CN201681876U - Packaging structure with exposed multiple-salient point bases - Google Patents

Packaging structure with exposed multiple-salient point bases Download PDF

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Publication number
CN201681876U
CN201681876U CN201020178462XU CN201020178462U CN201681876U CN 201681876 U CN201681876 U CN 201681876U CN 201020178462X U CN201020178462X U CN 201020178462XU CN 201020178462 U CN201020178462 U CN 201020178462U CN 201681876 U CN201681876 U CN 201681876U
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CN
China
Prior art keywords
pin
dao
plastic packaging
packaging material
metal
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
CN201020178462XU
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Chinese (zh)
Inventor
王新潮
梁志忠
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
JCET Group Co Ltd
Original Assignee
Jiangsu Changjiang Electronics Technology Co Ltd
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Filing date
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Priority to CN201020178462XU priority Critical patent/CN201681876U/en
Application granted granted Critical
Publication of CN201681876U publication Critical patent/CN201681876U/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L24/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L24/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/93—Batch processes
    • H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/31—Structure, shape, material or disposition of the layer connectors after the connecting process
    • H01L2224/32—Structure, shape, material or disposition of the layer connectors after the connecting process of an individual layer connector
    • H01L2224/321—Disposition
    • H01L2224/32151—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/32221—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/32245—Disposition the layer connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/73—Means for bonding being of different types provided for in two or more of groups H01L24/10, H01L24/18, H01L24/26, H01L24/34, H01L24/42, H01L24/50, H01L24/63, H01L24/71
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/013—Alloys
    • H01L2924/0132—Binary Alloys
    • H01L2924/01322—Eutectic Alloys, i.e. obtained by a liquid transforming into two solid phases
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/06—Polymers
    • H01L2924/078—Adhesive characteristics other than chemical
    • H01L2924/07802—Adhesive characteristics other than chemical not being an ohmic electrical conductor

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  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Lead Frames For Integrated Circuits (AREA)

Abstract

The utility model relates to a packaging structure with exposed multiple-salient point bases, comprising bases (1), pins (2), conducting or non-conducting bonding material (6), chips (7), metal wires (8) and plastic packaging material with packing (9), wherein the front face and the back face of the base (1) and the pin (2) are respectively provided with a first metal layer (4) and a second metal layer (5); the front face of the base (1) is of a multiple-salient point structure; plastic packaging material without packing (3) is embedded at the periphery of the pin (2) and the area between the pin (2) and the base (1); and the back face dimensions of the base (1) and the pin (2) are smaller than the front face dimensions of the base (1) and the pin (2) to form a base and pin structure with big top and small bottom. The utility model has the benefits that the binding capacity of the plastic packaging body and the metal pins is large.

