CN201673927U - Light-emitting diode - Google Patents
Light-emitting diode Download PDFInfo
- Publication number
- CN201673927U CN201673927U CN2010201831724U CN201020183172U CN201673927U CN 201673927 U CN201673927 U CN 201673927U CN 2010201831724 U CN2010201831724 U CN 2010201831724U CN 201020183172 U CN201020183172 U CN 201020183172U CN 201673927 U CN201673927 U CN 201673927U
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- light
- fluorescent material
- adhesive layer
- emitting diode
- material mixed
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Abstract
The utility model discloses a light-emitting diode, which comprises a support, an LED chip and two electrodes, wherein the two electrodes are exposed from the two ends of the support, the support comprises a cavity body, the LED chip is arranged on the bottom portion of the cavity body and is communicated with the two electrodes through gold threads, the cavity body is filled with a white glue layer and a fluorescent powder mixing layer, the fluorescent powder mixing layer is covered on the upper portion of the white glue layer, and the thickness of the white glue layer is 75-85 percent of the total thickness of the white glue layer and the fluorescent powder mixing layer. The light-emitting diode can effectively use the fluorescent powder mixing layer, also can lead the LED to keep in higher emitting light rate and light-focusing effect, and increases the light brightness thereof.
Description
Technical field
The utility model relates to a kind of light-emitting diode.
Background technology
LED (light-emitting diode) technology is called as the revolution of throwing light on again after incandescent lamp and fluorescent lamp as having most one of revolutionary important industry technology in recent years.The LED technology has all obtained extensive use in multiple fields such as illumination, demonstrations, and has vast potential for future development.
LED generally comprises the support of material such as pottery, silicon, has the cavity that is used to place led chip on the support, in the LED encapsulation process, after at first led chip being placed on cavity bottom and connection electrode, the phosphor mixture that filling gel and green emitting phosphor, red fluorescence powder etc. constitute in cavity, after blue led chip conduction is luminous, thereby fluorescent material of all kinds is excited and makes LED produce white light.At present, white light-emitting diodes is widely used in the various products such as communication, electronics.
Most of LED have filled abundant fluorescent material mixed layer in cavity, make the upper surface of fluorescent material mixed layer concordant with the upper surface of substrate, yet, this structure can't be fully used the fluorescent material mixed layer, and the part fluorescent material that promptly is positioned at cavity bottom can not be used for synthesize white light under the excitation of led chip.Also have some LED below the fluorescent material mixed layer, to be provided with transparent white adhesive layer, yet, if the thickness of white adhesive layer is too small, still can not guarantee that the fluorescent material mixed layer makes full use of, if the thickness of white adhesive layer is excessive, then can influence light extraction efficiency and the spotlight effect of LED, therefore, the thickness proportion of white adhesive layer and fluorescent material mixed layer is provided with unreasonablely among a lot of existing LED, and the performance of LED is brought certain influence.
The utility model content
The main technical problems to be solved in the utility model is, provides a kind of light emission rate high and make full use of the light-emitting diode of fluorescent material mixed layer.
For solving the problems of the technologies described above, the utility model provides a kind of light-emitting diode, comprise support, led chip and expose two electrodes at described support two ends, described support comprises cavity, described led chip is arranged on described cavity bottom and by gold thread and described two electrode conductions, also fill white adhesive layer and fluorescent material mixed layer in the described cavity, described fluorescent material mixed layer covers described white adhesive layer top, the thickness of described white adhesive layer account for described white adhesive layer and fluorescent material mixed layer gross thickness 75%~85%.
Further, the end face of described fluorescent material mixed layer is concordant with the end face of described support.
Preferably, the thickness of described white adhesive layer account for described white adhesive layer and fluorescent material mixed layer gross thickness 80%.
In a kind of execution mode, described led chip is the purple LED chip.
The beneficial effects of the utility model are: the utility model is by the thickness of appropriate design white adhesive layer, both made LED have good white light conversion effect, effectively utilize the fluorescent material mixed layer, can make LED keep higher light emission rate and spotlight effect again, strengthen the brightness of LED.
