of wet etching | |
| CN205231093U (en) | Solar cell wet etching's water film device | |
| CN202183408U (en) | Double-row twenty-station hand-operated etching and cleaning device | |
| CN206412322U (en) | A kind of etching device | |
| CN206109602U (en) | Solar wafer slot type making herbs into wool equipment | |
| CN207327565U (en) | A kind of novel cable sheath cooling device | |
| CN207149539U (en) | A kind of silicon chip cleaning gaily decorated basket | |
| CN207425896U (en) | A kind of solar energy cell wet-method water film in etching device | |
| CN202989355U (en) | Double-layer uniform flow plate for groove-type polysilicon texturing | |
| CN207391587U (en) | A kind of electrolytic phosphating device for electrolytic phosphating of steel wires | |
| KR101097901B1 (en) | Cooling apparatus of solar cell module | |
| CN205974661U (en) | Silicon chip is graphite frame for coating film | |
| CN102728656B (en) | Pickling-free drawing method of middle and high carbon wire rods |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20170508 Address after: 471943 Yanshi Industrial Park, Yanshi, Henan, Luoyang Patentee after: RISEN (LUOYANG) NEW ENERGY CO.,LTD. Address before: 315609 Zhejiang city of Ningbo province Ninghai County Meilin Tashan Industrial Park East sunrise new energy Limited by Share Ltd Patentee before: RISEN ENERGY Co.,Ltd. |
|
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150325 Termination date: 20211211 |