Description

The base island exposed type encapsulating structure of multi-convex point
(1) technical field
The utility model relates to the base island exposed type encapsulating structure of a kind of multi-convex point.Belong to the semiconductor packaging field.
(2) background technology
Traditional encapsulating structure mainly contains two kinds:
First kind: after chemical etching and surface electrical coating are carried out in the front of employing metal substrate, stick the resistant to elevated temperatures glued membrane of one deck at the back side of metal substrate and form the leadframe carrier (as shown in Figure 3) that to carry out encapsulation process;
Second kind: after chemical etching and surface electrical coating are carried out in the front of employing metal substrate, promptly finish the making (as shown in Figure 4) of lead frame.Back etched is then carried out at the back side of lead frame again in encapsulation process.
And the not enough point of two kinds of above-mentioned lead frames below in encapsulation process, having existed:
First kind:
1) but the lead frame of this kind must stick the glued membrane of one deck costliness high temperature resistance because of the back side.So directly increased high cost.
2) but also because the glued membrane of one deck high temperature resistance must be sticked in the back side of the lead frame of this kind, so the load technology in encapsulation process can only be used conduction or nonconducting resin technology, and the technology that can not adopt eutectic technology and slicken solder is fully carried out load, so selectable product category just has bigger limitation.
3) but again because the glued membrane of one deck high temperature resistance must be sticked in the back side of the lead frame of this kind, and in the ball bonding bonding technology in encapsulation process, because but the glued membrane of this high temperature resistance is a soft materials, so caused the instability of ball bonding bonding parameter, seriously influenced the quality of ball bonding and the stability of production reliability.
4) but again because the glued membrane of one deck high temperature resistance must be sticked in the back side of the lead frame of this kind, and the plastic package process process in encapsulation process, because the high pressure of plastic packaging relation is easy to cause between lead frame and the glued membrane and infiltrates plastic packaging material, be that the kenel of conduction has become insulation pin (as shown in Figure 5) on the contrary because of having infiltrated plastic packaging material and will formerly should belong to metal leg.
Second kind:
The lead frame structure of this kind has carried out etching partially technology in the metal substrate front, though can solve the problem of first kind of lead frame, but because only carried out the work that etches partially in the metal substrate front, and plastic packaging material only envelopes the height of half pin in the plastic packaging process, so the constraint ability of plastic-sealed body and metal leg has just diminished, when if the plastic-sealed body paster is not fine to pcb board, does over again again and heavily paste, with regard to the problem (as shown in Figure 6) that is easy to generate pin.
Especially the kind of plastic packaging material is to adopt when filler is arranged, because material is at the environment and the follow-up surface-pasted stress changing relation of production process, can cause metal and plastic packaging material to produce the crack of vertical-type, its characteristic is the high more then hard more crisp more crack that is easy to generate more of proportion of filler.
(3) summary of the invention
The purpose of this utility model is to overcome above-mentioned deficiency, provides a kind of and reduces that packaging cost, selectable product category are wide, the big base island exposed type encapsulating structure of multi-convex point of constraint ability of good stability, plastic-sealed body and the metal leg of the quality of ball bonding and production reliability.
The purpose of this utility model is achieved in that the base island exposed type encapsulating structure of a kind of multi-convex point, comprise Ji Dao, pin, conduction or non-conductive bonding material, chip, metal wire and the filler plastic packaging material arranged, front and back at described Ji Dao and pin is respectively arranged with the first metal layer and second metal level, be provided with chip in front, basic island by conduction or non-conductive bonding material, be connected with metal wire between chip front side and the pin front the first metal layer, outside the top of described Ji Dao and pin and chip and metal wire, be encapsulated with the filler plastic packaging material, multi-convex point shape structure is arranged in front, described basic island, no filler plastic packaging material is set in zone between described pin periphery and pin and basic island, described no filler plastic packaging material links into an integrated entity periphery, pin bottom and pin and Ji Dao bottom, and make described Ji Dao and pin back side size less than Ji Dao and the positive size of pin, form up big and down small Ji Dao and pin configuration.
The beneficial effects of the utility model are:
1) but the glued membrane of one deck costliness high temperature resistance need not sticked in the back side of the lead frame of this kind.So directly reduced high cost.
2) but because the glued membrane of one deck high temperature resistance need not sticked in the back side of the lead frame of this kind yet, so the load technology in encapsulation process is except using conduction or nonconducting resin technology, can also adopt the technology of eutectic technology and slicken solder to carry out load, so selectable product category is just wide.
3) but again because the glued membrane of one deck high temperature resistance need not sticked in the back side of the lead frame of this kind, guaranteed the stability of ball bonding bonding parameter, guaranteed the quality of ball bonding and the stability of production reliability.
4) but again because the lead frame of this kind need not stick the glued membrane of one deck high temperature resistance, and the plastic package process process in encapsulation process can not cause between lead frame and the glued membrane fully and infiltrate plastic packaging material.
5) because the soft gap filler of no filler is set in the zone between described metal leg (pin) and metal leg, the soft gap filler of this no filler has the filler plastic packaging material to envelope the height of whole metal leg with the routine in the plastic packaging process, so the constraint ability of plastic-sealed body and metal leg just becomes big, do not have the problem that produces pin again.
6) owing to adopted positive method of separating the etching operation with the back side, so in the etching operation, can form the slightly little and big slightly structure of positive basic island size of the size of back side Ji Dao, and with the size that varies in size up and down of a Ji Dao by tighter more difficult generation slip that no filler plastic packaging material coated and fall pin.
(4) description of drawings
Fig. 1 is the base island exposed type encapsulating structure of a utility model multi-convex point schematic diagram.
Fig. 2 is the vertical view of Fig. 1.
Fig. 3 was for sticked the resistant to elevated temperatures glued membrane figure of one deck operation in the past at the back side of metal substrate.
Fig. 4 was for to adopt the front of metal substrate to carry out chemical etching and surface electrical coating flow diagram in the past.
Fig. 5 was for formed insulation pin schematic diagram in the past.
Fig. 6 pin figure for what formed in the past.
Reference numeral among the figure:
The base island 1, pin 2, no filler plastic packaging material 3, the first metal layer 4, second metal level 5, conduction or non-conductive bonding material 6, chip 7, metal wire 8, filler plastic packaging material 9 is arranged.
(5) embodiment
Referring to Fig. 1～2, Fig. 1 is the base island exposed type encapsulating structure of a utility model multi-convex point schematic diagram.Fig. 2 is the vertical view of Fig. 1.By Fig. 1 and Fig. 2 as can be seen, the base island exposed type encapsulating structure of the utility model multi-convex point, comprise basic island 1, pin 2, conduction or non-conductive bonding material 6, chip 7, metal wire 8 and filler plastic packaging material 9 is arranged, front and back at described basic island 1 and pin 2 is respectively arranged with the first metal layer 4 and second metal level 5, be provided with chip 7 in 1 front, basic island by conduction or non-conductive bonding material 6, chip 7 positive with pin 2 front the first metal layers 4 between be connected with metal wire 8, outside the top of described basic island 1 and pin 2 and chip 7 and metal wire 8, be encapsulated with filler plastic packaging material 9, multi-convex point shape structure is arranged in 1 front, described basic island, no filler plastic packaging material 3 is set in zone between described pin 2 peripheries and pin 2 and basic island 1, described no filler plastic packaging material 3 links into an integrated entity pin periphery, 2 bottom and pin 2 with 1 bottom, basic island, and make described basic island 1 and pin 2 back side sizes less than basic island 1 and pin 2 positive sizes, form up big and down small Ji Dao and pin configuration.