Description of drawings
Fig. 1 is the vertical view of the light-emitting diode of a kind of embodiment of the utility model;
Fig. 2 is the cutaway view of the light-emitting diode of a kind of embodiment of the utility model in the A-A direction.
Embodiment
In conjunction with the accompanying drawings the utility model is described in further detail below by embodiment.
As depicted in figs. 1 and 2, the light-emitting diode of present embodiment comprises that support 1, led chip 2 and 3, two electrodes 3 of two electrodes expose the two ends of support 1 respectively, and is used to draw the both positive and negative polarity of led chip 2.
Also fill white adhesive layer 4 and fluorescent material mixed layer 5 in the cavity 1, white adhesive layer 4 covers led chip 2 tops and on every side, can be made of silica gel, and color is transparent.Fluorescent material mixed layer 5 is that silica gel mixes the mixture that obtains mutually with the fluorescent material of various colors, covers white adhesive layer 4 tops.In for example a kind of white light-emitting diodes, led chip 2 is a blue-light LED chip, has comprised green emitting phosphor and red fluorescence powder in the fluorescent material mixed layer 5, and certainly, led chip 2 also can change the purple LED chip into, can further improve the color rendering of LED.
In the present embodiment, the thickness of white adhesive layer 4 should rationally be provided with, if thickness is excessive, then can influence light emission rate and the spotlight effect of LED, therefore relatively thinner white adhesive layer generally generally can be set, yet, the fluorescent material of fluorescent material mixed layer 5 bottoms can't make full use of if thickness is too small, the limited number of time test data shows, when the thickness of white adhesive layer 4 account for white adhesive layer 4 and fluorescent material mixed layer 5 gross thickness 75%~85% the time, can make full use of fluorescent material mixed layer 5, guarantee good light compositing effect, can make LED keep higher light emission rate and spotlight effect again, strengthen the brightness of LED.
Preferably, the thickness of white adhesive layer 4 account for white adhesive layer 4 and fluorescent material mixed layer 5 gross thickness 80%, for example when the thickness of fluorescent material mixed layer 5 was 0.1mm, the thickness of desirable white adhesive layer 5 was 0.4mm.
Further, the end face of fluorescent material mixed layer 5 is concordant with the end face of support 1, makes LED have the shape of rule, installs easily.
Above content be in conjunction with concrete execution mode to further describing that the utility model is done, can not assert that concrete enforcement of the present utility model is confined to these explanations.For the utility model person of an ordinary skill in the technical field, under the prerequisite that does not break away from the utility model design, can also make some simple deduction or replace, all should be considered as belonging to protection range of the present utility model.
Claims (4)
1. light-emitting diode, comprise support, led chip and expose two electrodes at described support two ends, described support comprises cavity, described led chip is arranged on described cavity bottom and by gold thread and described two electrode conductions, it is characterized in that, also fill white adhesive layer and fluorescent material mixed layer in the described cavity, described fluorescent material mixed layer covers described white adhesive layer top, the thickness of described white adhesive layer account for described white adhesive layer and fluorescent material mixed layer gross thickness 75%~85%.
2. light-emitting diode as claimed in claim 1 is characterized in that the end face of described fluorescent material mixed layer is concordant with the end face of described support.
3. light-emitting diode as claimed in claim 2 is characterized in that, the thickness of described white adhesive layer account for described white adhesive layer and fluorescent material mixed layer gross thickness 80%.
4. as each described light-emitting diode in the claim 1 to 3, it is characterized in that described led chip is the purple LED chip.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201831724U CN201673927U (en) | 2010-05-07 | 2010-05-07 | Light-emitting diode |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2010201831724U CN201673927U (en) | 2010-05-07 | 2010-05-07 | Light-emitting diode |
Publications (1)
Publication Number | Publication Date |
---|---|
CN201673927U true CN201673927U (en) | 2010-12-15 |
Family
ID=43331335
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN2010201831724U Expired - Fee Related CN201673927U (en) | 2010-05-07 | 2010-05-07 | Light-emitting diode |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN201673927U (en) |
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2010
- 2010-05-07 CN CN2010201831724U patent/CN201673927U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20101215 Termination date: 20170507 |