Claims (1)

1. base island exposed type encapsulating structure of multi-convex point, comprise Ji Dao (1), pin (2), conduction or non-conductive bonding material (6), chip (7), metal wire (8) and filler plastic packaging material (9) is arranged, front and back at described Ji Dao (1) and pin (2) is respectively arranged with the first metal layer (4) and second metal level (5), be provided with chip (7) in Ji Dao (1) front by conduction or non-conductive bonding material (6), chip (7) positive with pin (2) front the first metal layer (4) between be connected with metal wire (8), outside the top of described Ji Dao (1) and pin (2) and chip (7) and metal wire (8), be encapsulated with filler plastic packaging material (9), it is characterized in that: described Ji Dao (1) is arranged to multi-convex point shape structure in the front, no filler plastic packaging material (3) is set in zone between described pin (2) periphery and pin (2) and Ji Dao (1), described no filler plastic packaging material (3) links into an integrated entity pin (2) periphery, bottom and pin (2) with Ji Dao (1) bottom, and make described Ji Dao (1) and pin (2) back side size less than Ji Dao (1) and the positive size of pin (2), form up big and down small Ji Dao and pin configuration.
CN201020178462XU 2010-04-26 2010-04-26 Packaging structure with exposed multiple-salient point bases Expired - Lifetime CN201681876U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201020178462XU CN201681876U (en) 2010-04-26 2010-04-26 Packaging structure with exposed multiple-salient point bases

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201020178462XU CN201681876U (en) 2010-04-26 2010-04-26 Packaging structure with exposed multiple-salient point bases

Publications (1)

Publication Number Publication Date
CN201681876U true CN201681876U (en) 2010-12-22

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Granted publication date: 20101222